C
over Page
OPERATING MANUAL
UHV Bakeable Sensor
PN 074-154N
Title P
age
www.inficon.com reachus@inficon.com
©2014 INFICON
®
OPERATING MANUAL
UHV Bakeable Sensor
PN 074-154N
Trademarks
The trademarks of the products mentioned in this manual are held by the companies that
produce them.
RateWatcher™ is a registered trademark of INFICON GmbH.
ConFlat® is a registered trademark of Varian Corporation.
Inconel® is a registered trademark of Inco Alloys International, Huntington, WV.
Swagelok® is a registered trademark of Swagelok Company.
VCR® is a registered trademark of Cajon Company.
Scotch-Brite™ is a trademark of 3M.
Teflon® is a registered trademark of E.I. du Pont de Nemours and Company.
All other brand and product names are trademarks or registered trademarks of their respective companies.
Disclaimer
The information contained in this manual is believed to be accurate and reliable. However, INFICON assumes
no responsibility for its use and shall not be liable for any special, incidental, or consequential damages related
to the use of this product.
Due to our continuing program of product improvements, specifications are subject to change without notice.
Copyright
©2014 All rights reserved.
Reproduction or adaptation of any part of this document without permission is unlawful.
Warranty
WARRANTY AND LIABILITY - LIMITATION: Seller warrants the products
manufactured by it, or by an affiliated company and sold by it, and described on
the reverse hereof, to be, for the period of warranty coverage specified below, free
from defects of materials or workmanship under normal proper use and service.
The period of warranty coverage is specified for the respective products in the
respective Seller instruction manuals for those products but shall not be less than
one (1) year from the date of shipment thereof by Seller. Seller's liability under this
warranty is limited to such of the above products or parts thereof as are returned,
transportation prepaid, to Seller's plant, not later than thirty (30) days after the
expiration of the period of warranty coverage in respect thereof and are found by
Seller's examination to have failed to function properly because of defective
workmanship or materials and not because of improper installation or misuse and
is limited to, at Seller's election, either (a) repairing and returning the product or
part thereof, or (b) furnishing a replacement product or part thereof, transportation
prepaid by Seller in either case. In the event Buyer discovers or learns that a
product does not conform to warranty, Buyer shall immediately notify Seller in
writing of such non-conformity, specifying in reasonable detail the nature of such
non-conformity. If Seller is not provided with such written notification, Seller shall
not be liable for any further damages which could have been avoided if Seller had
been provided with immediate written notification.
THIS WARRANTY IS MADE AND ACCEPTED IN LIEU OF ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, WHETHER OF MERCHANTABILITY OR
OF FITNESS FOR A PARTICULAR PURPOSE OR OTHERWISE, AS BUYER'S
EXCLUSIVE REMEDY FOR ANY DEFECTS IN THE PRODUCTS TO BE SOLD
HEREUNDER. All other obligations and liabilities of Seller, whether in contract or
tort (including negligence) or otherwise, are expressly EXCLUDED. In no event
shall Seller be liable for any costs, expenses or damages, whether direct or
indirect, special, incidental, consequential, or other, on any claim of any defective
product, in excess of the price paid by Buyer for the product plus return
transportation charges prepaid.
No warranty is made by Seller of any Seller product which has been installed,
used or operated contrary to Seller's written instruction manual or which has been
subjected to misuse, negligence or accident or has been repaired or altered by
anyone other than Seller or which has been used in a manner or for a purpose for
which the Seller product was not designed nor against any defects due to plans or
instructions supplied to Seller by or for Buyer.
This manual is intended for private use by INFICON® Inc. and its customers.
Contact INFICON before reproducing its contents.
NOTE: These instructions do not provide for every contingency that may arise in
connection with the installation, operation or maintenance of this equipment.
Should you require further assistance, please contact INFICON.
www.inficon.com reachus@inficon.com
Chapter 1
1.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2 Definition of Notes, Cautions and Warnings. . . . . . . . . . . . . . . . . . . . . . . . .1-2
1.3 How to Contact INFICON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.3.1 Returning the UHV Bakeable Sensor to INFICON . . . . . . . . . . . . . . . . . . . .1-3
1.4 Unpacking and Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
1.4.1 UHV Bakeable Sensor Configuration Overview and Parts. . . . . . . . . . . . . .1-4
1.5 Specifications for the UHV Bakeable Sensor . . . . . . . . . . . . . . . . . . . . . . . .1-5
1.5.1 UHV Bakeable Sensor without Shutter (PN BK-A0F). . . . . . . . . . . . . . . . . . 1-5
1.5.2 UHV Bakeable Sensor with Shutter (PN BK-A1F) . . . . . . . . . . . . . . . . . . . . 1-6
1.5.3 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-6
1.5.4 Installation Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7
1.6 UHV Bakeable Sensor Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-8
UHV Bakeable Sensor Operating Manual
Table Of Contents
Cover Page
Title Page
Trademarks
Disclaimer
Copyright
Warranty
Introduction and Specifications
Chapter 2
UHV Bakeable Sensor Installation
2.1 Pre-installation Sensor Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
PN 074-154N
2.1.1 Sensor Check with XTC/3, IC6, or Cygnus 2
Deposition Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.1.2 Sensor Check with STM-2XM, STM-3, SQM-160, SQC-310,
SQM-242, or IQM-233 Deposition Controller/Monitor . . . . . . . . . . . . . . . . .2-2
™
2.1.3 Sensor Check with Q-pod
or STM-2 Deposition Monitor. . . . . . . . . . . . . . 2-3
2.1.4 Sensor Shutter Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
2.2 Sensor Installation Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
2.3 Sensor Installation Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
2.3.1 Tube Bending . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
2.4 Providing Improved Cooling for the Sensor . . . . . . . . . . . . . . . . . . . . . . . .2-10
TOC - 1
Chapter 3
3.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.2 Installation with the UHV Bakeable Sensor . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.3 Pneumatic Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.4 Electrical Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Chapter 4
4.1 General Precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1.1 Handle the Crystal with Care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1.2 Use the Optimum Crystal Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1.3 Maintain the Temperature of the Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.1.4 Crystal Concerns when Opening the Chamber . . . . . . . . . . . . . . . . . . . . . . 4-2
4.2 Crystal Replacement Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.3 UHV Bakeable Sensor Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.3.1 Adjusting the Leaf Spring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.3.2 Cleaning the Crystal Holder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
4.3.3 Adjusting the Crystal Holder Retainer Spring. . . . . . . . . . . . . . . . . . . . . . . . 4-7
4.3.4 Lubricating the Clamping Mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8
4.3.5 Lubricating the Shutter Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8
4.4 Replacement Parts and Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-9
UHV Bakeable Sensor Operating Manual
Solenoid Valve Assembly Installation
Maintenance and Spare Parts
Chapter 5
Troubleshooting
5.1 Troubleshooting Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.1.1 Symptom, Cause, Remedy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.1.2 Diagnostic Tools. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
5.1.2.1 PN 782-902-023 Oscillator with 5.5 MHz Test Crystal. . . . . . . . . . . . . . . . . 5-4
5.1.2.2 OSC-100 Test Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
5.1.2.3 PN 761-601-G2 Crystal Sensor Emulator . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
5.1.2.4 XIU Test Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5
5.1.3 Digital Multimeter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5
5.1.3.1 Electrical Isolation Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5
5.1.3.2 Electrical Continuity Check. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6
PN 074-154N
TOC - 2
1.1 Introduction
The INFICON UHV Bakeable Sensor (see Figure 1-1) is designed to withstand
continuous bakeout temperatures up to 450°C (for bakeout only, water flow
required for actual deposition monitoring). The front load design allows for easy
insertion of the crystal holder in applications lacking sufficient room for side
insertion. All UHV Bakeable Sensors are welded to a CF40 (2-3/4 in. ConFlat®)
feedthrough. Sensor length must be specified in a sensor length specification form
provided by INFICON, which must be completed when ordering the UHV Bakeable
Sensor.
Figure 1-1 UHV Bakeable Sensor
UHV Bakeable Sensor Operating Manual
Chapter 1
Introduction and Specifications
The UHV Bakeable Sensor is available in a standard configuration where the water
tubes are parallel to the crystal face.
Optionally, sensors can be ordered with a pneumatically driven crystal shutter to
protect the crystal during source warm up, when not used during deposition of an
alternate material, or to extend crystal life when used with RateWatcher™ or rate
PN 074-154N
sampling.
NOTE: Maximum bakeout temperature for sensors with the optional crystal shutter
is reduced to 400°C.
The exposed crystal electrode is fully grounded to effectively eliminate problems
due to RF interference.
1 - 1
UHV Bakeable Sensor Operating Manual
CAUTION
WARNING
1.2 Definition of Notes, Cautions and Warnings
Before using this manual, please take a moment to understand the Cautions and
Warnings used throughout. They provide pertinent information that is useful in
achieving maximum instrument efficiency while ensuring personal safety.
NOTE: Notes provide additional information about the current topic.
Failure to heed these messages could result in damage
to the instrument.
Failure to heed these messages could result in personal
injury.
1.3 How to Contact INFICON
Worldwide customer support information is available under Support >> Support
Worldwide at www.inficon.com:
Sales and Customer Service
Technical Support
Repair Service
When communicating with INFICON about a UHV Bakeable Sensor, please have
the following information readily available:
The Sales Order or Purchase Order number of the UHV Bakeable Sensor
purchase.
The Lot Identification Code, located on the side surface of the sensor head.
A description of the problem.
The exact wording of any error messages that may have been received.
An explanation of any corrective action that may have already been attempted.
PN 074-154N
1 - 2
UHV Bakeable Sensor Operating Manual
1.3.1 Returning the UHV Bakeable Sensor to INFICON
Do not return any sensor component to INFICON without first speaking with a
Customer Support Representative and obtaining a Return Material Authorization
(RMA) number. UHV Bakeable Sensors will not be serviced without an RMA
number.
Packages delivered to INFICON without an RMA number will be held until the
customer is contacted. This will result in delays in servicing the UHV Bakeable
Sensor.
Prior to being given an RMA number, a completed Declaration Of Contamination
(DoC) form may be required. DoC forms must be approved by INFICON before an
RMA number is issued. INFICON may require that the sensor be sent to a
designated decontamination facility, not to the factory.
1.4 Unpacking and Inspection
1 If the UHV Bakeable Sensor has not been removed from its packaging, do so
now. The sensor and accessories are packaged in a single cardboard carton
with a rigid foam insert. Carefully remove the packaged accessories before
removing the sensor.
2 Examine the sensor for damage that may have occurred during shipping. It is
especially important to note obvious rough handling on the outside of the
container. Immediately report any damage to the carrier and to INFICON.
NOTE: Do not discard the packaging material until inventory has been taken
and installation is successful.
3 Refer to the invoice and the information contained in section 1.4.1 to take
inventory.
4 To install the sensor, see Chapter 2, UHV Bakeable Sensor Installation.
5 For additional information or technical assistance, refer to section 1.3, How to
PN 074-154N
Contact INFICON, on page 1-2.
1 - 3
UHV Bakeable Sensor Operating Manual
F
0
1
B K –
A
NOTE 1:
Orders cannot be entered without a completed sensor length
specication form (provided by INFICON). Once order is conrmed,
it cannot be canceled.
NOTE 2:
Sensor lengths are measured from the center of the crystal to
the vacuum side (sealing surface) of the feedthrough (see length
specication form).
NOTE 3:
All UHV Bakeable Sensors are welded to a CF40 feedthrough.
NOTE 4:
Shutter air tube is connected to the feedthrough tube using a
VCR® tting.
Type of Sensor
(crystals sold separately)
Standard
(water lines parallel to crystal face)
Shutter Assembly
None
Standard shutter
Length of Sensor
Standard length –
Shuttered sensors
From 17 to 101.6 cm (6.7 to 40 in.)
Non-shuttered sensors
From 10.2 to 101.6 cm (4 to 40 in.)
subject to an additional charge, as well
as 2-4 weeks additional lead time.
1.4.1 UHV Bakeable Sensor Configuration Overview and Parts
UHV Bakeable Sensor . . . . . . . . . . . . . . BK-AXF (see Figure 1-2)
Figure 1-2 UHV Bakeable Sensor configurations
1 - 4
Thin Film Manuals CD . . . . . . . . . . . . . . . . . . . . . . . PN 074-5000-G1
Crystal Snatcher. . . . . . . . . . . . . . . . . . . . . . . . . . . . PN 008-007
Molybdenum Disulfide in Isopropyl Alcohol . . . . . . . PN 750-191-G1
Graphite in Isopropyl Alcohol
(provided only with shuttered sensors) . . . . . . . . . . PN 009-175
PN 074-154N
UHV Bakeable Sensor Operating Manual
1.5 Specifications for the UHV Bakeable Sensor
Figure 1-3 UHV Bakeable Sensor
1.5.1 UHV Bakeable Sensor without Shutter (PN BK-A0F)
Maximum Temperature. . . . . . . . . . . 450°C continuous bakeout
NOTE: Water flow recommended
for deposition.
Sensor Head Size
(maximum envelope) . . . . . . . . . . . . 34 x 35 x 24 mm
(1.35 x 1.38 x 0.94 in.)
Tubes
Water . . . . . . . . . . . . . . . . . . . . . 3.2 mm (0.125 in.) OD (vacuum side)
6.4 mm (0.25 in.) OD (atmosphere side)
Coax . . . . . . . . . . . . . . . . . . . . . . 4.8 mm (0.188 in.) OD
Crystal exchange . . . . . . . . . . . . . . . Front loading, self-contained package,
cam-type locking handle
PN 074-154N
Mounting. . . . . . . . . . . . . . . . . . . . . . Four #4-40 tapped holes
(on back of sensor body)
4.57 mm (0.18 in.) thread depth
Crystal
(not included with sensor) . . . . . . . . 14 mm (0.550 in.) diameter
1 - 5
UHV Bakeable Sensor Operating Manual
1.5.2 UHV Bakeable Sensor with Shutter (PN BK-A1F)
Maximum Temperature . . . . . . . . . . 400°C continuous bakeout
NOTE: Water flow recommended
for deposition.
Sensor Head Size
(maximum envelope) . . . . . . . . . . . . 34 x 35 x 31 mm
(1.35 x 1.38 x 1.21 in.)
Tubes
Water . . . . . . . . . . . . . . . . . . . . . 3.2 mm (0.125 in.) OD (vacuum side)
6.4 mm (0.25 in.) OD (atmosphere side)
Air. . . . . . . . . . . . . . . . . . . . . . . . 3.2 mm (0.125 in.) OD (vacuum side)
4.8 mm (0.188 in.) OD (atmosphere side)
Coax. . . . . . . . . . . . . . . . . . . . . . 4.8 mm (0.188 in.) OD
Crystal Exchange . . . . . . . . . . . . . . . Front loading, self-contained package,
cam-type locking handle
Mounting . . . . . . . . . . . . . . . . . . . . . Four #4-40 tapped holes
Crystal
(not included with sensor) . . . . . . . . 14 mm (0.550 in.) diameter
1.5.3 Materials
Body and Holder . . . . . . . . . . . . . . . 304 stainless steel
Springs . . . . . . . . . . . . . . . . . . . . . . . Molybdenum and Inconel® X-750
Tubes . . . . . . . . . . . . . . . . . . . . . . . . Seamless 304 stainless steel
Other Mechanical Parts . . . . . . . . . . 18-8 or 304 stainless steel
Insulators . . . . . . . . . . . . . . . . . . . . . >99% Al
Wire . . . . . . . . . . . . . . . . . . . . . . . . . 1) Ni (in vacuum)
Braze . . . . . . . . . . . . . . . . . . . . . . . . Vacuum process high temperature
(on back of sensor body)
4.57 mm (0.18 in.) thread depth
PN 074-154N
2O3
2) Ni plated Cu (atmosphere)
Ni-Cr alloy
1 - 6
1.5.4 Installation Requirements
CAUTION
WARNING
Feedthrough . . . . . . . . . . . . . . . . . . . CF40 (2-3/4 in. ConFlat) feedthrough,
Other . . . . . . . . . . . . . . . . . . . . . . . . XIU or Oscillator to match specific
Water Flow Rate. . . . . . . . . . . . . . . . Minimum water flow 150 to 200 cm
Water Quality . . . . . . . . . . . . . . . . . . Coolant should not contain chlorides as
UHV Bakeable Sensor Operating Manual
integral with sensor head
controller/monitor
BK-A1F only: Solenoid Valve for air,
PN 750-420-G1 (see Chapter 3, Solenoid
Valve Assembly Installation)
30°C maximum
NOTE: User should provide means of easily
disconnecting the 6.35 mm (1/4 in.)
water tubes during bakeout.
stress corrosion cracking may occur.
Extremely dirty water may result in loss of
cooling capacity.
3
/min,
Do not allow water tubes to freeze. This may happen if the
tubes pass through a cryogenic shroud and the flow of
fluid is interrupted.
Air (BK-A1F only) . . . . . . . . . . . . . . . 70 psi (gauge) {85 psi (absolute)}
(5.8 bar (absolute)) [584 kPa (absolute)]
(minimum)
80 psi (gauge) {95 psi (absolute)}
(6.5 bar (absolute)) [653 kPa (absolute)]
PN 074-154N
(maximum)
Do not exceed 100 psi (gauge) {115 psi (absolute)}
(7.9 bar (absolute)) [791 kPa (absolute)].
Connection to excessive pressure may result in personal
injury or equipment damage.
1 - 7
UHV Bakeable Sensor Operating Manual
1.6 UHV Bakeable Sensor Drawings
The following UHV Bakeable Sensor Outline and Assembly Drawings provide
dimensions and other relevant data necessary for planning equipment
configurations.
Figure 1-4 on page 1-9. . . . . . . . . . . UHV Bakeable Sensor and Feedthrough
Figure 1-5 on page 1-10. . . . . . . . . . UHV Bakeable Sensor and Feedthrough
Figure 1-6 on page 1-11. . . . . . . . . . Shuttered UHV Bakeable Sensor with
Figure 1-7 on page 1-12. . . . . . . . . . Shuttered UHV Bakeable Sensor with
Outline
Assembly
Feedthrough Outline
Feedthrough Assembly
1 - 8
PN 074-154N
UHV Bakeable Sensor Operating Manual
XX
XX + 6.31 [160 MM]
Figure 1-4 UHV Bakeable Sensor and feedthrough outline
PN 074-154N
1 - 9
UHV Bakeable Sensor Operating Manual
1 - 10
Figure 1-5 UHV Bakeable Sensor and feedthrough assembly
PN 074-154N
UHV Bakeable Sensor Operating Manual
XX
XX + 6.31 [160 MM]
Figure 1-6 Shuttered UHV Bakeable Sensor with feedthrough outline
PN 074-154N
1 - 11
UHV Bakeable Sensor Operating Manual
1 - 12
Figure 1-7 Shuttered UHV Bakeable Sensor with feedthrough assembly
PN 074-154N
UHV Bakeable Sensor Operating Manual
UHV Bakeable Sensor Installation
2.1 Pre-installation Sensor Check
Prior to installing the sensor in the vacuum system, make certain that it is in proper
working condition by following the appropriate procedure.
2.1.1 Sensor Check with XTC/3, IC6, or Cygnus 2 Deposition Controller
1 Connect one end of the 15.2 cm (6 in.) BNC cable (PN 755-257-G6)
to the BNC connector on the feedthrough.
2 Connect the other end of the 15.2 cm (6 in.) BNC cable
to the connector of the ModeLock oscillator (XIU) (PN 781-600-GX).
3 Connect one end of the XIU cable (PN 600-1261-PXX)
to the mating connector of the XIU.
Chapter 2
4 Connect the other end of the XIU cable to a sensor channel
at the rear of the controller.
5 Install the crystal as instructed by section 4.2 on page 4-3.
6 Connect power to the controller.
7 Set the power switch to ON.
8 Set density at 1.00 g/cm
3
.
9 Zero the thickness. The display should indicate 0 or ± 0.001 kÅ.
Crystal life should read from 0 to 5%.
10 Breathe heavily on the crystal. A thickness indication of 1.000 to 2.000 kÅ
should display. When the moisture evaporates, the thickness indication should
PN 074-154N
return to approximately zero. If these conditions are observed, the sensor is in
proper working order and may be installed (see section 2.3 on page 2-7).
2 - 1
UHV Bakeable Sensor Operating Manual
2.1.2 Sensor Check with STM-2XM, STM-3, SQM-160, SQC-310, SQM-242, or IQM-233 Deposition Controller/Monitor
1 Connect one end of the 15.2 cm (6 in.) BNC cable (PN 782-902-011)
to the BNC connector on the feedthrough.
2 Connect the other end of the 15.2 cm (6 in.) BNC cable to the connector
of the oscillator (PN 782-900-010 or 783-500-013) labeled Feedthrough or
Sensor.
3 Connect one end of the oscillator cable (PN 782-902-012-XX)
to the mating connector of the oscillator labeled Instrument or Control Unit.
4 Connect the other end of the oscillator cable to a sensor connector
at the rear of the controller/monitor.
5 Install the crystal as instructed by section 4.2 on page 4-3.
6 Connect power to the controller.
7 Set the power switch to ON.
8 For the SQM-242 card, IQM-233 card, or STM-3, launch the appropriate
software.
9 Set density at 1.00 g/cm
3
.
10 Zero the thickness. The display should indicate 0 or ± 0.001 kÅ.
Crystal life should read from 95 to 100%.
11 Breathe heavily on the crystal. A thickness indication of 1.000 to 2.000 kÅ
should display. When the moisture evaporates, the thickness indication should
return to approximately zero. If these conditions are observed, the sensor is in
proper working order and may be installed (see section 2.3 on page 2-7).
PN 074-154N
2 - 2
UHV Bakeable Sensor Operating Manual
2.1.3 Sensor Check with Q-pod™ or STM-2 Deposition Monitor
1 Connect one end of the 15.2 cm (6 in.) BNC cable (PN 782-902-011)
to the BNC connector on the feedthrough.
2 Connect the other end of the 15.2 cm (6 in.) BNC cable to the connector
of the Q-pod or STM-2.
3 Connect one end of the USB cable (PN 068-0472) to the mating connector
of the Q-pod or STM-2.
4 Connect the other end of the USB cable to a USB port on the computer being
used to operate the Q-pod or STM-2.
5 Install the crystal as instructed by section 4.2 on page 4-3.
6 Launch the appropriate monitor software.
7 Set density at 1.00 g/cm
8 Zero the thickness. The display will indicate 0 or ± 0.001 kÅ. Crystal life should
read from 95 to 100%. The green indicator on the Q-pod or STM-2 should be
illuminated.
3
.
9 Breathe heavily on the crystal. A thickness indication of 1.000 to 2.000 kÅ
should display. When the moisture evaporates, the thickness indication should
return to approximately zero. If these conditions are observed, the sensor is in
proper working order and may be installed (see section 2.3 on page 2-7).
PN 074-154N
2 - 3
UHV Bakeable Sensor Operating Manual
WARNING
2.1.4 Sensor Shutter Check
Temporarily connect an air supply to the actuator air tube fitting on the feedthrough.
Use the manual override button on the solenoid valve (see Figure 3-2 on page 3-4),
or other means, to activate and deactivate the pneumatic shutter several times.
NOTE: The air supply must be 70 psi (gauge) {85 psi (absolute)}
(5.8 bar (absolute) [584 kPa (absolute)] (minimum) to 80 psi (gauge)
{95 psi (absolute)} (6.5 bar (absolute)) [653 kPa (absolute)] (maximum).
Do not exceed 100 psi (gauge) {115 psi (absolute)}
(7.9 bar (absolute)) [791 kPa (absolute)].
Connection to excessive pressure may result in personal
injury or equipment damage.
When activated, shutter movement should be smooth, rapid, complete, and the
shutter should completely expose the crystal opening. When deactivated, the
shutter should completely cover the crystal opening. Repositioning of the shutter
may be required to achieve optimum positioning. To adjust the position of the
shutter on the shutter shaft, loosen the socket screw on the shutter assembly,
rotate the shutter to the desired position, and tighten the socket screw.
NOTE: A Solenoid Valve (PN 750-420-G1) is required for a shuttered sensor
installation. See Chapter 3 for more information on the Solenoid Valve
and its installation.
2.2 Sensor Installation Guidelines
Install the sensor as far as possible from the evaporation source (a minimum of
25.4 cm or 10 in.) while keeping the sensor in a position well within the evaporant
stream to accumulate thickness at a rate proportional to accumulation on the
substrate. Figure 2-2 on page 2-6 shows proper and improper methods of installing
sensors.
Plan the installation to ensure that there are no obstructions blocking a direct path
between the sensor and the source.
For best process reproducibility, support the sensor so that it cannot move during
maintenance and crystal replacement.
Figure 2-1 shows the typical installation of an INFICON UHV Bakeable Sensor in
the vacuum process chamber. Use the illustration and the following guidelines to
install sensors for optimum performance and convenience.
PN 074-154N
2 - 4
Figure 2-1 Typical UHV Bakeable Sensor installation
>
Mounting Bracket
Coax Tube
Weld Joint
Source
to
Sensor
25.4 cm
(10 in.)
Minimum
Sensor
Shutter
Source
Pneumatic
Actuator
PN 750-420-G1
Solenoid
Valve
Instrument Chassis
To
Source Controller
To
Instrument
Chassis
Water In
Water Out
Air Supply
Source
Shutter
XIU (Oscillator)
VCR
Fitting
UHV Bakeable Sensor Operating Manual
PN 074-154N
2 - 5
UHV Bakeable Sensor Operating Manual
Correct
Incorrect
Correct
Incorrect
Incorrect
Obstruction
Source
The sensor head must be installed such that the face of the crystal is perpendicular
to the evaporant stream from the source (see Figure 2-2). Two effects may arise if
the sensor head is not perpendicular to the evaporant stream, and the combination
of these effects will have a negative effect on crystal life and increase the
probability of mode hops:
The deposit will not be even across the crystal surface. The edge of the crystal
that is angled away from the source is farther away from the source and
receives less material, causing the thickness of the deposit to become wedge
shaped. This wedge shape in the deposited film tends to reduce the activity of
the crystal at its primary resonance.
The area of the deposit shifts from the center of the crystal. This is due to the
shadowing effect of the crystal aperture. If the crystal is not square to the
evaporant stream, the strength of spurious (non-thickness shear) modes of
vibration are enhanced. If the activity of these spurious modes of oscillation
become strong enough, they cause short-term perturbation of the fundamental
frequency. If they get very strong, the oscillator can lock onto the spurious
mode of oscillation, causing a mode hop.
Figure 2-2 Sensor installation guidelines
2 - 6
To guard against spattering, use a source shutter to shield the sensor during initial
soak periods. If the crystal is hit with only a very small particle of molten material,
it may be damaged and stop oscillating. Even in cases when it does not completely
stop oscillating, the crystal may immediately become unstable, or shortly after
deposition begins, instability may occur.
PN 074-154N
UHV Bakeable Sensor Operating Manual
CAUTION
In many cases installing multiple sensors to monitor one source can improve
thickness accuracy. The rules for multiple sensors are the same as for a single
sensor installation, and the locations chosen must be as defined above. Consult
the monitor or controller manual for more information regarding the availability of
this feature.
NOTE: A technical description may be found in the 39th Annual Conference
Proceedings, Society of Vacuum Coaters, Reducing Process Variation
Through Multiple Point Crystal Sensor Monitoring, J. Kushneir, C. Gogol,
J. Blaise, pp19-23, ISSN 0737-5921 (1996).
2.3 Sensor Installation Procedure
The UHV Bakeable Sensor should be clean and free of
grease when installed in the vacuum chamber. Clean
nylon gloves should be worn while handling.
If parts do become contaminated, clean them thoroughly
using a suitable solvent to avoid outgassing.
1 A mounting bracket (user provided) is recommended to prevent movement of
the sensor head during maintenance or crystal replacement. Assemble the
sensor mounting bracket (user provided) on the process system.
NOTE: Four #4-40 thread holes are provided on the back of the sensor head
for attaching the bakeable sensor to the mounting bracket.
2 If the sensor tubing needs to be bent to achieve the desired position of the
sensor head, see section 2.3.1, Tube Bending, on page 2-9.
3 Connect the sensor feedthrough to the mating flange on the vacuum chamber.
PN 074-154N
4 Connect the sensor head to the mounting bracket, using #4-40 screws and the
mounting holes provided on the back of the sensor head.
NOTE: Mounting hole thread depth is 4.57 mm (0.18 in.)
5 Connect the external water tubes from the feedthrough to the water supply
system and flow controller. Use detachable couples (Swagelok® or equivalent)
for external water tube connections.
6 Apply water at the specified flow rate (refer to section 1.5.4, Installation
Requirements, on page 1-7), and verify that the water connections are tight.
2 - 7
UHV Bakeable Sensor Operating Manual
WARNING
7 If the bakeable sensor has a shutter:
7a Attach air connection to solenoid valve (see Chapter 3) and adjust air
pressure to be 70 psi (gauge) {85 psi (absolute)} (5.8 bar (absolute))
[584 kPa (absolute)] (minimum) to 80 psi (gauge) {95 psi (absolute)}
(6.5 bar (absolute)) [653 kPa (absolute)] (maximum).
Do not exceed 100 psi (gauge) {115 psi (absolute)}
(7.9 bar (absolute)) [791 kPa (absolute)].
Connection to excessive pressure may result in personal
injury or equipment damage.
7b Activate the solenoid valve (the manual override button may be used), and
verify that the sensor shutter moves smoothly and rapidly to completely
expose the crystal opening. Deactivate the solenoid valve and verify that
the shutter completely covers the crystal opening.
NOTE: If adjustment of the shutter position is needed, loosen the socket screw
on the shutter assembly, rotate the shutter to the desired position, and
tighten the socket screw.
8 Because of geometric factors, variations in surface temperature, and
differences in electrical potential, the crystal and substrates often do not
receive the same amount of material. Calibration is required to make sure the
thickness indication on the instrument accurately represents the thickness on
the substrates. Refer to the instrument operating manual for calibration
procedures.
9 Refer to section 1.5 on page 1-5 for other installation requirements, including
maximum operating temperatures.
10 See section 2.4 on page 2-10 for recommendations concerning improved
cooling for the UHV Bakeable Sensor.
PN 074-154N
2 - 8
2.3.1 Tube Bending
CAUTION
CAUTION
CAUTION
If it is necessary to bend the tubes to clear obstacles inside the chamber or to bring
the sensor head into a proper mounting location, observe the following precautions:
For bakeable sensors with clamps on the tubing, bend the tubing only between
the clamps, making sure the clamp screws are tight before bending the tubing.
For shorter bakeable sensors that do not include clamps, bend the tubing only
where the tubes are parallel and in contact with each other.
UHV Bakeable Sensor Operating Manual
Read this entire section before attempting to
bend the tubes. Incorrect tube bending that
damages the tubes voids the warranty.
Do not bend near the sensor head. Stress in this area can
crack the ceramic feedthrough and cause loss of vacuum
integrity or short the wire providing crystal drive.
Always use a bending tool or form and support the tubes where the bends will
be placed to avoid a tube being collapsed or pinched.
If the water tube is collapsed or pinched, water flow will be restricted. The
sensor will not have sufficient cooling.
If the air tube is collapsed or pinched, air pressure will be restricted. The
shutter will not operate correctly.
If the coax tube is collapsed or pinched, the wire providing the crystal drive
can short.
PN 074-154N
Do not form the sensor tubes with a bend radius
less than 50.8 mm (2.0 in.) from the inside of the bend.
Water, air, and coax tubes are semi-rigid, but flexible enough to bend. They are not
designed for repeated bending. Plan bends wisely. Before the actual tube bending,
verify the bend position again to avoid readjusting. If in doubt, contact INFICON
support (refer to section 1.3, How to Contact INFICON, on page 1-2).
2 - 9
UHV Bakeable Sensor Operating Manual
19 mm
(0.75 in.)
27 mm
(1.06 in.)
Material - Au, Al
Recommended thickness range
0.013 to 0.08 mm (0.0005 to 0.003 in.)
2.4 Providing Improved Cooling for the Sensor
Because of its temperature requirements, the UHV Bakeable Sensor is made
primarily of stainless steel. This poses a difficult problem from the design
standpoint of thermal transfer. The clamping action of the spring and cam
mechanism was found to provide better transfer of heat than other methods,
because it allows continuous contact pressure throughout the temperature cycles
encountered. However, for some applications where the materials are evaporated
at high rate and/or high temperatures, thermal transfer may still be insufficient for
ideal operation of the quartz crystal.
To improve the thermal transfer between the crystal holder and the water-cooled
body of the UHV Bakeable Sensor, a thin washer can be fabricated of easily
deformable metal to insert between the holder and the body. Once fabricated, this
washer will last indefinitely. It can provide a 50% improvement in thermal transfer
between the two parts by increasing the surface contact between the two
non-deformable stainless steel parts.
Both gold and aluminum have been used successfully in this way, but since
aluminum foil is nearly perfect in thickness, it is the first choice. (Gold works only
slightly better.) Figure 2-3 is a guide to the fabrication of the washer.
Figure 2-3 Guide to fabrication of washer
PN 074-154N
2 - 10
3.1 Introduction
UHV Bakeable Sensor Operating Manual
Chapter 3
Solenoid Valve Assembly Installation
The solenoid valve assembly (PN 750-420-G1, see
the shuttered UHV Bakeable Sensor assembly should be installed at the same
time.
3.2 Installation with the UHV Bakeable Sensor
1 Align the score line on the solenoid valve bracket (see Figure 3-2 on page 3-4)
over the edge of a table or other square edge.
2 Using pliers, grasp the part of the bracket extending over the edge and push
down. The assembly will break along the score line.
3 Use a file to smooth any rough edges which occur along the break.
4 Insert the bakeable sensor through the mating flange on the vacuum chamber.
5 Place the solenoid valve bracket at the desired position on the outside of the
feedthrough, with the two holes in the bracket aligned with two of the
feedthrough bolt holes.
6 Install and tighten the feedthrough bolts.
7 Remove the quick disconnect air fitting from the exhaust port of the
solenoid valve (see Pneumatic Connections, section 3.3) and thread it into the
#10-32 fitting adapter on the feedthrough air tube.
Figure 3-2 on page 3-4
) and
8 Connect the 3.175 mm (0.125 in.) air tube from the A port of the solenoid valve
to the quick disconnect fitting installed in step 7 (see Pneumatic Connections,
section 3.3).
PN 074-154N
3 - 1
UHV Bakeable Sensor Operating Manual
WARNING
CAUTION
To Ai r
Fitting Of
Feedthrough
(Normally Open)
A Output
Port
P Supply
(Normally Closed)
Tube Fitting
Air Supply
(Provided With Valve)
Exhaust
9 Attach the P port of the solenoid valve to a source of air. The air supply must
be 70 psi (gauge) {85 psi (absolute)} (5.8 bar (absolute)) [584 kPa (absolute)]
(minimum) to 80 psi (gauge) {95 psi (absolute)} (6.5 bar (absolute))
[653 kPa (absolute)] (maximum) (see Pneumatic Connections, section 3.3.)
Do not exceed 100 psi (gauge) {115 psi (absolute)}
(7.9 bar (absolute)) [791 kPa (absolute)].
Connection to excessive pressure may result in personal
injury or equipment damage.
Maximum temperature for the solenoid valve assembly
is 105 °C for bakeout and operation.
10 Make electrical connections to the solenoid valve (see Electrical Connections,
section 3.4).
3.3 Pneumatic Connections
Figure 3-1 Pneumatic solenoid valve tube connections
PN 074-154N
3 - 2
3.4 Electrical Connections
CAUTION
To complete installation of the assembly, make electrical connections
where indicated in Figure 3-2 to either 24 V(ac) or 24 V(dc).
Current required is approximately 70 mA.
The maximum applied voltage must not exceed
26 V (ac) or 26 V (dc).
UHV Bakeable Sensor Operating Manual
PN 074-154N
3 - 3
UHV Bakeable Sensor Operating Manual
Figure 3-2 Solenoid valve
PN 074-154N
3 - 4
4.1 General Precautions
CAUTION
CAUTION
Wear clean nylon or talc-free latex lab gloves when
handling sensor components. If sensor components
become contaminated, clean them thoroughly using a
suitable solvent to avoid outgassing under vacuum.
4.1.1 Handle the Crystal with Care
The crystal surfaces are easily contaminated; handle the crystals only by their
edges, and always use clean nylon lab gloves when handling crystal holders and
retainers and clean plastic tweezers when handling crystals. If using a vacuum
pencil to handle crystals, be sure the vacuum pencil tip is clean and not
contaminated.
UHV Bakeable Sensor Operating Manual
Chapter 4
Maintenance and Spare Parts
Contamination can lead to poor film adhesion. Poor film adhesion will result in high
rate noise and premature crystal failure.
Do not use metal tweezers to handle crystals.
Metal tweezers may chip the edge of the crystal.
PN 074-154N
4.1.2 Use the Optimum Crystal Type
Silver crystals are recommended for sputtering and other applications with
sustained high heat loads.
Certain materials, especially dielectrics, may not adhere strongly to the crystal
surface and may cause erratic readings. For many dielectrics, adhesion is
improved by using alloy crystals.
Gold is preferred for other applications. Contact INFICON for crystal material
electrode recommendations for a specific evaporant application (refer to section
1.3 on page 1-2).
4 - 1
UHV Bakeable Sensor Operating Manual
4.1.3 Maintain the Temperature of the Crystal
Periodically measure the water flow rate leaving the sensor to verify that
the flow rate meets or exceeds the flow rate value specified (refer to page 1-7).
Depending upon the condition of the cooling water used, the addition of an in-line
water filtering cartridge system may be necessary to prevent flow obstructions.
Many system coaters use parallel water supplies that provide high water flow rates.
With a parallel water supply, an obstruction or closed valve in the pipe that supplies
water to the sensor head may not result in a noticeable reduction of total flow.
Therefore, monitor the flow leaving the sensor, not the flow entering the sensor.
The crystal requires sufficient water cooling to sustain proper operational and
temperature stability. Ideally, a constant heat load is balanced by a constant flow of
water at a constant temperature.
INFICON quartz crystals are designed to provide the best possible stability
under normal operating conditions.
No crystal can completely eliminate the effects of varying heat loads. Sources of
heat variation include radiated energy emanating from the evaporant source and
from substrate heaters.
NOTE: Water cooling temperature near the dew point in the room should be
avoided. Condensation can cause early crystal failures.
It is recommended that water cooling temperature be maintained at 5 to 10°C
above the dew point in the room during a vent of the system. Water cooling
temperature can be lowered to a temperature less than 30°C under vacuum.
4.1.4 Crystal Concerns when Opening the Chamber
Thick deposits of some materials, such as SiO, Si, and Ni will normally peel off the
crystal when it is exposed to air due to changes in film stress caused by gas
absorption. When peeling is observed, replace the crystal.
PN 074-154N
4 - 2
UHV Bakeable Sensor Operating Manual
CAUTION
4.2 Crystal Replacement Instructions
Follow the steps below to replace the crystals.
NOTE: Review section 4.1, General Precautions, on page 4-1.
To preserve cleanliness and to maximize crystal
performance, perform all work in a clean room
environment.
1 Remove the crystal holder by releasing the clamping spring handle towards the
crystal side of the sensor.
2 Insert the tapered end of the crystal snatcher (PN 008-007) into the ceramic
retainer (see Figure 4-1 (A)) and apply a small amount of pressure. This locks
the retainer to the snatcher and allows the retainer to be pulled straight out (see
Figure 4-1 (B)).
Figure 4-1 Using the crystal snatcher
PN 074-154N
3 Invert the crystal holder and the crystal will drop out.
4 Prior to installing the new crystal, review section 4.1.1, Handle the Crystal with
Care, on page 4-1.
5 Grasp the edge of the new crystal with clean plastic tweezers. Orient the crystal
so the patterned electrode is facing up. Gently insert the edge of the crystal
beneath one of the wire segments that protrude into the crystal cavity. Release
the crystal.
4 - 3
UHV Bakeable Sensor Operating Manual
CAUTION
CAUTION
6 Replace the ceramic retainer. Initially orient it at an angle to displace the spring
wire segments in the crystal holder.
Do not use excessive force when handling the
Ceramic Retainer Assembly since breakage may occur.
Always use the crystal snatcher.
To prevent scratching the crystal electrode, do not rotate
the ceramic retainer after installation.
7 Release the crystal snatcher with a slight side-to-side rocking motion. Using the
backside of the crystal snatcher, push on the ceramic retainer to ensure it is
completely seated.
8 Reinstall the holder in the sensor body. Push the holder straight in making
certain that it is completely seated in the senor body, then latch the clamping
spring handle.
Never deposit material on a sensor unless the crystal
holder and crystal are installed. Material deposited on the
exposed sensor body assembly will cause either
complete failure to oscillate or lead to premature crystal
failure. Removing the deposited material requires
extensive rework and new components.
PN 074-154N
4 - 4
UHV Bakeable Sensor Operating Manual
45°
Avoid
Kinking
Leaf
Spring
Leaf Spring
45°
4.3 UHV Bakeable Sensor Maintenance
4.3.1 Adjusting the Leaf Spring
UHV Bakeable Sensors have one leaf spring with three prongs located on the
ceramic retainer that provides an electrical connection to the crystal electrode.
Examine the prongs on the leaf spring positioned on the ceramic retainer. If they
are significantly lower than shown by Figure 4-2, they should be adjusted to an
angle of approximately 45 degrees.
NOTE: A leaf spring adjusted to 45 degrees will flatten slightly after being inserted
into and extracted from the crystal holder.
Figure 4-2 Ceramic retainer
To adjust the prongs on the leaf spring positioned on the ceramic retainer, touch
the end of the prong with a gloved finger, or grip the prong with Teflon tweezers,
and gently lift it upward. Be careful not to kink the prongs. An ideal bend has a
smooth, sweeping shape (see Figure 4-3).
Figure 4-3 Leaf spring shape
PN 074-154N
4 - 5
UHV Bakeable Sensor Operating Manual
CAUTION
Clean or polish
this surface.
Remove all oxides.
Do not scratch.
4.3.2 Cleaning the Crystal Holder
In dielectric coating applications, the crystal seating surface of the crystal holder
may require periodic cleaning. Since most dielectrics are insulators, any material
buildup on this surface from an evaporation process can cause a poor electrical
contact between the crystal and the crystal holder. Material buildup will also cause
a reduction in thermal transfer from the crystal to the sensor body. A poor electrical
contact or poor thermal transfer will result in noisy operation and early crystal
failure.
Cleaning may be accomplished by following three steps:
1 Gently buffing the crystal seating surface in the crystal holder with a white,
#7445 Scotch-Brite™ cleaning pad (ee Figure 4-4).
2 Washing the crystal seating surface in the crystal holder in an ultrasonic bath
in soap solution.
3 Thorough rinsing of the crystal seating surface in the crystal holder with
deionized water and drying, or by ultrasonic cleaning and deionized water
rinsing only.
NOTE: The crystal holder seating surface is machined to a very fine finish
(16 micro inches rms). This high quality finish is essential to provide good
electrical and thermal contact with the crystal.
4 - 6
Applying excessive force during cleaning or using overly
abrasive cleaning materials may damage this finish and
reduce sensor performance.
Figure 4-4 Crystal holder cleaning
PN 074-154N
UHV Bakeable Sensor Operating Manual
Scribe
Crystal Holder
Move location of transition point in this
direction to decrease retainer retention force
Move location of transition point in this
direction to increase retainer retention force
Location of Transition Point
(c)
4.3.3 Adjusting the Crystal Holder Retainer Spring
Occasionally, the ceramic retainer may not be secured in the crystal holder. To alter
the retainer retention force, use the following procedure.
Tools required
Scribe or other pointed tool
Needle nose pliers (two required)
Procedure
1 Position the crystal holder with the crystal aperture oriented downward.
2 Insert the point of the scribe between the inside edge of the crystal holder cavity
and one of the two wire segments that protrude into the crystal cavity (see
Figure 4-5 (a)).
Figure 4-5 Location of the transition point
Wire
(a)
(b)
3 Using the scribe, gently remove the spring from its groove in the
PN 074-154N
crystal holder cavity.
4 Refer to Figure 4-5 (b) to determine the direction in which the ‘transition point’
must be relocated, to attain the desired retention forces. Moving this transition
point approximately 1.59 mm (1/16 in.) is generally sufficient.
5 Grasp the spring, with the pliers, just below the transition point. Use the second
set of pliers to bend the spring as illustrated by the dashed line in Figure 4-5 (c)
to remove the existing transition point.
6 Use both pliers to form a new transition point according to Figure 4-5 (b),
thus returning the spring to a shape similar to the solid line delineation
of Figure 4-5 (c).
4 - 7
UHV Bakeable Sensor Operating Manual
Apply molybdenum
disulfide or graphite
to the inside of the
slots in the clamping
mechanism.
7 Reinstall the spring into the groove provided in the crystal cavity.
8 Determine if the retention force is acceptable and that the wire does not impede
crystal insertion. If needed, repeat the adjustment procedure.
4.3.4 Lubricating the Clamping Mechanism
If operation is impaired, lubricate moving parts with molybdenum disulfide (PN
750-191-G1), provided with each shuttered sensor, or graphite (PN 009-175), if
appropriate for the process.
The clamping mechanism may need to be lubricated on both shuttered and
non-shuttered UHV Bakeable Sensors (see Figure 4-6).
Figure 4-6 Lubricating the clamping mechanism
4.3.5 Lubricating the Shutter Module
The shutter module should be lubricated approximately every 2000 strokes at
areas specified as shown in Figure 4-7. Failure to lubricate the shutter module may
significantly reduce life of operation or cause assembly to become inoperative.
For lubrication, use molybdenum disulfide (PN 750-191-G1), provided with each
shuttered sensor, or use graphite (PN 009-175), if appropriate for the process.
4 - 8
PN 074-154N
UHV Bakeable Sensor Operating Manual
Apply graphite to
the top edge of the
clamp where the shutter
meets the clamp
Apply molybdenum
disulfide to the
exposed shaft with
the shutter in the
open position
Apply molybdenum disulfide to
the hole where the pin makes
contact with the shutter in
the open and closed positions
Apply molybdenum disulfide
or graphite to the inside of
the slots in the clamping mechanism
Lubricate these moving
parts if operation is impaired
Apply graphite to
the inside hole
Figure 4-7 Lubrication of shuttered UHV Bakeable Sensor
PN 074-154N
4.4 Replacement Parts and Accessories
Ceramic Retainer . . . . . . . . . . . . . . . PN 007-064
Crystal Holder. . . . . . . . . . . . . . . . . . PN 750-218-G1
Shutter . . . . . . . . . . . . . . . . . . . . . . . PN 750-216-G1
Crystal Snatcher. . . . . . . . . . . . . . . . PN 008-007
4 - 9
UHV Bakeable Sensor Operating Manual
This page is intentionally blank.
4 - 10
PN 074-154N
5.1 Troubleshooting Tools
If the UHV Bakeable Sensor fails to function, or appears to have diminished
performance, diagnose the sensor using one or more of the following:
Symptom, Cause, Remedy chart (see section 5.1.1)
Diagnostic Tools (see section 5.1.2 on page 5-4)
Digital Multimeter (see section 5.1.3 on page 5-5)
5.1.1 Symptom, Cause, Remedy
The Symptom, Cause, Remedy chart can help identify the causes of, and solutions
to, sensor problems and related issues (see Table 5-1).
UHV Bakeable Sensor Operating Manual
Chapter 5
Troubleshooting
Table 5-1 Symptom, Cause, Remedy
SYMPTOM CAUSE REMEDY
Large jumps of thickness
reading during deposition.
PN 074-154N
Crystal ceases to oscillate
during deposition before it
reaches its “normal” life.
Mode hopping due to damaged
or heavily damped crystal.
Crystal is near the end of its life.
Scratches or foreign particles on
the crystal holder seating
surface.
Uneven coating. Mount the sensor with the
Particles on the crystal. Remove source of particles and
Crystal is being hit by small
droplets of molten material from
the evaporation source.
Replace the crystal.
Clean or polish the crystal
seating surface of the crystal
holder (refer to section 4.3.2 on
page 4-6).
crystal face perpendicular to the
evaporant stream (refer to
section 2.2 on page 2-4).
replace the crystal.
Use a shutter to shield the
sensor during initial period of
evaporation.
Move the sensor farther from the
source.
5 - 1
UHV Bakeable Sensor Operating Manual
Table 5-1 Symptom, Cause, Remedy (continued)
SYMPTOM CAUSE REMEDY
Crystal ceases to oscillate
during deposition before it
reaches its “normal” life.
Short crystal life Crystal life is highly dependent on process conditions of rate,
Crystal does not oscillate or
oscillates intermittently (both in
vacuum and in air).
Crystal oscillates in vacuum but
stops oscillation after open to air.
Damaged crystal. Replace the crystal.
Deposition material on crystal
holder opening is touching the
crystal.
Deposition material on crystal
holder opening is partially
masking the crystal.
power radiated from source, location, material, and residual gas
composition.
Damaged crystal. Replace the crystal.
Sensor or feedthrough has
electrical short or open, or poor
electrical connections.
Crystal is near the end of its life;
opening to air causes film
oxidation, which increases film
stress.
Excessive moisture
accumulation on the crystal.
Remove material buildup from
the crystal holder opening, being
careful not to scratch the crystal
seating surface (refer to section
4.3.2 on page 4-6).
Check electrical continuity and
isolation of sensor and
feedthrough (see section 5.1.3
on page 5-5).
Replace the crystal.
Turn off cooling water to sensor
before venting vacuum
chamber.
Thermal instability: large
changes in thickness reading
during source warm-up (usually
causes thickness reading to
decrease) and after the
termination of deposition
(usually causes thickness
reading to increase).
Crystal is not properly seated,
causing poor thermal transfer
from crystal to crystal holder.
Thermal transfer from crystal
holder to sensor body is
insufficient for the application.
Flow hot water through the
sensor when the vacuum
chamber is open.
Check and clean the crystal
seating surface of the crystal
holder (refer to section 4.3.2 on
page 4-6).
Install a thin metal washer
between crystal holder and
sensor body to improve thermal
transfer (refer to section 2.4 on
page 2-10).
PN 074-154N
5 - 2
UHV Bakeable Sensor Operating Manual
Table 5-1 Symptom, Cause, Remedy (continued)
SYMPTOM CAUSE REMEDY
Thermal instability: large
changes in thickness reading
during source warm-up (usually
causes thickness reading to
decrease) and after the
termination of deposition
(usually causes thickness
reading to increase).
Poor thickness reproducibility. Erratic source emission
Excessive heat applied to the
crystal.
No cooling water.
Water flow rate is low.
Water temperature too high.
Heat induced from electron flux. Use sputtering head for
characteristics.
If heat is due to radiation from
the evaporation source, move
sensor farther away from source
and use Low Thermal Shock
crystals (PN SPC-1157-G10) for
better thermal stability.
If the source of crystal heating is
due to a secondary electron
beam, use a sputtering sensor.
Check cooling water flow rate.
non-magnetron sputtering.
Move sensor to a different
location.
Check the evaporation source
for proper operating conditions.
Ensure relatively constant pool
height and avoid tunneling into
the melt.
Use multiple sensor option if
available on controller.
Material does not adhere to the
crystal.
PN 074-154N
Check the cleanliness of the
crystal.
Use gold or silver or alloy
crystals, as appropriate.
Evaporate an intermediate layer
of proper material on the crystal
to improve adhesion.
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UHV Bakeable Sensor Operating Manual
5.1.2 Diagnostic Tools
The following diagnostic tools can be used to determine if a crystal fail condition is
due to the UHV Bakeable Sensor or the instrument the sensor is used with:
PN 782-902-023 oscillator with 5.5 MHz test crystal (see section 5.1.2.1).
OSC-100 oscillator test function (see section 5.1.2.2).
PN 760-601-G2 Crystal Sensor Emulator (see section 5.1.2.3).
XIU test function (see section 5.1.2.4).
5.1.2.1 PN 782-902-023 Oscillator with 5.5 MHz Test Crystal
1 Disconnect the short BNC cable from the BNC connector on the bakeable
sensor feedthrough.
2 Connect the 5.5 MHz test crystal (included with oscillator) to the short BNC
cable connected to the oscillator.
If the crystal fail disappears within 5 seconds, the bakeable sensor is the
cause of the crystal fail.
If the crystal fail is still present after 5 seconds, the controller or monitor, the
oscillator, or a cable is the cause of the crystal fail. Refer to the controller or
monitor operating manual.
5.1.2.2 OSC-100 Test Function
1 Disconnect the short BNC cable from the BNC connector on the bakeable
sensor feedthrough.
2 Depress the test button on the OSC-100 oscillator.
If the crystal fail disappears within 5 seconds with the button depressed, the
bakeable sensor or the short BNC cable is the cause of the crystal fail.
If the crystal fail is still present after 5 seconds with the button depressed,
the controller or monitor, the oscillator, or a cable is the cause of the crystal
fail. Refer to the controller or monitor operating manual.
5.1.2.3 PN 761-601-G2 Crystal Sensor Emulator
1 Disconnect the short BNC cable from the BNC connector on the bakeable
sensor feedthrough.
2 Connect the Crystal Sensor Emulator to the short BNC cable connected to the
XIU or oscillator.
PN 074-154N
5 - 4
If the crystal fail disappears within 5 seconds, the bakeable sensor is the
cause of the crystal fail.
If the crystal fail is still present after 5 seconds, the controller or monitor, the
oscillator or XIU, or a cable is the cause of the crystal fail. Refer to the
controller or monitor operating manual.
5.1.2.4 XIU Test Function
The XIU Test function is a feature of IC/5, Cygnus, IC6, Cygnus 2, and XTC/3
controllers. Refer to the controller operating manual for instructions on using
the XIU test function.
5.1.3 Digital Multimeter
A useful tool for diagnosing sensor problems is the Digital Multimeter (DMM).
To isolate the cause of a sensor problem, perform electrical isolation and continuity
checks, starting with the Electrical Isolation Check (section 5.1.3.1).
5.1.3.1 Electrical Isolation Check
1 Remove the crystal holder from the bakeable sensor.
2 Disconnect the BNC cable from the bakeable sensor feedthrough.
3 Select the DMM ohmmeter function and a high megohm (M) resistance scale.
4 At the BNC connector on the feedthrough, measure the resistance between the
center contact and shield, as shown by Figure 5-1.
UHV Bakeable Sensor Operating Manual
If resistance is more than 10 M
5.1.3.2, Electrical Continuity Check, on page 5-6.
If resistance is less than 10 M
page 1-2).
Figure 5-1 BNC connector resistance
PN 074-154N
, electrical isolation is good. Go to section
, contact INFICON (refer to section 1.3 on
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UHV Bakeable Sensor Operating Manual
5.1.3.2 Electrical Continuity Check
1 Select the DMM ohmmeter function and a low resistance scale.
NOTE: The resistance specifications in the following steps do not take into
account the resistance of the Digital Multimeter probes. Touch the
probe tips together and note the resistance reading. Compensate for
probe resistance by subtracting probe resistance from resistance
measurements, or by zeroing the ohmmeter while the probes are
touching.
2 Remove the ceramic retainer and crystal from the crystal holder, and then
reinstall the ceramic retainer into the crystal holder without a crystal.
3 Measure the resistance between the ceramic retainer and crystal holder as
shown by Figure 5-2.
If resistance is less than 0.3 ohm (
If resistance is more than 0.3
, continue to step 4.
, correct the cause of the high resistance
before continuing to step 4. Check the following:
Cleanliness of the crystal seating surface inside the crystal holder (refer
to section 4.3.2 on page 4-6).
Angle of the leaf spring on the ceramic retainer (refer to section 4.3.1
on page 4-5).
Verify that the leaf spring and circular plate on the ceramic retainer are
tightly held together by the rivet.
Figure 5-2 Resistance between ceramic retainer and crystal holder
PN 074-154N
5 - 6
4 Install the crystal holder with ceramic retainer into the bakeable sensor.
5 At the BNC connector on the bakeable sensor feedthrough, measure the
resistance between the center contact and shield (refer to Figure 5-1).
If resistance is less than 1 , electrical continuity is good.
If resistance is more than 1 , contact INFICON (refer to section 1.3 on
page 1-2.)
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