LG 42LB550A-TA, 42LB552A-TB Schematic

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Printed in KoreaP/NO : MFL68180003 (1402-REV00)
LED TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
CHASSIS : LB45B
MODEL : 42LB550A 42LB550A-TA
42LB552A 42LB552A-TB
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS .................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
TROUBLE SHOOTING GUIDE ............................................................... 13
BLOCK DIAGRAM .................................................................................. 24
DISASSEMBLY WORKING GUIDE ........................................................ 25
EXPLODED VIEW .................................................................................. 26
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau-
tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharg-
ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec-
trically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate-
rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir-
cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri-
ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when-
ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This specification is applied to the LB45B chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
ea ch dra wing and speci ficat ion by part number in
accordance with BOM.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. Model General Specification
* HDMI 1.4 with Deep Color is only apply for FHD Model
No. Item Specication Remarks
1. Market NON EU
2. Broadcasting system
PAL/SECAM B/G/D/K,
PAL I, NTSC-M PALB/B
3. Channel Storage
BAND PAL(BG,I) NTSC(M) China(DK)
VHF/UHF 01-C69 2~78 C1~C69
Cable S1~S47 1~71 S1~S47
4. Receiving system Upper Heterodyne
5. Video Input PAL, SECAM, NTSC Rear (2EA)
6. Component Input Y/Cb/Cr, Y/ Pb/Pr Rear (1EA), Except RGB PC Models
7. USB Input MP3, JPEG,Movie Side (1EA)
8. AV Audio Output RCA-RF/AV/HDMI Audio Output Rear (1EA)
9. D-SUB RGB-PC or Service Only Rear (1EA)
10. HDMI Input HDMI-DTV, Only PCM MODE AV input 2EA
11. Audio Input (1EA) AV&Component &PC 2EA
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5. Component Video Input(Y, PB, PR)
No Resolution H-freq. (kHz) V-freq. (Hz) Pixel clock (MHz) Proposed
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720*480 31.47 59.94 27.000 SDTV 480P
5 720*480 31.50 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45.00 60.00 74.250 HDTV 720P
9 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920*1080 33.72 59.94 74.176 HDTV 1080I
12 1920*1080 33.75 60.00 74.25 HDTV 1080I
13 1920*1080 56.25 50 148.5 HDTV 1080P
14 1920*1080 67.432 59.94 148.350 HDTV 1080P
15 1920*1080 67.5 60.00 148.5 HDTV 1080P
6. HDMI input
(PC-Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq. (kHz) V-freq. (Hz) Pixel clock (MHz) Proposed
1 640×480 31.469 59.94 25.17 VESA(VGA)
2 800×600 37.879 60.317 40.00 VESA(SVGA)
3 1024×768 48.363 60.004 65.00 VESA(XGA)
4 1280×768 47.776 59.87 79.5 VESA(WXGA)
5 1360×768 47.72 59.799 84.62 VESA(WXGA)
6 1366×768 47.7 60.00 84.62 WXGA
7 1280×1024 63.595 60.00 108.875 SXGA
8 1920×1080 66.647 59.988 138.625 WUXGA
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
7. HDMI input (DTV)
No. Resolution H-freq. (kHz) V-freq. (Hz) Pixel clock(MHz) Proposed Remarks
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
Spec. out but display.2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720*480 31.469 59.94 27 SDTV 480P
5 720*480 31.5 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27 SDTV 576P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45 60.00 74.25 HDTV 720P
9 1280*720 37.5 50.00 74.25 HDTV 720P
10 1920*1080 28.125 50.00 74.25 HDTV 1080I
11 1920*1080 33.72 59.94 74.176 HDTV 1080I
12 1920*1080 33.75 60.00 74.25 HDTV 1080I
13 1920*1080 56.25 50.00 148.5 HDTV 1080P
14 1920*1080 67.43 59.94 148.350 HDTV 1080P
15 1920*1080 67.5 60.00 148.5 HDTV 1080P
16 1920*1080 27 24.00 74.25 HDTV 1080P
17 1920*1080 33.75 30.00 74.25 HDTV 1080P
18 1920*1080 26.97 23.97 74.25 HDTV 1080P
19 1920*1080 33.716 29.976 74.25 HDTV 1080P
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED TV with
LB45B chassis.
2. Designation
(1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep 100-220 V,
50/60Hz.
(5)
The receiver must be operated for over 5 minutes prior to
the adjustment when module is in the circumstance of
above 15 °C.
In case of keeping module is in the circumstance of 0 °C, it
should be placed in the circumstance of above 15 °C for 2
hours.
In case of keeping module is in the circumstance of below
-20 °C, it should be placed in the circumstance of above 15
°C for 3 hours.
* Caution
When a still image is displayed for 20 minutes or longer
(especially where W/B scale is strong. Digital pattern 13ch
an d/ or Cr os s h at ch pa tt ern 0 9ch), there can s ome
afterimage in the black level area.
3. ADC Calibration
- An ADC calibration is automatically adjusted from DFT-Jig
- If it needs to adjust manually, refer to appendix.
* ADC Calibration Protocol (RS232)
Adjust Sequence
▪aa 00 00 [Enter Adjust Mode]
▪xb 00 40 [Component1 Input (480i)]
▪ad 00 10 [Adjust 480i Comp1]
▪xb 00 60 [RGB Input (1024*768)]
▪ad 00 10 [Adjust 1024*768 RGB]
▪aa 00 90 End Adjust mode
4. EDID Download
4.1. Overview
- It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.2. Equipment
- Since EDID data is embedded, EDID download JIG, HDMI
cable are not need.
4.3. Download method
- The EDID data is automatically saved.
■ 8BIT FHD Large Inch 42LB5**A Models(LB45B)
Checksum: Changeable b y total EDID data.
<Large FHD Model> LB45B- 42LB5xx
NO Item CMD 1 CMD 2 Data 0
Enter Adjust
MODE
Adjust
‘Mode In’
A A 0 0
When transfer the ‘Mode In’,
Carry the command.
ADC adjust
ADC
Adjust
A D 1 0
Automatically adjustment
(The use of a internal pattern)
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Area Option
3. ADC Calibration
9. W/V ADJUST
5. EDID D/L(AC3)
EDID D/L
HDMI1 NG
HDMI2 NG
Start
Reset
EDID D/L
HDMI1 OK
HDMI2 OK
Start
Reset
** HDMI 1 : 256Bytes
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01
10 01 18 01 03 80 A0 5A 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 01 01 45 40 61 40 01 01 81 80
30 01 01 D1 C0 01 01 02 3A 80 18 71 38 2D 40 58 2C
40 45 00 08 44 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 88 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01
80 02 03 28 F1 4F 90 07 01 16 02 03 11 12 13 04 14
90 05 20 22 1F 26 11 07 50 09 7F 07 83 01 00 00 68
A0 03 0C 00 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20
B0 40 80 35 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0
C0 2D 10 10 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14
D0 51 F0 16 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D
E0 80 18 71 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
EDID C/S data
FHD (8Bit)
HDMI
check sum (Hex)
Block 0 C0
Block 1
44 (HDMI1)
34 (HDMI2)
- 10 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5. White Balance Adjustment
5.1. Overview
5.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
1) Surrounding Temperature: 25 °C ± 5 °C
2) Warm-up time: About 5 Min◦
3) Surrounding Humidity: 20% ~ 80%
4) Befor e White balance adjustment, Keep po wer on
status, don’t power off.
5.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux.
Try to isolate adj. area into dark surrounding.
(2) Probe location: Color Analyzer(CA-210) probe should be
within 10 cm and perpendicular of the module surface
.
(80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during 5
Minutes.
2) In case of LCD, Back-light on should be checked using
no signal or Full-white pattern.
5.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer(During auto adj., RS-232C protocol is needed)
(3) Adjust Remote control
(4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
* Color Analyzer Matrix should be calibrated using CS-1000.
5.3. Equipment connection
** RS-232C Connection Method.
LB45S/LB45R → RGB cable → UART Jig → RS232C cable
and USB AM-BM cable → PC(RS232C Port)
5.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
(2) Adjustment Map
5.5. Adjustment method
5.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-Only key(or POWER ON key).
(2) Place optical probe on the center of the display.
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message, check
adjustment status of pre-set mode.(Cool, Medium, Warm)
(6) Remove probe and RS-232C cable.
W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
5.5.2. LED White balance table
- If Model is Polaris Model, G-gain fix is applied.
(1) Cool Mode
1) Purpose : Especially G-gain fix adjust leads to the
luminance enhancement. Adjust the color temperature
to reduce the deviation of the module color temperature.
2) Principle: To adjust the white balance without the saturation,
- Adjust the G gain more than 172 (If R gain or G gain is
more than 255, G gain can adjust less than 172) and
change the others(R/B Gain).(20LB45X model)
- Fix the G gain to 172(default data) and change the
others(R/B Gain).(over 22inch model)
3) Adjustment mode : mode - Cool
Co lor Anal yze r
Co mp ute r
Pattern Gen era to r
RS -232 C
RS- 232 C
RS- 232 C
Pro be
Sig nal Sou rce
* If TV internal pattern is used, not needed
RS-232C COMMAND
Explanation
CMD DATA ID
wb 00 00 Begin White Balance adjustment
wb 00 ff
End White Balance adjustment
(internal pattern disappears)
Adj. item
Command
(lower caseASCII)
Data Range
(Hex.)
Default
(Decimal)
CMD1 CMD2 MIN MAX
Cool
R Gain j g 00 C0 172
G Gain j h 00 C0 192
B Gain j i 00 C0 192
R Cut 64
G Cut 64
B Cut 64
Medium
R Gain j a 00 C0 192
G Gain j b 00 C0 192
B Gain j c 00 C0 192
R Cut 64
G Cut 64
B Cut 64
Warm
R Gain j d 00 C0 192
G Gain j e 00 C0 192
B Gain j f 00 C0 192
R Cut 64
G Cut 64
B Cut 64
- 11 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
(2) Medium / Warm Mode
1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
2) Principle: To adjust the white balance without the saturation,
- In Medium mode, Fix to G gain to 192 and change the
others(R/B Gain)(20LB45X model)
- Fix the one of R/G/B gain to 192(default data) and
decrease the others.
3) Adjustment mode : Two modes - Medium / Warm
5.6. Reference(White Balance Adjustment
coordinate and color temperature)
(1) Luminance: 204 Gray, 80IRE
(2) Standard color coordinate and temperature using CS-1000
(over 26 inch)
■ The spec of color temperatre and coordinate.
* Note : x,y coordinates are drifted about 0.007 after 30 mins
heat-run. So checking color coordinate within 5-min at
total assembly line, consider x,y coordinates might be
up to 0.007 than x,y target of each color temperature.
● W/B Table in process of aging time
- LGD Module
- AUO/ INX/ COST/ SHARP/ BOE Module which cool spec is
13000K
6. Tool Option setting & Inspection per
countries
(1) Press 'IN START' key at Factory Service remote control.
(2) Select 'Tool Option 1'.
(3) Punch in the number and press 'OK'. (Each of models has
their number)
(4) Correct 'Tool Option2' ~ 'Tool Option5'.
(5) Completed adjusting Tool option.
7. Ship-out mode check (In-stop)
After final inspection, press In-Stop key of the Adjustemnt
Remote Control and check that the unit goes to Stand-by mode.
8. AUDIO output check
8.1. Audio input condition
(1) RF input: Mono, 1 KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1 KHz sine wave signal (0.4 Vrms)
8.2. Specification
9. GND and HI-POT Test
9.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
9.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
Mode Color Temp Color coordinate Remark
Cool
(C50)
13,000 K
x = 0.271 (±0.015)
y = 0.270 (±0.015)
* Test signal
- Inner pattern for
W/B adjust
- External white
pattern (80IRE,
204gray)
Medium
(0)
9,300 K
x = 0.286 (±0.015)
y = 0.289 (±0.015)
Warm
(W50)
6,500 K
x = 0.313 (±0.015)
y = 0.329 (±0.015)
Item Min Typ Max Unit Remark
Audio practical max
Output, L/R (Distortion
=10% max Output)
4.5 5.0 6.0
W
Vrms
(1) Measurement condition
- EQ/AVL/Clear Voice: Off
(2) Speaker (8 Ω Impedance)
(normal line) March ~ December
Aging time Cool Medium Warm
color coordinate x y x y x y
Target 271 270 286 289 313 329
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
3 6-9 279 284 294 303 321 343
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
(normal line) January ~ Feburary
Aging time Cool Medium Warm
color coordinate x y x y x y
Target 271 270 286 289 313 329
1 0-2 286 295 301 314 328 354
2 3-5 284 290 299 309 326 349
3 6-9 282 287 297 306 324 346
4 10-19 279 283 294 302 321 342
5 20-35 276 278 291 297 318 337
6 36-49 274 275 289 294 316 334
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
cool med Warm
x y x y x Y
spec 271 270 286 289 313 329
target 278 280 293 299 320 339
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
9.3. Checkpoint
(1) Test voltage
- GND: 1.5 KV / min at 100 mA
- SIGNAL: 3 KV / min at 100 mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Tes t = POWER CORD GND a nd LIVE &
NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5 mArms
10. USB S/W Download
(optional, Service only)
* Warning : Do not Download on Power only mode
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work.
Otherwise USB data is automatically detected.
(3) Show the message “Copying files from memory”.
(4) Updating is starting.
(5) Updating Completed, the TV will restart automatically.
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn't
have a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1) Push "IN-START" key in service remote control.
2) Select "Tool Option 1" and push "OK" key.
3) Punch in the number. (Each model has their number.)
11. Optional adjustments
11.1. Manual ADC Calibration
■ Enter ‘EZ ADJUST’ mode by pressing ‘ADJ’ key.
Enter Internal ADC calibration mode by pressing ‘OK’ key at
‘3. ADC CALIBRATION’
* Caution: Using ‘P-ONLY’ button of the Factory SVC remote
control when turns TV on.
If you can’t success ADJUST ADC, please confirm ‘Support
Int. ADC’ at TOOL OPTION2.
11.2. Manual White balance Adjustment
11.2.1. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface.
(80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during 5
Minutes.
2) In case of LCD, Back-light on should be checked using
no signal or Full-white pattern.
11.2.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer(During auto adj., RS-232C protocol is needed)
(3) Adjust Remot control
(4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model: 217, Pattern: 78)
11.2.3. Adjustment
(1) Set TV in Adj. mode using POWER ON.
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
(3) Press ADJ key EZ adjust using adj. R/C 6. White-
Balance then press the cursor to the right (Key►). When
Key(►) is pressed 216 Gray interna l pattern will be
displayed.
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
POWER BOARD
Sound AMP
NTP7513
IC301
(
(
(
(
Module
JK101
Y,Pb,Pr In
Audio
Out
MST6841XP
5
9
4
3
10
11
Tuner SDA
Tuner SCL
TUNER
IF_AGC
B+
IR/KEY
40
24Mhz
98
99
44
43
IC50 2
Serial Flash
8Mbytes
IC50 3
EEPROM
24C64
IC501
30
LPF
33
18
21
P30 1
AV2 In
OP-AMP
IC302
x4 Gain
P70 1
P60 1/602
Audio L-Out
2 4 1
XXX
39
37 38
Audio R-Out
HDMI
SCL/SDA
48
115
50
51 113 112
Audio_SCL
Audio_SDA
LVDS
Output
P Dim
Inv. ON
RL On
P_ST 3.5V
M_3.3V
TU_3.3V
P_24V
IC701
MP20051
Main_1.2V
A_OUT_12V
10 11
7
8
9
38
I2S_MCLK
I2S_WS
I2S_SCK
I2S_SDO
P40 0
108
111
117
IR
KEY1
Led_PWR
102 105 101
53
52
45
85
84
EEP SDA
EEP SCL
94
95
97
96
SPI_CLK
SPI_DI
SPI_CZ
SPI_DO
S_AMP_24V
32
40
9
LPF
JK202
USB_5V
110
KEY2
ST_3.5V
5
P_12V
Q71 0
IC711
1.8V REG
Main_1.8V
Main_3.3V
Q72 0
AO3407A
Panel_Vcc
IC709
MP1497
Main_5V
To USB
USB_DN
USB_DP
IF_P
IF_N
31
35
10
13~1 5
3
JK203
JK204
IC401
To USB
7
TU_1.8V
19
20
Comp. R/L In
AV1 In
26,33,34 27,35,3622,20,24,33,34
77
62
54
41
30
18
9
116
107
100
XXX
IR Board
BLOCK DIAGRAM
- 14 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
900
200
400
410
420
540
521
530
820
501
500
120
502
121
LV1
A2
A7
A10
Set + Stand
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT1
MNTROUT
MNTLOUT
COMMONRIN
COMMONLIN
AV2RIN
AV2LIN
COMP_PR
COMP_PB
COMMON_VIN
AV2_VIN
R105
10K
C103
5600pF
50V
R109
12K
TP101
R107
220K
COMMON_RIN
MUTE_AOUT
R106
12K
MUTE_AOUT
R103
75
R108
10K
R104
220K
COMP_PR
MNT_ROUT
C105
5600pF
50V
MNT_LOUT
R110
1K
COMMON_LIN
COMP_PB
COMMON_VIN
P_12V
MNT_VOUT
R102
75
R111
1K
R123
220
DEBUG
R120
75
DEBUG
AV2_RIN
R116
220K
R114
10K
R117
10K
R118
12K
R113
220K
R115
12K
AV2_LIN
AV2_VIN
C106
10uF
16V
C104
10uF
16V
Q101
MMBT3904(NXP)
E
B
C
Q102
MMBT3904(NXP)
READY
E
B
C
Q103
MMBT3904(NXP)
E
B
C
Q104
MMBT3904(NXP)
READY
E
B
C
Q105
MMBT3904(NXP)
DEBUG
E
B
C
AV2_VIN
R122
0
OPT
R121
33
DEBUG
C101
470pF
50V
C102
470pF
50V
C107
470pF
50V
C108
470pF
50V
JK101
PPJ239-06
6J
7J
4J
8K
5K
8L
5L
5M
4N
6N
7N
7D
5D
8E
5E
8F
6F
4F
5G
4H
6H
7H
ZD110
20V
ZD10 7
20V
ZD109
20V
ZD105
20V
ZD104
20V
ZD10 6
20V
ZD108
SD05
READY
ZD100
SD05
READY
ZD102
SD05
READY
ZD101
SD05
READY
D102
D101
D104
D103
D105
D106
D107
D108
JK101-*1
PPJ239-26
GREEN & YELLOW
5J
[YL/GL]O-SPRING
6J
[YL/GL]E-LUG
4J
[YL/GL]CONTACT
7K
[BL]E-LUG-S
5K
[BL]O-SPRING
7L
[RD1]E-LUG-S
5L
[RD1]O-SPRING
5M
[WH1]O-SPRING
4N
[RD2]CONTACT
5N
[RD2]O-SPRING
6N
[RD2]E-LUG
6D
[WH2]E-LUG
5D
[WH2]O-SPRING
7E
[RD3]E-LUG-S
5E
[RD3]O-SPRING
7F
[YL]E-LUG-S
5F
[YL]O-SPRING
4F
[YL]CONTACT
5G
[WH3]O-SPRING
4H
[RD4]CONTACT
5H
[RD4]O-SPRING
6H
[RD4]E-LUG
R101
75
R150
75
READY
R151
75
READY
R112
75
1 7
INPUT1
COMPONENT / AV IN / AV AUDIO OUT
LB45B/LT5B
EAX65550501
POP NOISE
POP NOISE
V-OUT Buffer(DEBUG)
32/42LB550A
2013/08/15
Size check!!
Size check!!
Copyright © 2014 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
USB DOWN STR EAM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT2
GND
+5V_USB
ZD221
30V
READY
ZD220
30V
READY
USB_DP
USB_DN
C220
10uF
10V
OPT
C221
22uF
10V
R204
0
W/O UART IC
C203
0.1uF
With UART IC
IC201
MAX3232CDR
EAN41348201
With UART IC
3
C1-
2
V+
4
C2+
1
C1+
6
V-
5
C2-
7
DOUT2
8
RIN2
9
ROUT2
10
DIN2
11
DIN1
12
ROUT1
13
RIN1
14
DOUT1
15
GND
16
VCC
R205
0
W/O UART IC
JK201
KJA-PH-1-0177
3 M3_DETECT
4 M4
5 M5_GND
1 M1
6 M6
C205
0.1uF
With UART IC
C202
0.1uF
With UART IC
R202
100
With UART IC
DSUB_SCL
C201
0.1uF
P201
12505WS-04A00
DEBUG
1
2
3
4
5
P202
12507WS-04L
1
VCC
2
PM_RXD
3
GND
4
RM_TXD
5
GND
DSUB_SDA
R201
100
With UART IC
C204
0.1uF
With UART IC
HDMI1_D0-
JK203
14
NC
13
CEC
5
DATA1_SHIELD
20
SHIELD
12
CLK-
11
CLK_SHIELD
2
DATA2_SHIELD
19
HPD
18
+5V_POWER
10
CLK+
4
DATA1+
1
DATA2+
17
DDC/CEC_GND
9
DATA0-
8
DATA0_SHIELD
3
DATA2-
16
SDA
7
DATA0+
6
DATA1-
15
SCL
HDMI1_SCL
Q230
MMBT3904(NXP)
E
B
C
R230
10K
HDMI1_CK+
R233
2.7K
+5V_USB
R232
2.7K
HDMI1_D1-
HDMI1_D2+
HDMI1_D0+
HDMI1_CK-
HDMI1_SDA
HDMI1_D2-
HDMI1_HPD
R231
1K
HDMI1_D1+
HDMI2_CK+
HDMI2_HPD
HDMI2_SCL
+5V_USB
HDMI2_D1-
HDMI2_CK-
Q240
MMBT3904(NXP)
E
B
C
R242
1K
R241
10K
HDMI2_D0-
HDMI2_D2-
HDMI2_D1+
JK204
14
NC
13
CEC
5
DATA1_SHIELD
20
SHIELD
12
CLK-
11
CLK_SHIELD
2
DATA2_SHIELD
19
HPD
18
+5V_POWER
10
CLK+
4
DATA1+
1
DATA2+
17
DDC/CEC_GND
9
DATA0-
8
DATA0_SHIELD
3
DATA2-
16
SDA
7
DATA0+
6
DATA1-
15
SCL
HDMI2_SDA
R243
2.7K
R244
2.7K
HDMI2_D2+
HDMI2_D0+
ZD230
READY
ZD231
READY
ZD232
READY
ZD233
READY
R236
100
R237
100
ZD240
READY
ZD241
READY
ZD242
READY
ZD243
READY
R247
100
R248
100
L220
120OHM
JK202
3AU04S-305-ZC-(LG)
1234
5
+3.5V_ST
+3.5V_ST
R206
100
W/O UART IC
HDMI2_DET
+3.5V_ST
D242
30V
READY
R246
10K
R245
10K
D241
30V
READY
+3.5V_ST
HDMI1_DET
D234
IP4283CZ10-TBA
ESD_HDMI2_IP4283
3
GND_1
2
TMDS_CH1+
4
TMDS_CH2-
1
TMDS_CH1-
5
TMDS_CH2+
6
NC_1
7
NC_2
8
GND_2
9
NC_3
10
NC_4
D235
IP4283CZ10-TBA
ESD_HDMI2_IP4283
3
GND_1
2
TMDS_CH1+
4
TMDS_CH2-
1
TMDS_CH1-
5
TMDS_CH2+
6
NC_1
7
NC_2
8
GND_2
9
NC_3
10
NC_4
D244
IP4283CZ10-TBA
ESD_HDMI2_IP4283
3
GND_1
2
TMDS_CH1+
4
TMDS_CH2-
1
TMDS_CH1-
5
TMDS_CH2+
6
NC_1
7
NC_2
8
GND_2
9
NC_3
10
NC_4
D245
IP4283CZ10-TBA
ESD_HDMI2_IP4283
3
GND_1
2
TMDS_CH1+
4
TMDS_CH2-
1
TMDS_CH1-
5
TMDS_CH2+
6
NC_1
7
NC_2
8
GND_2
9
NC_3
10
NC_4
D234-*1
IP4294CZ10-TBR
ESD_HDMI_IP4294
1
8
2
7
3
6
4
5
9
10
D235-*1
IP4294CZ10-TBR
ESD_HDMI_IP4294
1
8
2
7
3
6
4
5
9
10
D244-*1
IP4294CZ10-TBR
ESD_HDMI_IP4294
1
8
2
7
3
6
4
5
9
10
D245-*1
IP4294CZ10-TBR
ESD_HDMI_IP4294
1
8
2
7
3
6
4
5
9
10
2 7
INPUT2
Close to SIDE_USB
USB(SIDE)
I2C Control
HDMI(REAR)
EAX65550501
32/42LB550A
2013/08/15
LB45B/LT5B
Copyright © 2014 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AUDIO
R357
6.8K
MNT_ROUT
Q351
MMBT3904(NXP)
E
B
C
R353
6.8K
R358
1K
C356
6800pF
50V
P_12V
MNT_R_AMP
MNT_L_AMP
R356
10K
C352 33pF 50V
IC302
AS324MTR-E1
3 INPUT1+
2 INPUT1-
4 VCC
1 OUT1
6 INPUT2-
5 INPUT2+
7 OUT2 8OUT3
9INPUT3-
10INPUT3+
11GND
12INPUT4+
13INPUT4-
14OUT4
R354 5.6K
Q350
MMBT3904(NXP)
E
B
C
P_12V
C351
6800pF
50V
R35 9
4.7 K
P_12V
R350
4.7K
C350
0.1uF
16V
C354
33pF
50V
MNT_LOUT
C355
0.1uF
16V
R352
10K
R355
5.6K
SPK_L+
SPK_R-
JP302
JP301
SPK_L-
JP304
SPK_R+
P301
SMAW250-H04R
1
.
2
3
4
JP303
SPK_R+
SPK_L-
C329
0.47uF
50V
0.1uF
C334
50V
0.1uF
C331
50V
C333
0.47uF
50V
SPK_R-
0.1uF
C330
50V
SPK_L+
0.1uF
C335
50V
R351 1K
C353
0.1uF
16V
R316
12
C306
33pF
50V
R307 100
C319
22000pF
50V
I2S_SCK
C315
22000pF
50V
C326
390pF
50V
R317
12
R314
12
R315
12
C31 2
1uF
10V
C302
0.1uF
16V
OPT
1uF
C303
10V
SW_RESET
AUAMP_SDA
0.1uF
C309
50V
0.1uF
C318
50V
+24V_AMP
C327
390pF
50V
I2S_WS
R306 100
C325
390pF
50V
C305
33pF
50V
R320
12
C301
0.1uF
16V
R318
12
C311
22000pF
50V
R311
100
READY
C314
1uF
10V
C308
22000pF
50V
R319
12
+24V_AMP
I2S_SDO
C328
390pF
50V
R313
12
I2S_MCLK
AUAMP_SCL
C320
1000pF
50V
R308
4.7K
R309
4.7K
+3.3V_M
0.1uF
C322
16V
R301 100
R302 100
R303 100
L301
BLM18PG121SN1D
+3.3V_M
R304 100
C321
10uF
6.3V
L304
10uH
ABCO
L305
10uH
ABCO
L303
10uH
ABCO
L306
10uH
ABCO
POWER_DET
C317
10uF
35V
C310
10uF
35V
L303-*1
10.0uH
TAIYO YUDEN
L304-*1
10.0uH
TAIYO YUDEN
L305-*1
10.0uH
TAIYO YUDEN
L306-*1
10.0uH
TAIYO YUDEN
R324
4.7K
R323
4.7K
R322
4.7K
R325
4.7K
IC301
NTP7514
3
NC_2
2
VDD_PLL
4
GND
1
NC_1
6
DVDD
5
NC_3
7
SDATA
8
WCK
9
BCK
10
SDA
11
SCL
12
FAULT
13
MONITOR_0
14
MONITOR_1
15
MONITOR_2
16
BST2B
17
PGND2B
18
OUT2B
19
PVDD2B
20
PVDD2A
21
OUT2A
22
PGND2A
23
BST2A
24
VDR2
25
AGND
26
NC_4
27
VDR1
28
BST1B
29
PGND1B
30
OUT1B
31
PVDD1B
32
PVDD1A
33
OUT1A
34
PGND1A
35
BST1A
36
RESET
37
AD
38
CLK_I
39
GND_IO
40
VDD_IO
41
[EP]GND
AUDIO
3 7
AUDIO_OUT AMP : GAIN X 4
SPK_R+
SPK_L-
SPK_L+
SPK_R-
SPEAKER_R
SPEAKER_L
0x54
EAX65550501
32/42LB550A
2013/08/15
LB45B/LT5B
Copyright © 2014 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TUNER & IR
IF_N
C402
47pF
50V
C403
47pF
50V
IF_P
C410
0.1uF
16V
IF_AGC
R412
100
+3.3V_M
C405
0.1uF
16V
C411
0.1uF
16V
+3.3V_TU
+3.3V_TU
L421
BLM18PG121SN1D
IR
+3.5V_ST
C423
0.1uF
16V
KEY1
KEY2
C425
0.1uF
16V
OPT
C422
0.1uF
OPT
C421
0.1uF
OPT
C426
100pF
50V
+3.5V_ST
C424
1000pF
50V
LED
C404
22uF
6.3V
100pF
C406
50V
TUNER_SCL
TUNER_SDA
L401
BLM18PG121SN1D
R421
10K
R422
10K
R407
2.2K
R408
2.2K
R405
33
R406
33
C412
10uF
6.3V
R413
10
PAL
R414
10
PAL
R413-*1
0
NTSC
R414-*1
0
NTSC
ZD401
SD05
ZD402
SD05
R423
3.3K
OPT
TU401
TDJH-G101D
PAL
47
SHIELD
6
IF[P]
7
IF[N]
8
NC_2
9
NC_3
1
B1[+3.3V]
2
NC_1
3
IF_AGC
4
SCL
5
SDA
A1
A1
B1
B1
P421
12507WR-10L
1
2
3
4
5
6
7
8
9
10
11
ZD404
IR_Zener
ZD403
LED_R_Zener
TDJH-H101F
TU403
NTSC
47
SHIELD
6
IF[P]
7
IF[N]
8
NC_2
9
NC_3
1
B1[+3.3V]
2
NC_1
3
IF_AGC
4
SCL
5
SDA
A1
A1
B1
B1
TUNER & IR
4 8
close to the tuner pin.
IR/LED+Control
IF
should be guarded by ground
Close to the tuner
EAX65550501
32/42LB550A
2013/08/15
LB45B/LT5B
Copyright © 2014 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
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