MOTOROLA MC10E143, MC100E143 Technical data

D

2D3D4VCCOQ0Q1Q2

V

CCO

D

5

D

6

D

7

D

8

SEL

MR

CLK1

CLK2

V

EE

NC

D

0

D

1

26

27

28

2

3

4

25 24 23 22 21 20 19

18

17

16

15

14

13

12

115 6 7 8 9 10

Q

8

Q

7

Q

6

V

CC

Q

5

V

CCO

Q

4

Q

3

1

Pinout: 28-Lead PLCC (Top View)

* All VCC and V

CCO

pins are tied together on the die.

MUX

MUX

MUX

MUX

LOGIC DIAGRAM

D

0

D

1

D

2

D

3

D

8

SEL

CLK1
CLK2

MR

Q

0

Q

1

Q

2

Q

3

Q

8

MUX

D

R

D

D

D

D

R

R

R

R



SEMICONDUCTOR TECHNICAL DATA

2–1

REV 2

 Motorola, Inc. 1996

12/93

  

The MC10E/100E143 is a 9-bit holding register, designed with
byte-parity applications in mind. The E143 holds current data or loads
new data, with the nine inputs D0 – D8 accepting parallel input data.

• 700MHz Min. Operating Frequency

• 9-Bit for Byte-Parity Applications

• Asynchronous Master Reset

• Dual Clocks

• Extended 100E V

EE

Range of – 4.2V to – 5.46V

• 75kΩ Input Pulldown Resistors

The SEL (Select) input pin is used to switch between the two modes of
operation — HOLD and LOAD. Input data is accepted by the registers a
set-up time before the positive going edge of CLK1 or CLK2. A HIGH on
the Master Reset pin (MR) asynchronously resets all the registers to zero.

PIN NAMES

Pin Function

D0 – D

8

Parallel Data Inputs
SEL Mode Select Input
CLK1, CLK2 Clock Inputs
MR Master Reset
Q0 – Q

8

Data Outputs
NC No Connection

FUNCTIONS

SEL Mode

L
H

Load

Hold





9-BIT HOLD

REGISTER

FN SUFFIX

PLASTIC PACKAGE

CASE 776-02

查询MC100E143供应商

MC10E143 MC100E143

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–2

DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

I

IH

Input HIGH Current 150 150 150 µA

I

EE

Power Supply Current mA

10E 120 145 120 145 120 145
100E 120 145 120 145 138 165

AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

f

MAX

Max. Toggle Frequency 700 900 700 900 700 900 MHz

t

PLH

Propagation Delay to Output ps

t

PHL

Clk 600 800 1000 600 800 1000 600 800 1000
MR 600 800 1000 600 800 1000 600 800 1000

t

s

Setup Time ps

D 50 –100 50 –100 50 –100
SEL 300 150 300 150 300 150

t

h

Hold Time ps

D 300 100 300 100 300 100
SEL 75 –150 75 –150 75 –150

t

RR

Reset Recovery Time 900 700 900 700 900 700 ps

t

PW

Minimum Pulse Width ps

Clk, MR 400 400 400

t

SKEW

Within-Device Skew 75 75 75 ps 1

t

r

Rise/Fall Times ps

t

f

20 - 80% 300 525 800 300 525 800 300 525 800

1. Within-device skew is defined as identical transitions on similar paths through a device.

MC10E143 MC100E143

2–3 MOTOROLAECLinPS and ECLinPS Lite

DL140 — Rev 4

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 776–02

ISSUE D

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.004 (0.100)

SEATING
PLANE

-T-

12.32

12.32

4.20

2.29

0.33

0.66

0.51

0.64

11.43

11.43

1.07

1.07

1.07
—
2

°

10.42

1.02

12.57

12.57

4.57

2.79

0.48

0.81
—
—

11.58

11.58

1.21

1.21

1.42

0.50

10

°

10.92
—

1.27 BSC

A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y

Z
G1
K1

MIN MINMAX MAX

INCHES MILLIMETERS

DIM

NOTES:

1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.

2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.

3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).

VIEW S

B

U

Z

G1

X

VIEW D-D

H

K

F

VIEW S

G

C

Z

A

R

E

J

0.485

0.485

0.165

0.090

0.013

0.026

0.020

0.025

0.450

0.450

0.042

0.042

0.042
—
2

°

0.410

0.040

0.495

0.495

0.180

0.110

0.019

0.032
—
—

0.456

0.456

0.048

0.048

0.056

0.020

10

°

0.430
—

0.050 BSC

-N-

Y BRK

D

D

W

-M-

-L-

28 1

V

G1

K1

MC10E143 MC100E143

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–4

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability , including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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Opportunity/Affirmative Action Employer.

How to reach us:
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MC10E143/D

*MC10E143/D*

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