Sales Representative. (Unit sample quantity is 50 pcs.)
ABSOLUTE MAXIMUM RATINGS (TA= 25 °C)
PARAMETERSYMBOLRATINGUNIT
Collector to Base VoltageVCBO9V
Collector to Emitter VoltageVCEO6V
Emitter to Base VoltageVEBO2V
Collector CurrentIC30mA
Total Power DissipationPT150 in 1 elementmW
200 in 2 elements
Junction TemperatureTj150˚C
Storage TemperatureTstg–65 to +150˚C
Note
0.7
0.9±0.1
654
1
Q
123
PIN CONNECTIONS
1. Collector (Q1)
2. Emitter (Q1)
3. Collector (Q2)
0~0.1
Q
2
4. Emitter (Q2)
5. Base (Q2)
6. Base (Q1)
+0.1
–0
0.15
Note 110 mW must not be exceeded in 1 element.
Document No. ID-3640
(O.D. No. ID-9147)
Date Published April 1995 P
Printed in Japan
The information in this document is subject to change without notice.
DC Current GainhFEVCE = 3 V, IC = 10 mA
Gain Bandwidth ProductfTVCE = 3 V, IC = 10 mA, f = 2 GHz12GHz
Feed-back CapacitanceCreVCB = 3 V, IE = 0, f = 1 MHz
Insertion Power Gain|S21|
2
VCE = 3 V, IC = 10 mA, f = 2 GHz78.5dB
Noise FigureNFVCE = 3 V, IC = 3 mA, f = 2 GHz1.52.5dB
hFE RatiohFE1/hFE2VCE = 3 V, IC = 10 mA0.85
2. Measured with 3-pin bridge, emitter and case should be connected to guard pin of bridge.
Note 1
Note 2
75150
0.40.7pF
µ
PA806T
µ
A
µ
A
hFE CLASSIFICATION
RankKB
MarkingT83
hFE Value75 to 150
TYPICAL CHARACTERISTICS (TA = 25 °C)
TOTAL POWER DISSIPATION
vs. AMBIENT TEMPERATURE
Free Air
200
(mW)
T
100
Total Power Dissipation P
0
2 Elements in Total
Per Element
50100150
Ambient Temperature TA (°C)
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
50
VCE = 3 V
40
(mA)
C
30
20
Collector Current I
10
0
Base to Emitter Voltage VBE (V)
0.51.0
2
µ
PA806T
Collector Current IC (mA)
Gain Bandwidth Product fT (GHz)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
60
50
40
30
20
10
0
Collector to Emitter Voltage VCE (V)
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
14
f = 2 GHz
12
10
8
6
4
2
0.5
12 51020 501
Collector Current IC (mA)
500 µA
400 µA
300 µA
200 µA
IB = 100 µA
5 V
3 V
VCE = 1 V
DC Current Gain hFE
(dB)
2
Insertion Power Gain l S21e l
200
100
0
0.2 0.5 1 2
0.1
10
f = 2 GHz
8
6
4
2
DC CURRENT GAIN vs.
COLLECTOR CURRENT
5 V
VCE = 3 V
5 10 2050 100
Collector Current IC (mA)
INSERTION GAIN vs.
COLLECTOR CURRENT
5 V
3 V
VCE = 1 V
25102050
Collector Current IC (mA)
4
3
2
Noise Figure NF (dB)
1
0
0.5
12520 50
NOISE FIGURE vs.
COLLECTOR CURRENT
10
Collector Current I
C (mA)
f = 2 GHz
V
CE = 3 V
Feed-back Capacitance Cre (pF)
FEED-BACK CAPACITANCE vs.
COLLECTOR TO BASE VOLTAGE
0.6
0.5
0.4
0.3
0.2
0.5
2
151020
Collector to Base Voltage VCB (V)
f = 1 MHz
3
S-PARAMETERS
VCE = 3 V, IC = 1 mA, ZO = 50 Ω
fS11S21S12S22
GHzMAGANGMAGANGMAGANGMAGANG
0.2000.9340–15.73.5100164.80.045082.60.9850–8.7
0.4000.9040–29.43.3520150.70.078068.00.9410–17.1
0.6000.8150–43.43.1060138.00.114062.80.8960–23.6
0.8000.7530–56.62.8840126.30.137058.00.8260–29.9
1.0000.6540–68.92.6050115.10.149055.20.7830–34.7
1.2000.5900–79.82.4490105.40.166045.40.7220–38.0
1.4000.5160–90.12.261096.80.177044.80.6790–42.0
1.6000.4590–101.52.078089.40.178045.10.6430–45.2
1.8000.4230–110.81.925083.70.188042.50.6290–46.8
2.0000.3670–123.91.870076.30.190041.90.5880–51.4
2.2000.3370–136.71.779069.90.211043.90.5630–54.3
2.4000.3150–145.51.660064.10.214041.90.5520–57.0
2.6000.3080–159.11.569059.40.207042.80.5450–59.2
2.8000.2930–164.81.519055.30.214045.80.5220–64.5
3.0000.2950–179.61.461050.70.226045.40.4960–61.3
VCE = 3 V, IC = 3 mA, ZO = 50 Ω
µ
PA806T
fS11S21S12S22
GHzMAGANGMAGANGMAGANGMAGANG
0.2000.8020–25.98.8990154.20.037067.20.9420–15.7
0.4000.6780–45.87.4880134.40.076065.60.8040–26.6
0.6000.5440–62.86.1260119.60.086060.90.7060–33.2
0.8000.4430–75.75.1230108.10.105058.40.6250–36.6
1.0000.3540–87.34.305099.10.121055.90.5660–38.3
1.2000.2930–99.73.788091.30.133061.20.5190–41.4
1.4000.2360–108.43.356084.80.144055.40.4950–43.9
1.6000.2000–121.03.010079.10.157056.20.4660–44.5
1.8000.1820–129.52.696074.40.176058.00.4560–44.5
2.0000.1480–151.72.534069.40.194056.10.4310–48.8
2.2000.1370–166.12.382064.00.215056.30.4050–51.9
2.4000.1340175.22.187060.00.213057.80.3990–52.8
2.6000.1640169.72.053055.80.241057.60.3950–52.9
2.8000.1500170.91.966053.00.249055.20.3750–59.2
3.0000.1780147.71.871049.60.275056.60.3740–60.8
4
S-PARAMETERS
VCE = 3 V, IC = 5 mA, ZO = 50 Ω
fS11S21S12S22
GHzMAGANGMAGANGMAGANGMAGANG
0.2000.6900–33.312.2960147.10.032074.80.8850–19.7
0.4000.5360–54.79.4300125.50.061066.30.7210–30.3
0.6000.4010–70.07.2390111.30.070059.60.6030–34.5
0.8000.3150–82.45.8220101.10.095063.80.5230–36.7
1.0000.2360–93.84.783093.40.109062.30.4870–38.0
1.2000.1850–105.44.170086.40.126061.90.4600–38.8
1.4000.1440–115.83.641080.70.135065.90.4360–40.4
1.6000.1230–134.43.238076.10.156061.20.4170–42.6
1.8000.1040–144.62.891071.40.177062.40.4020–43.9
2.0000.1000–170.62.704067.30.193060.70.3940–45.8
2.2000.1110167.42.533062.60.208060.60.3710–50.3
2.4000.1040158.22.327058.70.226061.60.3500–50.2
2.6000.1180156.32.185054.90.256058.20.3560–51.2
2.8000.1190150.02.091052.60.256056.80.3520–58.1
3.0000.1490142.41.976049.00.286056.60.3410–56.9
VCE = 3 V, IC = 10 mA, ZO = 50 Ω
µ
PA806T
fS11S21S12S22
GHzMAGANGMAGANGMAGANGMAGANG
0.2000.5080–43.617.0900135.90.033063.80.7930–26.2
0.4000.3410–65.311.3980114.20.052068.50.5910–32.9
0.6000.2320–80.78.2250102.00.069069.00.5130–32.9
0.8000.1770–90.86.395093.80.088071.60.4480–32.8
1.0000.1220–108.25.187087.20.106069.30.4180–35.9
1.2000.1010–121.84.439081.60.126070.10.4030–33.3
1.4000.0670–138.23.877076.90.145070.50.3930–36.5
1.6000.0620–167.63.435072.40.159065.50.3680–36.2
1.8000.0660–171.33.065068.80.179065.00.3610–39.5
2.0000.0770146.72.854065.00.206063.90.3480–42.3
2.2000.0990146.52.659060.50.222062.80.3360–46.6
2.4000.1140128.12.440057.00.242060.90.3370–48.8
2.6000.1260136.82.279053.50.266059.90.3170–47.2
2.8000.1020129.62.195050.90.277059.60.3280–55.1
3.0000.1370123.52.080047.90.286058.30.3100–51.2
5
µ
PA806T
[MEMO]
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
“Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on
a customer designated “quality assurance program“ for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact NEC Sales Representative in advance.
Anti-radioactive design is not implemented in this product.
M4 94.11
6
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