Texas Instruments CD74HCT4094M96, CD74HCT4094E, CD74HC4094PWR, CD74HC4094PW, CD74HC4094NSR Datasheet

...
CD74HC4094,
/ j
[ /Title (CD74H C4094, CD74H CT4094 )
Sub-
ect (High Speed CMOS Logic 8-
Data sheet acquired from Harris Semiconductor SCHS211
November 1997
8-Stage Shift and Store Bus Register, Three-State
Features
• Buffered Inputs
• Separate Serial Outputs Synchronous to Both Positive and Negative Clock Edges For Cascading
• Fanout (Over Temperature Range)
• Wide Operating Temperature Range . . . -55
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
= 30%, NIH = 30% of V
IL
at VCC = 5V
o
CD74HCT4094
High Speed CMOS Logic
C to 125oC
CC
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
1µA at VOL, V
l
Pinout
CD74HC4094, CD74HCT4094
(PDIP, SOIC)
TOP VIEW
STROBE
DAT A
CP
Q Q Q Q
GND
1 2 3 4
0
5
1
6
2
7
3
8
16 15 14 13 12 11 10
9
V OE Q Q Q Q QS QS
OH
CC
4 5 6 7
2 1
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright
© Harris Corporation 1997
1
File Number 1779.1
CD74HC4094, CD74HCT4094
Description
The Harris CD74HC4094 and CD74HCT4094 are 8-stage serial shift registers having a storage latch associated with each stage for strobing data from the serial input to parallel buffered three-state outputs. The parallel outputs may be connected directly to common bus lines. Data is shifted on positive clock transitions. The data in each shift register stage is transferred to the storage register when the Strobe input is high. Data in the storage register appears at the outputs whenever the Output-Enable signal is high.
Two serial outputs are available for cascading a number of these devices. Data is available at the QS
serial output
1
terminal on positive clock edges to allow for high-speed operation in cascaded system in which the clock rise time is fast. The same serial information, available at the QS terminal on the next negative clock edge, provides a means
Functional Diagram
2
3
8-STAGE
SHIFT
REGISTER
DAT A
CP
for cascading these devices when the clock rise time is slow.
Ordering Information
PART NUMBER TEMP. RANGE (oC) PACKAGE
CD74HC4094E -55 to 125 16 Ld PDIP E16.3 CD74HCT4094E -55 to 125 16 Ld PDIP E16.3 CD74HC4094M -55 to 125 16 Ld SOIC M16.15 CD74HCT4094M -55 to 125 16 Ld SOIC M16.15
NOTES:
1. When ordering,use the entire part number. Add the suffix 96 to
2
obtain the variant in the tape and reel.
2. Waferordie for thispartnumber is availablewhich meets allelec­trical specifications. Please contact your local sales office or Harris customer service for ordering information.
9
QS
1
10
QS
2
PKG.
NO.
STROBE
OE
1
15
8-BIT
STORAGE
REGISTER
THREE-
STATE
OUTPUT
4
Q
0
5
Q
1
6
Q
2
7
Q
3
14
Q
4
13
Q
5
12
Q
GND = 8
6
11
V
= 16
Q
CC
7
TRUTH TABLE
INPUTS PARALLEL OUTPUTS SERIAL OUTPUTS
CP OE STR D Q
0
Q
n
QS1 (NOTE 4) QS
2
L X X Z Z Q’6 NC LXXZZNCQ
7
H L X NC NC Q’6 NC HHLLQ
-1 Q’6 NC
n
2
CD74HC4094, CD74HCT4094
TRUTH TABLE
INPUTS PARALLEL OUTPUTS SERIAL OUTPUTS
CP OE STR D Q
HHHHQ H H H NCNCNCQ
NOTES:
3. H = High Voltage Level, L = Low Voltage Level, X = Don’t Care, NC = No charge, Z = High Impedance Off-state, = Transition from Low to High Level, = Transition from High to Low.
4. At the positive clock edge the information in the seventh register stage is transferred to the 8th register stage and QS1 output.
0
Q
n
-1 Q’6 NC
n
QS1 (NOTE 4) QS
2
7
3
Logic Diagram
CD74HC4094, CD74HCT4094
FF
FF
FF
FF
FF
9
1
QS
8
L
10
2
QS
7
Q
11
7
L
CP CPQD
6
Q
7
6
5
4
3
6
L
5
L
4
L
3
L
2
L
12
5
Q
13
4
Q
14
3
Q
7
2
Q
6
2
FF
1
FF
O
FF
DQ
2
DAT A
CPCP
1
Q
5
1
L
0
Q
4
Q
O
L
OE OE
STR STR
3
CP
1
STR
15
OE
4
CD74HC4094, CD74HCT4094
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, I
OK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, I
O
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, V
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to V
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
5. θJA is measured with the component mounted on an evaluation PC board in free air.
CC
Thermal Resistance (Typical, Note 5) θJA (oC/W)
PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . .300oC
(SOIC - Lead Tips Only)
CC
DC Electrical Specifications
PARAMETER SYMBOL
HC TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage CMOS Loads
High Level Output Voltage TTL Loads
Low Level Output Voltage CMOS Loads
Low Level Output Voltage TTL Loads
Input Leakage Current
Quiescent Device Current
V
IH
V
IL
V
OH
V
OL
I
I
I
CC
TEST
CONDITIONS
(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
I
V
CC
(V)
o
C -40oC TO 85oC -55oCTO125oC
25
UNITSV
- - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V
- - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V
VIHor VIL-0.02 2 1.9 - - 1.9 - 1.9 - V
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-0.02 6 5.9 - - 5.9 - 5.9 - V
- - ---- - - -V
-4 4.5 3.98 - - 3.84 - 3.7 - V
-5.2 6 5.48 - - 5.34 - 5.2 - V
VIHor VIL0.02 2 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 6 - - 0.1 - 0.1 - 0.1 V
- - ---- - - -V 4 4.5 - - 0.26 - 0.33 - 0.4 V
5.2 6 - - 0.26 - 0.33 - 0.4 V
VCC or
-6--±0.1 - ±1-±1µA
GND
VCC or
0 6 - - 8 - 80 - 160 µA
GND
5
CD74HC4094, CD74HCT4094
DC Electrical Specifications (Continued)
TEST
CONDITIONS
PARAMETER SYMBOL
HCT TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
V
IH
V
IL
V
OH
CMOS Loads High Level Output
Voltage TTL Loads
Low Level Output Voltage
V
OL
CMOS Loads Low Level Output
Voltage TTL Loads
Input Leakage Current
Quiescent Device Current
Additional Quiescent Device Current Per
I
I
I
CC
I
CC
(Note)
Input Pin: 1 Unit Load
NOTE: For dual-supply systems theoretical worst case (V
(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
I
- - 4.5 to
- - 4.5 to
VIHor VIL-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-4 4.5 3.98 - - 3.84 - 3.7 - V
VIHor VIL0.02 4.5 - - 0.1 - 0.1 - 0.1 V
4 4.5 - - 0.26 - 0.33 - 0.4 V
VCCand
0 5.5 - - ±0.1 - ±1-±1µA
GND
VCC or
0 5.5 - - 8 - 80 - 160 µA
GND
V
CC
- 4.5 to
-2.1
o
C -40oC TO 85oC -55oCTO125oC
V
CC
25
(V)
2--2- 2 - V
5.5
- - 0.8 - 0.8 - 0.8 V
5.5
- 100 360 - 450 - 490 µA
5.5
= 2.4V, VCC = 5.5V) specification is 1.8mA.
I
UNITSV
HCT Input Loading Table
INPUT UNIT LOADS
D 0.4
CP, OE 1.5
STR 1.0
NOTE: Unit Load is ICClimit specified in DC Electrical Table, e.g., 360µA max at 25oC.
Prerequisite for Switching Specifications
CHARACTERISTIC SYMBOL VCC (V)
HC TYPES
CP Pulse Width t
STR Pulse Width t
W
WH
2 80 - 100 - 120 - ns
4.5 16 - 20 - 24 - ns 6 14 - 17 - 20 - ns 2 80 - 100 - 120 - ns
4.5 16 - 20 - 24 - ns 6 14 - 17 - 20 - ns
o
25
C -40oC TO 85oC -55oC TO 125oC
UNITSMIN MAX MIN MAX MIN MAX
6
CD74HC4094, CD74HCT4094
Prerequisite for Switching Specifications (Continued)
25
CHARACTERISTIC SYMBOL V
Data Set-up Time t
SU
Data Hold Time t
STR Set-up Time t
SU
STR Hold Time t
Maximum CP Frequency f
CL (MAX)
HCT TYPES
CP Pulse Width t STR Pulse Width t Data Set-up Time t
W
WH
SU
Data Hold Time t STR Set-up Time t
SU
STR Hold Time t Maximum CP Frequency f
CL (MAX)
H
H
H
H
(V)
CC
2 50 - 65 - 75 - ns
4.5 10 - 13 - 15 - ns 6 9 -11-13-ns 2 3-3-3-ns
4.5 3 - 3 - 3 - ns 6 3-3-3-ns 2 100 - 125 - 150 - ns
4.5 20 - 25 - 30 - ns 6 17 - 21 - 26 - ns 2 0-0-0-ns
4.5 0 - 0 - 0 - ns 6 0-0-0-ns 2 6-5-4-MHz
4.5 30 - 24 - 20 - MHz 6 35 - 28 - 24 - MHz
4.5 16 - 20 - 24 - ns
4.5 16 - 20 - 24 - ns
4.5 10 - 13 - 15 - ns
4.5 4 - 4 - 4 - ns
4.5 20 - 25 - 30 - ns
4.5 0 - 0 - 0 - ns
4.5 30 - 24 - 20 - MHz
o
C -40oC TO 85oC -55oC TO 125oC
UNITSMIN MAX MIN MAX MIN MAX
Switching Specifications Input t
PARAMETER SYMBOL
HC TYPES
Propagation Delay Time (Figure 1)
CP to QS
CP to QS
CP to Q
STR to Q
1
2
n
n
t
PLH,
t
PHL
t
PLH,
t
PHL
t
PLH,
t
PHL
t
PLH,
t
PHL
, tf = 6ns
r
o
C -40oC TO 85oC -55oCTO125oC
TEST
CONDITIONS
V
CC
(V)
25
CL= 50pF 2 - - 150 - 190 - 225 ns
4.5 - - 30 - 38 - 45 ns
C
=15pF 5 - 12 - - - - - ns
L
C
= 50pF 6 - - 26 - 33 - 38 ns
L
CL= 50pF 2 - - 135 - 170 - 205 ns
4.5 - - 27 - 34 - 41 ns
C
=15pF 5 - 11 - - - - - ns
L
C
= 50pF 6 - - 23 - 29 - 35 ns
L
CL= 50pF 2 - - 195 - 245 - 295 ns
4.5 - - 39 - 49 - 59 ns 5 - 16 - - - - - ns 6 - - 33 - 42 - 50 ns
CL= 50pF 2 - - 180 - 225 - 270 ns
4.5 - - 36 - 45 - 54 ns 6 - - 31 - 38 - 46 ns
UNITSMIN TYP MAX MIN MAX MIN MAX
7
Switching Specifications Input t
PARAMETER SYMBOL
Output Enable to Q
Output Disable to Q
n
n
Output Transition Time t
Output Disabling Time t Maximum CP Frequency f Input Capacitance C Power Dissipation Capacitance
(Notes 6, 7) Three-State Output
Capacitance
HCT TYPES
Propagation Delay Time (Figure 1)
CP to QS CP to QS
CP to Q
STR to Q
Output Enable to Q Output Disable to Q
1 2
n
n
n
n
Output Transition Time t Output Disabling Time t Maximum CP Frequency f Input Capacitance C Power Dissipation Capacitance
(Notes 6, 7) Three-State Output
Capacitance
NOTES:
6. C
is used to determine the dynamic power consumption, per register.
PD
7. PD = V
2
fi(CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.
CC
t
PZH,tPZLCL
t
PHZ,tPLZCL
TLH,tTHLCL
PHZ,tPLZCL
MAX
C
C
t
PLH,
t
PHL
t
PLH,
t
PHL
t
PLH,
t
PHL
t
PLH,
t
PHL
t
PZH,tPZLCL
t
PHZ,tPLZCL TLH,tTHLCL PHZ,tPLZCL
MAX
C
C
, tf = 6ns (Continued)
r
o
C -40oC TO 85oC -55oCTO125oC
TEST
CONDITIONS
V
CC
(V)
25
= 50pF 2 - - 175 - 220 - 265 ns
4.5 - - 35 - 44 - 53 ns 6 - - 30 - 37 - 45 ns
= 50pF 2 - - 125 - 155 - 190 ns
4.5 - - 25 - 31 - 38 ns 6 - - 21 - 26 - 32 ns
= 50pF 2 - - 75 - 95 - 110 ns
4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns
=15pF 5 - 10 - - - - - ns CL=15pF 5 - 60 - - - - - MHz CL= 50pF - - - 10 - 10 - 10 pF
IN
CL=15pF 5 - 90 - - - - - pF
PD
CL= 50pF - - - 15 - 15 - 15 pF
O
CL= 50pF 4.5 - - 39 - - - - ns
CL=15pF 5 - 16 - - - - - ns CL= 50pF 4.5 - - 36 - - - - ns C
=15pF 5 - 15 - - - - - ns
L
CL= 50pF 4.5 - - 43 - - - - ns C
=15pF 5 - 18 - - - - - ns
L
CL= 50pF 4.5 - - 39 - - - - ns
= 50pF 4.5 - - 35 - - - - ns
= 50pF 4.5 - - 35 - - - - ns
= 50pF 4.5 - - 15 - - - - ns
=15pF 5 - 14 - - - - - ns CL=15pF 5 - 60 - - - - - MHz CL= 50pF - - - 10 - 10 - 10 pF
IN
CL=15pF 5 - 110 - - - - - pF
PD
CL= 50pF - - - 15 - 15 - 15 pF
O
UNITSMIN TYP MAX MIN MAX MIN MAX
8
Test Circuits and Waveforms
6ns 6ns
CLOCK
t
SU
CD74HC4094, CD74HCT4094
90%
V
S
10%
t
H
t
W
V
S
t
W
INPUT LEVEL
GND
INPUT LEVEL
SERIAL IN
CLOCK
STROBE
Q
n
SERIAL IN
, QS
Q
n
QS
t
PLH,tPHL
t
PLH
V
S
1
2
t
PLH
V
S
t
PHL
FIGURE 1. DATA PROPAGATION DELAYS, SET-UP AND HOLD TIMES
INPUT LEVEL
GND
t
V
S
SU
t
H
INPUT LEVEL
V
S
GND
t
W
V
S
V
S
V
OH
V
OL
V
OH
V
OL
= 6ns
t
r
OE 90%
t
PLZ
OUTPUT
LOW TO OFF
t
PHZ
OUTPUT
HIGH TO OFF
OUTPUTS
CONNECTED
GND
V
OH
V
OL
t
PHL
V
OH
V
OL
10%
90%
OUTPUTS
DISCONNECTED
t
= 6ns
f
V
t
t
S
10%
PZL
V
S
PZH
V
S
OUTPUTS CONNECTED
FIGURE 2. STROBE PROPAGATIONDELAYS AND SET-UP
AND HOLD TIMES
FIGURE 3. ENABLE AND DISABLE TIMES
9
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
Loading...