MOTOROLA MC10E167, MC100E167 Technical data



SEMICONDUCTOR TECHNICAL DATA

2–1

REV 2

 Motorola, Inc. 1996

12/93

  

The MC10E/100E167 contains six 2:1 multiplexers followed by D
flip-flops with single-ended outputs. Input data are selected by the Select
control, SEL. The selected data are transferred to the flip-flop outputs by
a positive edge on CLK1 or CLK2 (or both). A HIGH on the Master Reset
(MR) pin asynchronously forces all Q outputs LOW.

• 1000MHz Min. Operating Frequency

• 800ps Max. Clock to Output

• Single-Ended Outputs

• Asynchronous Master Resets

• Dual Clocks

• Extended 100E V

EE

Range of – 4.2V to – 5.46V

• 75kΩ Input Pulldown Resistors

Q

0

V

CCO

NCD3aD3bD4aD4bD5a

D5b

CLK1

CLK2

V

EE

MR

SEL

D0a

26

27

28

2

3

4

25 24 23 22 21 20 19

18

17

16

15

14

13

12

115 6 7 8 9 10

Q

5

Q

4

V

CC

Q

3

Q

2

V

CCO

Q

1

D0b D1a D1b D2a D2b V

CCO

1

Pinout: 28-Lead PLCC (Top View)

* All VCC and V

CCO

pins are tied together on the die.

PIN NAMES

Pin Function

D0a – D5a Input Data a
D0b – D5b Input Data b
SEL Select Input
CLK1, CLK2 Clock Inputs
MR Master Reset
Q0– Q

5

Data Outputs

FUNCTIONS

SEL Data

H
L

a
b





6-BIT 2:1

MUX-REGISTER

FN SUFFIX

PLASTIC PACKAGE

CASE 776-02

LOGIC DIAGRAM

D0a

D0b

D1a

D1b

D2a

D2b

D3a

D3b

D4a

D4b

SEL

CLK1
CLK2

MR

Q

0

Q

1

Q

2

Q

3

Q

4

D

Q

R

D

Q

R

D

Q

R

D

Q

R

D

Q

R

D5a

D5b

Q

5

D

Q

R

SEL

MUX

SEL

MUX

SEL

MUX

SEL

MUX

SEL

MUX

SEL

MUX

MC10E167 MC100E167

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–2

DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

I

IH

Input HIGH Current 150 150 150 µA

I

EE

Power Supply Current mA

10E 94 113 94 113 94 113
100E 94 113 94 113 108 130

AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

f

MAX

Max. Toggle Frequency 1000 1400 1000 1400 1000 1400 MHz

t

PLH

Propagation Delay to Output ps

t

PHL

Clk 450 650 800 450 650 800 450 650 800
MR 450 650 850 450 650 850 450 650 850

t

s

Setup Time ps

D 100 – 50 100 – 50 100 – 50
SEL 275 125 275 125 275 125

t

h

Hold Time ps

D 300 50 300 50 300 50
SEL 75 –125 75 –125 75 –125

t

RR

Reset Recovery Time 750 550 750 550 750 550 ps

t

PW

Minimum Pulse Width ps

Clk, MR 400 400 400

t

SKEW

Within-Device Skew 75 75 75 ps 1

t

r

Rise/Fall Times ps

t

f

20 - 80% 300 450 800 300 450 800 300 450 800

1. Within-device skew is defined as identical transitions on similar paths through a device.

MC10E167 MC100E167

2–3 MOTOROLAECLinPS and ECLinPS Lite

DL140 — Rev 4

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 776–02

ISSUE D

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.004 (0.100)

SEATING
PLANE

-T-

12.32

12.32

4.20

2.29

0.33

0.66

0.51

0.64

11.43

11.43

1.07

1.07

1.07
—
2

°

10.42

1.02

12.57

12.57

4.57

2.79

0.48

0.81
—
—

11.58

11.58

1.21

1.21

1.42

0.50

10

°

10.92
—

1.27 BSC

A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y

Z
G1
K1

MIN MINMAX MAX

INCHES MILLIMETERS

DIM

NOTES:

1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.

2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.

3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).

VIEW S

B

U

Z

G1

X

VIEW D-D

H

K

F

VIEW S

G

C

Z

A

R

E

J

0.485

0.485

0.165

0.090

0.013

0.026

0.020

0.025

0.450

0.450

0.042

0.042

0.042
—
2

°

0.410

0.040

0.495

0.495

0.180

0.110

0.019

0.032
—
—

0.456

0.456

0.048

0.048

0.056

0.020

10

°

0.430
—

0.050 BSC

-N-

Y BRK

D

D

W

-M-

-L-

28 1

V

G1

K1

MC10E167 MC100E167

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–4

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability , including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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Opportunity/Affirmative Action Employer.

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MC10E167/D

*MC10E167/D*

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