HIT 2SK3157 Datasheet

2SK3157
Silicon N Channel MOS FET High Speed Power Switching
Features
Low on-resistance
RDS = 50 m typ.
High speed switching
4 V gate drive device can be driven from 5 V source
Outline
ADE-208-769A (Z)
2nd. Edition
Februaty 1999
TO–220FM
G
D
1. Gate
2. Drain
1
2
3
S
3. Source
2SK3157
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body-drain diode reverse drain current I Avalanche current I Avalanche energy E Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note3
Note3
AR
Note1
Note2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10 µs, duty cycle 1%
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg 50
Electrical Characteristics (Ta = 25°C)
150 V ±20 V 20 A 80 A 20 A 20 A 30 mJ 35 W
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V Gate to source breakdown voltage V Gate to source leak current I Zero gate voltege drain current I Gate to source cutoff voltage V Static drain to source on state R resistance R
(BR)DSS
(BR)GSS
GSS
DSS
GS(off)
DS(on)
DS(on)
150 V ID = 10 mA, VGS = 0 ±20——V I
= ±100 µA, VDS = 0
G
——±10 µAVGS = ±16 V, VDS = 0 ——10µAVDS = 150 V, VGS = 0
1.0 2.5 V ID = 1 mA, VDS = 10 V —5070m ID = 10 A, VGS = 10 V
—6080m ID = 10 A, VGS = 4 V Forward transfer admittance |yfs|1322—S ID = 10 A, VDS = 10 V Input capacitance Ciss 1750 pF VDS = 10 V Output capacitance Coss 600 pF VGS = 0 Reverse transfer capacitance Crss 300 pF f = 1 MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body–drain diode forward voltage V Body–drain diode reverse
recovery time
t
d(on)
r
d(off)
f
DF
rr
18 ns ID = 10 A, VGS = 10 V
125 ns RL = 3
400 ns
190 ns
0.9 V IF = 20 A, VGS = 0
170 ns IF = 20 A, VGS = 0
diF/ dt = 50 A/ µs
Note: 4. Pulse test
Note4
Note4
Note4
2
Main Characteristics
2SK3157
Power vs. Temperature Derating
40
30
20
10
Channel Dissipation Pch (W)
0
50 100 150 200
Case Temperature Tc (°C)
Typical Output Characteristics
10 V
20
5 V
16
4 V
Pulse Test
3 V
500 200
100
50
D
20 10
5 2
Operation in
1
0.5
0.2
0.1
0.05
0.1
this area is limited by R
Ta = 25°C
0.3
Drain Current I (A)
DC Operation
(Tc = 25°C)
DS(on)
1
3
Drain to Source Voltage V (V)
Typical Transfer Characteristics
20
Maximum Safe Operation Area
V = 10 V
DS
Pulse Test
16
10 µs
100 µs
PW = 10 ms(1shot)
1 ms
10
30
DS
1000
300100
D
12
8
Drain Current I (A)
4
0
246810
Drain to Source Voltage V (V)
V = 2.5 V
GS
2 V
DS
D
12
75°C
8
Drain Current I (A)
4
0
12345
Gate to Source Voltage V (V)
25°C
Tc = –25°C
GS
3
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