HP HLMA-DL00, HLMA-KH00, HLMA-KL00, HLMA-CH00, HLMA-CL00 Datasheet

H

T-13/4 (5 mm), T-1 (3 mm), High Performance AlInGaP LED Lamps

Technical Data

Features

•Outstanding LED Material Efficiency

•High Light Output over a Wide Range of Currents

•Low Electrical Power Dissipation

•CMOS/MOS Compatible

•Colors: 590/592 nm Amber, 615/617 nm and 622 nm Reddish-Orange

•Variety of Packages Available

Applications

•Outdoor Message Boards

•Safety Lighting Equipment

•Signaling Applications

•Emitter for Emitter/ Detector Applications

•Changeable Message Signs

•Portable Equipment

•Medical Equipment

•Automotive Lighting

•Alternative to Incandescent Lamps

Description

These untinted, non-diffused, solid state lamps utilize the latest absorbing/transparent substrate aluminum indium gallium phosphide (AS/TS AlInGaP) LED technology. These materials have a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. In addition, these LED lamps are at wavelengths ranging from amber to reddish orange and at viewing angles ranging from 7 to 45 degrees.

SunPower Series

HLMA-CX00 Series

HLMA-DX00 Series

HLMA-KX00 Series

HLMT-CX00 Series

HLMT-DX00 Series

5963-2323E

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Package Dimensions

5.08 (0.200)

4.57 (0.180)

9.19 (0.362)

8.43 (0.332)

12		.70 (0			.500)														0.89 (0.035)
11.94					(0.470)
																			0.64 (0.025)
					CATHODE														1.65 (0.065)
							LEAD													1.35	(0.053)
	23.0				MIN.
	(0.90)

1.27 NOM.

(0.050)

0.64 SQUARE

(0.025) NOMIMAL

6.10 (0.240)

5.59 (0.220)

(0.100)2.54 NOM.

A

NOTES:

1.ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).

2.THE LEADS ARE MILD STEEL, SOLDER DIPPED.

3.AN EPOXY MENISCUS MAY EXTEND ABOUT 1 MM (0.040") DOWN THE LEADS, UNLESS OTHERWISE NOTED.

3.18 (0.125)

5.08 (0.200) 2.67 (0.105)

4.57 (0.180)

																		3.43 (0.135)
																		2.92 (0.115)
9.19			(0.362)
																		4.70 (0.185)
																6.35 (0.250)
8.43 (0.332)
																		4.19 (0.165)
																5.58 (0.220)
															0.89 (0.035)		1.02
															0.64 (0.025)			NOM.
																(0.040)

(0.018)0.45 SQUARE NOMINAL

CATHODE			0.102 (0.004)
				MAX. TYP.
	LEAD				25.40
	NOTE 1				(1.00)MIN.
25.40	MIN.
(1.00)
			1.27		NOM.
			(0.050)

(0.100)2.54 NOM.

1.27 NOM.

(0.050)

0.46 SQUARE

(0.018) NOMIMAL

CATHODE

6.10 (0.240)

5.59 (0.220)

(0.100)2.54 NOM.

B C

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Absolute Maximum Ratings at TA = 25°C

(T-13/4 Package)

DC Forward Current[1,4,5] ...........................................................	50 mA
Peak Forward Current[2] ...........................................................	200 mA
Time Average Input Power[2] ...................................................	103 mW
Transient Forward Current[3] (10 μs Pulse) ..............................	500 mA
Reverse Voltage (IR = 100 μA).........................................................	5 V
Operating Temperature Range ..........................................	-40 to 100°C
Storage Temperature .........................................................	-40 to 120°C
Junction Temperature .................................................................	130°C
Soldering Temperature ..........................................	260°C for 5 seconds

[1.59 mm (0.06 in.) below seating plane]

Notes:

1.Derate linearly as shown in Figure 4.

2.Any pulsed operation cannot exceed the Absolute Max Peak Forward Current or the Max Allowable Time Average Power as specified in Figure 5.

3.The transient peak current is the maximum nonrecurring peak current the device can withstand without damaging the LED die and wire bonds.

4.Drive Currents between 10 and 30 mA are recommended for best long term performance.

5.Operation at currents below 10 mA is not recommended, please contact your Hewlett-Packard sales representative.

Absolute Maximum Ratings at TA = 25°C (T-1 Package)

DC Forward Current[1,4,5] ...........................................................	50 mA
Peak Forward Current[2] ...........................................................	200 mA
Time Average Input Power[2] ...................................................	103 mW
Transient Forward Current[3] (10 μs Pulse) ..............................	500 mA
Reverse Voltage (IR = 100 μA).........................................................	5 V
Operating Temperature Range ..........................................	-40 to 100°C
Storage Temperature .........................................................	-40 to 100°C
Junction Temperature ..................................................................	110°C
Solder Temperature ................................................	260°C for 5 seconds

[1.59 mm (0.06 in.) below seating plane]

Notes:

1.Derate linearly as shown in Figure 4.

2.Any pulsed operation cannot exceed the Absolute Max Peak Forward Current or the Max Allowable Time Average Power as specified in Figure 5.

3.The transient peak current is the maximum nonrecurring peak current the device can withstand without damaging the LED die and wire bonds.

4.Drive Currents between 10 mA and 30 mA are recommended for best long term performance.

5.Operation at currents below 10 mA is not recommended, please contact your Hewlett-Packard sales representative.

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