LG Display LP133WQ1-SJA1 Specification

Revision	ECO#	Approved By	Date	Revision History
B	xxxxxx	Per ECO Approvals	08/14/2012	See Last Page for Revision History

LGD LCD Module Specification for X34

13.3” (2560X1600) TFT-LCD

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Apple Inc.	Size: Letter	Scale: NONE	Page 1 of 67
Title: ERIS, DSPL, LCD MODULE, LGD, X34		DWG Number: 069-8326	___Rev. B___

Revision History

Revision	Date	ECO	Author	Comments
1	09/16/11		Eric Benson	Initial Engineering Release
2	12/12/11		Eric Benson	Light Leakage and Testing Updates
3	8/8/11		Eric Benson	Optical, Mechanical, and Testing Updates
4	4/24/12		Eric Benson	Optical, Mechanical, Grinding, Electrical, Reliability
				Updates
5	5/28/12		Eric Benson	Optical, Electrical, Mechanical, Reliability Updates.
				Removed light leakage requirement
6	6/7/2012		Eric Benson	Added LCD edge ink spec.
A	8/06/2012		Eric Benson	Production Release
B	8/14/2012		Eric Benson	Added V-Com tuning requirement. Transmittance minimum
				updated.

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Title: ERIS, DSPL, LCD MODULE, LGD, X34		DWG Number: 069-8326	___Rev. B___

TABLE OF CONTENTS
1. Order Of Precedence Of Documentation Authority..........................................................				8
2.	Reference Documents.................................................................................................................			9
3.	General Description ..................................................................................................................			10
4.	Functional Requirements........................................................................................................			11
	4.1.	Display Model ....................................................................................................................................		11
	4.2.	Pixel Configuration ..........................................................................................................................		12
	4.3.	Pixel Pitch ...........................................................................................................................................		12
	4.4.	Resolution...........................................................................................................................................		12
	4.5.	Rubbing Direction ............................................................................................................................		12
	4.6. Interface and Driving Scheme ......................................................................................................			13
	4.7.	Front Surface Treatment................................................................................................................		13
5.	Mechanical Requirements ......................................................................................................			13
	5.1. Envelope Dimensions and Tolerances ......................................................................................			13
	5.2.	Active Area..........................................................................................................................................		13
	5.3.	Mass.......................................................................................................................................................		13
	5.4.	Unit Flatness.......................................................................................................................................		13
	5.4.1.		Flatness Measurement Requirements ................................................................................................	13
	5.5. Exposed Area and Restrictions ....................................................................................................			13
	5.6.	Edge Quality Requirements ..........................................................................................................		13
	5.6.1.		Surface Finish Requirements..................................................................................................................	14
	5.6.2.		Edge Defect Requirements.......................................................................................................................	15
	5.6.3.		Ground Surface Profile...............................................................................................................................	16
	5.7.	Polarizer Edge Requirement ........................................................................................................		17
	5.8.	Mechanical Stack-up........................................................................................................................		18
	5.9. Driver IC Mechanical Requirements ..........................................................................................			18
	5.9.1. Driver IC Edge Quality................................................................................................................................			18
	5.9.2. Driver IC Top Surface Requirement.....................................................................................................			19
	5.10. Unit Edge Ink Requirement ........................................................................................................			19
6.	Thermal Requirements............................................................................................................			19
7.	Electrical Requirements ..........................................................................................................			19
	7.1.	Block Diagram ...................................................................................................................................		19
	7.2.	Display PCB Schematics..................................................................................................................		20
	7.3.	Display PCB Layout ..........................................................................................................................		21
	7.4.	Active Components ..........................................................................................................................		21
	7.4.1.		Electrical Interface Requirements........................................................................................................	21
	7.4.2. Extended Display Identification Data (EDID) Interface ..............................................................			22
	7.4.3.		Power Supply Requirements ..................................................................................................................	25
	7.4.4.		Signal Timing .................................................................................................................................................	25
	7.4.5. Power Requirements (W/O backlight)...............................................................................................			27
	7.4.6.		Display Pattern Requirements ...............................................................................................................	27
	7.5.	Power on-off sequence ...................................................................................................................		28
	7.6. Vcc Voltage Drop Requirement....................................................................................................			28
	7.7.	Near-Field Noise................................................................................................................................		28
	7.8. eDP Bit-Error-Rate (BER) Requirement ...................................................................................			28
	7.9. COG Bit Error Rate (BER) Requirement....................................................................................			28
	7.10.	Programmable Gamma Settings ...............................................................................................		28

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Title: ERIS, DSPL, LCD MODULE, LGD, X34		DWG Number: 069-8326	___Rev. B___

	7.11.	Backlight Subsystem.....................................................................................................................		29
	7.11.1.		General Information.................................................................................................................................	29
	7.11.2.		Backlight Electrical Characteristics...................................................................................................	29
	7.11.3.		LED Connection..........................................................................................................................................	31
	7.11.4. LED string to string current variation..............................................................................................			32
	7.11.5.		LED Driver Requirement........................................................................................................................	32
	7.12.	ITO Electrical Shielding................................................................................................................		32
8.	Optical Requirements...............................................................................................................			34
	8.1.	General Optical Specifications .....................................................................................................		34
	8.2.	Optical Measuring Conditions......................................................................................................		35
	8.2.1.		Center Point Luminance............................................................................................................................	36
	8.2.2.		Average Luminance.....................................................................................................................................	37
	8.2.3.		Brightness Uniformity................................................................................................................................	37
	8.2.4.		Contrast Ratio................................................................................................................................................	37
	8.2.5.		White Color Uniformity.............................................................................................................................	37
	8.2.6. Panel to Panel White Color Uniformity ..............................................................................................			38
	8.2.7. Max Color Difference with respect to the center within a panel.............................................			38
	8.2.8. Max Color Difference between any two points within the panel ............................................			38
	8.2.9. Average Color Difference between top and bottom......................................................................			38
	8.2.10. Max Color Difference between two neighbors .............................................................................			39
	8.2.11.		RGB Color Chromaticity..........................................................................................................................	39
	8.2.12.		Viewing Angle .............................................................................................................................................	39
	8.2.13.		Gray Scale Inversion.................................................................................................................................	39
	8.2.14.		Response Time ...........................................................................................................................................	40
	8.2.15. Gray Scale Linearity or Gamma Value ..............................................................................................			41
	8.3.	Flicker...................................................................................................................................................		41
	8.4.	Cross-talk ............................................................................................................................................		41
	8.5.	Surface Reflection.............................................................................................................................		42
	8.6. General Requirement for Camera and CIL/ALS Area ...........................................................			43
	8.7. Camera/ALS/CIL Optical Parameter Definition.....................................................................			44
	8.7.1.		Camera Window Transmittance............................................................................................................	44
	8.7.2.		Camera Window Parallelism...................................................................................................................	44
	8.7.3. Camera Window Transmitted Wavefront Distortion...................................................................			44
	8.7.4.		Haze....................................................................................................................................................................	44
	8.7.5.		Color Shift........................................................................................................................................................	44
	8.7.6. ALS and CIL Transmittance .....................................................................................................................			44
	8.8.	Image Retention................................................................................................................................		45
	8.8.1. Quick Check Image Retention.................................................................................................................			46
	8.8.2. Short Term Image Retention...................................................................................................................			46
	8.8.3.		Middle Term...................................................................................................................................................	46
	8.8.4.		Long Term.......................................................................................................................................................	46
	8.9. Common Voltage (Vcom) Tuning Requirements ...................................................................			46
	8.10.	Color Washout.................................................................................................................................		47
	8.10.1. Testing Method and Condition ............................................................................................................			47
	8.10.2. Observation and Pass Criteria .............................................................................................................			48
	8.11. ODF Fill Amount and Suction Cup Testing.............................................................................			48
	8.12.	FOS Shimmering Specifications.................................................................................................		48
9.	ENVIRONMENTAL.......................................................................................................................			49
	9.1.	Shock Requirements........................................................................................................................		49
	9.2.	Sine Vibration Requirements.......................................................................................................		49

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Title: ERIS, DSPL, LCD MODULE, LGD, X34		DWG Number: 069-8326	___Rev. B___

9.3.		Temperature and Humidity..........................................................................................................		49
9.4.		Non-operational Environmental Requirements....................................................................		49
	9.4.1.		Low Temperature ........................................................................................................................................	49
	9.4.2.		High Temperature .......................................................................................................................................	49
	9.4.3. High Temperature and High Humidity...............................................................................................			50
	9.4.4.		Thermal Shock...............................................................................................................................................	50
9.5.		Operational Testing.........................................................................................................................		50
	9.5.1.		Low Temperature ........................................................................................................................................	50
	9.5.2.		High Temperature .......................................................................................................................................	50
	9.5.3.		Heat Soak.........................................................................................................................................................	50
	9.5.4. High Temperature and High Humidity...............................................................................................			50
	9.5.5. Four Corner Test (72 hrs – operating) ...............................................................................................			50
9.6.		Altitude ................................................................................................................................................		50
9.7.		Cold Soak .............................................................................................................................................		50
10.	FREQUENCY MARGIN..............................................................................................................			51
11.	RELIABILITY..............................................................................................................................			52
11.1.		4-Corner Peeling Test (Color Filter (CF) & TFT).................................................................		52
	11.1.1. 4-Corner Peel Test Procedure..............................................................................................................			53
11.2. LCD Assembly Ball-on-Ring Test...............................................................................................				53
	11.2.1.		BOR Test Configuration..........................................................................................................................	54
	11.2.2.		BOR Test Procedure.................................................................................................................................	55
11.3. LCD Assembly 4-Point Bend Test..............................................................................................				56
	11.3.1. 4-Point Bend Test Setup.........................................................................................................................			56
	11.3.2. 4-Point Bend Test Procedure...............................................................................................................			58
11.4. Polarizer Perimeter Delamination Test.................................................................................				60
11.5. LCD Display Column Spacer Test ..............................................................................................				60
11.6. Flexible Printed Circuit (FPC) Strain Relief ..........................................................................				61
11.7. Rigid Flex Bending Tests .............................................................................................................				61
11.8. Flex Cable to Glass Bonding Strength......................................................................................				62
11.9.		Spacer Rigidity Testing ................................................................................................................		62
11.10. Shielding ITO Sheet Resistance Heat Soak..........................................................................				63
11.11. Electrostatic Discharge (ESD) Test........................................................................................				64
11.12.			MTBF................................................................................................................................................	64
12.	COSMETIC REQUIREMENTS..................................................................................................			65
13. DISPLAY SERIAL NUMBERS AND LABELING....................................................................				65
14.	REGULATORY ............................................................................................................................			65
14.1. Product Safety (Environmental, Ergonomics, Safety and Health).................................				65
14.2. RoHS Compliance and other Substance Regulations .........................................................				65
14.3.		Halogen Free....................................................................................................................................		66
14.4. Environmental Markings and Recycling ................................................................................				66
14.5.		Product Safety .................................................................................................................................		66
14.6.		Ergonomics ......................................................................................................................................		66
14.7.		Electromagnetic Compatibility (EMC) ....................................................................................		66
	14.7.1.		Electromagnetic Emissions Requirements ....................................................................................	66
	14.7.2.		Electromagnetic Immunity Requirements.....................................................................................	66
15.	14.7.3.		EMC Production Audit Procedure......................................................................................................	66
	Acronyms....................................................................................................................................			67

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Apple Inc.	Size: Letter	Scale: NONE	Page 5 of 67
Title: ERIS, DSPL, LCD MODULE, LGD, X34		DWG Number: 069-8326	___Rev. B___

Table of Figures

FIGURE 1 LCD ASSEMBLY OVERVIEW	10
FIGURE 2 RESOLUTION OVERVIEW	12
FIGURE 3 RUBBING DIRECTIONS	12
FIGURE 4 SURFACE ROUGHNESS MEASUREMENT AREA	14
FIGURE 5 SURFACE ROUGHNESS MEASUREMENT TEST CONFIGURATIONS	14
FIGURE 6 GRINDING ZONE DEFINITIONS	16
FIGURE 7 GLASS CHIP PROFILE DEFINITION	16
FIGURE 8 CHAMFER OF GRINDING EDGE PROFILE	17
FIGURE 9 GRINDING PROFILE ZONE DEFINITIONS	17
FIGURE 10 POLARIZER OVERHANG REQUIREMENT	18
FIGURE 11 DRIVER IC EDGE QUALITY	19
FIGURE 12 UNIT ELECTRICAL BLOCK DIAGRAM (FOR REFERENCE ONLY)	20
FIGURE 13 CONNECTOR DRAWING (PCB SIDE)	21
FIGURE 14 WHITE SCREEN DISPLAY FIGURE 15 MOSAIC PATTERN DISPLAY	28
FIGURE 16 VERTICAL STRIPE PATTERN DISPLAY	28
FIGURE 17 LED CONTROLLER BLOCK DIAGRAM	30
FIGURE 18 LED CONTROLLER REFERENCE APPLICATION CIRCUITS	30
FIGURE 19 DISPLAY BACKLIGHT CONTROL DIAGRAM	31
FIGURE 20 ITO TRANSMITTANCE	33
FIGURE 21 OPTICAL MEASUREMENT SET-UP	36
FIGURE 22 OPTICAL MEASUREMENT POINTS	36
FIGURE 23 NEIGHBORING POINTS	37
FIGURE 24 VIEWING ANGLE DEFINITION	39
FIGURE 25 RESPONSE TIME MEASUREMENT	40
FIGURE 26 GRAY TO GRAY RESPONSE TIME	41
FIGURE 27 CROSS TALK MEASUREMENT	42
FIGURE 28 SURFACE REFLECTION MEASUREMENT	43
FIGURE 29 CAMERA/ALS/CIL PATTERN MEASUREMENT	45
FIGURE 30 IMAGE RETENTION CHECKING CONDITION	45
FIGURE 31 IMAGE RETENTION CHECKING PATTERNS	46
FIGURE 32 COLOR WASHOUT TEST LOCATIONS	47
FIGURE 33 4-CORNER PEEL TEST SETUP	52
FIGURE 34 4-CORNER PEEL TEST EXAMPLE	53
FIGURE 35 BALL AND SUPPORT RING GEOMETRY	54
FIGURE 36 EXAMPLE OF BALL ON RING TEST CONFIGURATION (INSTRON)	55
FIGURE 37 MODULE TEST LOCATIONS FOR BALL ON RING TEST	55
FIGURE 38 4 POINT BEND 90% SURVIVAL RATE ON WEIBULL PROBABILITY PLOT	56
FIGURE 394 POINT BEND TEST SETUP	57
FIGURE 40 4-POINT BEND HORIZONTAL GLASS CONFIGURATION	57
FIGURE 41 4-POINT BEND VERTICAL GLASS CONFIGURATION	58
FIGURE 42 4-POINT BEND FAILURE CASE OVERVIEW	59
FIGURE 43 STRAIN RELIEF ON THE FPC	61
FIGURE 44 FPC LEVEL BENDING TEST	62
FIGURE 45 FISHERSCOPE HM2000	63
FIGURE 46 SPACER RIGIDITY TEST	63

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Apple Inc.	Size: Letter	Scale: NONE	Page 6 of 67
Title: ERIS, DSPL, LCD MODULE, LGD, X34		DWG Number: 069-8326	___Rev. B___

Table of Tables

TABLE 1 UNIFIED DISPLAY FOR X34 GENERAL DESCRIPTION	11
TABLE 2 DISPLAY SUBSYSTEM CONNECTOR PIN ASSIGNMENT (FOR REFERENCE ONLY)	22
TABLE 3 EDID DATA (FOR REFERENCE ONLY)	23
TABLE 4 COLOR DATA REFERENCE	26
TABLE 5 LED REQUIREMENTS (CHARACTERIZED AT 20 MA)	29
TABLE 6 LED CONNECTION DATA	31
TABLE 7 LED CONNECTOR ASSIGNMENTS (FOR REFERENCE ONLY)	31
TABLE 8 ITO LAYER CHARACTERISTICS	32
TABLE 9 GENERAL OPTICAL CHARACTERISTICS	34
TABLE 10 CAMERA AND CIL/ALS REQUIREMENTS	43
TABLE 11 COLOR WASHOUT TEST CONDITIONS	47
TABLE 12 APPLE DEVELOPMENT DISPLAY LABEL REQUIREMENTS	65

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Title: ERIS, DSPL, LCD MODULE, LGD, X34		DWG Number: 069-8326	___Rev. B___

1. Order Of Precedence Of Documentation Authority

In the case of any conflict in any specification related to these parts, this order of precedence of authority shall apply:

•The Purchase Order

•This Specification

•Reference Documents

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Title: ERIS, DSPL, LCD MODULE, LGD, X34		DWG Number: 069-8326	___Rev. B___

2. Reference Documents

	NUMBER	TITLE
	069-7821	LCD, MCO, X34
	070-1191	Supplier Quality and Business Requirements, Apple
	070-0385	Apple Service Requirements
	069-7366	LCD Engineering Cosmetic Specification
	069-7370	X34 Unified Backlight Specification
	080-0855	Drop, Shock and Vibration
	080-0854	Four-Corner Temperature and Humidity Test
	062-0087	Packaging Finished Goods Shock and Vibration
	062-7993	Electromagnetic Emissions Requirements
	062-7994	Electromagnetic Immunity Requirements
	080-0840	EMC Production Audit Procedure
	062-2082	Vendor Packaging Procedure
	062-0585	FG Labeling Specification
	062-2111	Manufacturing Bar Code Specification
	062-2208	Static Breakage Test
	070-0371	Service: Packaging Standard
	070-0385	Service: Product Quality Requirements
	070-1191	Supplier Quality and Business Requirement
	070-1193	Barcode Label Specification
	074-0321	ESD Anti-static Label Specification
	13406-2.3	ISO Specification
	062-0093	Apple Corporate Specification, Mandatory Requirements for Product Safety
	IEC60950	Safety of Information Technology Equipment (International Standard)
	EN 60950	Safety of Information Technology Equipment (European Standard based on
		IEC 60950)
		Safety of Information Technology Equipment . Third Edition (US Standard
	UL 1950	based on IEC 60950) C22.2 No. 950 Safety of Information Technology
		Equipment. Third Edition (Canadian Standard based on IEC 60950)
		Tests for Flammability of Plastic Materials for Parts in Devices and
	UL 94	Appliances (UL standard for flame testing plastics. Includes test
		requirements for HB, V-2, V-1 and V-0 flame ratings)
	JIS K 5401	Pencil Scratch Tester for Coated Film 13406-2.3
	069-0279	Product Safety Requirements for Component Flat Panel Display Assemblies
	069-1111	Apple RoHS Compliance Specification
	080-2153	Apple’s RoHS Declaration of Conformity Procedure

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Title: ERIS, DSPL, LCD MODULE, LGD, X34		DWG Number: 069-8326	___Rev. B___

3. General Description

The board assembly drawing for X34 is shown in Figure 1. The LCD Module contains the following hardware. From this point forward the complete Unified Display for X34 13.3” TFT-LCD will be referred to as the unit.

•2x 0.3 mm glass (TFT and CF)

•Liquid Crystal

•Front and Rear Polarizers

•IC Drivers on glass

•PCB with rigid flex cables

•COG Spacer

•ITO Tape

•PCB Label / Insulation Tape

Figure 1 LCD Assembly Overview

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Title: ERIS, DSPL, LCD MODULE, LGD, X34		DWG Number: 069-8326	___Rev. B___

4. Functional Requirements

Table 1 provides a summary of the functionality and requirements of the LCD Module.

		Table 1 Unified Display for X34 General Description
	Category	Parameter	Specification	Reference
				Section
	General	LCD TYPE	Normally-Black Transmissive, Mobile-IPS a-SI TFT-LCD	4.1
		Product Code	TBA	N/A
		Manufacturer	LGD	N/A
		Manufacturer P/N	TBD	N/A
		Diagonal	13.3”
		Pixel Format	2560 (RGB stripe, H) x 1600 (V)	4.4
		Pixel Pitch	0.03725(V) x 3 x 0.11175(H) mm	4.3
		Color Depth	24-bits (8R, 8G, 8B)
		Packaging	Protective film on front & back polarizer w/ pull tab. LCD
			board packaged and sealed in ESD protection bags in class
			10k or better clean room with all the glass edge & flex/ PCB
	Electrical		protections
		Interface	5V input power, 4 lane DisplayPort interface	7.4.3
		Power	2.0W Typical (Web Black/White/Mosaic)	7.4.5
		Consumption	2.6W Worse Case (R/G/B)
		Inversion	Z-inversion (1-dot)	4.6
		Color Filter ITO	2.0 kΩ / square typical	7.12
	Mechanical	Sheet Resistance	2.5 kΩ / square maximum
		Active Area	286.08 mm (H) X 178.80 mm (V)	5.2
		Minimum Viewing	354.11 mm x 231.70 mm
		Area
		Module Outline	354.49 mm x 237.30 mm	5.1
		Size
		LCD Panel	iPEX:CAB CA 30 pins: 20525-130E-02	7.4.1
		Receptacle
		Cable Plug	iPEX:CAB CA 30 pins: 20523-130T-01	7.4.1
		Perimeter Flatness	0.3 mm
		Vertical Bending	-5 to 15
		Mass	125 (typical), max 130 g	5.3
	Environmental	Operating	0°C to +60°C	9.5
		Temperature
		(functioning)	25 +/- 3 0C and 60% +/- 5% relative humidity to maintain
		Storage
		Temperature	panel flatness

4.1.Display Model

The unit shall be Normally-Black, Transmissive, Mobile-IPS a-SI TFT-LCD with compensation film polarizer.

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4.2.Pixel Configuration

The unit shall be configured using a RGB Vertical Stripe, Vertical Chevron Dual Domain.

4.3.Pixel Pitch

The unit shall provide a sub pixel pitch no greater than 0.03725 mm x 0.11175 mm

4.4.Resolution

The unit shall be no less than 2560 (RGB stripe, H) x 1600 (V).

Figure 2 Resolution Overview

4.5.Rubbing Direction

The unit shall have Color Filter (CF) Rubbing from the bottom of the module to the top and shall have TFT Rubbing from the top of the module to the bottom as shown in Figure 3.

Figure 3 Rubbing Directions

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Title: ERIS, DSPL, LCD MODULE, LGD, X34		DWG Number: 069-8326	___Rev. B___

4.6.Interface and Driving Scheme

The unit shall provide a 5V 4-lane DisplayPort interface, requiring Hsync and Vsync signals, along with DE (Data Enable) mode, 1-dot Z-inversion scheme.

4.7.Front Surface Treatment

The front surface of the unit shall provide a Dry AR1.5 coating that meets the requirements specified herein.

5. Mechanical Requirements

5.1.Envelope Dimensions and Tolerances

The unit shall meet the dimensional requirements specified in 069-7821 LCD, MCO, X34.

5.2.Active Area

The unit shall meet the active area requirement specified in 069-7821 LCD, MCO, X34.

5.3.Mass

The unit mass shall not exceed the mass specified in 069-7821 LCD, MCO, X34.

5.4.Unit Flatness

The LCD module shall meet the flatness requirement specified in 069-7821 LCD, MCO, X34.

5.4.1. Flatness Measurement Requirements

All units shall require a flatness measurement after aging that meet the following requirements:

•Flatness measurement shall be completed within 24 hours after removal from aging chamber

•Post aging, unit shall be stored in 25 +/- 3 0C and 60% +/- 5% relative humidity

5.5.Exposed Area and Restrictions

The display module shall not have exposed edges or components, which may cause injury or damage during handling, inspection, assembly, and service. Exposed areas of the display module (those not protected or shielded by construction) must be insulated and otherwise protected to eliminate the possibility of electrical shorting or destructive ESD discharges (per Section 7.2) during handling, inspection, assembly, and service.

5.6.Edge Quality Requirements

The edge quality of the module shall be measured using an optical profiler such as the Keyence VK-9700 or equivalent.

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5.6.1.Surface Finish Requirements

5.6.1.1.Measurement Requirements

The following settings on the Keyence VK-9700 shall be used to measure the surface finish requirements.

•20x Objective

•Measurement Area: 0.25 mm x 0.1 mm

•Measurement Area distance from Glass Grinding Transition: 0.015 mm

Figure 4 Surface Roughness Measurement Area

Figure 5 Surface Roughness Measurement Test Configurations

5.6.1.2.Root Mean Square (Rq)

The ground edge surface Root Mean Square shall not exceed 2.25 um.

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Root Mean Square is defined as:

5.6.1.3.Maximum Height (Rz_max)

The ground edge Maximum Height shall not exceed 25 um where maximum height is defined as distance between the highest peak and the lowest valley.

5.6.2. Edge Defect Requirements

The module shall have an edge scan completed using the Meere Company X35 EDGE INSPECTION SYSTEM Model No. EI-AGTT-17.3.

The ground edge surface shall not exceed the following chip size requirements as specified for each grinding zone (see Figure 6).

•Zone 1: CF/TFT Glass Perimeter (0.6t)

o0 defects greater than 50 um in any direction

•Zone 2: Bottom TFT Ledge (0.3t)

o0 defects greater than 50 um in any direction

•Zone 3: CF Edge (Scribe / Break)

oX-Dimension: Defect shall not exceed 500 um

oY-Dimension: Defect shall not exceed 500 um

•Zone 4: Bottom TFT Corners (0.3t)

oX- Dimension: No defect length requirement

o Y-Dimension: Defect shall not exceed 150 um

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Figure 6 Grinding Zone Definitions

Glass Chip

Y-Dimension

X-Dimension

Figure 7 Glass Chip Profile Definition

5.6.3. Ground Surface Profile

The top and bottom chamfer size (Figure 8) of the glass shall meet the following requirements shown below in the specified zone (Figure 9):

•Zone 1: CF/TFT Glass Perimeter (0.6t): o 200 um ≥ chamfer size ≥ 60 um

•Zone 2: Bottom TFT Ledge (0.3t)

o 200 um ≥ chamfer size ≥ 50 um

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Figure 8 Chamfer of grinding edge profile

Figure 9 Grinding Profile Zone Definitions

5.7.Polarizer Edge Requirement

The laser cut polarizer edge with release lines removed shall be inspected using a variable pressure electron microscope to evaluate polarizer edge damage.

Polarizer overhang on the edge of the polarizer caused from laser cutting shall not exceed 15 um as shown in Figure 10.

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Figure 10 Polarizer Overhang Requirement

5.8.Mechanical Stack-up

The unit shall meet the stack-up requirements specified in 069-7821 LCD, MCO, X34.

	Mechanical Stack-up	Part #	Nominal Thickness
			(mm)
	Top Polarizer	Nitto Denko NATZ-AR1.5	0.166
	LCD Glass CF	-	0.30
	LCD Glass TFT	-	0.30
	Bottom Polarizer (glossy, APCF)	Nitto Denko APCFG3CVTT	0.162
	Total	-	0.928

5.9.Driver IC Mechanical Requirements

The driver IC shall meet the envelope requirements specified in 069-7821 LCD, MCO, X34.

5.9.1. Driver IC Edge Quality

The Driver IC chip depth shall not exceed 35 um on any edge as shown in Figure 11.

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Figure 11 Driver IC Edge Quality

5.9.2. Driver IC Top Surface Requirement

The top surface of the driver IC shall meet the following requirements as defined in ASME B.46.1-1995

•Ra≤0.015 um

•Rmax≤0.100 um

5.10.Unit Edge Ink Requirement

A black halogen free ink approved by Apple shall be applied to the edge of the unit in the location specified in 069-7821 LCD, MCO, X34.

6. Thermal Requirements

The unit white point color shift over temperature shall meet ∆ ! ! ≤ 0.008 from 30 °C to 50 °C.

7. Electrical Requirements

The unit shall meet the electrical requirements as specified in 069-8336, X34 Display TCON PCBA Engineering Requirements Specification (ERS), LGD.

7.1.Block Diagram

The unit shall meet the interface requirements as specified in 069-8336, X34 Display TCON PCBA Engineering Requirements Specification (ERS), LGD.

The block diagram is shown in Figure 12 as reference only.

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Figure 12 Unit Electrical Block Diagram (FOR REFERENCE ONLY)

7.2.Display PCB Schematics

The unit shall meet the schematic diagram as specified in 069-8336, X34 Display TCON PCBA Engineering Requirements Specification (ERS), LGD.

•Schematics shall be provided with the following information:

•Numbered by version and date coding, PDF searchable

•Include signal-net page-number tags where signal-nets transfer to other pages

•Resistors to show the value, tolerance, and package information

•Capacitors to show the value, rating, tolerance, material, and package information

•Inductors to show the value, rating (current & power), tolerance, and package information

•Fuses to show the rating and package information.

•ICs, Diodes, Inductors, Fuses, and Connectors must show the Manufacturer, Manufacturer’s Part Number, and package information.

•Test points

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7.3.Display PCB Layout

The unit shall meet PCB layout requirements specified in 069-8336, X34 Display TCON PCBA Engineering Requirements Specification (ERS), LGD. .

The PCB CAD layout files shall be provided for Apple approval shall be an Allegro .brd file format. The other acceptable format is Specctra format - AutoVue compatible.

7.4.Active Components

The unit shall active components requirements as specified in 069-8336, X34 Display TCON PCBA Engineering Requirements Specification (ERS), LGD.

7.4.1.Electrical Interface Requirements

7.4.1.1.Connector Requirements

The unit shall provide an IPEX 20525-130E-02 connector (1.0 mm thickness, lock-in type) as shown in Figure 13. Pin 1 on the connector is defined by the datum mark (triangle) located on the connector (see Figure 73).

Apple will provide an IPEX 20523-130T-01 mating connector (micro-coax type).

The unit connector and mating connect shall have palladium-nickel plating (silver color).

Figure 13 Connector Drawing (PCB Side)

7.4.1.2.Connector Pin Assignments

The unit shall meet connector pin assignments specified in 069-8336, X34 Display TCON PCBA Engineering Requirements Specification (ERS), LGD.

Table 2 presents the connector pin assignments and is for reference only.

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Title: ERIS, DSPL, LCD MODULE, LGD, X34		DWG Number: 069-8326	___Rev. B___