INFICON STM-100-MF User Manual
instruments
STM-100 / MF
THICKNESS / RATE MONITOR
Users Manual
September 1997 Rev. G
Sycon Instrument s
STM-100 / MF
Thickness / Rate Monitor
Tel (315) 463-5297 Fax (315) 463-5298
Sycon Instruments
6757 Kinne Street
East Syracuse, New York 13057-1215
Preface
Sycon Instruments, Inc. reser ves the r ight to change any information contained in this manual
without notice.
©
Copyright Sycon Instruments, Inc. 1989-1993
IBM® is a Registered trademark of I B M Corporation
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SWAGELOK® is a Registered trademark owned by Crawford Fitting Company
BITBUSTM is a trademark of Intel Corporation
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AMPHENOL® is a Registered trademark of Allied Corporation
Page i Preface
Warranty
SYCON INSTRUMENTS, INC.
Policy
Sycon Instr um ent s , I nc . ( Sycon) warrant s t hat all electronic instrumentation equipment
manufactured by Sycon shall be free fr om defects in materials and workmanship for a per iod
of 2 years from date of shipment. Mechanical vacuum components such as feedthroug hs,
sensors, cables, and shutters shall be warranted for a period of six months from t he dat e of
shipment. For the duration of t he warranty period Sycon will, at its option, either repair or
replace any part which is defective in materials or workmanship without charge t o t he
purchaser. The foregoing shall constitute the exclusive and sole remedy of the purchaser for
any breach by Sycon of this warranty.
This warrant y does not apply to any equipment which has not been used in accordance
with the specifications recommended by Sycon for the proper and normal use of the
equipment. Sycon shall not be liable under any circumstances for consequential or incidental
damages in connection with, or arising out of the sale, performance, or use of, the equipment
covered by this warranty.
This warrant y is in lieu of all ot her warrant ies by Sycon, expressed or implied, including
the implied warranty of merchantability, the implied warranty of fitness for a particular
purpose, and warranty against infringem ent of any patent.
EQUIPMENT RETURN
Bef ore returning any equipment to Sycon contact the Product Service Department in
your area for instructions. Obtain a RA (Return Authorization) number and indicate this
number on all shipping cartons and correspondence. Ship all items in suit able cont ainer s with
adequate protection from outside damage.
Sycon Instruments, Inc.
6757 Kinne Street
East Syracuse, New York
13057-1215
Phone (315) 463-5297
Fax (315) 463-5298
Warranty Page ii
EC Declaration of Conf ormity
We,
SYCON Instruments
6757 Kinne Street
East Syracuse, NY 13057
USA
declare under sole responsibility that the
STM-100/MF Thickness/Rate Monitor
meets the intent of Directive 89/336/EEC as am ended by 92/31/ EEC and 93/68/ EEC for
Electromagnetic Compatibility and the 72/23/EEC Low Voltage Directive for Pr oduct Safety.
Compliance was demonstrated to the following specificat ions as list ed in the Official Journal
of the European Communities:
EN 50081-1: 1992 Em issions
EN 50022 Class B Radiated and Conducted Emissions
EN 61000-3-2 AC Power Line Harmonic Current Emissions
EN 50082-1: 1995 I m m unit y
IEC 1000-4-2 Electrostatic Discharge Imm unit y
IEC 1000-4-3 RF Electromagnetic Field Immunity
IEC 1000-4-4 Electrical Fast Transient/Burst Immunity
IEC 1000-4-5 Power Line Surge Immunity
IEC 1000-4-11 Power Line Dips and Interrupts Immunity
EN 61010-1: 1993 Safety Requirements f or Electrical Equipment for Measurement,
Control, and Laboratory Use
Page iii Warranty
Table of Contents
REFACE .......................................................................................................................................................... I
P
ARRANTY ....................................................................................................................................................... II
W
SYCON INSTRUMENTS, INC. POLICY ........................................................................................................................ II
EQUIPMENT
TABLE OF CONTENTS ........................................................................................................................................ IV
IST OF FIGURES ............................................................................................................................................... VIII
L
IST OF TABLES ................................................................................................................................................ IX
L
GENERAL
INTRODUCTION ........................................................................................................................................................ 1-1
SECTION
UNPACKING .............................................................................................................................................................. 1-1
SECTION
STM-100 / MF
SECTION
SENSOR
SECTION
FEEDTHROUGH
SENSOR
SECTION
STM-100 / MF
SECTION
OPERATION AND PROGRAMMING ............................................................................................................. 2-1
KEYBOARD DESCRIPTION ...................................................................................................................................... 2-1
SECTION
SYSTEM
SECTION
DATA
SECTION
FILM
PARAMETERS ................................................................................................................................................. 2-3
SECTION
USER
SECTION
SWITCH
TEST
MODE ............................................................................................................................................................... 2-11
SECTION
RETURN ............................................................................................................................................... II
INFORMATION ............................................................................................................................. 1-1
1.1 ....................................................................................................................................................... 1-1
1.2 ....................................................................................................................................................... 1-1
SPECIFICATIONS ............................................................................................................................. 1-2
1.3 ....................................................................................................................................................... 1-2
SPECIFICATIONS ...................................................................................................................................... 1-4
1.4 ....................................................................................................................................................... 1-4
OPERATION ................................................................................................................................................... 1-4
INSTALLATION .............................................................................................................................. 1-4
WATER ........................................................................................................................................................... 1-4
ELECTRICAL .................................................................................................................................................. 1-4
MATERIALS
SPARE PARTS ........................................................................................................................................... 1-5
(IN VAC) ..................................................................................................................................... 1-4
1.5 ....................................................................................................................................................... 1-5
PARTS & ACCESSORIES ................................................................................................................. 1-5
1.6 ....................................................................................................................................................... 1-5
MONITOR ....................................................................................................................................................... 1-5
FEEDTHROUGHS .......................................................................................................................................... 1-5
SENSORS ...................................................................................................................................................... 1-5
OPTIONS ........................................................................................................................................................ 1-5
ACCESSORIES .............................................................................................................................................. 1-5
SENSOR
CONTROL KEY GROUP ............................................................................................................................. 2-1
S
HUTTER KEYS ................................................................................................................................................. 2-2
ZERO
C
RYSTAL LIFE KEY ............................................................................................................................................. 2-2
ENTRY AND PROGRAMMING GROUP ........................................................................................................... 2-2
P
ROGRAM KEY .................................................................................................................................................. 2-2
E
NTER KEY ....................................................................................................................................................... 2-3
A
RROW KEYS .................................................................................................................................................... 2-3
LCD
F
ILM NUMBER PARAMETER ................................................................................................................................. 2-4
D
ENSITY PARAMETER ......................................................................................................................................... 2-5
Z-F
CRYSTALS ..................................................................................................................................... 1-5
2.1 ....................................................................................................................................................... 2-1
2.2 ....................................................................................................................................................... 2-1
KEY ....................................................................................................................................................... 2-2
2.3 ....................................................................................................................................................... 2-2
2.4 ....................................................................................................................................................... 2-3
DATA DISPLAYS ......................................................................................................................................... 2-4
ACTOR PARAMETER ...................................................................................................................................... 2-6
END THICKNESS ................................................................................................................................................ 2-6
S
ETPOINT THICKNESS PARAMETER ...................................................................................................................... 2-7
S
ETPOINT TIMER ................................................................................................................................................ 2-7
T
OOLING FACTOR PARAMETER ............................................................................................................................ 2-8
CONFIGURATION SWITCHES ....................................................................................................................... 2-8
2.5 ....................................................................................................................................................... 2-8
FUNCTION DEFINITIONS........................................................................................................................... 2-9
C
ONFIGURATION ................................................................................................................................................ 2-9
2.6 ....................................................................................................................................................... 2-11
E
NABLING THE TEST MODE ................................................................................................................................. 2-11
Table of Contents Page iv
BEEPER ..................................................................................................................................................................... 2-12
SECTION
2.7 ....................................................................................................................................................... 2-12
D
ISABLING THE BEEPER ...................................................................................................................................... 2-12
INSTALLATION .............................................................................................................................................. 3-1
ELECTRICAL CONNECTIONS AND DESCRIPTIONS ............................................................................................................... 3-1
SECTION
SECTION
3.1 ....................................................................................................................................................... 3-1
3.2 ....................................................................................................................................................... 3-1
L
INE POWER WARNING ...................................................................................................................................... 3-1
L
INE VOLTAGES ................................................................................................................................................. 3-1
GROUND ................................................................................................................................................................... 3-2
SECTION
I/O
INTERFACE CONNECTION ................................................................................................................................. 3-3
SECTION
3.3 ....................................................................................................................................................... 3-2
G
ROUNDING ...................................................................................................................................................... 3-2
C
ONNECTOR SHIELDING ..................................................................................................................................... 3-2
3.4 ....................................................................................................................................................... 3-3
I/O
CONNECTOR ................................................................................................................................................ 3-3
RELAYS .......................................................................................................................................................... 3-3
INPUTS ........................................................................................................................................................... 3-3
RELAY
OUTPUTS ...................................................................................................................................................... 3-3
R
ELAY OUTPUTS................................................................................................................................................ 3-3
C
RYSTAL FAIL ................................................................................................................................................... 3-3
E
LAPSED TIMER ................................................................................................................................................. 3-3
S
HUTTER .......................................................................................................................................................... 3-3
T
HICKNESS SETPOINT ........................................................................................................................................ 3-4
REMOTE
INPUTS ...................................................................................................................................................... 3-4
REMOTE INPUTS ................................................................................................................................................ 3-4
S
HUTTER RELAYS .............................................................................................................................................. 3-4
T
HICKNESS ZERO INPUT ..................................................................................................................................... 3-4
T
IMER ZERO INPUT ............................................................................................................................................. 3-4
R
EMOTE INPUT SPECIFICATIONS .......................................................................................................................... 3-4
SENSOR
ANALOG
RS-232
COMMUNICATIONS
DEPOSITION
CONNECTION............................................................................................................................................ 3-4
SECTION
SECTION
SECTION
SECTION
SECTION
3.5 ....................................................................................................................................................... 3-4
O
SCILLATOR CONNECTION .................................................................................................................................. 3-4
RECORDER INTERFACE .......................................................................................................................... 3-5
3.6 ....................................................................................................................................................... 3-5
A
NALOG OUTPUT SPECIFICATIONS ....................................................................................................................... 3-5
RECORDER
R
ECORDER OUTPUTS ......................................................................................................................................... 3-6
SERIAL COMMUNICATIONS INTERFACE ................................................................................................... 3-6
RS-232
RS-232
C
OMMUNICATIONS OPTIONS ................................................................................................................................ 3-7
S
YSTEM INSTALLATION ....................................................................................................................................... 3-8
S
ENSOR INSTALLATION ....................................................................................................................................... 3-8
CALIBRATION ........................................................................................................................... 3-5
3.7 ....................................................................................................................................................... 3-6
CONNECTIONS ...................................................................................................................................... 3-6
CONNECTOR DEFINITIONS ............................................................................................................. 3-7
OPTIONS ................................................................................................................................. 3-7
3.8 ....................................................................................................................................................... 3-7
SYSTEM INSTALLATION .................................................................................................................... 3-8
3.9 ....................................................................................................................................................... 3-8
INSTALLING WATER LINES .............................................................................................................................................. 3-9
W
ATER LINES .................................................................................................................................................... 3-9
VACUUM
ELECTRICAL
FEEDTHROUGH ........................................................................................................................................ 3-10
V
ACUUM FEEDTHROUGH ..................................................................................................................................... 3-10
IN-VACUUM CABLE ............................................................................................................................ 3-10
V
ACUUM ELECTRICAL CONNECTIONS ................................................................................................................... 3-10
B
AKEABLE SENSOR ............................................................................................................................................ 3-10
CALIBRATION AND THEORY ................................................................................................................................ 4-1
MEASUREMENT THEORY ................................................................................................................................................ 4-1
SECTION
T
HICKNESS READING CALIBRATION ................................................................................................................................. 4-2
SECTION
D
ENSITY DETERMINATION ............................................................................................................................................... 4-2
4.1 ........................................................................................................................................................ 4-1
E
QUATION 1: ..................................................................................................................................................... 4-1
M
EASURING PERIOD ........................................................................................................................................... 4-1
R
ATE COMPUTATION .......................................................................................................................................... 4-1
4.2 ........................................................................................................................................................ 4-2
T
HICKNESS........................................................................................................................................................ 4-2
Page v Table of Contents
DENSITY ........................................................................................................................................................... 4-2
Z-F
ACTOR DETERMINATION ............................................................................................................................................ 4-2
Z-F
ACTOR......................................................................................................................................................... 4-2
T
OOLING DETERMINATION .............................................................................................................................................. 4-3
SECTION
M
ATERIAL REFERENCE TABLE ........................................................................................................................................ 4-4
4.3 ........................................................................................................................................................ 4-4
B
ULK DENSITY AND Z-FACTOR VALUES ................................................................................................................ 4-4
A
LUMINUM THROUGH INDIUM ............................................................................................................................... 4-4
I
NDIUM INTIMONIDE THROUGH TANTALUM ............................................................................................................. 4-5
T
ELURIUM THROUGH ZIRCONIUM OXIDE ................................................................................................................ 4-6
COMPUTER INTERFACING .......................................................................................................................... 5-1
RS-232 INTERFACE .................................................................................................................................................. 5-1
SECTION
BAUD
S
YCON PROTOCOL ........................................................................................................................................................ 5-2
SECTION
SECS-II
SECTION 5.3 ....................................................................................................................................................... 5-5
IEEE-488
SECTION
COMMANDS .............................................................................................................................................................. 5-7
SECTION
RESPONSE
DETAILED
SECTION
5.1 ....................................................................................................................................................... 5-1
RS-232
RATES AND CABLING ...................................................................................................................................... 5-1
M
C
S
M
B
SECS-II
SECS-II
D
G
M
SECS-II
M
C
S
S
Z
Z
Z
S
S
DESCRIPTION ....................................................................................................................................... 5-1
AKING AN RS-232 CABLE ................................................................................................................................ 5-2
OMMUNICATION DEMO DISK .............................................................................................................................. 5-2
ETTING BAUD RATES ........................................................................................................................................ 5-2
5.2 ....................................................................................................................................................... 5-2
ESSAGE FORMAT ............................................................................................................................................. 5-3
ASIC DRIVER ROUTINE ..................................................................................................................................... 5-4
PROTOCOL...................................................................................................................................................... 5-5
ADDRESSING ....................................................................................................................................... 5-5
PROTOCOL .......................................................................................................................................... 5-5
OCUMENTATION REQUIREMENTS ....................................................................................................................... 5-5
ENERAL INFORMATION ...................................................................................................................................... 5-5
ESSAGE SUMMARY .......................................................................................................................................... 5-5
MESSAGES .......................................................................................................................................... 5-6
ESSAGE DETAILS ............................................................................................................................................. 5-6
INTERFACE OPTION ................................................................................................................................. 5-6
5.4 ....................................................................................................................................................... 5-6
5.5 ....................................................................................................................................................... 5-7
FORMAT ................................................................................................................................................ 5-7
OMMAND LIST FOR STM-100 / MF ................................................................................................................... 5-8
COMMAND DESCRIPTION ..................................................................................................................... 5-8
5.6 ....................................................................................................................................................... 5-8
OFTWARE VERSION CODE ................................................................................................................................ 5-8
HUTTER RELAY CONTROL ................................................................................................................................. 5-9
ERO THICKNESS AND TIMER .............................................................................................................................. 5-9
ERO THICKNESS ............................................................................................................................................... 5-9
ERO TIMER ...................................................................................................................................................... 5-9
ET THE DENSITY PARAMETER ............................................................................................................................ 5-9
ET THE Z-FACTOR PARAMETER ......................................................................................................................... 5-9
SET THE END THICKNESS ................................................................................................................................... 5-9
S
ET THE SETPOINT RELAY THICKNESS ................................................................................................................. 5-9
S
ET THE TIMER RELAY PARAMETER ..................................................................................................................... 5-10
S
ET THE TOOLING FACTOR PARAMETER ............................................................................................................... 5-10
T
URN THE TEST MODE ON/OFF ........................................................................................................................... 5-10
A
CKNOWLEDGE THE STATUS OF NON-VOLITILE MEMORY ....................................................................................... 5-10
G
ET THE CRYSTAL FAIL STATUS .......................................................................................................................... 5-10
G
ET THE STATUS OF THE SETPOINT TIMER RELAY ................................................................................................. 5-10
G
ET THE STATUS OF THE SETPOINT THICKNESS RELAY ......................................................................................... 5-10
G
ET THE STATUS OF THE END THICKNESS RELAY ................................................................................................. 5-11
G
ET THE REMOTE INPUT STATUS ........................................................................................................................ 5-11
G
ET THE CONFIGURATION SWITCH STATUS .......................................................................................................... 5-11
G
ET THE THICKNESS VALUE ................................................................................................................................ 5-11
G
ET THE RATE VALUE ........................................................................................................................................ 5-11
G
ET THE SENSOR FREQUENCY............................................................................................................................ 5-11
G
ET THE CRYSTAL LIFE VALUE ............................................................................................................................ 5-11
G
ET THE TIMER VALUE ....................................................................................................................................... 5-12
G
ET THE SHUTTER CLOSE EVENT THICKNESS LOG ............................................................................................... 5-12
G
ET THE SHUTTER CLOSE TIME LOG .................................................................................................................... 5-12
G
ET THE LOG EVENT RATE ................................................................................................................................. 5-12
Table of Contents Page vi
GET THE POWER ON STATUS .............................................................................................................................. 5-12
F
ORCE PARAMETERS TO THEIR DEFAULT VALUES ................................................................................................. 5-12
T
URN THE KEY BOARD BEEPER ON/OFF .............................................................................................................. 5-13
I
NTERNAL USE COMMANDS ................................................................................................................................. 5-13
M
ULTI-FILM FILM NUMBER SELECTION ................................................................................................................. 5-13
M
ULTI-FILM DENSITY PARAMETER ....................................................................................................................... 5-13
M
ULTI-FILM Z-FACTOR PARAMETER..................................................................................................................... 5-13
M
ULTI-FILM END THICKNESS PARAMETER ............................................................................................................ 5-14
M
ULTI-FILM SET POINT RELAY THICKNESS PARAMETER ......................................................................................... 5-14
M
ULTI-FILM SET POINT TIMER RELAY PARAMETER ................................................................................................ 5-14
M
ULTI-FILM TOOLING FACTOR PARAMETER .......................................................................................................... 5-14
MAINTENANCE .............................................................................................................................................. 6-1
WARNINGS ................................................................................................................................................................... 6-1
SECTION
CONTROL
REPLACING
SECTION
P
ERSISTENT CRYSTAL FAIL INDICATION ........................................................................................................................... 6-3
SECTION
6.1 ....................................................................................................................................................... 6-1
UNIT ......................................................................................................................................................... 6-1
A SENSOR CRYSTAL........................................................................................................................... 6-2
6.2 ....................................................................................................................................................... 6-2
6.3 ....................................................................................................................................................... 6-3
APPENDIX A-COMMUNICATION DEMO DISK ........................................................................................................ A-1
SECTION A-1 .......................................................................................................................................................... A-1
STM-100
/MF SPECIFIC PROGRAMS .............................................................................................................................. A-1
S
ECTION A-2 .......................................................................................................................................................... A-1
APPENDIX B-TECHNICAL DRAWINGS .................................................................................................................. B-1
PPENDIX C-SHMX-4 OPERATION .................................................................................................................... C-1
A
INTRODUCTION ........................................................................................................................................................ C-1
O
PERATION ............................................................................................................................................................. C-2
I
NSTALLATION .......................................................................................................................................................... C-2
Page vii Table of Contents
List of Figures
Figure 1.1: Standard Sensors. ................................................................................................. 1-4
Figure 2.1: STM-100 / MF Front Panel. .................................................................................. 2-1
Figure 2.2: System Control Keys. ............................................................................................ 2-1
Figure 2.3: Data Entry And Programming Keys. ..................................................................... 2-2
Figure 2.4: LCD Data Areas. .................................................................................................... 2-4
Figure 2.5: LCD Variable Parameter Legends. ........................................................................ 2-4
Figure 2.6: Film Number Parameter. ....................................................................................... 2-4
Figure 2.7: Density Parameter. ................................................................................................ 2-5
Figure 2.8: Z-Factor Parameter. .............................................................................................. 2-5
Figure 2.9: End Thickness Parameter. .................................................................................... 2-6
Figure 2.10: Set Point Thickness Parameter. .......................................................................... 2-7
Figure 2.11: Set Point Timer Parameter. ................................................................................. 2-7
Figure 2.12: Tooling Parameter. .............................................................................................. 2-8
Figure 2.13: Configuration Switch Settings. ............................................................................. 2-9
Figure 3.1: Rear Panel. ............................................................................................................ 3-1
Figure 3.2: Recommended Grounding Procedure. .................................................................. 3-2
Figure 3.3: Recorder Output Plug. ........................................................................................... 3-5
Figure 3.4: Example of Thickness Mode Recorder Output. ..................................................... 3-6
Figure 3.5: Example of Rate Mode Recorder Output. ............................................................. 3-6
Figure 3.6: Cable Connections From STM to MSDos Computers. ......................................... 3-7
Figure 3.7: Typical System. ..................................................................................................... 3-8
Figure 3.8: Head Mounting Dimensions................................................................................... 3-9
Figure 4.1: Typical Tooling Factors. ......................................................................................... 4-3
Figure 5.1: Cable Connection From STM-100 / MF to IBM-AT. .............................................. 5-1
Figure 5.2: Connections for STM-100 / MF to PC Compatible Computers. ........................... 5-2
Figure 5.3: BASIC Driver Routine. ........................................................................................... 5-4
Figure 5.4: HP-85 IEEE-488 BASIC Driver Program. .............................................................. 5-7
Figure 6.1: Sensor and Feed Through Connections. ............................................................... 6-3
Figure 6.2: Test Oscillator OSC-100A. .................................................................................... 6-4
Figure 6.3: SM75, MicroDot
Figure C.1: SHMX-4 Front Panel ............................................................................................. C-1
Figure C.2: Firmware ROM Label ............................................................................................ C-2
Connector. ................................................................................ 6-4
Figure C.3: SHMX-4 Back Panel ............................................................................................. C-2
Figure C.4: SHMX-4 to STM-100 Control Cable ...................................................................... C-3
List of Figures Page viii
List of Tables
Table 2.1: Baud Rate Switch Settings .......................................................2-10
Table 2.2: Configuration Switch Address Sett ings ....................................2-11
Table 4.1: Common Material Reference Table ........................................... 4-4
Table 4.1: Common Material Reference Table, Cont inued ......................... 4-5
Table 4.1: Common Material Reference Table, Cont inued ......................... 4-6
Table 5.1: Baud Rate Configuration Table. ................................................ 5-2
Table 5.2: Communication Command Summary........................................ 5-8
Page ix List of Tables
SECTION 1
General Information
GENERAL INFORMATION
SECTION 1.1
SECTION 1.2
INTRODUCTION
The STM-100 / MF from Sycon Instruments, Inc. represents a new class
of thin film monitor. I t uses the time-proven 6 MHz oscillating quartz crystal as
the sensor device. The STM-100 / MF is constructed with advanced LSI and
microprocessor technology. This enables the dir ec t solut ion of the complex
mathematical equation associated with the f r equency shift versus mass
loading characteristics of the quartz crystal sensor. Its computational power
allows the measurement of the material accum ulat ed on t he s ensor c r ystal t o
be accurately converted to film thickness using the exact equation;
inaccuracies due to approximations and limited ranges of m aterial constants
do not contribute to thickness and r at e er r or s . A hig h frequency period
measurement clock (over 70 MHz) enables the STM-100 / MF to make and
display 4 measurements/second with one-tenth Angstr om r ate resolution. The
STM-100 / MF is equipped with 4 setpoint relays, 4 remote inputs, a comput er
interface (RS-232) supporting 2 protocols including SECS-II, and a high
resolution analog recorder output. A r ack mount for half-rac k mounting is also
standard. If desired, t he front panel LCD can be configured, by rear panel
switch setting, to display the freq uency of the sensing crystal instead of
computed rate and thickness. ST M-100 / MF 's manufactured and shipped
after October 1990 have the additional capability of storing film parameter for
nine film or processes. Earlier STM's can be factory upgraded to include this
feature. An extra-cost opt ion is a second com puter interface. This f actory
installed upgrade can be either IEEE-488 or BIT BUS.
UNPACKING
The STM-100 / MF comes with a power cord, and connectors for the RS232 interface, the I/O int er face and analog output. If t he O SC-100 or crystals
were ordered at the same time, they will also be included. The unit is shipped
with the rack mount attached, which may be removed for t able t op oper at ion.
To complete a system installation a sensing head and a vacuum to air
feedthrough are req uir ed. Schematic drawings and a MSDOS Format diskette
of demonstration sof t ware are included with this manual. Refer to Appendix A
for a detailed description of the included software. The unit comes set for the
line voltage as ordered. If you need to change it , r efer to Section 3.2. Make
sure that you install the correct fus es when changing line voltage. If it is ever
necessary to return the unit to Sycon, f or any reason, call and obt ain an Retur n
Authorization (RA) num ber before returning the unit.
Page 1 - 1 GENERAL INFORMATION
SECTION 1.3
STM-100 / MF SPECIFICATIONS
DISPLAY TYPE ........................................ 7 DIGIT LCD
THICKNESS DISPLAY RANGE ................ 0 to 999.9 kÅ
RESOLUTION .................................. 1 Å autoranged
# DIGITS .......................................... 4
RATE DISPLAY RANGE........................... 0.0 to 999 Å/S
RESOLUTION .................................. 0.1 Å/S autoranged
# DIGITS .......................................... 3
MEASUREMENT PERIOD........................ 0.25 SEC
SENSOR TYPE ................................ Quartz Crystal Microbalance
FREQUENCY ................................... 6 MHz Plano Convex A/T Cut
MAX. FREQ. SHIFT ......................... 1 MHz
FILM PARAMETER .................................. 9 MATERI AL S
VARIABLES .............................................. 7
FILM # .............................................. 1 t o 9
MATERIAL. DENSITY ...................... 0.500 t o 99. 99 gm/cc
MATERIAL. Z FACTOR.................... 0.100 to 9.999
SYS. TOOLING ................................ 10.0 to 399 %
SHUT TER CLOSURE ...................... 0.000 to 9999 kÅ
T HI CKNESS SETPOINT .................. 0.000 to 9999 kÅ
T I MER SETPOINT ........................... 00:00 to 99:59 M:S
I/O CONNECTION .................................... 15 PIN D MALE
HARDWARE O UTPUTS ........................... 4, SPST 2.5A RELAYS
- Shutter Relay (Pins 5,6)
- Thickness Setpoint (Pins 7,8)
- Sensor Failure (Pins 1,2)
- Timer Setpoint (Pins 3,4)
HARDWARE I NPUTS ............................... 4 TTL COMP., ACTIVE LOW
- Open Shutter (Pin 12)
- Close Shutter (Pin 11)
- Zero Thickness (Pin 10)
- Zero Timer (Pin 9)
Note: Pins 13,14,15 are GND.
ANALOG RECORDER ............................. + 10V F.S. RATE OR THICKNESS
- 2 mA max Load,
- 11 BIT Resolution
CONNECTION ................................. Miniature Stereo Jack
STD. COMMUNICATIONS I/O .................. RS-232, DUAL PROTOCOL
- 4 BAUD RATES
- 300,1200,2400,9600
CONNECTION ................................. - 9 PIN "D" FEMALE
GENERAL INFORMATION Page 1 - 2
OPTIONAL COMMUNICATIONS I/O
1) ...................................................... IEEE-488 T/L
CONNECTION ................................. - 24 PIN TYPE 57 FEMALE
2) ...................................................... BITBUS Slave Node
CONNECTION ................................. - 2 TWINAX BNC's
DISPLAY FUNCTIONS
1) ..................................................... DATA/FILM #
2) ..................................................... THICKNESS / RATE
3) ..................................................... CRYSTAL % USAGE / TIMER
4) ..................................................... SENSOR FREQUENCY
DISPLAY ANNUNCIATORS ..................... STATUS
RELAY ............................................. ON/OFF EACH RELAY
PARAMETER ID .............................. EACH VARIABLE
MODE ID .......................................... PROGRAM / OPERATE
ACTIVITY ......................................... COMMUNICATIO NS INTERFACE
KEYBOARD FUNCTIONS ........................ 8 KEYS
TYPE ................................................ Individual Buttons
FUNCTIONS .................................... - Shutter Open
- Shutter Close
- Zero Thickness & Time
- Set Program Mode On / Of f
- Increase Value
- Decrease Value
- Enter Data
- Crystal Status
USER OPTION SWITCHES ..................... Rear Panel
- Baud Rate Selection
- Serial Protocol Selection
- Communications Address
- Parameter Lock
- Negative Limit Operation
- Frequency Meas. Mode
- Analog Recorder Function
POW ER REQUIREMENTS ....................... 120/240V,+5%-
......................................................... 20%,50/60Hz,10VA
CONNECTOR .................................. IEC Standard
POWER SWITCH ............................ Rear Panel Mounted
T EMPERATURE RANG E ................. 0o C to 50oC Operating
-15oC to 65oC Storage
SIZE / WEIGHT ........................................ 2.5"H, 7.25"W, 10"D 4lbs
(RACK MOUNTED) .................................. 3.5"H, 8.0"W, 10"D ;
SHIP WEIGHT .......................................... 8lbs
Page 1 - 3 GENERAL INFORMATION
SECTION 1.4
OPERATION
WATER
ELECTRICAL
MATERIALS (IN VAC)
SECTION 1.5
SENSOR SPECIFICATIONS
Low Profile P/N 500-042 RIGHT ANGLE P/N 5 00 -088
Figure 1.1: Standard Sensors.
Low Profile and Right Angle sensors, See Appendix B for dimensions and
more detailed drawings of these and other sensor pac kages.
Maximum Temperature ............................. 175° C
Water Line and Coax Lengt h ................... 30 inches
Sensor Mounting ...................................... Rear of Body, 4-40 Tapped Holes
FEEDTHROUGH INSTALLATION
Connections .................................... Two Required
Type ................................................ 1/8 inch O.D. Stainless Tubing
Flow Rate ......................................... 0.2 to 0.3 gal/min
Water Temp ..................................... 50° C max.
Connections .................................... One Coaxial Line
Type ................................................ Microdot Miniature S-50
Body and Water Lines .................... 304 Stainless
Insulators ........................................ Alumina
Coax Insulator ................................. Teflon
Coax Conductor and Shields ........... Copper/Silver
Braze Material ................................. High Vac Ni/CR/Cu Alloy
Crystal ............................................. Quartz with Gold Electrodes
SENSOR SPARE PARTS
Description SYCON Part Number
Sensor Body (Standar d) .................. 550-219
Snap Spring ..................................... 024-002
Sensor Cap ...................................... 550-218
30 inch In-Vacuum Coax Cable ....... 500-024
10 inch In-Vacuum Coax Cable ....... 500-023
Crystals (box of 10) ......................... 500-117
GENERAL INFORMATION Page 1 - 4
STM-100 / MF PARTS & ACCESSORIES
SECTION 1.6
MONITOR
FEEDTHROUGHS
SENSORS
OPTIONS
ACCESSORIES
SENSOR CRYSTALS
ASSEMBLY PART NUMBER
STM-100 / MF (Multi Film) ................ 500-104
POWER CORD (12 0 VAC).............. 600-004
FUSES (1/4 A Slow Blow for 120VAC) ...... 356-005
FUSES (1/8 A Slow Blow for 240VAC) ...... 356-007
RECORDE R PLUG ......................... 404-007
I/O 15 PIN CONNECTOR ................ 404-008
RS-23 2 9 PIN CONNECTOR .......... 404-009
MANUAL ......................................... 518-000
CONNECTOR KIT ............................ 514-001
19" Rack Mount (Single) ................... 014-008
19" Rack Mount (Dual) ..................... 014-009
1" BOLT STANDARD ...................... 500-016
2 3/4" ConFlat STANDARD ............. 500-017
LOW PROFILE ................................. 500-042
RIGHT ANGLE ................................ 500-088
IEEE-488 BUS INTERFACE ............ 500-021
BITBUS INTERFACE ...................... 500-022
30" I N-VACUUM COAX CABLE ...... 500-024
10" I N-VACUUM COAX CABLE ...... 500-023
10' OSC TO STM CABLE ................ 500-026
30' OSC TO STM CABLE ................ 500-027
6" OSC TO FEED THRU COAX ....... 500-025
BOX O F 10 ...................................... 500-117
Page 1 - 5 GENERAL INFORMATION
SECTION 2
Operation and Programming
STM - 100 / MF
THICKNESS / RATE MONITOR
instruments
SHUTTER
SENSOR
OPEN
ZERO
CLOSE
LIFE
DENS
Z-FACT END THK
XTAL FAIL
SHUTTER
SP TIME
SP THICK
SP THK SP TMR TOOL
PGM
COM
DATA ENTRY
PROGRAM
ENTER
DATA
OPEN
CLOSE
SENSORSHUTTER
ZERO
LIFE
SECTION 2.1
SECTION 2.2
OPEN
CLOSE
SHUTTER
Shutter Keys
OPERATION AND PROGRAMMING
KEYBOARD DESCRIPTION
The STM-100 / MF keyboard is divided into two separate functional
groups. The keys to the left of the LCD display are system control keys and
the keys to the right of the display are data entry and programming keys. All
keys are sensed when depressed and must be released to cause further
action. The exceptions to this rule are the (LI FE) and ( ARROW) keys. T hese
keys will cause continuous action if held depressed. An audible beep will
accompany each key activation. The beeper may be disabled if desired. See
Section 2.7.
Figure 2.1: STM-100 / MF Front Panel.
SYSTEM CONTROL KEY GROUP
Figure 2.2: System Control Keys.
SHUTTER OPEN
Activating the SHUTTER OPEN key will cause the internal shutter relay
contacts to close. This relay is typically used to control a deposition system
source shutter. The LCD display (SHUTTER) leg end will be visible when the
shutter relay is active. This key is active at all times and states (Program and
Normal) of the STM-100 / MF. A remote input duplicating this key function is
also provided.
Page 2 - 1 OPERATION AND PROG RAMMING
SHUTTER CLOSE
DATA
ENTER
PROGRAM
DATA ENTRY
ZERO Key
ZERO
Crystal Life Key
LIFE
SECTION 2.3
Program Key
PROGRAM
The SHUT TER CLOSE key provides the reverse function of the
SHUTTER OPEN key. This key is active at all times and states of the
STM-100 / MF. A remote input duplicating this k ey f unc t ion is also provided.
ZERO
The ZERO key provides two functions, "THICKNESS ZERO" and " TIMER
ZERO". Activating the key will cause any accumulated reading in the
thickness display to be set to zero, thus providing a new accumulation
reference point. It will also reset the elapsed t imer and display to t he set point
value contained in the program m emory. Any setpoint relays that may have
been closed at the time of the "ZERO" key operation will be reset to the open
state. This key is inactive in the PROGRAM mode. Remote inputs providing
separate operation of the THI CKNESS ZERO and T I MER ZERO operations
are also provided. Note that during a Crystal Fail condition, the Zer o key does
not function.
LIFE
Activating the CRYSTAL LIFE key will provide the user with a measure of
remaining possible sensor crystal life. T his information is expressed in percent
with 100% representing a new sensor crystal and 0% indicating a fully loaded
sensor crystal (1MHz frequency shift). This information is presented where
rate information is normally shown. This data should serve as an indicator for
the need to change the sensor crystal. T he frequency of the sensor crystal t o
the nearest kilohertz is also presented. T his information is shown where
accumulated thickness data is normally displayed. A new sensor crystal
should indicate close to 99% life and a freq uency near 5. 950 MHz. This key
function is inactive in the PROGRAM mode. Activating this key during a
CRYSTAL FAIL condition may result in a blank data display. The LIFE display
is active as long as the LIFE key is held depressed.
DATA ENTRY AND PROGRAMMING GROUP
Figure 2.3: Data Entry And Programming Keys.
PROGRAM
Activation of the PROGRAM key places the instrument in a mode wherein
the internal parameter variables may be viewed or modified. Data view
operation is always available whereas, data modification may be inhibited by a
user option switch on the rear panel. If the instrument is in the PROGRAM
mode, depressing the PROGRAM key will return the unit to the norm al display
mode. Six variable parameters, for each of nine films of the STM-100 / MF
OPERATION AND PROG RAMMING Page 2 - 2
may be programmed by the user. Two of t hes e m at erial constants are needed
Enter Key
ENTER
Arrow Keys
DATA
SECTION 2.4
LCD Data Displays
to provide correct thickness and rate information for a particular film material
and one is a constant used to correct f or system sensor and substrate
geometry variations. Three setpoint variables ar e pr ovided to act ivate relay
events. Two of these are related to thickness and one to elapsed time. These
variables and their meanings are discussed in detail in Section 2.4.
ENTER
The ENTER key has two functions. It is used (1) to sequence through
the six parameter variables, one parameter f or eac h pr ess of the ENTER key,
and (2) to place modified variable data into the non-volatile storage memory of
the instrument. This data will be retained until modif ied by the user even with
no power to the instrument. A legend on the LCD display will indicate which
variable parameter data is being displayed. Any modifications to parameter
data occur in the display memory only, and will cause the associated
parameter legend to f lash. The flashing legend indicates that a param et er
change has been made but has not yet been saved in memory. To stor e the
data in memory the ENTER key must be pressed. Exiting t he PRO G RAM
mode (via the PROGRAM key) while a parameter legend is flashing does not
cause the modified data to be saved. Previously saved parameter data will be
retained. The ENTER key only functions in the PROGRAM mode.
ARROW KEYS
The ARROW keys are used to select t he ac t ive f ilm and to increment or
decrement the displayed parameter variable data in order to achieve the
desired value. The rate of incremental change will increase as the key is held
depressed. This will speed up parameter changes covering a large dynamic
data range. Letting up on the key and then resuming key depression will reset
the rate of change to t he slowest rat e and it will again increase with time as t he
key remains depressed.
FILM PARAMETERS
The STM-100 / MF utilizes a high contrast liquid crystal display for the
viewing device. All measurement data, instrument status, and pr ogram
variable operations are viewable on the display. A three or four digit parameter
display and a four digit time display (min:sec) are used t o display the dynamic
data.
Page 2 - 3 OPERATION AND PROG RAMMING
PROGRAM
ENTER
DATA
Film Number Parameter
Figure 2.4: LCD Data Areas.
The STM-100 / MF incorporates six programmable parameter variables
for each of nine films pr ogrammable by the user. Three variables are used by
the thickness equation and are relat ed t o m at erial physical constants and
system geometry (Density, Z-Factor, and Tooling). The three remaining
parameters are used as setpoint values to activate t he internal relays on the
I/O connector.
Each variable has a specif ic LCD legend as soc iated with it. These
legends are only active in the PROGRAM mode and only one will be on at a
time. Each parameter is discussed in more det ail below.
Figure 2.5: LCD Variable Parameter Legends.
Af ter entering the program m ode by pushing t he Pr ogram Button the
current film number is displayed in the upper lef t hand c or ner of the LCD
display. (FL.n, n is 1 through 9). Ref er to Figure 2.6.
Figure 2.6: Film Number Parameter.
At this point t he c ur r ent film's parameters may be reviewed or changed or
a new current film selected. To select a new current film the film number is
OPERATION AND PROG RAMMING Page 2 - 4
increased or decreased by using the up and down arrow keys. Pushing the
Density Parameter
enter button selects the film num ber shown to be the c ur r ent film and displays
the first parameter ( densit y) of that film. Each of t he film parameters can now
be reviewed or changed by using the DATA keys and / or the ENTER key.
WARNING
When leaving the Program Mode, the last Selected
FILM is the current active FILM.
DENSITY
Figure 2.7: Density Parameter.
LEGEND DENS
RANGE 0. 500 to 99.99
UNITS gm/cc
The DENSITY parameter refers to t he m easured material density in
gm/cc. This constant is nor m ally the bulk m at er ial value but is somet im es
different due to deposition and film growth conditions. This value is utilized in
the thickness equation to convert m easured mass to a thickness value. See
Table 4.1 for an extensive value list. See Section 4.2 for calibr at ion
information.
LEGEND Z-FACT
RANGE 0. 100 to 9.999
UNITS NONE
Page 2 - 5 OPERATION AND PROG RAMMING
Z-FACTOR
Figure 2.8: Z-Factor Parameter.
Z-Factor Parameter
End Thickness
The Z-Factor parameter refers t o t he elastic properties of the measured
material. This value is utilized in the thickness equation to m at c h t he
acoustical properties of the film being measured to the acoustic properties of
the base quartz material of t he sensor c r ystal. This correction is necessary to
insure accurate measurements when sensor crystal shifts of greater than 15%
are realized. See Table 4.1 for an extensive material value list. See Section
4.2 for calibration inform at ion.
END THICKNESS
Figure 2.9: End Thickness Param et er .
LEGEND END THK
RANGE 0 to 9999
UNITS KILO ANGSTROMS (1 Angstrom = 10
-10
meters)
The END T HI CKNESS paramet er is used to provide a trigger setpoint for
the STM-100 / MF Shutter Relay contacts. If t he s hut t er relay contacts are
closed by operating the front panel shutt er c losed but t on or by rem ot e input .
These contacts will return to the open state when the thickness display value
becomes equal to or exceeds the END THICKNESS SETPOINT value. T he
STM-100 / MF Shutter Relay contacts are normally used to automatically
control a deposition system source shutter. This is a trigger event and will
only effect shutter st at us at t he time the event occurs. If the shut t er r elay
contacts were already open at the time of the event the event will be ignored.
A setpoint value of 0.000 kÅ causes the setpoint function to be ignored.
OPERATION AND PROG RAMMING Page 2 - 6
SETPOINT THICKNESS
Setpoint Thickness Parameter
Setpoint Timer
Figure 2.10: Set Point Thicknes s Par am et er.
LEGEND SP THK
RANGE 0 to 9999
UNITS KILO ANGSTROMS
The SETPOINT THICKNESS parameter is used to provide a comparison
point for the STM-100 / MF Thickness Set point Relay. T his set of relay
contacts will be closed whenever the thickness display equals or exceeds the
setpoint value. A setpoint value of 0.000 kÅ causes the t hickness setpoint
function to be ignored.
SETPOINT TIMER
Figure 2.11: Set Point Timer Parameter.
LEGEND SP TMR
RANGE 00:00 to 99:59
UNITS MIN:SEC
The SETPOINT TIMER parameter is used to provide a comparison point
for the STM-100 / MF Timer Setpoint Relay. The int er nal STM-100 / MF timer
is pre-set with the setpoint value whenever the front panel ZERO k ey, or a
remote ZERO TIMER input, is activated. The Tim er Relay contact s ar e
opened at this time and the timer display begins counting downward toward
zero. When the timer display reaches zero the relay contacts are closed and
the display timer begins counting in an upwards fashion. A setpoint value of
00:00 will cause the timer setpoint function to be ig nor ed.
Page 2 - 7 OPERATION AND PROG RAMMING
TOOLING
Tooling Factor Parameter
SECTION 2.5
Figure 2.12: Tooling Paramet er .
LEGEND TOOL
RANGE 10.0 to 399
UNITS PERCENT
The TOOLING parameter is used as a corr ection factor to compensate
for geometric position differences between the location of the sensor and the
target substrate. Cor r ec t ion is r equired both the substrate and sensor see the
material source in an identical manner, unless for this case, the Tooling
Parameter is set to 100%. Generally, if the sensor is farther f r om the source
than the substrate, the tooling will be set to >100%. If the sensor is closer to
the source, the tooling will be set to < 100%. See Section 4. 2 for calibration
information.
USER CONFIGURATION SWITCHES
On t he r ear panel of the STM-100 / MF a twelve selection configuration
switch is located. The settings of this switch allow the user to select various
system operational modes. All communications related variables are also set
here. Switches 1 thru 4 may be changed at any time and will have immediate
effect. Switches 5 thru 12 ar e only read at t he time of power turn on.
OPERATION AND PROG RAMMING Page 2 - 8
CONFIGURATION
SWITCH
BINARY DEVICE ADDRESS
SW8=MS BIT SW12=LS BIT
SW 8 SW9 SW10 SW11 SW12
OFF OFF OFF OFF OFF = 0
OFF OFF OFF ON OFF = 0
ON OFF ON OFF ON = 0
SERIAL BAUD RATE
SW 6 SW7
OFF OFF = 300
OFF ON = 1200
ON OFF = 2400
ON ON = 9600
PROTOCOL ON = SEMI OFF = SYCON
NEGATIVE RATES ON = ENABLE OFF = DISABLE
FREQUENCY MODE ON = ENABLE OFF = DISABLE
ANALOG OUTPUT ON = THICK OFF = RATE
PARAMETER LO CK ON = LOCK OFF = UNLOCK
see Note:
NOTE: Sw itch settings involvi ng c omm unications functions are sensed at power up onl y.
Configuration
Figure 2.13: Configuration Switch Settings.
SWITCH FUNCTION DEFINITIONS
SW1 - PARAMETER LOCK
When on, st or ed par am eter data cannot be modified via the front
panel. This switch is sensed at all times.
SW2 - RECORDER FUNCTION
When on, the analog output will provide thickness information.
Rate information is presented in the off state. This switch is
sensed at all times. See Section 3.6.
SW3 - FREQUENCY MODE
When on, the unit will display seven digits of sensor frequency to
a resolution of one Hertz. All other instrument functions remain
normal. This switch is active at all times.
SW4 - NEGATIVE LIMITS
When on, both thickness setpoints and their associated relays will
activate on negative thickness data only. This switch is sensed at
all times.
SW5 - SERIAL COMMUNICATIONS FORMAT
When on, the RS-232 serial communications channel will respond
SW6 & SW7 - BAUD RATE SELECT ION
These two switch settings in combination select one of four baud
Page 2 - 9 OPERATION AND PROG RAMMING
to SEMI STANDARD SECS-II form at t ed c om m ands. Sycon
formatted commands ar e valid f or the off state. This switch is
sensed only at power-up.
rates for the RS-232 serial comm unicat ions channel. These
switches are sensed only during power-up.
SW6 SW7 BAUD
OFF OFF 300
OFF ON 1200
ON OFF 2400
ON ON 9600
Table 2.1: Baud Rate Switch Settings
SW8, SW9, SW10, SW11, SW12 DEVICE ADDRESS SELECTION
These switches in combination select the device address for t he
instrument when operating with the SECS RS-232 protocol or with
either the IEEE-488 or BITBUS communications opt ion car ds.
These options allow multiple devices to operate on a single bus,
and only the individual addressing prevents response conflicts.
Switch coding is in binary 1 of 32 format with SW8 the MSB and
SW12 the LSB. T hes e switches are s ensed only during powerup. See Table 2.2 for a list of addresses.
OPERATION AND PROG RAMMING Page 2 - 10
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