Richtek RT9193-15GB, RT9193-15PB, RT9193-15PU5, RT9193-16GB, RT9193-16PB Schematic [ru]

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RT9193
300mA, Ultra-Low Noise, Ultra-Fast CMOS LDO Regulator
General Description
The RT9193 is designed for portable RF and wireless applications with demanding performance and space requirements. The RT9193 performa nce is optimized f or battery-powered systems to deliver ultra low noise and low quiescent current. A noise bypa ss pin is availa ble for further reduction of output noise. Regulator ground current increa s e s only slightly in dropout, further prolonging the battery life. The RT9193 also works with low-ESR cera mic capa citors, reducing the a mount of board space necessary for power applications, critical in hand-held wireless devices. The RT9193 consumes less than 0.01
μA in
shutdown mode and ha s fa st turn-on time less than 50μs. The other features include ultra low dropout voltage, high output accura cy , current limiting protection, and high ri pple rejection ratio. Available in the SC-70-5, SOT-23-5, TSOT-23-5, W D F N-6L 2x2 a nd MSOP-8 packages.
Ordering Information
RT9193-
Package Type U5 : SC-70-5 B : SOT-23-5 J5 : TSOT-23-5 QW : WDFN-6L 2x2 (W-Type) F : MSOP-8
Lead Plating System P : Pb Free G : Green (Halogen Free and Pb Free)
Output Voltage 15 : 1.5V 16 : 1.6V : 49 : 4.9V 50 : 5.0V 1H : 1.85V 2H : 2.85V 4G : 4.75V (1.5V to 5V with 0.1V step is available)
Note : Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Features
zz
Ultra Low Noise for RF Application
z
zz
zz
z Ultra Fast Response in Line/Load Transient
zz
zz
z Quick Start-Up (T ypically 50
zz
zz
z <0.01
zz
zz
z Low Dropout : 220mV @ 300mA
zz
zz
z Wide Operating Voltage Ranges : 2.5V to 5.5V
zz
zz
z TTL-Logic-Controlled Shutdown Input
zz
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z Low Temperature Coefficient
zz
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z Current Limiting Protection
zz
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z Thermal Shutdown Protection
zz
zz
z Only 1
zz
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z High Power Supply Rejection Ratio
zz
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z Custom Voltage Available
zz
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z RoHS Compliant and 100% Lead (Pb)-Free
zz
μμ
μA Standby Current When Shutdown
μμ
μμ
μF Output Capacitor Required for Stability
μμ
μμ
μs)
μμ
Applications
z CDMA/GSM Cellular Handsets z Battery-Powered Equipment z Laptop, Palmtops, Notebook Computers z Hand-Held Instruments z PCMCIA Cards z Portable Information Applia nces
Marking Information
Typical Application Circuit
RT9193
V
IN
1µF/X7R
Chip Enable
C
IN
VIN
GND EN
VOUT
BP
C
OUT
1µF/X7R
C
BP
22nF
(Option for low noise)
V
OUT
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DS9193-16 January 2013 www.richtek.com
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RT9193
Pin Configurations
(TOP VIEW)
VOUT BP
1
5
23
VIN GND EN
4
EN
2
GND
3
WDFN-6L 2x2 MSOP-8
SC-70-5/SOT-23-5/TSOT-23-5
Functional Pin Description
Pin Name Pin Function
6
BP
5
NC
7
4
VOUTVIN
NC
VIN
NC
VOUT
8 2 3 4
NC
7
EN
6
BP
5
GND
EN
BP
Chip Enable (Active High). Note that this pin is high impedance. There should be a pull low 100kΩ resist or c onn ected to G ND wh en the control s ignal is flo at ing.
Reference Noise Bypass. This pin can be floating. For lowest noise performance, connect a 22nF capacitor between the BP and GND pins.
GND Ground. VOUT Output Voltage. VIN Power Input Voltage.
Function Block Diagram
EN
Quick
Start
BP
V
REF
Shutdown
and
Logic Control
+
-
Error
Amplifier
VIN
MOSFET
Driver
VOUT
Current-Limit
and
Thermal
Protection
GND
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
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DS9193-16 January 2013www.richtek.com
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RT9193
Absolute Maximum Ratings (Note 1)
z Supply Input V oltage------------------------------------------------------------------------------------------------------ 6V z Power Dissipation, P
SC-70-5 ---------------------------------------------------------------------------------------------------------------------- 300mW TSOT-23-5/SOT -23-5------------------------------------------------------------------------------------------------------ 400mW WDFN-6L 2x2 -------------------------------------------------------------------------------------------------------------- 606mW MSOP-8 --------------------------------------------------------------------------------------------------------------------- 625mW
z Package Thermal Resistance (Note 2)
SOT-70-5, θJA--------------------------------------------------------------------------------------------------------------- 333°C/W TSOT-23-5/SOT -23-5, θJA------------------------------------------------------------------------------------------------ 250°C/W TSOT-23-5/SOT-23-5, θJC----------------------------------------------------------------------------------------------- 25°C/W W DFN-6L 2x2, θJA--------------------------------------------------------------------------------------------------------- 165°C/W WDFN-6L 2x2, θJC-------------------------------------------------------------------------------------------------------- 20°C/W MSOP-8 θJA---------------------------------------------------------------------------------------------------------------- 160°C/W MSOP-8 θJC---------------------------------------------------------------------------------------------------------------- 55°C/W
z Junction T emperature----------------------------------------------------------------------------------------------------- 150°C z Lead T e mperature (Soldering, 10 sec.)------------------------------------------------------------------------------- 26 0°C z Storage T emperature Range -------------------------------------------------------------------------------------------- 65°C to 150°C z ESD Susceptibility (Note 3)
HBM (Human Body Model)---------------------------------------------------------------------------------------------- 2kV MM (Machine Model) ----------------------------------------------------------------------------------------------------- 200V
@ T
D
= 25°C
A
Recommended Operating Conditions (Note 4)
z Supply Input V oltage------------------------------------------------------------------------------------------------------ 2.5V to 5.5V z EN Input V oltage----------------------------------------------------------------------------------------------------------- 0V to 5.5V z Junction T emperature Range-------------------------------------------------------------------------------------------- z Ambient T emperature Range--------------------------------------------------------------------------------------------
Electrical Characteristics
(VIN = V
+ 1V, CIN = C
OUT
= 1μF, CBP = 22nF, T
OUT
= 25° C, unless otherwise specified)
A
Parameter Symbol Test Conditions Min Typ Max Unit
Output Voltage Accuracy ΔV Current Limit I Quiescent Current IQ V
D rop out Voltage ( Note 5) V
Line Regulation ΔV
Load Regulation ΔV Standby Cu rrent I
I
OUT
R
LIM
DROP
LINE
1mA < I
LOAD
VEN = GND, Shutdo wn -- 0.0 1 1 μA
STBY
= 1mA 2 -- 2 %
OUT
= 1Ω 360 400 -- mA
LOAD
≥ 1.2V, I
EN
I
= 200mA , V
OUT
I
= 300mA , V
OUT
= (V
V
IN
I
= 1mA
OUT
+ 1V) to 5.5V,
OUT
< 300mA -- -- 0.6 %
OUT
= 0mA -- 90 130 μA
OUT
> 2.8V 170 200
OUT
> 2.8V -- 220 300
OUT
-- -- 0.3 %
40°C to 125°C
40°C to 85°C
mV
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
DS9193-16 January 2013 www.richtek.com
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RT9193
Parameter Symbol Test Conditions Min Typ Max Unit
EN Input Bias Current I EN Threshold
Voltage
Logic-Low Logic-High
Output Noise Voltage eNO
f = 100Hz -- −70 -- Power Supply
Rej ect ion Rat e
f = 10kHz
VEN = GND or VIN -- 0 100 nA
IBSD
VIN = 3V to 5.5V, Shutdown -- -- 0.4
V
IL
VIN = 3V to 5.5V, Start-Up 1.2 -- --
V
IH
PSRR C
10Hz to 100kHz, I
= 1μF
C
OUT
= 1μF, I
OUT
OUT
= 200mA
OUT
= 10mA
-- 100 -- μV
-- 50 --
V
RMS
dB
Thermal Shutdown Temperature TSD -- 165 -- °C Thermal Shutdown Temperature
Note 1. Stresses beyond those listed Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability.
Note 2. θ Note 3. Devices are ESD sensitive. Handling precaution is recommended. Note 4. The device is not guaranteed to function outside its operating conditions. Note 5. The dropout voltage is defined as V
is measured at T
JA
= 25°C on a low effective thermal conductivity single-layer test board per JEDEC 51-3.
A
ΔTSD -- 30 -- °C
IN
V
, which is measured when V
OUT
OUT
is V
OUT(NORMAL)
100mV.
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
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DS9193-16 January 2013www.richtek.com
)
Typical Operating Characteristics
RT9193
Output Voltage vs. Temperature
1.8
RT9193-15xU5 V
= 3.3V
IN
1.7
1.6
1.5
1.4
CIN = C
= 1μF X7R
OUT
Output Voltage (V)
1.3
1.2
-50 -25 0 25 50 75 100 125
Temperature (°C)
Dropout Voltage v s. Load Current
300
RT9193-33xB CIN = C
250
200
150
100
Dropout V oltage (mV)
50
OUT
= 1μF
T
J
= 25°C
T
= 125°C
J
T
= -40°C
J
Quiescent Current vs. Temperature
95
RT9193-15xU5 V
= 3.3V
IN
90
CIN = C
85
80
75
70
= 1μF X7R
OUT
Quiescent C urrent (µ A
65
60
-50 -25 0 25 50 75 100 125
Temperature (°C)
PSRR
20
V
= 4V to 5V
IN
PSRR (dB)
CIN = C
0
-20
-40
-60
= 1μF , X7R
OUT
I
Load
= 100mA
I
Load
= 10mA
0
0 0.05 0.1 0.15 0.2 0.25 0.3
Load Current (A)
EN Pin Shutdown Threshold vs. Tem pe rature
1.75
RT9193-15xU5 V
= 3.3V
IN
CIN = C
1.50
1.25
1.00
0.75
EN Pin Shutdown Threshold (V) 1
0.50
-50 -25 0 25 50 75 100 125
= 1μF X7R
OUT
-80
10 100 1K 10K 100K 1M
0.01 0.1 1 10 100 1000
Frequency (kHz)
(Hz)
EN Pin Shutdown Response
V
= 5V
10 5
(V)
0
EN Pin Voltage
(V)
Output Voltage
2 1 0
IN
CIN = C
OUT
= 1μF
Time (500μs/Div)
RT9193-28xU5 No Load
Temperature (°C)
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
©
DS9193-16 January 2013 www.richtek.com
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