H
Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications
Technical Data
Features
•Dual Marked with Device Part Number and DESC Drawing Number
•Manufactured and Tested on a MIL-PRF-38534 Certified Line
•QML-38534, Class H and K
•Five Hermetically Sealed Package Configurations
•Performance Guaranteed, Over -55°C to +125°C
•High Speed: Typically 400 kBit/s
•9 MHz Bandwidth
•Open Collector Output
•2-18 Volt VCC Range
•1500 Vdc Withstand Test Voltage
•High Radiation Immunity
•6N135, 6N136, HCPL-2530/ -2531, Function Compatibility
•Reliability Data
Applications
•Military and Space
•High Reliability Systems
•Vehicle Command, Control, Life Critical Systems
•Line Receivers
•Switching Power Supply
•Voltage Level Shifting
•Analog Signal Ground Isolation (see Figures 7, 8, and 13)
•Isolated Input Line Receiver
•Isolated Output Line Driver
•Logic Ground Isolation
•Harsh Industrial Environments
•Isolation for Test Equipment Systems
Description
These units are single, dual and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DESC Drawing. All devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DESC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits.
Each channel contains a GaAsP light emitting diode which is optically coupled to an integrated photon detector. Separate connections for the photodiodes and output transistor collectors
4N55*
5962-87679 HCPL-655X HCPL-553X 5962-90854 HCPL-653X HCPL-550X
*See matrix for available extensions.
improve the speed up to a hundred times that of a conventional phototransistor optocoupler by reducing the base-collector capacitance.
These devices are suitable for wide bandwidth analog applications, as well as for interfacing TTL to LSTTL or CMOS. Current Transfer Ratio (CTR) is 9% minimum at IF = 16 mA. The 18 V VCC
Truth Table
(Positive Logic)
Input |
Output |
On (H) |
L |
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Off (L) |
H |
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Functional Diagram
Multiple Channel Devices
Available
VCC |
VB |
VO |
GND |
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
5965-3002E |
1-559 |
capability will enable the designer to interface any TTL family to CMOS. The availability of the base lead allows optimized gain/ bandwidth adjustment in analog applications. The shallow depth of the IC photodiode provides better radiation immunity than conventional phototransistor couplers.
These products are also available with the transistor base node connected to improve common mode noise immunity and ESD susceptibility. In addition, higher CTR minimums are available by special request.
Package styles for these parts are 8 and 16 pin DIP through hole (case outlines P and E respectively), 16 pin DIP flat pack (case outline F), and leadless ceramic
chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options, see Selection Guide Table for details. Standard Military Drawing (SMD) parts are available for each package and lead style.
similarities give justification for the use of data obtained from one part to represent other part’s performance for die related reliability and certain limited radiation test results.
Because the same functional die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These
8 Pin Ceramic DIP Single
Channel Schematic
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ICC |
8 |
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2 |
IF |
VCC |
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ANODE |
IB |
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+ |
7 |
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VF |
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VB |
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IO |
6 |
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– |
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VO |
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CATHODE |
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3 |
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5 |
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GND |
Note base pin 7.
Selection Guide–Package Styles and Lead Configuration Options
Package |
16 Pin DIP |
8 Pin DIP |
8 Pin DIP |
16 Pin Flat Pack |
20 Pad LCCC |
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Lead Style |
Through Hole |
Through Hole |
Through Hole |
Unformed Leads |
Surface Mount |
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Channels |
2 |
1 |
2 |
4 |
2 |
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Common Channel Wiring |
None |
None |
VCC GND |
VCC GND |
None |
HP Part # & Options |
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Commercial |
4N55* |
HCPL-5500 |
HCPL-5530 |
HCPL-6550 |
HCPL-6530 |
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MIL-PRF-38534, Class H |
4N55/883B |
HCPL-5501 |
HCPL-5531 |
HCPL-6551 |
HCPL-6531 |
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MIL-PRF-38534, Class K |
HCPL-257K |
HCPL-550K |
HCPL-553K |
HCPL-655K |
HCPL-653K |
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Standard Lead Finish |
Gold Plate |
Gold Plate |
Gold Plate |
Gold Plate |
Solder Pads |
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Solder Dipped |
Option #200 |
Option #200 |
Option #200 |
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Butt Cut/Gold Plate |
Option #100 |
Option #100 |
Option #100 |
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Gull Wing/Soldered |
Option #300 |
Option #300 |
Option #300 |
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SMD Part # |
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Prescript for all below |
5962- |
5962- |
5962- |
5962- |
5962- |
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Either Gold or Solder |
8767901EX |
9085401HPX |
8767902PX |
8767904FX |
87679032X |
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Gold Plate |
8767901EC |
9085401HPC |
8767902PC |
8767904FC |
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Solder Dipped |
8767901EA |
9085401HPA |
8767902PA |
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87679032A |
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Butt Cut/Gold Plate |
8767901UC |
9085401HYC |
8767902YC |
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Butt Cut/Soldered |
8767901UA |
9085401HYA |
8767902YA |
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Gull Wing/Soldered |
8767901TA |
9085401HXA |
8767902XA |
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*JEDEC registered part.
1-560
Functional Diagrams
16 Pin DIP |
8 Pin DIP |
8 Pin DIP |
16 Pin Flat Pack |
20 Pad LCCC |
Through Hole |
Through Hole |
Through Hole |
Unformed Leads |
Surface Mount |
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2 Channels |
1 Channel |
2 Channels |
4 Channels |
2 Channels |
1 |
VB1 |
16 |
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1 |
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16 |
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15 |
14 |
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VCC2 |
VB2 |
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1 |
VCC |
8 |
1 |
VCC |
8 |
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19 |
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13 |
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2 |
VOC1 |
15 |
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2 |
VCC |
15 |
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VO2 |
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VO1 |
20 |
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12 |
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2 |
VB |
7 |
2 |
7 |
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GND2 |
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3 |
VO1 |
14 |
VOUT |
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VO2 |
3 |
VO1 |
14 |
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VCC1 |
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3 |
6 |
3 |
6 |
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2 |
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10 |
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VO1 |
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4 |
GND |
13 |
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4 |
VO2 |
13 |
3 |
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VB1 |
9 |
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4 |
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5 |
4 |
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5 |
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GND1 |
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5 |
VB2 |
12 |
GND |
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GND |
5 |
VO3 |
12 |
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7 |
8 |
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6 |
VCC2 |
11 |
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6 |
VO4 |
11 |
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7 |
GND |
10 |
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7 |
GND |
10 |
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8 |
VO2 |
9 |
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8 |
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9 |
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Note: 8 pin DIP and flat pack devices have common VCC and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages have isolated channels with separate VCC and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790) |
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8.13 (0.320) |
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20.83 (0.820) |
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MAX. |
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0.89 (0.035) |
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1.65 (0.065) |
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4.45 (0.175) |
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MAX. |
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0.51 (0.020) |
3.81 (0.150) |
0.20 (0.008) |
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MIN. |
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MIN. |
0.33 (0. |
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2.29 (0.090) |
0.51 (0.020) |
7.36 (0.290) |
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7.87 (0.310) |
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2.79 (0.110) |
MAX. |
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NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Leaded Device Marking |
Leadless Device Marking |
HP LOGO |
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HP QYYWWZ |
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COMPLIANCE INDICATOR,* |
HP LOGO |
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HP P/N |
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XXXXXX |
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DATE CODE, SUFFIX (IF NEEDED) |
HP P/N |
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DESC SMD* |
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XXXXXXX |
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PIN ONE/ |
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DESC SMD* |
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XXX USA |
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COUNTRY OF MFR. |
ESD IDENT |
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PIN ONE/ |
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* 50434 |
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HP FSCN* |
COUNTRY OF MFR. |
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ESD IDENT |
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* QUALIFIED PARTS ONLY |
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HP QYYWWZ |
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COMPLIANCE INDICATOR,* |
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XXXXXX |
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DATE CODE, SUFFIX (IF NEEDED) |
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* XXXX |
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DESC SMD* |
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XXXXXX |
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DESC SMD* |
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USA 50434 |
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HP FSCN* |
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ONLY |
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*QUALIFIEDPARTS ONLY |
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1-561
Outline Drawings (contd.)
16 Pin Flat Pack, 4 Channels
7.24 (0.285)
6.99 (0.275) 2.29 (0.090) MAX.
1.27 (0.050) REF.
11.13 (0.438)
10.72 (0.422)
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0.46 (0.018) |
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0.36 (0.014) |
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8.13 (0.320) |
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2.85 (0.112) |
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MAX. |
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MAX. |
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0.88 (0.0345) |
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0.31 (0.012) |
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MIN. |
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0.23 (0.009) |
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0.89 (0.035) |
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5.23 |
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9.02 (0.355) |
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0.69 (0.027) |
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(0.206) |
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8.76 (0.345) |
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MAX. |
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NOTE: DIMENSIONS IN MILLIMETERS (INCHES). |
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20 Terminal LCCC Surface Mount, 2
Channels
1.78 (0.070) |
2.03 (0.080) |
8.70 (0.342) |
9.10 (0.358) |
4.95 (0.195) |
5.21 (0.205) |
8.70 (0.342)
9.10(0.358)
4.95(0.195)
5.21(0.205)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
TERMINAL 1 IDENTIFIER 2.16 (0.085)
1.78 (0.070) |
METALIZED |
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CASTILLATIONS (20 PLCS) |
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2.03 (0.080) |
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0.64 (0.025) 0.51 (0.020)
(20 PLCS)
1.52 (0.060)
2.03 (0.080)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
8 Pin DIP Through Hole, 1 and 2
Channel
9.40 (0.370) |
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8.13 (0.320) |
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9.91 (0.390) |
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MAX. |
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0.76 (0.030) |
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7.16 (0.282) |
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1.27 (0.050) |
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7.57 (0.298) |
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4.32 (0.170) |
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MAX. |
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0.51 (0.020) |
3.81 (0.150) |
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MIN. |
0.20 (0.008) |
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MIN. |
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0.33 (0.013) |
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7.36 (0.290) |
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2.29 (0.090) |
0.51 (0.020) |
7.87 (0.310) |
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2.79 (0.110) |
MAX. |
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NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1-562