MOTOROLA MC10E211FN, MC10E211FNR2, MC100E211FNR2 Datasheet

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
1:6 Differential Clock Distribution Chip
Guaranteed Low Skew Specification
Synchronous Enabling/Disabling
Multiplexed Clock Inputs
V
Internal 75k Input Pulldown Resistors
Common and Individual Enable/Disable Control
High Bandwidth Output Transistors
Extended 100E V
of a lower speed scan or test clock along with the high speed system clock. When LOW (or left open in which case it will be pulled LOW by the input pulldown resistor) the SEL pin will select the differential clock input.
input and bypassed to ground via a 0.01µF capacitor. The V
Output for Single-Ended Use
BB
Range of –4.2V to –5.46V
EE
The E21 1 features a multiplexed clock input to allow for the distribution
BB
MC10E211
MC100E211
1:6 DIFFERENTIAL
CLOCK DISTRIBUTION CHIP
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
Both a common enable and individual output enables are provided. When asserted the positive output will go LOW on the next negative transition of the CLK (or SCLK) input. The enabling function is synchronous so that the outputs will only be enabled/disabled when the outputs are already in the LOW state. In this way the problem of runt pulse generation during the disable operation is avoided. Note that the internal flip flop is clocked on the falling edge of the input clock edge, therefore all associated specifications are referenced to the negative edge of the CLK input.
The output transitions of the E211 are faster than the standard ECLinPS edge rates. This feature provides a means of distributing higher frequency signals than capable with the E111 device. Because of these edge rates and the tight skew limits guaranteed in the specification, there are certain termination guidelines which must be followed. For more details on the recommended termination schemes please refer to the applications information section of this data sheet.
FUNCTION TABLE
CLK SCLK SEL ENx Q
H/L
X
Z*
* Z = Negative transition of CLK or SCLK
X
H/L
Z*
L H X
L L H
CLK
SCLK
L
ECLinPS is a trademark of Motorola Inc.
5/95
Motorola, Inc. 1996
2–1
REV 3
MC10E211 MC100E211
EN3
SEL
SCLK
V
CLK
CLK
V
BB
EE
EN0
EN4 EN5 V
25
26
27
28
1
2
3
4
5
CEN
24
6
EN2
Q5 Q5 Q4 Q4
CC0
22
23
7
8
EN1
EN0
Pinout: 28-Lead PLCC (Top View)
21
CC0
19
20
18
Q3
17
Q3
16
V
CC
Q2
15
14
Q2
Q1
13
12
Q1 11109
Q0
Q0V
Q0 Q0
QD
CLK CLK
SCLK
SEL
EN1-4
CEN
EN5
V
BB
0 1
BITS 1-4
Q1-4 Q1-4
QD
Q5 Q5
QD
Logic Diagram
MOTOROLA ECLinPS and ECLinPS Lite
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DL140 — Rev 4
MC10E211 MC100E211
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
0°C 25°C 85°C
Characteristic Symbol Min Typ Max Min Typ Max Min Typ Max Unit Condition
Output Reference Voltage
10E
100E Input High Current I Power Supply Current
10E
100E
AC CHARACTERISTICS (V
Characteristic Symbol Min Typ Max Min Typ Max Min Typ Max Unit Condition
Propagation Delay to Output
CLK to Q (Diff)
CLK to Q (SE)
SCLK to Q
SEL to Q Disable Time
CLK or SCLK to Q Part–to–Part Skew
CLK (Diff) to Q
CLK (SE), SCLK to Q
Within-Device Skew Setup Time
EN
x to CLK
to CLK
CEN Hold Time
CLK to EN Minimum Input Swing (CLK) V Com. Mode Range (CLK) V Rise/Fall Times
20 – 80%
1. Within-Device skew is defined for identical transitions on similar paths through a device.
2. Setup, Hold and Disable times are all relative to a falling edge on CLK or SCLK.
3. Minimum input swing for which AC parameters are guaranteed. Full DC ECL output swings will be generated with only 50mV input swings.
4. The range in which the high level of the input swing must fall while meeting the VPP spec. The lower end of the range is VEE dependent and can be calculated as VEE + 2.4V.
x, CEN
V
BB
–1.38 –1.38
IH
I
EE
= VEE(min) to VEE(max); VCC = V
EE
t
PLH
t
PHL
t
PHL
t
skew
t
s
t
h
PP
CMR
t
r
t
f
119 119
0°C 25°C 85°C
795
930
745
930
650
900
745
970
600 800 600 800 600 800
50
200
–100
200
900 600 900 160 900 600
0.25 1.0 0.25 1.0 0.25 1.0 V 3 –0.4 Note –0.4 Note –0.4 Note V 4
150 400 150 400 150 400
0
–1.27
–1.35
–1.26
–1.38
150 150 150 µA
160 160
CCO
1065 1115 1085 1195
805 755 650 755
270 370
75
200 200
= GND)
CCO
119 119
= GND)
940 940 910 980
50
–100
–1.25
–1.31
–1.26
–1.38
160 160
1075 1125 1095 1205
0
825 775 650 775
270 370
75
200 200
119 137
960 960 930
1000
–100
0
–1.19 –1.26
160 164
1095 1145 1115 1225
270 370
75
V
mA
ps
ps
2
ps
1
ps
2
ps
2
ps
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MC10E211 MC100E211
APPLICATIONS INFORMATION
General Description
The MC10E/100E211 is a 1:6 fanout tree designed explicitly for low skew high speed clock distribution. The device was targeted to work in conjunction with the E111 device to provide another level of flexibility in the design and implementation of clock distribution trees. The individual synchronous enable controls and multiplexed clock inputs make the device ideal as the first level distribution unit in a distribution tree. The device provides the ability to distribute a lower speed scan or test clock along with the high speed system clock to ease the design of system diagnostics and self test procedures. The individual enables could be used to allow for the disabling of individual cards on a backplane in fault tolerant designs.
Because of lower fanout and larger skews the E211 will not likely be used as an alternative to the E1 11 for the bulk of the clock fanout generation. Figure 1 shows a typical application combining the two devices to take advantage of the strengths of each.
E211
Q0
Q5
E111
BACKPLANE
E111
Q0
Q8
Q0
Q8
Figure 1. Standard E211 Application
Using the E211 in PECL Designs
The E21 1 device can be utilized very effectively in designs utilizing only a +5V power supply . Since the internal switching reference levels are biased off of the VCC supply the input thresholds for the single-ended inputs will vary with VCC. As a result the single-ended inputs should be driven by a device on the same board as the E21 1. Driving these inputs across a backplane where significant differences between the VCC’s of the transmitter and receiver can occur can lead to AC performance and/or significant noise margin degradations. Because the differential I/O does not use a switching reference, and due to the CMR range of the E211, even
under worst case VCC situations between cards there will be no AC performance or noise margin loss for the differential CLK inputs.
For situations where TTL clocks are required the E21 1 can be interfaced with the H641 or H643 ECL to TTL Clock Distribution Chips from Motorola. The H641 is a single supply 1:9 PECL to TTL device while the H643 is a 1:8 dual supply standard ECL to TTL device. By combining the superior skew performance of the E211, or E111, with the low skew translating capabilities of the H641 and H643 very low skew TTL clock distribution networks can be realized.
Handling Open Inputs and Outputs
All of the input pins of the E211 have a 50k to 75k pulldown resistor to pull the input to VEE when left open. This feature can cause a problem if the differential clock inputs are left open as the input gate current source transistor will become saturated. Under these conditions the outputs of the CLK input buffer will go to an undefined state. It is recommended, if possible,that the SCLK input should be selected any time the differential CLK inputs are allowed to float. The SCLK buffer, under open input conditions, will maintain a defined output state and thus the Q outputs of the device will be in a defined state (Q = LOW). Note that if all of the inputs are left open the differential CLK input will be selected and the state of the Q outputs will be undefined.
With the simultaneous switching characteristics and the tight skew specifications of the E211 the handling of the unused outputs becomes critical. To minimize the noise generated on the die all outputs should be terminated in pairs, ie. both the true and compliment outputs should be terminated even if only one of the outputs will be used in the system. With both complimentary pairs terminated the current in the VCC pins will remain essentially constant and thus inductance induced voltage glitches on VCC will not occur. VCC glitches will result in distorted output waveforms and degradations in the skew performance of the device.
The package parasitics of the 28-lead PLCC cause the signals on a given pin to be influenced by signals on adjacent pins. The E211 is characterized and tested with all of the outputs switching, therefore the numbers in the data book are guaranteed only for this situation. If all of the outputs of the E21 1 are not needed and there is a desire to save power the unused output pairs can be left unterminated. Unterminated outputs can influence the propagation delay on adjacent pins by 15ps - 20ps. Therefore under these conditions this 15ps ­20ps needs to be added to the overall skew of the device. Pins which are separated by a package corner are not considered adjacent pins in the context of propagation delay influence. Therefore as long as all of the outputs on a single side of the package are terminated the specification limits in the data sheet will apply.
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APPLICATIONS INFORMATION
MC10E211 MC100E211
Differential versus Single-Ended Use
As can be seen from the data sheet, to minimize the skew of the E21 1 the device must be used in the dif ferential mode. In the single-ended mode the propagation delays are dependent on the relative position of the VBB switching reference. Any VBB offset from the center of the input swing will add delay to either the T
PLH
or T
and subtract delay
PHL
from the other. This increase and decrease in delay will lead to an increase in the duty cycle skew and thus part-to-part skew. The within-device skew will be independent of the V
BB
and therefore will be the same regardless of whether the device is driven differentially or single-endedly.
For applications where part-to-part skew or duty cycle skew are not important the advantages of single-ended clock distribution may lead to its use. Using single-ended interconnect will reduce the number of signal traces to be routed, but remember that all of the complimentary outputs still need to be terminated therefore there will be no reduction in the termination components required. T o use the E21 1 with a single-ended input the arrangement pictured in Figure 2b should be used. If the input to the differential CLK inputs are AC coupled as pictured in Figure 2a the dependence on a centered VBB reference is removed. The situation pictured will ensure that the input is centered around the bias set by the VBB. As a result when AC coupled the AC specification limits for a differential input can be used. For more information on AC coupling please refer to the interfacing section of the design guide in the ECLinPS data book.
pulse. On initial power up the enable flip flops will randomly attain a stable state, therefore precautions should be taken on initial power up to ensure the E21 1 is in the desired state.
IN
0.001µF
IN
50
0.01µF
V
BB
Figure 2a. AC Coupled Input
IN
IN
Using the Enable Pins
Both the common enable (CEN enables (ENx
) are synchronous to the CLK or SCLK input
) and the individual
depending on which is selected. The active low signals are clocked into the enable flip flops on the negative edges of the E211 clock inputs. In this way the devices will only be disabled when the outputs are already in the LOW state. The internal propagation delays are such that the delay to the output through the distribution buffers is less than that through the enable flip flops. This will ensure that the disabling of the device will not slice any time off the clock
0.01µF
V
BB
Figure 2b. Single-Ended Input
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MC10E211 MC100E211
-N-
-L-
28 1
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
SNSM
G1
–M
SNSM
–M
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
Y BRK
B
0.007 (0.180) T L
U
D
Z
-M-
D
W
V
X
VIEW D-D
Z
C
G
G1
0.010 (0.250) T L
0.007 (0.180) T L
A
0.007 (0.180) T L
R
E
0.004 (0.100)
J
PLANE
SEATING
-T-
VIEW S
SNSS
–M
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
–M
–M
SNSM
SNSM
H
0.007 (0.180) T L
–M
SNSM
K1
K
SNSM
0.007 (0.180) T L
F
–M
VIEW S
INCHES MILLIMETERS
MIN MINMAX MAX
DIM
A
0.485
B
0.485
C
0.165
E
0.090
F
0.013
G
0.050 BSC
H
0.026
J
0.020
K
0.025
R
0.450
U
0.450
V
0.042
W
0.042
X
0.042
Y
Z
2°
G1
0.410
K1
0.040
0.495
0.495
0.180
0.110
0.019
0.032
0.456
0.456
0.048
0.048
0.056
0.020 10°
0.430
12.32
12.57
12.32
12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
0.64
11.43
11.43
1.07
1.07
1.07
10.42
1.02
— —
11.58
11.58
1.21
1.21
1.42
0.50
2°
10°
10.92 —
— —
MOTOROLA ECLinPS and ECLinPS Lite
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DL140 — Rev 4
MC10E211 MC100E211
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