HP HCPL-4562, HCNW-4562 Datasheet

H

High Bandwidth, Analog/Video

Optocouplers

Technical Data

HCPL-4562

HCNW4562

Features	Applications
• Wide Bandwidth[1]:	• Video Isolation for the
17 MHz (HCPL-4562)	Following Standards/
9 MHz (HCNW4562)	Formats: NTSC, PAL,
• High Voltage Gain[1]:	SECAM, S-VHS, ANALOG
2.0 (HCPL-4562)	RGB

	3.0 (HCNW4562)	• Low Drive Current Feedback
	• Low GV Temperature	Element in Switching Power
	Coefficient: -0.3%/°C	Supplies, e.g., for ISDN
	• Highly Linear at Low Drive	Networks
		• A/D Converter Signal
	Currents
	• High-Speed AlGaAs Emitter	Isolation
		• Analog Signal Ground
	• Safety Approval
		Isolation
	UL Recognized - 2500 V rms
		• High Voltage Insulation
	for 1 minute (5000 V rms for
	1 minute for HCPL-
	4562#020 and HCNW4562)	Functional Diagram
	per UL 1577
	CSA Approved
	VDE 0884 Approved	NC	1	8	VCC
	-VIORM = 1414 V peak for
	HCNW4562	ANODE	2	7	VB
	BSI Certified (HCNW4562)
	• Available in 8-Pin DIP and	CATHODE	3	6	VO
	Widebody Packages
		NC	4	5	GND

Description

The HCPL-4562 and HCNW4562 optocouplers provide wide bandwidth isolation for analog signals. They are ideal for video isolation when combined with their application circuit (Figure 4). High linearity and low phase shift are achieved through an AlGaAs LED combined with a high speed detector. These single channel optocouplers are available in 8-Pin DIP and Widebody package configurations.

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

5965-3579E

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Selection Guide

Single Channel Packages

8-Pin DIP	Widebody
(300 Mil)	(400 Mil)
HCPL-4562	HCNW4562

Ordering Information

Specify Part Number followed by Option Number (if desired).

Example:

HCPL-4562#XXX

020 = UL 5000 V rms/1 Minute Option*

300 = Gull Wing Surface Mount Option†

500 = Tape and Reel Packaging Option

Option data sheets are available. Contact your Hewlett-Packard sales representative or authorized distributor for information.

*For HCPL-4562 only.

†Gull wing surface mount option applies to through hole parts only.

Schematic

		ICC	8
	2	IF	VCC
	ANODE
	+
	VF	IO	6
	–
			VO
	CATHODE
	3

5

GND

IB

7 VB

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Package Outline Drawings

8-Pin DIP Package (HCPL-4562)

9.65 ± 0.25

(0.380 ± 0.010)

TYPE NUMBER

8

7

6

5

OPTION NUMBER*

HP XXXXZ

DATE CODE

YYWW

UR

UL

1

2

3

4

RECOGNITION

1.19 (0.047) MAX.

1.78 (0.070) MAX.

4.70 (0.185) MAX.

0.51 (0.020) MIN.

2.92 (0.115) MIN.

1.080 ± 0.320

0.65 (0.025) MAX.

(0.043 ± 0.013)

2.54 ± 0.25

(0.100 ± 0.010)

7.62 ± 0.25

(0.300 ± 0.010)

6.35 ± 0.25

(0.250 ± 0.010)

5° TYP.				0.254	+ 0.076
					- 0.051
			(0.010		+ 0.003)
					- 0.002)

DIMENSIONS IN MILLIMETERS AND (INCHES).

* MARKING CODE LETTER FOR OPTION NUMBERS. "L" = OPTION 020

"V" = OPTION 060

OPTION NUMBERS 300 AND 500 NOT MARKED.

8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-4562)

																													PAD LOCATION (FOR REFERENCE ONLY)
							9.65 ± 0.25																																	1.016 (0.040)
						(0.380 ± 0.010)
																																															1.194 (0.047)
			8					7							6				5
																																																										4.826					TYP.
																																																										(0.190)
																									6.350 ± 0.25
																									(0.250 ± 0.010)																																						9.398 (0.370)
																																																															9.906 (0.390)
		1				2							3					4
																																																																0.381 (0.015)
																													1.194 (0.047)																																			0.635 (0.025)
																													1.778 (0.070)
																		1.780											9.65 ± 0.25
1.19																						(0.070)																						(0.380 ± 0.010)
																								MAX.																					7.62 ± 0.25
(0.047)
																																									(0.300 ± 0.010)
MAX.																																																																			+ 0.076
																																																																	0.254
																																																																			- 0.051
																									4.19			MAX.																																			(0.010				+ 0.003)
																		(0.165)
																																																																			- 0.002)

1.080	± 0.320
																								0.635 ± 0.25
(0.043	± 0.013)
																						(0.025 ± 0.010)								12° NOM.
							2.54						0.635		± 0.130
	(0.100)												(0.025		± 0.005)

BSC

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

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8-Pin Widebody DIP Package (HCNW4562)

						11.15 ± 0.15																						11.00
					(0.442 ± 0.006)																							(0.433) MAX.
																											9.00 ± 0.15
	8						7				6				5								(0.354 ± 0.006)
																				TYPE NUMBER
									HP											DATE CODE
					HCNWXXXX
									YYWW
	1						2				3				4
																										10.16 (0.400)
																												TYP.

1.55

(0.061)

MAX. 7° TYP. 0.254 + 0.076 - 0.0051

+ 0.003) (0.010 - 0.002)

																																					5.10 MAX.
																																			(0.201)
																														3.10 (0.122)
																															3.90 (0.154)				0.51 (0.021) MIN.
	2.54 (0.100)
	TYP.
1.78	± 0.15																						0.40 (0.016)														DIMENSIONS IN MILLIMETERS (INCHES).
(0.070	± 0.006)																												0.56 (0.022)

8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW4562)

						11.15 ± 0.15																PAD LOCATION (FOR REFERENCE ONLY)
					(0.442 ± 0.006)
																5
	8						7				6
																																						6.15			TYP.
																																						(0.242)
																			9.00 ± 0.15
																			(0.354 ± 0.006)
																																									12.30 ± 0.30
																																									(0.484 ± 0.012)
	1						2				3				4
																																						0.9
															1.3

(0.051)	(0.035)

1.78 ± 0.15

(0.070 ± 0.006)

																			1.55														12.30 ± 0.30
																						(0.061)																	(0.484 ± 0.012)
																							MAX.																	11.00 MAX.
																																			(0.433)
																								4.00				MAX.
																							(0.158)
																																						1.00 ± 0.15
																	2.54											0.75 ± 0.25								(0.039 ± 0.006)														+ 0.076
(0.100)																												(0.030 ± 0.010)																					0.254 - 0.0051
																	BSC																																(0.010	+ 0.003)
DIMENSIONS IN MILLIMETERS (INCHES).																																																		- 0.002)
																																														7° NOM.

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

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Solder Reflow Temperature Profile (Gull Wing Surface Mount Option Parts)

TEMPERATURE – °C

260

240

T = 145°C, 1°C/SEC

220

T = 115°C, 0.3°C/SEC

200

180

160

140

120

100

80

T = 100°C, 1.5°C/SEC

60

40

20

0

0

1

2

3

4

5

6

7

8

9

10

11

12

TIME – MINUTES

Note: Use of nonchlorine activated fluxes is highly recommended.

Regulatory Information	CSA
The devices contained in this data	Approved under CSA Component
sheet have been approved by the	Acceptance Notice #5, File CA
following organizations:	88324.

UL	VDE
Recognized under UL 1577,	Approved according to VDE
Component Recognition	0884/06.92 (HCNW4562 only).
Program, File E55361.

BSI

Certification according to BS415:1994

(BS EN60065:1994); BS EN60950:1992 (BS7002:1992) and

EN41003:1993 for Class II applications (HCNW4562 only).

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Insulation and Safety Related Specifications

		8-Pin DIP	Widebody
		(300 Mil)	(400 Mil)
Parameter	Symbol	Value	Value	Units	Conditions
Minimum External	L(101)	7.1	9.6	mm	Measured from input terminals to
Air Gap (External					output terminals, shortest distance
Clearance)					through air.
Minimum External	L(102)	7.4	10.0	mm	Measured from input terminals to
Tracking (External					output terminals, shortest distance
Creepage)					path along body.
Minimum Internal		0.08	1.0	mm	Through insulation distance,
Plastic Gap					conductor to conductor, usually the
(Internal Clearance)					direct distance between the photo-
					emitter and photodetector inside the
					optocoupler cavity.
Minimum Internal		NA	4.0	mm	Measured from input terminals to
Tracking (Internal					output terminals, along internal cavity.
Creepage)
Tracking Resistance	CTI	200	200	Volts	DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)
Isolation Group		IIIa	IIIa		Material Group
					(DIN VDE 0110, 1/89, Table 1)

Option 300 - surface mount classification is Class A in accordance with CECC 00802.

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