INFICON STM-100-MF User Manual

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instruments

STM-100 / MF

THICKNESS / RATE MONITOR

Users Manual

September 1997 Rev. G

Sycon Instrument s

STM-100 / MF

Thickness / Rate Monitor

Tel (315) 463-5297 Fax (315) 463-5298

Sycon Instruments

6757 Kinne Street

East Syracuse, New York 13057-1215

Preface

Sycon Instruments, Inc. reser ves the r ight to change any information contained in this manual without notice.

IBM® is a Registered trademark of I B M Corporation MICROSOFT® is a Registered trademark of Microsoft Corporation SWAGELOK® is a Registered trademark owned by Crawford Fitting Company BITBUSTM is a trademark of Intel Corporation CONFLAT® is a Registered trademark of Varian Associates, Inc. AMPHENOL® is a Registered trademark of Allied Corporation

Page i Preface

Warranty

SYCON INSTRUMENTS, INC.

Policy

Sycon Instr um ent s , I nc . ( Sycon) warrant s t hat all electronic instrumentation equipment manufactured by Sycon shall be free fr om defects in materials and workmanship for a per iod of 2 years from date of shipment. Mechanical vacuum components such as feedthroug hs, sensors, cables, and shutters shall be warranted for a period of six months from t he dat e of shipment. For the duration of t he warranty period Sycon will, at its option, either repair or replace any part which is defective in materials or workmanship without charge t o t he purchaser. The foregoing shall constitute the exclusive and sole remedy of the purchaser for any breach by Sycon of this warranty.

This warrant y does not apply to any equipment which has not been used in accordance with the specifications recommended by Sycon for the proper and normal use of the equipment. Sycon shall not be liable under any circumstances for consequential or incidental damages in connection with, or arising out of the sale, performance, or use of, the equipment covered by this warranty.

This warrant y is in lieu of all ot her warrant ies by Sycon, expressed or implied, including the implied warranty of merchantability, the implied warranty of fitness for a particular purpose, and warranty against infringem ent of any patent.

EQUIPMENT RETURN

Bef ore returning any equipment to Sycon contact the Product Service Department in your area for instructions. Obtain a RA (Return Authorization) number and indicate this number on all shipping cartons and correspondence. Ship all items in suit able cont ainer s with adequate protection from outside damage.

Sycon Instruments, Inc.

6757 Kinne Street

East Syracuse, New York

13057-1215

Phone (315) 463-5297 Fax (315) 463-5298

Warranty Page ii

EC Declaration of Conf ormity

We, SYCON Instruments 6757 Kinne Street East Syracuse, NY 13057 USA

declare under sole responsibility that the

STM-100/MF Thickness/Rate Monitor

meets the intent of Directive 89/336/EEC as am ended by 92/31/ EEC and 93/68/ EEC for Electromagnetic Compatibility and the 72/23/EEC Low Voltage Directive for Pr oduct Safety. Compliance was demonstrated to the following specificat ions as list ed in the Official Journal of the European Communities:

EN 50081-1: 1992 Em issions

EN 50022 Class B Radiated and Conducted Emissions EN 61000-3-2 AC Power Line Harmonic Current Emissions

EN 50082-1: 1995 I m m unit y

IEC 1000-4-2 Electrostatic Discharge Imm unit y IEC 1000-4-3 RF Electromagnetic Field Immunity IEC 1000-4-4 Electrical Fast Transient/Burst Immunity IEC 1000-4-5 Power Line Surge Immunity IEC 1000-4-11 Power Line Dips and Interrupts Immunity

EN 61010-1: 1993 Safety Requirements f or Electrical Equipment for Measurement, Control, and Laboratory Use

Page iii Warranty

REFACE .......................................................................................................................................................... I

ARRANTY ....................................................................................................................................................... II

SYCON INSTRUMENTS, INC. POLICY ........................................................................................................................ II

EQUIPMENT

TABLE OF CONTENTS ........................................................................................................................................ IV

IST OF FIGURES ............................................................................................................................................... VIII

IST OF TABLES ................................................................................................................................................ IX

L GENERAL

INTRODUCTION ........................................................................................................................................................ 1-1

SECTION

UNPACKING .............................................................................................................................................................. 1-1

SECTION

STM-100 / MF

SECTION

SENSOR

SECTION

FEEDTHROUGH

SENSOR

SECTION

STM-100 / MF

SECTION

OPERATION AND PROGRAMMING ............................................................................................................. 2-1

KEYBOARD DESCRIPTION ...................................................................................................................................... 2-1

SECTION

SYSTEM

SECTION

DATA

SECTION

FILM

PARAMETERS ................................................................................................................................................. 2-3

SECTION

USER

SECTION

SWITCH TEST

MODE ............................................................................................................................................................... 2-11

SECTION

RETURN ............................................................................................................................................... II

INFORMATION ............................................................................................................................. 1-1

1.1 ....................................................................................................................................................... 1-1

1.2 ....................................................................................................................................................... 1-1

SPECIFICATIONS ............................................................................................................................. 1-2

1.3 ....................................................................................................................................................... 1-2

SPECIFICATIONS ...................................................................................................................................... 1-4

1.4 ....................................................................................................................................................... 1-4

OPERATION ................................................................................................................................................... 1-4

INSTALLATION .............................................................................................................................. 1-4

WATER ........................................................................................................................................................... 1-4

ELECTRICAL .................................................................................................................................................. 1-4

MATERIALS

SPARE PARTS ........................................................................................................................................... 1-5

(IN VAC) ..................................................................................................................................... 1-4

1.5 ....................................................................................................................................................... 1-5

PARTS & ACCESSORIES ................................................................................................................. 1-5

1.6 ....................................................................................................................................................... 1-5

MONITOR ....................................................................................................................................................... 1-5

FEEDTHROUGHS .......................................................................................................................................... 1-5

SENSORS ...................................................................................................................................................... 1-5

OPTIONS ........................................................................................................................................................ 1-5

ACCESSORIES .............................................................................................................................................. 1-5

SENSOR

CONTROL KEY GROUP ............................................................................................................................. 2-1

HUTTER KEYS ................................................................................................................................................. 2-2

ZERO C

RYSTAL LIFE KEY ............................................................................................................................................. 2-2

ENTRY AND PROGRAMMING GROUP ........................................................................................................... 2-2

ROGRAM KEY .................................................................................................................................................. 2-2

NTER KEY ....................................................................................................................................................... 2-3

RROW KEYS .................................................................................................................................................... 2-3

LCD F

ILM NUMBER PARAMETER ................................................................................................................................. 2-4

ENSITY PARAMETER ......................................................................................................................................... 2-5

Z-F

CRYSTALS ..................................................................................................................................... 1-5

2.1 ....................................................................................................................................................... 2-1

2.2 ....................................................................................................................................................... 2-1

KEY ....................................................................................................................................................... 2-2

2.3 ....................................................................................................................................................... 2-2

2.4 ....................................................................................................................................................... 2-3

DATA DISPLAYS ......................................................................................................................................... 2-4

ACTOR PARAMETER ...................................................................................................................................... 2-6

END THICKNESS ................................................................................................................................................ 2-6

ETPOINT THICKNESS PARAMETER ...................................................................................................................... 2-7

ETPOINT TIMER ................................................................................................................................................ 2-7

OOLING FACTOR PARAMETER ............................................................................................................................ 2-8

CONFIGURATION SWITCHES ....................................................................................................................... 2-8

2.5 ....................................................................................................................................................... 2-8

FUNCTION DEFINITIONS........................................................................................................................... 2-9

ONFIGURATION ................................................................................................................................................ 2-9

2.6 ....................................................................................................................................................... 2-11

NABLING THE TEST MODE ................................................................................................................................. 2-11

Table of Contents Page iv

BEEPER ..................................................................................................................................................................... 2-12

SECTION

2.7 ....................................................................................................................................................... 2-12

ISABLING THE BEEPER ...................................................................................................................................... 2-12

INSTALLATION .............................................................................................................................................. 3-1

ELECTRICAL CONNECTIONS AND DESCRIPTIONS ............................................................................................................... 3-1

SECTION SECTION

3.1 ....................................................................................................................................................... 3-1

3.2 ....................................................................................................................................................... 3-1

INE POWER WARNING ...................................................................................................................................... 3-1

INE VOLTAGES ................................................................................................................................................. 3-1

GROUND ................................................................................................................................................................... 3-2

SECTION

I/O

INTERFACE CONNECTION ................................................................................................................................. 3-3

SECTION

3.3 ....................................................................................................................................................... 3-2

ROUNDING ...................................................................................................................................................... 3-2

ONNECTOR SHIELDING ..................................................................................................................................... 3-2

3.4 ....................................................................................................................................................... 3-3

I/O

CONNECTOR ................................................................................................................................................ 3-3

RELAYS .......................................................................................................................................................... 3-3

INPUTS ........................................................................................................................................................... 3-3

RELAY

OUTPUTS ...................................................................................................................................................... 3-3

ELAY OUTPUTS................................................................................................................................................ 3-3

RYSTAL FAIL ................................................................................................................................................... 3-3

LAPSED TIMER ................................................................................................................................................. 3-3

HUTTER .......................................................................................................................................................... 3-3

HICKNESS SETPOINT ........................................................................................................................................ 3-4

REMOTE

INPUTS ...................................................................................................................................................... 3-4

REMOTE INPUTS ................................................................................................................................................ 3-4

HUTTER RELAYS .............................................................................................................................................. 3-4

HICKNESS ZERO INPUT ..................................................................................................................................... 3-4

IMER ZERO INPUT ............................................................................................................................................. 3-4

EMOTE INPUT SPECIFICATIONS .......................................................................................................................... 3-4

SENSOR

ANALOG

RS-232

COMMUNICATIONS

DEPOSITION

CONNECTION............................................................................................................................................ 3-4

SECTION

3.5 ....................................................................................................................................................... 3-4

SCILLATOR CONNECTION .................................................................................................................................. 3-4

RECORDER INTERFACE .......................................................................................................................... 3-5

3.6 ....................................................................................................................................................... 3-5

NALOG OUTPUT SPECIFICATIONS ....................................................................................................................... 3-5

RECORDER R

ECORDER OUTPUTS ......................................................................................................................................... 3-6

SERIAL COMMUNICATIONS INTERFACE ................................................................................................... 3-6

RS-232 RS-232

OMMUNICATIONS OPTIONS ................................................................................................................................ 3-7

YSTEM INSTALLATION ....................................................................................................................................... 3-8

ENSOR INSTALLATION ....................................................................................................................................... 3-8

CALIBRATION ........................................................................................................................... 3-5

3.7 ....................................................................................................................................................... 3-6

CONNECTIONS ...................................................................................................................................... 3-6

CONNECTOR DEFINITIONS ............................................................................................................. 3-7

OPTIONS ................................................................................................................................. 3-7

3.8 ....................................................................................................................................................... 3-7

SYSTEM INSTALLATION .................................................................................................................... 3-8

3.9 ....................................................................................................................................................... 3-8

INSTALLING WATER LINES .............................................................................................................................................. 3-9

ATER LINES .................................................................................................................................................... 3-9

VACUUM ELECTRICAL

FEEDTHROUGH ........................................................................................................................................ 3-10

ACUUM FEEDTHROUGH ..................................................................................................................................... 3-10

IN-VACUUM CABLE ............................................................................................................................ 3-10

ACUUM ELECTRICAL CONNECTIONS ................................................................................................................... 3-10

AKEABLE SENSOR ............................................................................................................................................ 3-10

CALIBRATION AND THEORY ................................................................................................................................ 4-1

MEASUREMENT THEORY ................................................................................................................................................ 4-1

SECTION

HICKNESS READING CALIBRATION ................................................................................................................................. 4-2

SECTION

ENSITY DETERMINATION ............................................................................................................................................... 4-2

4.1 ........................................................................................................................................................ 4-1

QUATION 1: ..................................................................................................................................................... 4-1

EASURING PERIOD ........................................................................................................................................... 4-1

ATE COMPUTATION .......................................................................................................................................... 4-1

4.2 ........................................................................................................................................................ 4-2

HICKNESS........................................................................................................................................................ 4-2

Page v Table of Contents

DENSITY ........................................................................................................................................................... 4-2

Z-F

ACTOR DETERMINATION ............................................................................................................................................ 4-2

Z-F

ACTOR......................................................................................................................................................... 4-2

OOLING DETERMINATION .............................................................................................................................................. 4-3

SECTION

ATERIAL REFERENCE TABLE ........................................................................................................................................ 4-4

4.3 ........................................................................................................................................................ 4-4

ULK DENSITY AND Z-FACTOR VALUES ................................................................................................................ 4-4

LUMINUM THROUGH INDIUM ............................................................................................................................... 4-4

NDIUM INTIMONIDE THROUGH TANTALUM ............................................................................................................. 4-5

ELURIUM THROUGH ZIRCONIUM OXIDE ................................................................................................................ 4-6

COMPUTER INTERFACING .......................................................................................................................... 5-1

RS-232 INTERFACE .................................................................................................................................................. 5-1

SECTION

BAUD

YCON PROTOCOL ........................................................................................................................................................ 5-2

SECTION

SECS-II

SECTION 5.3 ....................................................................................................................................................... 5-5

IEEE-488

SECTION

COMMANDS .............................................................................................................................................................. 5-7

SECTION

RESPONSE DETAILED

SECTION

5.1 ....................................................................................................................................................... 5-1

RS-232

RATES AND CABLING ...................................................................................................................................... 5-1

M C S

M B

SECS-II SECS-II D G M SECS-II M

S S Z Z Z S S

DESCRIPTION ....................................................................................................................................... 5-1

AKING AN RS-232 CABLE ................................................................................................................................ 5-2

OMMUNICATION DEMO DISK .............................................................................................................................. 5-2

ETTING BAUD RATES ........................................................................................................................................ 5-2

5.2 ....................................................................................................................................................... 5-2

ESSAGE FORMAT ............................................................................................................................................. 5-3

ASIC DRIVER ROUTINE ..................................................................................................................................... 5-4

PROTOCOL...................................................................................................................................................... 5-5

ADDRESSING ....................................................................................................................................... 5-5

PROTOCOL .......................................................................................................................................... 5-5

OCUMENTATION REQUIREMENTS ....................................................................................................................... 5-5

ENERAL INFORMATION ...................................................................................................................................... 5-5

ESSAGE SUMMARY .......................................................................................................................................... 5-5

MESSAGES .......................................................................................................................................... 5-6

ESSAGE DETAILS ............................................................................................................................................. 5-6

INTERFACE OPTION ................................................................................................................................. 5-6

5.4 ....................................................................................................................................................... 5-6

5.5 ....................................................................................................................................................... 5-7

FORMAT ................................................................................................................................................ 5-7

OMMAND LIST FOR STM-100 / MF ................................................................................................................... 5-8

COMMAND DESCRIPTION ..................................................................................................................... 5-8

5.6 ....................................................................................................................................................... 5-8

OFTWARE VERSION CODE ................................................................................................................................ 5-8

HUTTER RELAY CONTROL ................................................................................................................................. 5-9

ERO THICKNESS AND TIMER .............................................................................................................................. 5-9

ERO THICKNESS ............................................................................................................................................... 5-9

ERO TIMER ...................................................................................................................................................... 5-9

ET THE DENSITY PARAMETER ............................................................................................................................ 5-9

ET THE Z-FACTOR PARAMETER ......................................................................................................................... 5-9

SET THE END THICKNESS ................................................................................................................................... 5-9

ET THE SETPOINT RELAY THICKNESS ................................................................................................................. 5-9

ET THE TIMER RELAY PARAMETER ..................................................................................................................... 5-10

ET THE TOOLING FACTOR PARAMETER ............................................................................................................... 5-10

URN THE TEST MODE ON/OFF ........................................................................................................................... 5-10

CKNOWLEDGE THE STATUS OF NON-VOLITILE MEMORY ....................................................................................... 5-10

ET THE CRYSTAL FAIL STATUS .......................................................................................................................... 5-10

ET THE STATUS OF THE SETPOINT TIMER RELAY ................................................................................................. 5-10

ET THE STATUS OF THE SETPOINT THICKNESS RELAY ......................................................................................... 5-10

ET THE STATUS OF THE END THICKNESS RELAY ................................................................................................. 5-11

ET THE REMOTE INPUT STATUS ........................................................................................................................ 5-11

ET THE CONFIGURATION SWITCH STATUS .......................................................................................................... 5-11

ET THE THICKNESS VALUE ................................................................................................................................ 5-11

ET THE RATE VALUE ........................................................................................................................................ 5-11

ET THE SENSOR FREQUENCY............................................................................................................................ 5-11

ET THE CRYSTAL LIFE VALUE ............................................................................................................................ 5-11

ET THE TIMER VALUE ....................................................................................................................................... 5-12

ET THE SHUTTER CLOSE EVENT THICKNESS LOG ............................................................................................... 5-12

ET THE SHUTTER CLOSE TIME LOG .................................................................................................................... 5-12

ET THE LOG EVENT RATE ................................................................................................................................. 5-12

Table of Contents Page vi

GET THE POWER ON STATUS .............................................................................................................................. 5-12

ORCE PARAMETERS TO THEIR DEFAULT VALUES ................................................................................................. 5-12

URN THE KEY BOARD BEEPER ON/OFF .............................................................................................................. 5-13

NTERNAL USE COMMANDS ................................................................................................................................. 5-13

ULTI-FILM FILM NUMBER SELECTION ................................................................................................................. 5-13

ULTI-FILM DENSITY PARAMETER ....................................................................................................................... 5-13

ULTI-FILM Z-FACTOR PARAMETER..................................................................................................................... 5-13

ULTI-FILM END THICKNESS PARAMETER ............................................................................................................ 5-14

ULTI-FILM SET POINT RELAY THICKNESS PARAMETER ......................................................................................... 5-14

ULTI-FILM SET POINT TIMER RELAY PARAMETER ................................................................................................ 5-14

ULTI-FILM TOOLING FACTOR PARAMETER .......................................................................................................... 5-14

MAINTENANCE .............................................................................................................................................. 6-1

WARNINGS ................................................................................................................................................................... 6-1

SECTION CONTROL REPLACING

SECTION P

ERSISTENT CRYSTAL FAIL INDICATION ........................................................................................................................... 6-3

SECTION

6.1 ....................................................................................................................................................... 6-1

UNIT ......................................................................................................................................................... 6-1

A SENSOR CRYSTAL........................................................................................................................... 6-2

6.2 ....................................................................................................................................................... 6-2

6.3 ....................................................................................................................................................... 6-3

APPENDIX A-COMMUNICATION DEMO DISK ........................................................................................................ A-1

SECTION A-1 .......................................................................................................................................................... A-1

STM-100

/MF SPECIFIC PROGRAMS .............................................................................................................................. A-1

ECTION A-2 .......................................................................................................................................................... A-1

APPENDIX B-TECHNICAL DRAWINGS .................................................................................................................. B-1

PPENDIX C-SHMX-4 OPERATION .................................................................................................................... C-1

INTRODUCTION ........................................................................................................................................................ C-1

PERATION ............................................................................................................................................................. C-2

NSTALLATION .......................................................................................................................................................... C-2

Page vii Table of Contents

List of Figures

Figure 1.1: Standard Sensors. ................................................................................................. 1-4

Figure 2.1: STM-100 / MF Front Panel. .................................................................................. 2-1

Figure 2.2: System Control Keys. ............................................................................................ 2-1

Figure 2.3: Data Entry And Programming Keys. ..................................................................... 2-2

Figure 2.4: LCD Data Areas. .................................................................................................... 2-4

Figure 2.5: LCD Variable Parameter Legends. ........................................................................ 2-4

Figure 2.6: Film Number Parameter. ....................................................................................... 2-4

Figure 2.7: Density Parameter. ................................................................................................ 2-5

Figure 2.8: Z-Factor Parameter. .............................................................................................. 2-5

Figure 2.9: End Thickness Parameter. .................................................................................... 2-6

Figure 2.10: Set Point Thickness Parameter. .......................................................................... 2-7

Figure 2.11: Set Point Timer Parameter. ................................................................................. 2-7

Figure 2.12: Tooling Parameter. .............................................................................................. 2-8

Figure 2.13: Configuration Switch Settings. ............................................................................. 2-9

Figure 3.1: Rear Panel. ............................................................................................................ 3-1

Figure 3.2: Recommended Grounding Procedure. .................................................................. 3-2

Figure 3.3: Recorder Output Plug. ........................................................................................... 3-5

Figure 3.4: Example of Thickness Mode Recorder Output. ..................................................... 3-6

Figure 3.5: Example of Rate Mode Recorder Output. ............................................................. 3-6

Figure 3.6: Cable Connections From STM to MSDos Computers. ......................................... 3-7

Figure 3.7: Typical System. ..................................................................................................... 3-8

Figure 3.8: Head Mounting Dimensions................................................................................... 3-9

Figure 4.1: Typical Tooling Factors. ......................................................................................... 4-3

Figure 5.1: Cable Connection From STM-100 / MF to IBM-AT. .............................................. 5-1

Figure 5.2: Connections for STM-100 / MF to PC Compatible Computers. ........................... 5-2

Figure 5.3: BASIC Driver Routine. ........................................................................................... 5-4

Figure 5.4: HP-85 IEEE-488 BASIC Driver Program. .............................................................. 5-7

Figure 6.1: Sensor and Feed Through Connections. ............................................................... 6-3

Figure 6.2: Test Oscillator OSC-100A. .................................................................................... 6-4



Figure 6.3: SM75, MicroDot

Figure C.1: SHMX-4 Front Panel ............................................................................................. C-1

Figure C.2: Firmware ROM Label ............................................................................................ C-2

Connector. ................................................................................ 6-4

Figure C.3: SHMX-4 Back Panel ............................................................................................. C-2

Figure C.4: SHMX-4 to STM-100 Control Cable ...................................................................... C-3

List of Figures Page viii

List of Tables

Table 2.1: Baud Rate Switch Settings .......................................................2-10

Table 2.2: Configuration Switch Address Sett ings ....................................2-11

Table 4.1: Common Material Reference Table ........................................... 4-4

Table 4.1: Common Material Reference Table, Cont inued ......................... 4-5

Table 4.1: Common Material Reference Table, Cont inued ......................... 4-6

Table 5.1: Baud Rate Configuration Table. ................................................ 5-2

Table 5.2: Communication Command Summary........................................ 5-8

Page ix List of Tables

SECTION 1

General Information

GENERAL INFORMATION

SECTION 1.1

SECTION 1.2

INTRODUCTION

The STM-100 / MF from Sycon Instruments, Inc. represents a new class

of thin film monitor. I t uses the time-proven 6 MHz oscillating quartz crystal as the sensor device. The STM-100 / MF is constructed with advanced LSI and microprocessor technology. This enables the dir ec t solut ion of the complex mathematical equation associated with the f r equency shift versus mass loading characteristics of the quartz crystal sensor. Its computational power allows the measurement of the material accum ulat ed on t he s ensor c r ystal t o be accurately converted to film thickness using the exact equation; inaccuracies due to approximations and limited ranges of m aterial constants do not contribute to thickness and r at e er r or s . A hig h frequency period measurement clock (over 70 MHz) enables the STM-100 / MF to make and display 4 measurements/second with one-tenth Angstr om r ate resolution. The STM-100 / MF is equipped with 4 setpoint relays, 4 remote inputs, a comput er interface (RS-232) supporting 2 protocols including SECS-II, and a high resolution analog recorder output. A r ack mount for half-rac k mounting is also standard. If desired, t he front panel LCD can be configured, by rear panel switch setting, to display the freq uency of the sensing crystal instead of computed rate and thickness. ST M-100 / MF 's manufactured and shipped after October 1990 have the additional capability of storing film parameter for nine film or processes. Earlier STM's can be factory upgraded to include this feature. An extra-cost opt ion is a second com puter interface. This f actory installed upgrade can be either IEEE-488 or BIT BUS.

UNPACKING

The STM-100 / MF comes with a power cord, and connectors for the RS232 interface, the I/O int er face and analog output. If t he O SC-100 or crystals were ordered at the same time, they will also be included. The unit is shipped with the rack mount attached, which may be removed for t able t op oper at ion. To complete a system installation a sensing head and a vacuum to air feedthrough are req uir ed. Schematic drawings and a MSDOS Format diskette of demonstration sof t ware are included with this manual. Refer to Appendix A for a detailed description of the included software. The unit comes set for the line voltage as ordered. If you need to change it , r efer to Section 3.2. Make sure that you install the correct fus es when changing line voltage. If it is ever necessary to return the unit to Sycon, f or any reason, call and obt ain an Retur n Authorization (RA) num ber before returning the unit.

Page 1 - 1 GENERAL INFORMATION

SECTION 1.3

STM-100 / MF SPECIFICATIONS

DISPLAY TYPE ........................................ 7 DIGIT LCD

THICKNESS DISPLAY RANGE ................ 0 to 999.9 kÅ

RESOLUTION .................................. 1 Å autoranged

# DIGITS .......................................... 4

RATE DISPLAY RANGE........................... 0.0 to 999 Å/S

RESOLUTION .................................. 0.1 Å/S autoranged

# DIGITS .......................................... 3

MEASUREMENT PERIOD........................ 0.25 SEC

SENSOR TYPE ................................ Quartz Crystal Microbalance

FREQUENCY ................................... 6 MHz Plano Convex A/T Cut

MAX. FREQ. SHIFT ......................... 1 MHz

FILM PARAMETER .................................. 9 MATERI AL S

VARIABLES .............................................. 7

FILM # .............................................. 1 t o 9

MATERIAL. DENSITY ...................... 0.500 t o 99. 99 gm/cc

MATERIAL. Z FACTOR.................... 0.100 to 9.999

SYS. TOOLING ................................ 10.0 to 399 %

SHUT TER CLOSURE ...................... 0.000 to 9999 kÅ

T HI CKNESS SETPOINT .................. 0.000 to 9999 kÅ

T I MER SETPOINT ........................... 00:00 to 99:59 M:S

I/O CONNECTION .................................... 15 PIN D MALE

HARDWARE O UTPUTS ........................... 4, SPST 2.5A RELAYS

- Shutter Relay (Pins 5,6)

- Thickness Setpoint (Pins 7,8)

- Sensor Failure (Pins 1,2)

- Timer Setpoint (Pins 3,4)

HARDWARE I NPUTS ............................... 4 TTL COMP., ACTIVE LOW

- Open Shutter (Pin 12)

- Close Shutter (Pin 11)

- Zero Thickness (Pin 10)

- Zero Timer (Pin 9) Note: Pins 13,14,15 are GND.

ANALOG RECORDER ............................. + 10V F.S. RATE OR THICKNESS

- 2 mA max Load,

- 11 BIT Resolution

CONNECTION ................................. Miniature Stereo Jack

STD. COMMUNICATIONS I/O .................. RS-232, DUAL PROTOCOL

- 4 BAUD RATES

- 300,1200,2400,9600

CONNECTION ................................. - 9 PIN "D" FEMALE

GENERAL INFORMATION Page 1 - 2

OPTIONAL COMMUNICATIONS I/O

1) ...................................................... IEEE-488 T/L

CONNECTION ................................. - 24 PIN TYPE 57 FEMALE

2) ...................................................... BITBUS Slave Node

CONNECTION ................................. - 2 TWINAX BNC's

DISPLAY FUNCTIONS

1) ..................................................... DATA/FILM #

2) ..................................................... THICKNESS / RATE

3) ..................................................... CRYSTAL % USAGE / TIMER

4) ..................................................... SENSOR FREQUENCY

DISPLAY ANNUNCIATORS ..................... STATUS

RELAY ............................................. ON/OFF EACH RELAY

PARAMETER ID .............................. EACH VARIABLE

MODE ID .......................................... PROGRAM / OPERATE

ACTIVITY ......................................... COMMUNICATIO NS INTERFACE

KEYBOARD FUNCTIONS ........................ 8 KEYS

TYPE ................................................ Individual Buttons

FUNCTIONS .................................... - Shutter Open

- Shutter Close

- Zero Thickness & Time

- Set Program Mode On / Of f

- Increase Value

- Decrease Value

- Enter Data

- Crystal Status

USER OPTION SWITCHES ..................... Rear Panel

- Baud Rate Selection

- Serial Protocol Selection

- Communications Address

- Parameter Lock

- Negative Limit Operation

- Frequency Meas. Mode

- Analog Recorder Function

POW ER REQUIREMENTS ....................... 120/240V,+5%-

......................................................... 20%,50/60Hz,10VA

CONNECTOR .................................. IEC Standard

POWER SWITCH ............................ Rear Panel Mounted

T EMPERATURE RANG E ................. 0o C to 50oC Operating

-15oC to 65oC Storage

SIZE / WEIGHT ........................................ 2.5"H, 7.25"W, 10"D 4lbs

(RACK MOUNTED) .................................. 3.5"H, 8.0"W, 10"D ;

SHIP WEIGHT .......................................... 8lbs

Page 1 - 3 GENERAL INFORMATION

SECTION 1.4

OPERATION

WATER

ELECTRICAL

MATERIALS (IN VAC)

SECTION 1.5

SENSOR SPECIFICATIONS

Low Profile P/N 500-042 RIGHT ANGLE P/N 5 00 -088

Figure 1.1: Standard Sensors.

Low Profile and Right Angle sensors, See Appendix B for dimensions and more detailed drawings of these and other sensor pac kages.

Maximum Temperature ............................. 175° C

Water Line and Coax Lengt h ................... 30 inches

Sensor Mounting ...................................... Rear of Body, 4-40 Tapped Holes

FEEDTHROUGH INSTALLATION

Connections .................................... Two Required

Type ................................................ 1/8 inch O.D. Stainless Tubing

Flow Rate ......................................... 0.2 to 0.3 gal/min

Water Temp ..................................... 50° C max.

Connections .................................... One Coaxial Line

Type ................................................ Microdot Miniature S-50

Body and Water Lines .................... 304 Stainless

Insulators ........................................ Alumina

Coax Insulator ................................. Teflon

Coax Conductor and Shields ........... Copper/Silver

Braze Material ................................. High Vac Ni/CR/Cu Alloy

Crystal ............................................. Quartz with Gold Electrodes

SENSOR SPARE PARTS

Description SYCON Part Number

Sensor Body (Standar d) .................. 550-219

Snap Spring ..................................... 024-002

Sensor Cap ...................................... 550-218

30 inch In-Vacuum Coax Cable ....... 500-024

10 inch In-Vacuum Coax Cable ....... 500-023

Crystals (box of 10) ......................... 500-117

GENERAL INFORMATION Page 1 - 4

STM-100 / MF PARTS & ACCESSORIES

SECTION 1.6

MONITOR

FEEDTHROUGHS

SENSORS

OPTIONS

ACCESSORIES

SENSOR CRYSTALS

ASSEMBLY PART NUMBER

STM-100 / MF (Multi Film) ................ 500-104

POWER CORD (12 0 VAC).............. 600-004

FUSES (1/4 A Slow Blow for 120VAC) ...... 356-005

FUSES (1/8 A Slow Blow for 240VAC) ...... 356-007

RECORDE R PLUG ......................... 404-007

I/O 15 PIN CONNECTOR ................ 404-008

RS-23 2 9 PIN CONNECTOR .......... 404-009

MANUAL ......................................... 518-000

CONNECTOR KIT ............................ 514-001

19" Rack Mount (Single) ................... 014-008

19" Rack Mount (Dual) ..................... 014-009

1" BOLT STANDARD ...................... 500-016

2 3/4" ConFlat STANDARD ............. 500-017

LOW PROFILE ................................. 500-042

RIGHT ANGLE ................................ 500-088

IEEE-488 BUS INTERFACE ............ 500-021

BITBUS INTERFACE ...................... 500-022

30" I N-VACUUM COAX CABLE ...... 500-024

10" I N-VACUUM COAX CABLE ...... 500-023

10' OSC TO STM CABLE ................ 500-026

30' OSC TO STM CABLE ................ 500-027

6" OSC TO FEED THRU COAX ....... 500-025

BOX O F 10 ...................................... 500-117

Page 1 - 5 GENERAL INFORMATION

SECTION 2

Operation and Programming

STM - 100 / MF

THICKNESS / RATE MONITOR

instruments

SHUTTER

SENSOR

OPEN

ZERO

LIFE

DENS

Z-FACT END THK

XTAL FAIL

SHUTTER

SP TIME

SP THICK

SP THK SP TMR TOOL

PGM COM

DATA ENTRY

PROGRAM

ENTER

DATA

OPEN

SENSORSHUTTER

ZERO

LIFE

SECTION 2.1

SECTION 2.2

OPEN

SHUTTER

Shutter Keys

OPERATION AND PROGRAMMING

KEYBOARD DESCRIPTION

The STM-100 / MF keyboard is divided into two separate functional groups. The keys to the left of the LCD display are system control keys and the keys to the right of the display are data entry and programming keys. All keys are sensed when depressed and must be released to cause further action. The exceptions to this rule are the (LI FE) and ( ARROW) keys. T hese keys will cause continuous action if held depressed. An audible beep will accompany each key activation. The beeper may be disabled if desired. See Section 2.7.

Figure 2.1: STM-100 / MF Front Panel.

SYSTEM CONTROL KEY GROUP

Figure 2.2: System Control Keys.

SHUTTER OPEN

Activating the SHUTTER OPEN key will cause the internal shutter relay contacts to close. This relay is typically used to control a deposition system source shutter. The LCD display (SHUTTER) leg end will be visible when the shutter relay is active. This key is active at all times and states (Program and Normal) of the STM-100 / MF. A remote input duplicating this key function is also provided.

Page 2 - 1 OPERATION AND PROG RAMMING

SHUTTER CLOSE

DATA

ENTER

PROGRAM

DATA ENTRY

ZERO Key

ZERO

Crystal Life Key

LIFE

SECTION 2.3

Program Key

PROGRAM

The SHUT TER CLOSE key provides the reverse function of the SHUTTER OPEN key. This key is active at all times and states of the STM-100 / MF. A remote input duplicating this k ey f unc t ion is also provided.

ZERO

The ZERO key provides two functions, "THICKNESS ZERO" and " TIMER ZERO". Activating the key will cause any accumulated reading in the thickness display to be set to zero, thus providing a new accumulation reference point. It will also reset the elapsed t imer and display to t he set point value contained in the program m emory. Any setpoint relays that may have been closed at the time of the "ZERO" key operation will be reset to the open state. This key is inactive in the PROGRAM mode. Remote inputs providing separate operation of the THI CKNESS ZERO and T I MER ZERO operations are also provided. Note that during a Crystal Fail condition, the Zer o key does

not function.

LIFE

Activating the CRYSTAL LIFE key will provide the user with a measure of remaining possible sensor crystal life. T his information is expressed in percent with 100% representing a new sensor crystal and 0% indicating a fully loaded sensor crystal (1MHz frequency shift). This information is presented where rate information is normally shown. This data should serve as an indicator for the need to change the sensor crystal. T he frequency of the sensor crystal t o the nearest kilohertz is also presented. T his information is shown where accumulated thickness data is normally displayed. A new sensor crystal should indicate close to 99% life and a freq uency near 5. 950 MHz. This key function is inactive in the PROGRAM mode. Activating this key during a CRYSTAL FAIL condition may result in a blank data display. The LIFE display is active as long as the LIFE key is held depressed.

DATA ENTRY AND PROGRAMMING GROUP

Figure 2.3: Data Entry And Programming Keys.

PROGRAM

Activation of the PROGRAM key places the instrument in a mode wherein the internal parameter variables may be viewed or modified. Data view operation is always available whereas, data modification may be inhibited by a user option switch on the rear panel. If the instrument is in the PROGRAM mode, depressing the PROGRAM key will return the unit to the norm al display mode. Six variable parameters, for each of nine films of the STM-100 / MF

OPERATION AND PROG RAMMING Page 2 - 2

may be programmed by the user. Two of t hes e m at erial constants are needed

Enter Key

ENTER

Arrow Keys

DATA

SECTION 2.4

LCD Data Displays

to provide correct thickness and rate information for a particular film material and one is a constant used to correct f or system sensor and substrate geometry variations. Three setpoint variables ar e pr ovided to act ivate relay events. Two of these are related to thickness and one to elapsed time. These variables and their meanings are discussed in detail in Section 2.4.

ENTER

The ENTER key has two functions. It is used (1) to sequence through the six parameter variables, one parameter f or eac h pr ess of the ENTER key, and (2) to place modified variable data into the non-volatile storage memory of the instrument. This data will be retained until modif ied by the user even with no power to the instrument. A legend on the LCD display will indicate which variable parameter data is being displayed. Any modifications to parameter data occur in the display memory only, and will cause the associated parameter legend to f lash. The flashing legend indicates that a param et er change has been made but has not yet been saved in memory. To stor e the data in memory the ENTER key must be pressed. Exiting t he PRO G RAM mode (via the PROGRAM key) while a parameter legend is flashing does not cause the modified data to be saved. Previously saved parameter data will be retained. The ENTER key only functions in the PROGRAM mode.

ARROW KEYS

The ARROW keys are used to select t he ac t ive f ilm and to increment or decrement the displayed parameter variable data in order to achieve the desired value. The rate of incremental change will increase as the key is held depressed. This will speed up parameter changes covering a large dynamic data range. Letting up on the key and then resuming key depression will reset the rate of change to t he slowest rat e and it will again increase with time as t he key remains depressed.

FILM PARAMETERS

The STM-100 / MF utilizes a high contrast liquid crystal display for the viewing device. All measurement data, instrument status, and pr ogram variable operations are viewable on the display. A three or four digit parameter display and a four digit time display (min:sec) are used t o display the dynamic data.

Page 2 - 3 OPERATION AND PROG RAMMING

PROGRAM

ENTER

DATA

Film Number Parameter

Figure 2.4: LCD Data Areas.

The STM-100 / MF incorporates six programmable parameter variables for each of nine films pr ogrammable by the user. Three variables are used by the thickness equation and are relat ed t o m at erial physical constants and system geometry (Density, Z-Factor, and Tooling). The three remaining parameters are used as setpoint values to activate t he internal relays on the I/O connector.

Each variable has a specif ic LCD legend as soc iated with it. These legends are only active in the PROGRAM mode and only one will be on at a time. Each parameter is discussed in more det ail below.

Figure 2.5: LCD Variable Parameter Legends.

Af ter entering the program m ode by pushing t he Pr ogram Button the current film number is displayed in the upper lef t hand c or ner of the LCD display. (FL.n, n is 1 through 9). Ref er to Figure 2.6.

Figure 2.6: Film Number Parameter.

At this point t he c ur r ent film's parameters may be reviewed or changed or a new current film selected. To select a new current film the film number is

OPERATION AND PROG RAMMING Page 2 - 4

increased or decreased by using the up and down arrow keys. Pushing the

Density Parameter

enter button selects the film num ber shown to be the c ur r ent film and displays the first parameter ( densit y) of that film. Each of t he film parameters can now be reviewed or changed by using the DATA keys and / or the ENTER key.

WARNING

When leaving the Program Mode, the last Selected FILM is the current active FILM.

DENSITY

Figure 2.7: Density Parameter.

LEGEND DENS RANGE 0. 500 to 99.99 UNITS gm/cc

The DENSITY parameter refers to t he m easured material density in gm/cc. This constant is nor m ally the bulk m at er ial value but is somet im es different due to deposition and film growth conditions. This value is utilized in the thickness equation to convert m easured mass to a thickness value. See Table 4.1 for an extensive value list. See Section 4.2 for calibr at ion information.

LEGEND Z-FACT RANGE 0. 100 to 9.999 UNITS NONE

Page 2 - 5 OPERATION AND PROG RAMMING

Z-FACTOR

Figure 2.8: Z-Factor Parameter.

Z-Factor Parameter

End Thickness

The Z-Factor parameter refers t o t he elastic properties of the measured material. This value is utilized in the thickness equation to m at c h t he acoustical properties of the film being measured to the acoustic properties of the base quartz material of t he sensor c r ystal. This correction is necessary to insure accurate measurements when sensor crystal shifts of greater than 15% are realized. See Table 4.1 for an extensive material value list. See Section

4.2 for calibration inform at ion.

END THICKNESS

Figure 2.9: End Thickness Param et er .

LEGEND END THK RANGE 0 to 9999 UNITS KILO ANGSTROMS (1 Angstrom = 10

-10

meters)

The END T HI CKNESS paramet er is used to provide a trigger setpoint for the STM-100 / MF Shutter Relay contacts. If t he s hut t er relay contacts are closed by operating the front panel shutt er c losed but t on or by rem ot e input . These contacts will return to the open state when the thickness display value becomes equal to or exceeds the END THICKNESS SETPOINT value. T he STM-100 / MF Shutter Relay contacts are normally used to automatically control a deposition system source shutter. This is a trigger event and will only effect shutter st at us at t he time the event occurs. If the shut t er r elay contacts were already open at the time of the event the event will be ignored. A setpoint value of 0.000 kÅ causes the setpoint function to be ignored.

OPERATION AND PROG RAMMING Page 2 - 6

SETPOINT THICKNESS

Setpoint Thickness Parameter

Setpoint Timer

Figure 2.10: Set Point Thicknes s Par am et er.

LEGEND SP THK RANGE 0 to 9999 UNITS KILO ANGSTROMS

The SETPOINT THICKNESS parameter is used to provide a comparison point for the STM-100 / MF Thickness Set point Relay. T his set of relay contacts will be closed whenever the thickness display equals or exceeds the setpoint value. A setpoint value of 0.000 kÅ causes the t hickness setpoint function to be ignored.

SETPOINT TIMER

Figure 2.11: Set Point Timer Parameter.

LEGEND SP TMR RANGE 00:00 to 99:59 UNITS MIN:SEC

The SETPOINT TIMER parameter is used to provide a comparison point for the STM-100 / MF Timer Setpoint Relay. The int er nal STM-100 / MF timer is pre-set with the setpoint value whenever the front panel ZERO k ey, or a remote ZERO TIMER input, is activated. The Tim er Relay contact s ar e opened at this time and the timer display begins counting downward toward zero. When the timer display reaches zero the relay contacts are closed and the display timer begins counting in an upwards fashion. A setpoint value of 00:00 will cause the timer setpoint function to be ig nor ed.

Page 2 - 7 OPERATION AND PROG RAMMING

TOOLING

Tooling Factor Parameter

SECTION 2.5

Figure 2.12: Tooling Paramet er .

LEGEND TOOL RANGE 10.0 to 399 UNITS PERCENT

The TOOLING parameter is used as a corr ection factor to compensate for geometric position differences between the location of the sensor and the target substrate. Cor r ec t ion is r equired both the substrate and sensor see the material source in an identical manner, unless for this case, the Tooling Parameter is set to 100%. Generally, if the sensor is farther f r om the source than the substrate, the tooling will be set to >100%. If the sensor is closer to the source, the tooling will be set to < 100%. See Section 4. 2 for calibration information.

USER CONFIGURATION SWITCHES

On t he r ear panel of the STM-100 / MF a twelve selection configuration switch is located. The settings of this switch allow the user to select various system operational modes. All communications related variables are also set here. Switches 1 thru 4 may be changed at any time and will have immediate effect. Switches 5 thru 12 ar e only read at t he time of power turn on.

OPERATION AND PROG RAMMING Page 2 - 8

CONFIGURATION

SWITCH

BINARY DEVICE ADDRESS SW8=MS BIT SW12=LS BIT SW 8 SW9 SW10 SW11 SW12

OFF OFF OFF OFF OFF = 0 OFF OFF OFF ON OFF = 0 ON OFF ON OFF ON = 0

SERIAL BAUD RATE SW 6 SW7 OFF OFF = 300 OFF ON = 1200 ON OFF = 2400 ON ON = 9600

PROTOCOL ON = SEMI OFF = SYCON NEGATIVE RATES ON = ENABLE OFF = DISABLE

FREQUENCY MODE ON = ENABLE OFF = DISABLE

ANALOG OUTPUT ON = THICK OFF = RATE PARAMETER LO CK ON = LOCK OFF = UNLOCK

see Note:

NOTE: Sw itch settings involvi ng c omm unications functions are sensed at power up onl y.

Configuration

Figure 2.13: Configuration Switch Settings.

SWITCH FUNCTION DEFINITIONS

SW1 - PARAMETER LOCK When on, st or ed par am eter data cannot be modified via the front

panel. This switch is sensed at all times. SW2 - RECORDER FUNCTION When on, the analog output will provide thickness information.

Rate information is presented in the off state. This switch is

sensed at all times. See Section 3.6. SW3 - FREQUENCY MODE When on, the unit will display seven digits of sensor frequency to

a resolution of one Hertz. All other instrument functions remain

normal. This switch is active at all times. SW4 - NEGATIVE LIMITS When on, both thickness setpoints and their associated relays will

activate on negative thickness data only. This switch is sensed at

all times. SW5 - SERIAL COMMUNICATIONS FORMAT When on, the RS-232 serial communications channel will respond

SW6 & SW7 - BAUD RATE SELECT ION These two switch settings in combination select one of four baud

Page 2 - 9 OPERATION AND PROG RAMMING

to SEMI STANDARD SECS-II form at t ed c om m ands. Sycon

formatted commands ar e valid f or the off state. This switch is

sensed only at power-up.

rates for the RS-232 serial comm unicat ions channel. These

switches are sensed only during power-up.

SW6 SW7 BAUD OFF OFF 300

OFF ON 1200 ON OFF 2400 ON ON 9600

Table 2.1: Baud Rate Switch Settings

SW8, SW9, SW10, SW11, SW12 DEVICE ADDRESS SELECTION These switches in combination select the device address for t he

instrument when operating with the SECS RS-232 protocol or with either the IEEE-488 or BITBUS communications opt ion car ds. These options allow multiple devices to operate on a single bus, and only the individual addressing prevents response conflicts. Switch coding is in binary 1 of 32 format with SW8 the MSB and SW12 the LSB. T hes e switches are s ensed only during powerup. See Table 2.2 for a list of addresses.

OPERATION AND PROG RAMMING Page 2 - 10

Switch Setting Address

SECTION 2.6

Enabling the Test Mode

SW8 SW9 SW10 SW11 SW12 IEEE BITBUS / SECS II

off off off off off 0 32 / 0 off off off off on 1 1 off off off on off 2 2 off off off on on 3 3 off off on off off 4 4 off off on off on 5 5 off off on on off 6 6 off off on on on 7 7 off on off off off 8 8 off on off off on 9 9 off on off on off 10 10 off on off on on 11 11 off on on off off 12 12 off on on off on 13 13 off on on on off 14 14 off on on on on 15 15 on off off off off 16 16 on off off off on 17 17 on off off on off 18 18 on off off on on 19 19 on off on off off 20 20 on off on off on 21 21 on off on on off 22 22 on off on on on 23 23 on on off off off 24 24 on on off off on 25 25 on on off on on 27 27 on on on off off 28 28 on on on off on 29 29 on on on on off 30 30 on on on on on 0 31

The STM-100 / MF incorporates a test and deposition simulation mode to aid in trouble shooting and demonstrating t he instrument. This mode simulates a deposition rate of 16 Angstrom s per second with a Density and Z-Fact or of 1 and Tooling of 100%. The t est mode may be activated only in the nonprogram mode. Holding the UP ARROW key down while activating the SHUTTER CLOSE key will turn the test mode on. The Å/S and KÅ legends will blink continuously to indicate the test function. Once in the t es t m ode t he

Page 2 - 11 OPERATION AND PROGRAMMING

Table 2.2: Configuration Switch Address Sett ings

TEST MODE

shutter open and close buttons control the sim ulat ed deposit ion. The test

SECTION 2.7

Disabling the Beeper

mode may be turned off by holding the UP ARROW key depressed and then activating the SHUTTER OPEN key. Turning the unit off and back on also clears the test mode.

BEEPER

The beeper will give a short audible tone when any key is depressed or the unit power switch is turned on. The keyboard beeper may be disabled if desired by holding the DOWN ARROW key and activating the SHUTTER CLOSE key while not in the PROGRAM mode. The same procedure and activating the SHUTTER OPEN key will turn the beeper on.

The beeper will always be enabled after power is applied to the unit.

OPERATION AND PROG RAMMING Page 2 - 12

SECTION 3

Installation

INSTALLATION

DAMAGE TO THE UNIT .

SECTION 3.1

SECTION 3.2

Line Power Warning

Line Voltages

POWER

Electrical Connections and Descriptions

All electrical connections to the STM-100 / MF are made at the rear panel of the instrument. Care should be exercised in routing all cables as far as practically possible from any other cables or wires that may be generat ing noise. These may include other line voltage cables, wires to heaters that are SCR-cont r olled, and wires or cables that may conduct high transient curr ent s during arc over of an Ebeam type supply.

Figure 3.1: Rear Panel.

WARNING

REPLACE BROKEN OR BLOWN FUSES ONLY W ITH

The STM-100 / MF may be configured to operate on either 110V or 220V nominal line voltage. Units are factory-shipped conf igured for 110V operation unless otherwise ordered. The setting may be verif ied by noting t he line voltage value visible in the small window of the power and fuse module. To change the configuration firs t r em ove the power cord, then release the latch in the center of the module and remove the insert holding the f uses . The insert contains two fuses, the system fus e and a spar e. Remove both fuses, then pull the two-prong fuse holder out of the latching insert. Rotate the fuse holder and replace it int o t he latching insert such that the proper line voltage is visible in the window. The reading will be either 110 or 220. Place the proper fuse into t he m et al clips ( 1/ 4 amp SB for 110V operation and 1/8 amp SB for 220V operation), place the spare fuse into the spare fuse ar ea and r eplace the latching insert back into the power module. Make sure the latch snaps are closed. Replace the power cord with the

OPERATING THE ST M-100 / MF AT 220V WHEN THE UNIT IS CONFIGURED FOR 110V MAY CAUSE

TYPE 3AG SLOW BLOW OR EQUIVALENT WITH THE RATINGS SPECIFIED. FAILURE TO DO SO MAY RESULT IN UNSAFE OPERATION AND MAY CAUSE

Page 3 - 1 INSTALLATION

proper type for the line voltage chosen. Proper power line cord should be used,

SECTION 3.3

Grounding

Connector Shielding

the 110V line cord should not be used for 220V operation.

GROUND

A gr ound pos t is pr ovided on the rear panel. This point should be connected to the DEPOSITION SYSTEM GROUND with the shortest convenient lengt h of heavy gauge wire. This connection is not required f or nor mal operation but will make the unit less susceptible to transient noise. See Figure 3.2 for an example of proper installation.

Figure 3.2: Recommended Grounding Pr oc edur e. CONNECTOR INSTAL L ATION In system s with a high noise environment, you need to be careful when

wiring up connectors. A little extra time spent her e can save you hours of frustration later. Sycon provides mating connectors with each instrument. Extra sets of mating connector s ar e available fr om Sycon as part number 514-001. For best results, use a shielded multi-conductor c able. On the D-connectors, the metal shells each come with a set of 4 gromm ets. Pick the grommet for the size cable that you are using. Cut the outer insulation off of the cable so that it is exposed to 3/4 of the grommet. Because the grommet is conductive, no additional shield wiring is needed.

INSTALLATION Page 3 - 2

I/O INTERFACE CONNECTION

SECTION 3.4

I/O Connector

RELAYS

INPUTS

Relay Outputs

Crystal Fail

Elapsed Timer

This c onnect or provides the user interface to the 4 sets of relay output contacts as well as the 4 remote input command lines.

RELAY CONTACT RATINGS 2.5 AMPS - 120VAC MAX. - 120VA Normally Open - SPST CONTACTS

I/O CONNECTOR DEFINITIONS TYPE 15 Pin "D" Male

MATING CONNECTOR AMPHENOL 117-DA15S OR EQUIVALENT FUNCTION PIN NUMBER Crystal Fail 1, 2 Elapsed Timer 3, 4 Shutter Relay 5, 6 Thickness Setpoint 7, 8 Ground 13, 14, 15 Shutter Open 12 Shutter Close 11 Zero Thickness 10 Zero Timer 9 Ground 13, 14, 15

RELAY OUTPUTS

The STM-100 / MF is standard equipped with four SPST 2.5 AMP relays rated to 120VAC and to 120VA. These contacts are normally open and become active when their respective function is true. Continuous display of the st atus of each relay is provided by legends on the LCD display. The available relay functions are:

1. CRYSTAL FAIL - This r elay provides a contact closure whenever the sensor crystal fails to operate properly or has exceeded its operating range. The LCD legend for this relay status is ( X TAL FAIL). The legend will also flash as a warning to the user.

2. ELAPSED TIMER - This relay provides a contact closure when the elapsed timer has counted down to a value of zero from a set point value other than zero. A setpoint value of zero disables this relay function. T he display will continue to count in an upward fashion after a count of zero is reached. The relay contacts will remain closed until the front panel ZERO button or a remote TIMER ZERO event occurs, or a new timer number is entered. The LCD legend for this relay is (SP TIME).

Page 3 - 3 INSTALLATION

Shutter

Thickness Setpoint

Remote Inputs

Shutter Relays

Thickness Zero Input

Timer Zero Input

Remote Input Specifications

3. SHUTTER RELAY - This relay is intended to pr ovide contr ol of a deposition system source shutter. The front panel and remote input OPEN and CLOSE SHUTTER functions directly control this relay. T he c ont ac t s are closed when the source shutter is intended to be open. The LCD legend for this relay is (SHUTTER). The relay status is also controlled by a END THICKNESS event. This event is controlled by the END THICKNESS setpoint parameter. If the shutter is open at the time of this event it will automatically close. The (SHUTT ER) legend will turn off and the (END THICK) leg end will become visible, indicating the shutter was closed by the END THICKNESS event.

4. THICKNESS SETPOINT - This relay provides a contact closure whenever the accumulated thickness display value equals or exceeds the thickness setpoint parameter value. This relay funct ion is disabled with a parameter value of zero. The LCD legend for this relay is (SP THICK).

REMOTE INPUTS

The STM-100 / MF is standard equipped with four remote input f unct ions. These inputs are intended to be activated with a contact closure t o ground but may also be controlled with TTL level signals. All remote inputs are leading edg e detected and can thus remain activated indef initely. T o c ause t he event t o happen again the input must be removed for a m inimum of 200 milliseconds and then can be re-applied. The four available input commands are:

1. REMOTE SHUTTER OPEN - Funct ionally identical to front panel SHUTTER OPEN button. Activating this input will close the contacts of the SHUTTER RELAY.

2. REMOTE SHUTTER CLOSE - Func t ionally identical to front panel shutter close button. Activating this input will open the contacts of t he SHUT TER RELAY.

3. REMOTE THICKNESS ZERO - Sets t he acc um ulat ed t hickness display to zero. Does not zero the elapsed time timer.

4. REMOTE TIMER ZERO - Re-initializes the elapsed time tim er . Does not zero accumulated thickness.

SPECIFICATIONS

ACTIVATION ................................. Contact closure to gnd or TT L low

INPUT IMPEDANCE ..................... 2700 ohm s

OPE N CIRCUIT VOLTAGE ........... 3.5V typical, 5V max.

MAXIMUM ON VOLTAGE ............. 0.6 volts

MAXIMUM SINK CURRENT ......... 2 mA (1 TTL LOAD)

INSTALLATION Page 3 - 4

Signal Ground

Shield

Signal

SECTION 3.5

Oscillator Connection

SECTION 3.6

Analog Output Specifications

SENSOR CONNECTION

CONNECTION TYPE -- BNC FEMALE This c onnect ion is t he REMOTE SENSOR OSCILLATOR interface to the

STM-100 / MF. This connection is both the signal and power path to t he oscillator . The supplied power is 5 volts at 50 mA. The input impedance is 50 ohms and the signal level is 1 volt peak to peak. The DC voltage may be removed by disconnecting internal STM-100 / MF jumper J1. T his m ay prove useful if a signal source other than the Sycon oscillator is utilized. This connection should always be made with coaxial cable. Type RG58 or RG59 is recommended. Cable lengths up to 500 feet are acceptable. T hese c ables in 10 and 30 foot lengths are available as standard parts from Sycon.

ANALOG RECORDER INTERFACE

This c onnect or provides an analog output voltage proportional to either displayed RATE or THICKNESS as selected by the user option dip switches on the rear panel of the STM-100 / MF. If SW2 of the user configuration dip switch is set OFF the analog output will report RATE inform at ion. I f SW2 is ON, the analog output will correspond to THICKNESS information. T he output voltage is bipolar and corresponds to the sign of t he displayed data.

CONNECTOR TYPE - MINIATURE STEREO SOCKET CONNECTOR MATE - 1/8 inch Miniature Stereo Jack

SPECIFICATIONS

RESOLUTION .................................. 11 BITS (0.05%)

ACCURACY ..................................... 0.3 % FS

LO ADING CAPACITY ...................... 2 m A

F.S. OUTPUT ................................... 10 VOLTS

TIP .................................................. SIGNAL

INSIDE RING ................................... SIGNAL G ROUND

OUTSIDE RING ............................... SHIELD

Figure 3.3: Recorder Output Plug.

RECORDER OUTPUT MATING PLUG CONNECTIONS

Page 3 - 5 INSTALLATION

T HI CKNESS MODE - The analog recorder output in the thick ness m ode is

CHART RECORDING OF 3500Å FILM

3500Å

ANALOG OUTPUT FOR THICKNESS

3000Å

2000Å

1000Å

V O

L T S

RATE - Ånstroms / Second

Slope 5.555mv per Å/sec between 100 Å/s and 1000 Å/s

Slope 50 mv per Å/sec between 0 and 100 Å/sec

ANALOG OUPUT

FOR RATE

V O L T S

100 200 300 400 500 600 700 800 900 1000

RECORDER CALIBRATION

Recorder Outputs

always scaled for plus or minus 999 Angstroms f ull scale (10V) . Resolut ion is always one (1) Angstrom. Display readings above 999 Angstroms will be sent to the recorder output as the rem ainder of the displayed value divided by 1000.

Figure 3.4: Example of Thick ness Mode Recorder O ut put .

RAT E MODE - The analog recorder output for t he r at e mode is scaled for a full scale (999.9 Å/S) reading of 10 volts. Readings of 0 Å/S to 100 Å/ S have a slope to 50 mV per Å/S and above 100.0 Å/S have a slope of 5.555 mV per Å/S. Readings up to 100.0 Å/S will be output with a resolution of 0.1 Å/S and values above 100.0 Angstroms will be output with a resolution of 1.0 Å/S. At a r ate of 100 Å/S the recorder output is 5 volts . This m et hod allows a continuous recor der accuracy of at least 0.3% and also provides a unique output voltag e for any rate value within the displayable range of values. Negative rate values will be indicated by negative output voltages.

INSTALLATION Page 3 - 6

Figure 3.5: Example of Rate Mode Recorder Output.

RS-232 SERIAL COMMUNICATIONS INTERFACE

STM-100 / MF

9 PIN MALE

SHIELD

9 PIN FEMALE

IBM-AT

2 RxD 3 TxD

5 GND

DSR 6 RxD 2

TxD 3 CTS 8

DTR 4

GND 5

STM - 100 / MF

9 PIN MALE

SHIELD

IBM - PC,XT

25 PIN FEMALE

2 RxD 3 TxD

5 GND

TxD 2 RxD 3

CTS 5 DSR 6 GND 7

DTR 20

SECTION 3.7

RS-232 Connections

RS-232 CONNECTOR DEFINITIONS

This Connect ion pr ovides a serial tr ans m ission dat a communications link to the STM-100 / MF. Four standard baud can be selected: 300, 1200, 2400, and

9600. They are selected via the rear panel configur at ion dip switches. ( See Section 2.5) The serial interface c om m unicat ions pr otocol is also selectable on these switches. The choices are SEMI STANDARD SECS-II, or Sycon format . The electrical specifications correspond to the RS-232 standard.

CONNECTOR TYPE 9 PIN "D" FEMALE CONNECTOR MATE AMPHENOL 117-DA9P OR EQUIVALENT

STM-100 / MF F UNCTION PIN NUMBER

RECEIVED DATA ............................ 2

T RANSMITTED DATA ..................... 3

CLEAR T O SEND ............................ 8

DAT A TERMINAL READY ............... 4

SIGNAL GROUND ........................... 5

CABLE SHIEL D ............................... 9

Page 3 - 7 INSTALLATION

Figure 3.6: Cable Connections From STM to MSDos Computers.

COMMUNICATIONS OPTIONS

SECTION 3.8

Communications Options

SECTION 3.9

System Installation

The STM-100 / MF will support two types of communications option boards. Type 1 is the IEEE-488 parallel bus and type 2 is the industrial standard BITBUS. Only one type of option card may be installed at a time. Both cards use the COMM OPTION rear panel cut-out for external connect ion. Cont act the factory for details on having either option installed.

The c om put er ident ification address (device address) for either option card is set in the same fashion. Dip switches 8 through 12 on the rear panel of the STM-100 / MF set a binary address from 0 through 31. Switch 8 is the MSB and switch 12 is the LSB. (See Table 2.2) The unit is fac t or y-shipped set for address

0. See Section 5 for a more detailed explanation of t he com mand and addressing

limitations.

Figure 3.7: Typical System.

DEPOSITION SYSTEM INSTALLATION

Figur e 3. 7 is a diagram of a typical evaporator installation. Refer r ing to this drawing and following the recommendations below should provide adequate information for mos t inst allat ions. I f further assistance is needed contac t t he customer service and applications department at Sycon.

INSTALLATION Page 3 - 8

SENSOR HEAD INSTALLATIO N

Water Cooling

Microdot Coaxial Connector

#4-40 Tap -- 4 holes Equally Spaced

on o0.731 B.C.

Sensor Installation

Water Lines

As a general rule the sensor head should not be installed closer than 10 inches to the evaporation source. This minimum dist ance will generally provide adequate measurement sensitivity while reducing the possibility of the sour c e spattering small particles onto the sens or . Even small part icles hit t ing the crystal surface may cause the crystal to become unst able or st op os cillating completely. The sensor should be shielded from the evaporant sour c e by a shutt er or other means when evaporant material is being initially conditioned or out gassed.

Inst all t he sensor so that the crystal opening is in a direct line with the evaporation source and well within the evaporant stream. Ensure that the sensor is not shadowed by mechanical structures within the vacuum system. The sensor should be held mechanically stable by attaching it to a mounting brack et via the rear #4-40 tapped holes.

Figure 3.8: Head Mounting Dimensions.

Installing Water Lines

Bend the two sensor water lines into t he desir ed pos ition for connection to the vacuum feedthrough. T ake care not to crimp the lines. There ar e t wo methods for attaching t he water lines t o t he feedthrough.

The first is to silver solder or T I G weld the sensor and water lines t ogether. To do this first locate the final position of the sensing head and feedthrough. Trim the 1/4" water lines on the feedthrough t o t he des ired length. Bend and fit the sensor water lines as required. Cut the 1/8" water lines to length allowing 1/4" to 1/2" of extra length to be inserted the 1/4" feedthrough water lines. Then braze, silver solder, or TIG weld.

The second is to use Swagelok compression f ittings. These are available from Sycon as part number 022-001. These can also be purchased from Swagelok as part number SS-300-6-2.

Page 3 - 9 INSTALLATION

adequate for most applications.

Vacuum Feedthrough

INSTALLING COMPRESSION FITTINGS

SWAGELOK T ube fittings are installed in three easy steps: Step 1 Simply insert t he t ubing into the SWAGELOK Tube Fitting. Make

sure that the tubing rests firmly on the shoulder of the fitt ing and that the nut is finger tight.

Step 2 Before tightening the SWAGELOK nut, scribe the nut at t he 6 o'clock

position.

Step 3 Now, while holding the fitt ing body steady with a backup wrench,

tighten the nut 3/4 of a turn. Watc h t he sc r ibe m ar k, and make 3/4 revolution to the 3 o'clock position.

By scribing the nut at the 6 o'clock position as it appear s to you, there

will be no doubt as to the starting position. When tightened 3/4 of a turn to the 3 o'clock position you can easily see that the fitting has been properly installed

RE-TIGHTENING INSTRUCTIONS

Connections can be disconnected and re-tightened many times. The sam e reliable, leak-proof seal can be obtained every time the connect ion is r em ade. First tighten t he nut by hand. T hen rotate the nut to the original position (scribe mark at 3 o'clock) with a wrench. An increase in resistance will be felt near this point. Now tighten an additional 1/8 turn.

VACUUM FEEDTHROUGH

The vacuum feedthrough should be installed as close as practically possible to the sensor head. This allows the shortest leng t h of sensor-to-feedthrough c oax cable to be used. Cable lengths greater t han 30 inches may reduce crystal life and stability. Install the feedthroug h using proper gaskets and vacuum grease if needed. The small electrical coax connector should be on the vacuum side of the installation.

Caution

Ensure that the water lines are clear of obstructions before operating the sensor above room temperature. A water flow rate of 0.2 to 0.3 gpm is

INSTALLATION Page 3 - 10

Vacuum Electrical Connections

Bakeable Sensor

ELECTRICAL IN-VACUUM CABLE

The electrical cable from the sensor head to the vacuum feedthrough should be wrapped around the water lines using up all excess length in the process. Firmly tighten the connectors at both t he s ensor and feedthrough ends. The water lines and sensor cable should then be wrapped with clean tin foil or other shielding material to prevent evaporant build-up and also to aid cable cooling and mechanical stability.

Bakeable sens ing heads ar e cus t om User des igned sensor units. The electrical and water cooling lines are typically integral to the design of t he unit . The units are generally made on a 2 3/4" ConFlat type f lang e and is inst alled as a one piece assembly. See Appendix B, Technical Drawings, for typical styles of bakeable sensing heads.

The s ensor head must always be operated at "GROUND" potential and this connection is carried through the sensor feedthrough coaxial connectors and shields. The remote oscillator is attached t o the vacuum feedthrough via the sixinch male / female coax cable. The long coax cable connects the remote oscillator to the display unit. This cable must be a coaxial 50 Ohm type and can be up to 500 feet in length.

For safety purposes a ground wire should always be installed between the vacuum vessel and earth ground. See Figure 3.2.

Page 3 - 11 INSTALLATION

SECTION 4

Calibration And Theory

( )

Af =

Nq Dq

Df Z Fc

ArcTan Z Tan

Fq - Fc

(1) (2)

•

• • •













• •

•

























SECTION 4.1

Equation 1:

Measuring Period

Rate Computation

Calibration and The ory

Measurement Theory

The STM-100 / MF uses the resonant frequency of an exposed quartz crystal to sense the mass of deposited films attached to its surface. There is a known relationship between the mass of such a film and t he m eas ur ed frequency of the sensor crystal. Knowing the freq uency chang e due to accumulated mass, film thickness is determined by the following equation:

Where T he Terms Used In The Equation Are Defined As:

Af Film Thickness, In Angstroms ( 1Å=10 Nq Frequency Constant For At Cut Crystal, 1. 668 X 1013 Hz-Ång Dq Density Of Quartz 2.648 g m /cm

The Constant Pi, 3.14159265358979324

Df Density Of Film Material In gm/cm3 Z Z-Factor of material, is the s quare root of the ratio [(dq·uq)÷(df·uf)].

Dq and df are the density and uq and uf are the shear moduli of quartz and the film, respect ively. These values are available in several materials handbooks.

Fq Frequency of sensor crystal prior to depositing film material on it.

This value is a manufacturing controlled const ant.

Fc Frequency Of Loaded Sensor Crystal.

By measuring t he per iod of approximately 1.2 million cycles of the sensor oscillator signal and using a stable vhf ref erence clock, an extremely accurate frequency value for fc is der ived. Four t im es per s econd, a new value is determined and used to update the above equation. T he m at hem atics is computed using IEEE double precision floating point format, ensuring the most accurate results obtainable from t he exact equation, even over wide extremes of the Z-Factor and density parameter s used in t hin-film deposition. Use of the tangent and arctangent functions to compute the film t hickness to the resolution of the floating point num er ic format (56 bits of resolut ion) ensur es maximum accuracy. Previous solutions incorporated approximations to Equation 1 or dealt strictly with the period type of measur em ent s olut ion. The thickness zero function stores as a base or offset of the cur r ent s ensor frequency and film thick nes s information, which is then continuously subtracted from the later updated readings, yielding a deposited film thickness value based on accumulated material since the latest zero f unc t ion was performed.

-10

Meters)

Rate com put at ion is based on t he rate of change of these t hickness readings, updated four tim es per second, then filtered for display. Also available from the instrum ent is the raw measured frequency of the sens or crystal.

Page 4 - 1 Calibration and Theory

Thickness Reading Calibration

Density

( Density Parameter) (Reading)

(Measured Thickness)

 



 



•

Z-Factor

Dq Uq

Df Uf

•





  





  

SECTION 4.2

Thickness

Density

Z-Factor

Instrument calibration is affected by three different par ameters, material density, material Z-Factor, and t ooling . Tooling is a deposition system geometry correction (location of sensor relative to substrates). Density and Z-Factor are material fact or s.

Density Determination

Use of the material bulk density value will normally provide sufficient film thickness accuracy. If addit ional accurac y is req uir ed, the following procedure may be used:

Using a new sensor crystal (this eliminates Z-Factor err or s) place a s ubst r ate adjacent to the sensor so that bot h sens or and subs t r at e s ee t he s am e evaporant stream. Set the instrument density to the bulk value of the material (see the Material Reference Table in section 4.3). Set t he Z-Factor to 1.000 and the tooling factor to 100% . Deposit appr oximately 5000 angs t r om s of material on the sensor and substrate. After deposition remove the substrate and measure the film thickness with a profilometer or multiple beam interferometer. The correct density value may be determined by the formula:

The calculated value may be checked by setting the STM-100 / MF density parameter to the calculated value and observing that the STM-100 / MF thickness display shows the corrected reading. Minor value adjustments c an be made to make the measurement s and calculat ions exactly equal.

A list of Z-Factor values may be f ound in the material reference table in section

4.3. For other materials Z-Fact or m ay be calculated by the following formula:

Dq = Density Of Quartz Uq = Shear Modulus Of Quartz Df = Density Of F ilm Uf = Shear Modulus Of Film

The dens it y and shear m odulus values may be found in m any mat er ial reference handbooks. Film Z-Fac t or values are t ypically very close to bulk Z-Factor values. High stress materials seem t o have values slightly lower than expected. For a more exact solution make a calibration deposition sim ilar t o the density method. Use the calibrated density value, a Z-Factor of 1.000 and a tooling of 100%. Deposit a thick film using at least 50% of the sensor c rystal

Calibration and Theory Page 4 - 2

Z-Factor Determinatio n

life. Measure the substrate and then adjust the STM-100 / MF Z-Factor

Tooling % = 100

(Substrate Thickness)

(Displayed Thickness)

Substrate

Source

Sensor

TOOLING > 100%

TOOLING < 100%

Sensor

Substrate

Source

parameter until the correct t hickness is displayed.

Tooling Determination

Place a substrate in the normal holder location and deposit a f ilm of approximately 5000 angstroms using either bulk or calibrated density and Z-Factor values. Make sure that when doing this calibration the tooling is s et to 100%. Measure the substrate film t hickness as in the density calibration method and determine the correct t ooling factor value by the following formula:

Figure 4.1: Typical Tooling Factors.

Gener ally tooling factors will follow the rule depicted by Figure 4.1.

Page 4 - 3 Calibration and Theory

SECTION 4.3

Bulk Density and Z-Factor Values

Aluminum through Indium

Material Reference Table

Material Symbol Bulk Density Z-Factor Gm/cm3 Aluminum Al 2.73 1.080 Aluminum Oxide Al2O3 3.97 -------Antimony Sb 6.62 0.768 Arsenic As 5.73 0.966 Barium Ba 3.50 2.100 Beryllium Be 1.85 0.543 Bismuth Bi 9.80 0.790 Bismuth Oxide Bi2O3 8.90 -------Boron B 2.54 0.389 Cadmium Cd 8.64 0.682 Cadmium Selenide CdSe 5.81 -------Cadmium Sulfide CdS 4.83 1.020 Cadmium Telluride CdTe 5.85 0.980 Calcium Ca 1.55 2.620 Calcium Fluoride CaF2 3.18 0.775 Carbon (Diamond) C 3.52 0.220 Carbon (Graphite) C 2.25 3.260 Cerium (III) Fluoride CeF3 6.16 -------Cerium (IV) Oxide CeO2 7.13 -------Chromium Cr 7.20 0.305 Chromium (III) Oxide Cr2O3 5.21 -------Cobalt Co 8.71 0.343 Copper Cu 8.93 0.437 Copper (I) Sulfide (A) Cu2S (A) 5.60 0.690 Copper (I) Sulfide (B) Cu2S (B) 5.80 0.670 Copper (III) Sulfide CuS 4.60 0.820 Dysprosium Dy 8.54 0.600 Erbium Er 9.05 0.740 Gadolinium Gd 7.89 0.670 Gallium Ga 5.93 0.593 Gallium Arsenide GaAs 5.31 1.590 Germanium Ge 5.35 0.516 Gold Au 19.3 0.381 Hafnium Hf 13.1 0.360 Hafnium Oxide HfO2 9.63 -------Holnium Ho 8.80 0.580 Indium In 7.30 0.841

Table 4.1: Common Material Reference Table

Calibration and Theory Page 4 - 4

Material Symbol Bulk Density Z-Factor

Indium Intimonide through Tantalum

Gm/cm3 Indium Intimonide InSb 5.76 0.769 Indium Oxide In2O3 7.18 -------Iridium Ir 22.4 0.129 Iron Fe 7.86 0.349 Lanthanum La 6.17 0.920 Lanthanum Fluoride LaF3 5.94 -------Lanthanum Oxide LaO3 6.51 -------Lead Pb 11.3 1.130 Lead Sulfide PbS 7.50 0.566 Lithium Li 0.53 5.900 Lithium Fluoride LiF 2.64 0.774 Magnesium Mg 1.74 1.610 Magnesium Fluoride MgF2 3.00 -------Magnesium Oxide MgO 3.58 0.411 Manganese Mn 7.20 0.377 Manganese (II) Sulfide MnS 3.99 0.940 Mercury Hg 13.46 0.740 Molybdenum Mo 10.2 0.257 Neodynium Fluoride NdF3 6.506 -------Neodynium Oxide Nd2O3 7.24 -------Nickel Ni 8.91 0.331 Niobium Nb 8.57 0.493 Niobium (V) Oxide Nb2O5 4.47 -------Palladium Pd 12.0 0.357 Platinum Pt 21.4 0.245 Potassium Chloride KCl 1.98 2.050 Rhenium Re 21.04 0.150 Rhodium Rh 12.41 0.210 Rubidium Rb 1.53 2.540 Samarium Sm 7.54 0.890 Scandium Sc 3.00 0.910 Selenium Se 4.82 0.864 Silicon Si 2.32 0.712 Silicon (II) Oxide SiO 2.13 0.870 Silicon Dioxide SiO2 2.20 1.070 Silver Ag 10.5 0.529 Silver Bromide AgBr 6.47 1.180 Silver Chloride AgCl 5.56 1.320 Sodium Na 0.97 4.800 Sodium Chloride NaCl 2.17 1.570 Sulfur S 2.07 2.290 Tantalum Ta 16.6 0.262 Tantalum (IV) Oxide Ta2O5 8.20 0.300

Page 4 - 5 Calibration and Theory

Table 4.1: Common Material Reference T able, Continued

Material Symbol Bulk Density Z-Factor

Telurium through Zirconium Oxide

Gm/cm3 Tellurium Te 6.25 0.900 Terbium Tb 8.27 0.660 Thallium Tl 11.85 1.550 Thorium (IV) Fluoride ThF4 6.32 -------Tin Sn 7.30 0.724 Titanium Ti 4.50 0.628 Titanium (IV) Oxide TiO2 4.26 0.400 Titanium Oxide TiO 4.90 -------Tungsten W 19.3 0.163 Tungsten Carbide WC 15.6 0.151 Uranium U 18.7 0.238 Vanadium V 5.96 0.530 Ytterbium Yb 6.98 1.130 Yttrium Y 4.34 0.835 Yttrium Oxide Y2O3 5.01 -------Zinc Zn 7.04 0.514 Zinc Oxide ZnO 5.61 0.556 Zinc Selenide ZnSe 5.26 0.722 Zinc Sulfide ZnS 4.09 0.775 Zirconium Zr 6.51 0.600 Zirconium Oxide ZrO2 5.6 --------

Table 4.1: Common Material Reference Table, Cont inued

Calibration and Theory Page 4 - 6

SECTION 5

Computer Interfacing

STM-100 / MF

9 PIN MALE

SHIELD

9 PIN FEMALE

IBM-AT

2 RxD 3 TxD

5 GND

DSR 6

RxD 2

TxD 3 CTS 8 DTR 4

GND 5

SECTION 5.1

RS-232 Description

Making an RS-232 Cable

COMPUTER INTERFACING

The STM-100 / MF can be connected to a computer in a variety of ways. An RS-232 interface is standard, and either an IEEE or BITBUS interface can be added as an option. There is room for only 1 optional comm unicat ions card. If you purchase a communications option and need to install it, see Section 3.8. For the RS-232 interface, either a SECS-II or s t andar d Sycon prot ocol can be selected. This section will describe the hardware with each interface, and g ive an example of how to interface to an IBM-PC.

RS-232 INTERFACE

RS-232 is an electrical specification for the transm iss ion of data in a serial format. What this means is that the m echanism for transmitting data is defined by RS-232. The particular set of c om m ands is defined by each vendor as they see fit. There is no comput er pr ogram that will communicate with all RS-232 devices.

Dif ferent sets of commands and m iscellaneous overhead mus t be handled differently. An example would be as if you were to call someone in a foreign country. Just because you can establish the link (the telephone) does not mean that you can communicate. Both parties must s peak the same language. For this reason the SEMI institute has devised a protocol that allows different vendors of semiconductor processing equipment t o "talk" RS-232 in a consistent manner. Unfortunately, because of the wide variety of situat ions t hat SECS-II will handle, it is a complicated protocol. The SECS-ll protocol provided in each Sycon instrument is a sub-set of t he full implementation, thus it is simpler and easier to install than the full implementation of SECS-ll. I t is s elect ed by sett ing the CONFIGURATION dip switch on the back of the instrument. This is shown in Table 5.1.

No matter what protocol you are using, the first order of business is to get the STM-100 / MF connected to your computer and set up the baud rat es. Figures

5.1a and 5.1b shows how to connect to an IBM-AT and IBM-PC. Note that the connectors are differ ent for each type of computer.

Page 5 - 1 COMPUTER INTERFACING

BAUD RATES and CABLING

Figure 5.1: Cable Connection From STM-100 / MF to IBM-AT.

STM - 100 / MF

9 PIN MALE

SHIELD

IBM - PC,XT

25 PIN FEMALE

2 RxD

3 TxD

9 5 GND

TxD 2 RxD 3

CTS 5

DSR 6

GND 7

DTR 20

Communication Demo Disk

Setting Baud Rates

Figure 5.2: Connections for ST M-100 / MF to PC Compatible Computers.

Af ter the proper cable is made, make sure t he baud rate of the computer and STM-100 / MF are the same. By setting two of t he dip switches on the CONFIGURATION set of switches, you can set one of four baud rates as shown in Table 5.1.

The diskette included with this manual contains demonstration sof t ware that will verify the communications connection between a MSDOS based computer and the STM-100 / MF. The program STMCKOUT.EXE com m unicates with the STM via RS232 and will exercise the communication sub system. For more informat ion of other programs on t he diskette refer to Appendix A. Follow the directions in the next paragraphs to set up the STM for ser ial com m unicat ions.

SW6 SW7 BAUD OFF OFF 300

OFF ON 1200 ON OFF 2400 ON ON 9600

Table 5.1: Baud Rate Configuration Table.

Make sure t hat t he baud r ate on your computer is set to the same baud rate. The STM-100 / MF is shipped from the f act or y set at 9600 baud. To set an IBMPC to the same baud rate, type in:

mode com1:9600,8,n,1 <Enter>

This will set the IBM for 9600 baud, 8 data bits, no parity, and 1 stop bit on its COM1 port. It is important to use 8 data bit s bec ause t he c om m unicat ion protocols use all 8 of them.

COMPUTER INTERFACING Page 5 - 2

SECTION 5.2

Message Format

Sycon Protocol

The STM-100 / MF does not initiate any messages on its own. It responds only when "spoken" to. In order for er r or-free communications to occur, s everal safeguards are built in f or chec king data integrity. The gener al format for sending and receiving commands is:

STX (Data Length) (Data(Data..Data)) (Checksum )

The STX character 0x02 (hex 02) indicates a start of message sequence. The STM-100 / MF uses this as a synchronization point. It just sit s in a loop waiting for the STX charact er . If a different char ac t er is r ec eived, it is discar ded. When the ST X character is received, the STM looks at the rest of the characters in the command.

The data length is a character from 'SOH' (1 decimal) through 'LF' (10 decimal) and indicates the number of data char ac t er s in the message. The data is defined in the protocol below. The STM-100 / MF uses this number t o det er m ine where the end of the command is. If there is a mismatch between this number and the actual number of data charac t er s in t he m es sage, two things can happen. If the data length number is low, the ST M-100 / MF will terminate the command prematurely. The checksum will not match and an er r or will be recognized by the STM-100 / MF. It will not respond in any way.

If the data length number is high, t he ST M-100 / MF will be waiting for more characters than actually contained in the message. I n order to recover from either kind of error, the host computer must have a time-out / ret ry capability built into the software.

The c hecksum is the sum (modulo 256) of only the data bytes. I f this does not match the actual checksum of the data, an error messag e is r ecognized by the STM-100 / MF. It will not respond to the command. Ref er to Figure 5.2 is a BASIC program that will run on an IBM-PC. It prom pt s you for a command to send to the STM-100 / MF and will print the response on the display. It is written in BASICA program, but will also run under Microsoft GWBASIC.

Page 5 - 3 COMPUTER INTERFACING

4 REM SYCON STM-100 / MF COMMUNICATIONS DEMO ROUTINE. 6/12/1987 S. Bender

Basic Driver Routine

5 REM Sycon Instruments Inc. E. Syracuse, NY 13057 6 REM *** 8 REM Establish com munications parameters and open as file #1. 10 OPEN "COM1:9600,N,8,1,CS,CD" A S #1 29 REM Get console user input to be s ent to STM as a command. 30 INPUT "ENTER MESSAGE TO SEND";MSG$ 34 REM Enter stop at prompt t o exit program. 35 IF (MSG$="stop" OR MSG$="STOP") THEN 1000 39 REM Send message and get reply, or els e some kind of error. 40 GOSUB 500 50 PRINT RPLY$ 54 REM For debug purposes, show returned reply in hex codes too. 55 PRINT "HEX DATA IS {" ; 60 FOR CNT=1 TO LEN(RPLY$) 70 PRINT USING "\\" ;HEX$(ASC(MID$(RPLY$,CNT, 1)) ); 75 IF CNT <> LEN(RPLY$) T HEN PRINT ":"; 80 NEXT CNT 90 PRINT "}" 99 REM Loop until break or user exit. 100 GOTO 30 101 REM ******* end of main program body ************ 102 REM ****************************************************** 103 REM **** start of msg/reply driver subroutine ***** 499 REM initialize variables. 500 OUTCNT=LEN(MSG$):CKS UM=0 509 REM Compute outgoing mess age check sum. 510 FOR INDX= 1 TO OUTCNT:CKSUM=CK SUM+ASC(MID$(MSG$,INDX,1)):NEXT INDX 519 REM Send msg to STM, ASCII stx, count, and checks um. 520 PRINT#1,CHR$(2)+CHR$(OUTCNT )+ MSG $+ CHR$ (CKSUM AND 255); 529 REM Get returned chars from ST M-100 / MF and c heck for ASCII stx. 530 GOSUB 600:IF CHAR$ <> CHR$(2) THEN 520 539 REM Got ASCII stx, next data is length in binary, get it. 540 GOSUB 600:INCNT=A SC(CHAR$) 544 REM init variables for receiving incoming reply. 545 CKSUM=0:RPLY$="" 549 REM Loop inputting the remote reply message. 550 FOR INDX=1 TO INCNT 560 GOSUB 600:RPLY$= RP L Y$+CHAR$:CKSUM=CKSUM+ASC(CHAR$) 565 NEXT INDX 569 REM Get final data, the checksum. 570 GOSUB 600 579 REM Check for valid checksum and data integrity. 580 IF (ASC(CHAR$))<>(CK SUM AND 255) THEN PRINT "BAD REPLY CHECKSUM" 590 RETURN 591 REM ******* End of msg/reply driver subroutine ********* 592 REM *********************************************************** 593 REM ** Start of receive a char from COM1 subroutine ** 600 ON TIMER(3) GOSUB 620 : TIMER ON 610 IF LOC(1)<1 THEN 610 ELSE TI ME R O F F : CHAR$=INPUT$(1,#1) : RETURN 620 TIMER OFF : PRINT "RECEIVE TIMEOUT" : CLOSE #1 : RETURN 10 621 REM **** End of receive a char from CO M1 subroutine ** 1000 PRINT:PRINT " PROGRAM TERMINATED BY US ER":PRINT

Figure 5.3: BASIC Driver Ro u t in e .

COMPUTER INTERFACING Page 5 - 4

SECS-II Protocol

SECTION 5.3

SECS-II Addressing

SECS-II Protocol

Documentation Requirements

General Information

Message Summary

SECS-II Messages

By setting switch number 5 ( on the configuration DIP switches) to the ON position, the protocol for the RS-232 interface will be SECS-II. The SECS-II protocol requires that each comm unicat ing mode be assigned a unique station address. This is similar in concept to the LISTEN and TALK addresses used by IEEE-488. Although the RS-232 link used by the SECS-II standard is point to point and does not require station addressing for message routing, s t at ion addressing is used to allow for a "networked" appr oach t o information transfer. This requires the address switches 8 through 12 be set and known by the host software. If either the IEEE-488 or BITBUS option is installed, the same address switches are used for it. Select an address that is compatible with both of these interfaces.

T he SECS-II protocol has defined within it several parameters. The STM-100 / MF fixes these parameters to the following definitions:

T1, T2, T3 f ixed at approximately 3 seconds RTY retry count fixed at 3 M/S set to Master in the STM-100 / MF

For all other aspec t s of the SECS implementation, refer t o SEMI publications E4-80 (SECS-I) and E5-85 (SECS-II).

T he SECS-II standard (ES-85 Section 6.2) defines a st andar d form for SECS-II-compatible equipment manufac t ur ers to use when describing the exact compliance of their equipment. The specific information that is r equired is detailed below.

a) Manufacturer and Product number Sycon Instruments, I nc. STM-100 / MF b) General Description of Equipment Funct ion Thickness/Rate deposition monitor using quartz crystal technology c) Intended Function of Inter face To allow for queries of unit status and data, and to alter and control status as needed d) Software Revision Code This software responds to SECS S1,F1 as version B2 e) Changes from Previous Versions: This is the original SECS compatible version

The following is a list of messages received and understood by the STM-100 / MF.

Message Recd. Description Reply Sent Desc S1 ,F1, Are you there request S1, F2 On Line S64, F65 STM comm packet S64, F66 STM Resp.

The STM-100 / MF comm packet and response is contained under the category of COMMANDS (Section 5.5). Note that all commands and r esponses are in ASCII form.

Page 5 - 5 COMPUTER INTERFACING

The following is a list of commands that are sent by the ST M-100 / MF

Message Details

SECTION 5.4

caused by an error condition in the protocol. Message Error Cause

F9, F1 Unrecognized Device ID error. SECS header has device ID which does not correspond to that set by internal DIP switch.

S9, F3 Unrecognized stream code. SECS header contains stream ID not understood by STM-100 / MF.

S9, F5 Unrecognized function code. SECS header contains function ID not valid or understood in conjunction with the header's stream code.

S9, F7 Illegal data Format of data for valid stream / function not correct.

S9, F11 Data too long.

Message Details

a) S1,F1: Structure: Header only. As per SECS E5. b) S1,F2: Structure: as per SECS E5. MDLN is 6 character ASCII " ST M100".

SOFTREV is 2 character ASCII numeric "B2". Future versions will be

incremental in decimal radix (07,08,09,10,11,. . ) . c) S9,F1: Structure: as per SECS E5. d) S9,F3: Structure: as per SECS E5. e) S9,F5: Structure: as per SECS E5. f) S9,F7: St r ucture: as per SECS E5. g) S9,F11: Structure: as per SECS E5. h) S64,F65: Define: SYCONQCMD SYCON protocol query/comm and ASCII

message. Format is 20. ASCII data contents is any SYCON message as

detailed in the following RS-232 specification.

Structure: <SYCONQCMD> i) S64,F66: Define: SYCONRSP SYCON protocol response ASCII message.

Format is 20. ASCII data contents is any SYCON response mes sage as

detailed in the following RS-232 specification.

Structure: <SYCONRSP>

IEEE-488 INTERFACE OPTION

This is a par allel inter face that is compatible with many different types of electronic instrumentation. It is a m ult i-drop interface that allows one controller and many slaves. You will generally find that IEEE-488 is the easiest computer interface to get running. The only thing that you need to set is the device address. The address is set on the CONFIGURATION switch (numbers 8 through 12). Table 2.2 contains IEEE-488, SECS, and BITBUS address codes. Make sur e t hat every device on the network has a different address. Fig ur e 5.3 is a program that runs on an HP-85 computer. It allows you to type commands in and see the response. This program assumes the address of the STM-100 / MF is set to 0.

COMPUTER INTERFACING Page 5 - 6

COMMANDS

SECTION 5.5

While there are 2 protocols for RS-232, one for IEEE-488, and another for BITBUS, the command set f or all of these is the same. The only things that change are the prefix befor e t he command and the suffix after . All comm ands and data are in printable ASCII form. Only the prefix and suffix characters that make up the protocol-dependent data are allowed to be non-printable. All comm ands are a single character. There c an be m odifying data associated with the command, but the command is a single char acter. Table 5.2 contains a list of all commands. Section 5.6 has a detailed description of each command

5 DISP "ENTER CMD, CR TO QUIT" 10 INPUT A$ 12 GOSUB 20 14 GOTO 5 20 N=LEN(A$) 25 IF N=0 THEN GOTO 5 30 B$=VAL$(N)&"A" 40 OUTPUT 700 USING B$ ; A$ 50 ENTER 700 ; A$ 60 DISP A$ 62 RETURN 65 DISP "DONE" 70 END

Figure 5.4: HP-85 IEEE-488 BASIC Driver Prog r am .

RESPONSE FORMAT

All commands r ec eived by the STM-100 / MF will return a response. The minimum response (not including protocol dependent c har acters) is a single ASCII character. This character indicat es t wo thing s. Fir s t , t he s ucc ess or failure of the command which was sent. One of four result t ypes is ret urned, to indicate success (AOK), illegal command token ( not in Table 5.2), illegal data value (number out of range for command) , and illeg al modifier (something other than required ?,!,@, = sent after command token).

Second, t he r et urned response character reports the power on reset s t at us of the STM-100 / MF. Each of the four response codes (see below) is modified after a reset until the L command resets the power failure flag. In this way each response message informs the host as to the occurrence of an instr ument reset since the last exchange. The reason this is done is so that in every communicat ion exchange a power on reset can be detected and the correct exception pr oces sing be performed via host software, without special polling overhead.

Message Power Lost No Reset

Message AO K B A Illegal Command G F Illegal Data Value I H lleg al Cm nd. Modifier K J

Page 5 - 7 COMPUTER INTERFACING

Parameter Example Comment

Command List For STM-100 / MF

SECTION 5.6

Software Version Code

Shutter Relay Control

Zero Thickness and Timer

Sent Returned

@ None @ STM100C5 Firmware Version and inst. model number A [@,!,?] A@ Turn shutter relay off B None B Zeros timer and thickness C None C Zeros thickness D None D Zeros timer E =[0.500 - 99.99],[?] E=1.23 Set current film density to 1.23 F =[0.100 - 9.999],[?] F? 1.234 Returns current film Z factor G =[0 - 9999999],[?] G=550 Set current film end thickness to 550Å H =[0 - 9999999],[?] H=10560 Set current film setpoint thickness to 10.56KÅ I =[00:00 - 99:59],[?] I=15:30 Set current film setpoint timer to 15:30 J =[10.0 - 399],[?] J = 80.1 Set current film tooling to 80.1% K [@,!,?] K? @ Return test mode status, was off L None L Acknowledge "a" response M None M ! Return crystal fail status, was failed O None O ! Return setpoint timer relay, was closed P None P @ Return end thickness relay, was open Q None Q C Return remote inputs, ZERO TIMER, ZERO THICK active R None R 193 Return config switch, switches 5,6,12 on S None S -0001595 Return thickness value -1.595KÅ T None T (sp)012.4 Return rate, 12.4 Å/s U None U 5319234 Return sensor freq., 5,319,234Hz V None V 012.4 Return crystal life, 12.4% left W None W +12:45 Return timer, 12 min 45 sec counting up X None X (sp)0000201 Return log thickness, 201 Å Y None Y +49:21 Return log timer, since THICK ZERO. Z None Z -012.3 Return log rate, -12.3 Å/sec a None a A Return RESET Status, true b None b Set parameters to default values c [@,!,?] c? ! Query beeper status, returned active d None Internal use commands e Mask Internal use commands f None Internal use commands g None Internal use commands h None Internal use commands i [1-9,?] i5 Sets the current film to number 5. j [1-9],[0.500 - 99.99]|[?] Sets / queries the selected film density. k [1-9],[0.100 - 99.99]|[?] Sets / queries the selected film z-factor. l [1-9],[0 - 9999000]|[?] Sets / queries the selected film End Thickness m [1-9],[0 - 9999000]|[?] Sets / queries the selected film set point relay thickness n [1-9],[00:00 - 99:59]|[?] Sets / queries the selected film timer relay o [1-9],[10.0 - 399]|[?] Sets / queris selected film tooling factor

Table 5.2: Communication Command Summary.

DETAILED COMMAND DESCRIPTION

_________________________________________________________________________ Command: @ Parameter: None

Description: Returns a string indicating the product model number and the software revision level.

The form is "STM100XY" where X is major (A.B,..) and Y is minor digits (0..9). _________________________________________________________________________ Command: A Parameter: [@,!,?]

Description: Turns the shutter relay on and off. A "@" will turn the shutter off and a "!" will turn it

on. The indicator on the LCD will indicate the new state. A "?" will send back "@" or

"!" as the current status. _________________________________________________________________________ Command: B Parameter: None

Description: Zeros the timer and thickness. This duplicates the ZERO button on the front panel.

COMPUTER INTERFACING Page 5 - 8

_________________________________________________________________________

Zero Thickness

Zero Timer

Set the Density Parameter

Set the Z-Factor Parameter

Set the End Thickness

Set the Setpoint Relay Thickness

Set the Timer Relay Parameter

Set the Tooling Factor Parameter

Command: C Parameter: None Description: Zeros only the thickness. _________________________________________________________________________ Command: D Parameter: None Description: Zeros only the timer. _________________________________________________________________________ Command: E Parameter: =[0.500 .. 99.99] | [?]

Description: Sets the density parameter of the currently selected film. If a "?" is sent as a

parameter, the current density value is returned. The units are gm/cc. _________________________________________________________________________ Command: F Parameter: =[0.100 .. 9.999] | [?]

Description: Sets the material Z-Factor of the currently selected film. If a "?" is the parameter, the

current Z-Factor is returned. _________________________________________________________________________ Command: G Parameter: =[0 .. 9999000] | [?]

Description: Sets the end thickness of the currently selected film. While any resolution number

can be programmed (up to 7 digits), the number that is accepted by the

STM-100 / MF will be within the display range. This is limited to a total of 4 digits.

The units are Angstroms. _________________________________________________________________________ Command: H Parameter: =[0 .. 9999000] | [?]

Description: Set the setpoint relay thickness limit of the currently selected film. See the

description for the G command. _________________________________________________________________________ Command: I Parameter: =[00:00 .. 99:59] | [?]

Description: Set the setpoint timer relay of the currently selected film. The format is

"Minutes:Seconds". A "?" will return the current value. _________________________________________________________________________ Command: J Parameter: =[10.0 .. 399] | [?]

Description: Set the tooling factor parameter of the currently selected film. A "?" will return the

Page 5 - 9 COMPUTER INTERFACING

current value. The units are in percent.

_________________________________________________________________________

Turn the Test Mode On/Off

Acknowledge the Memory

Get the Crystal Fail Status

Get the Status of the Setpoint Timer Relay

Get the Status of the Relay

Command: K Parameter: [@,!,?]

Description: Turns the test mode on and off. A "@" will turn the test mode off, a "!" will turn it on,

and a "?" will return the current status.

_________________________________________________________________________

Status of Non-Volitile

Setpoint Thickness

Command: L Parameter: None

Description: Acknowledges valid receipt of power on status and resets internal flags. See "a"

command. _________________________________________________________________________ Command: M Parameter: None

Description: Returns the crystal fail status. If a "@" is returned, the crystal is good. A status of "!"

indicates that the crystal has failed. _________________________________________________________________________ Command: N Parameter: None

Description: Returns the status of the setpoint timer relay. If a "@" is returned, the relay is open

(time has not been reached). A status of "!" indicates that the relay is closed (time

has been reached). _________________________________________________________________________ Command: O Parameter: None

Description: Returns the status of the setpoint thickness relay. If a "@" is returned, the relay is

open (thickness has not been reached). A status of "!" indicates that the relay is

closed (time has been reached).

COMPUTER INTERFACING Page 5 - 10

Get the Status of the End Thickness Relay

Get the Remote Input Status

Get the Configuration Switch Status

Get the Thickness Value

Get the Rate Value

Get the Sensor Frequency

_________________________________________________________________________ Command: P Parameter: None

Description: Returns the status of the end thickness status. This is not tied to a relay, but to an

annunciator. End Thickness closes the shutter and sets this status. A Zero

Thickness command clears this status. _________________________________________________________________________ Command: Q Parameter: None

Description: Returns the status of the 4 remote inputs. A code of @..O is sent back. The lower 4

bits of the character represent the 4 inputs. A 1 indicates that the input is at ground.

A 0 indicates that the input is open or at a logic high. The following table defines the

response bit weights with each input.

Input Name Active "ON" Weight

Zero Timer 1

Zero Thickness 2

Shutter Close 4

Shutter Open 8 _________________________________________________________________________ Command: R Parameter: None

Description: Returns the status of the configuration switches. Because there are 12 switches, the

returned value is between 0 and 4095. A value of 0 indicates that all switches are in

the OFF (or down) position. Switch number 12 is theLS (1) bit, switch number 1 is

the MS (2048) bit. _________________________________________________________________________

Command: S Parameter: None Description: Returns the thickness value, in Angstroms. This number will always contain 7 digits

with a leading space or minus sign. Leading zeros are not suppressed. _________________________________________________________________________ Command: T Parameter: None

Description: Returns the rate value, in A/s. The format is a leading space or minus followed by

NNN.N. _________________________________________________________________________ Command: U Parameter: None

Description: Returns the sensor frequency, in Hz. If the crystal has failed, the number is the last

valid reading, or blanks if there was never a good reading.

Page 5 - 11 COMPUTER INTERFACING

Get the Crystal Life Value

Get the Timer Value

Get the Shutter Close Event Thickness Log

Get the Shutter close Time Log

Get the Log Event Rate

Get the Power on Status

_________________________________________________________________________ Command: V Parameter: None

Description: Returns the crystal life number, in percent. A new crystal will return a number around

100 percent. The format is 000.0 .. 100.0 _________________________________________________________________________ Command: W Parameter: None

Description: Returns the timer value. The format is PMM:SS where P is "+", "-", or ">". The "+"

indicates that the STM-100 / MF is counting up, the "-" that it is counting down, and

">" indicates that the timer has exceeded 99:59 (in the up direction). _________________________________________________________________________ Command: X Parameter: None

Description: Returns the thickness value that existed at the last shutter close command event.

This allows the reading to be captured when the shutter was closed. The format is

the same as the S command. _________________________________________________________________________ Command: Y Parameter: None

Description: Returns the time between the last Zero Thickness event and the last Shutter Close

event. Not the same as the process timer. The response uses the same format

as the W command except there is no "-" countdown prefix. _________________________________________________________________________ Command: Z Parameter: None

Description: Returns the rate measured at the Shutter Close event. This is useful to hold the last

rate reading before closing the shutter. _________________________________________________________________________ Command: a Parameter: None

Description: This command allows you to determine the occurrence of critical events (power loss,

brownout, and non-volatile memory failure). A single character is returned between

an "@" and a "G" (inclusive). The LS bit indicates (if 1) that a power up reset has

occurred since the last L command. The next more significant bit is set by a

brownout condition. The next bit indicates that the non-volatile memory was faulty

when the STM100 attempted to load the parameter data for operation, and that

default values are in use. The correct parameter information should be downloaded

or entered manually before continuing. These three bits remain set until an L

command acknowledges that the host computer is aware of the status, with two

exceptions. The brownout status bit will be cleared by subsequent power failures (it is

not stored in non-volatile memory). The parameter defaulted status bit will be cleared

by either keyboard or computer interface re-programming of any internal parameter

(density, z-factor, etc. ).

COMPUTER INTERFACING Page 5 - 12

Force Parameters to Their Default Values

Turn the Key Board Beeper On/Off

Internal Use Commands

Multi-Film Film Number Selection

_________________________________________________________________________ Command: b Parameter: none

Description: This command forces the internal working parameter values to their default values (

Film = 1.0, Density = 1.0, Z-Factor = 1.0, End Thickness = 0, Setpoint Thickness = 0, Setpoint Timer = 00:00, and Tooling = 100%). This is primarily used for testing at

Sycon, but can be used to set the instrument into a known configuration. _________________________________________________________________________ Command: c Parameter: [@, !, ?]

Description: Set or query the Keyboard beeper mode. At power up the STM-100 / MF beeper

sounds with each keypress. This can be toggled on and off via the keyboard (see

Section 2.7) or via this command. The '@' modifier turns off the beeper, the '!'

modifier turns it on, and the '?' requests the current beeper status, returned as either

'!' (ON) or '@' (OFF). _________________________________________________________________________ Command: d

Description: System reset, computer requests a startup reset. Special Internal use. _________________________________________________________________________ Command: e Argument: [XX]

Description: Relay Over-ride, followed by 2 hex characters to substitute for current relay mask.

Special Internal use. _________________________________________________________________________ Command: f

Description: Reserved for Internal Use. _________________________________________________________________________ Command: g

Description: Reserved for Internal Use. _________________________________________________________________________ Command: h

Description: Reserved for Internal Use. _________________________________________________________________________ Command: i Argument: [=1 thru 9] l [?]

Description: Set or query the current film. Example: command i=6, sets the current film to film 6.

Page 5 - 13 COMPUTER INTERFACING

Multi-Film Density Parameter

Multi-Film Z-Factor Parameter

Multi-Film End Thickness Parameter

Multi-Film Set Point Parameter

Multi-Film Set Point Timer Relay Parameter

Multi-Film Tooling Factor Parameter

_________________________________________________________________________ Command: j Argument: [1 thru 9] [=0.500 .. 99.99] l [?]

Description: Sets the density parameter for the film specified in the first argument. If a "?" is

sent as a parameter, the current density value is returned. Example: command

j6=0.75 sets the density for film 6 to 0.750 gm/cc. The units are gm/cc. _________________________________________________________________________ Command: k Argument:: [1 thru 9] [=0.100 .. 99.99] l [?]

Description: Sets the material Z-Factor for the film specified in the first argument. If a "?" is the

parameter, the current Z-Factor is returned. Example: command k5=0.5 sets the Z-

Factor for film 5 to 0.5. Dimensionless number. _________________________________________________________________________ Command: l Argument: [1 thru 9] [=0 .. 9999000] l [?]

Description: Sets the end thickness for the film specified in the first argument. While any

resolution number can be programmed (up to 7 digits), the number that is accepted

by the STM-100 / MF will be within the display range. This is limited to a total of 4

digits. The units are Angstroms.

relay Thickness

_________________________________________________________________________ Command: m Argument: [1 thru 9] [=0 .. 9999000] l [?]

Description: Sets the Set Point Relay thickness limit for the film specified in the first argument.

See the description for the G command. _________________________________________________________________________ Command: n Argument: [1 thru 9] [=00:00 .. 99:59] l [?]

Description: Set the setpoint timer relay for the film specified in the first argument. The format is

"Minutes: Seconds". A "?" will return the current value. _________________________________________________________________________ Command: o Argument: [1 thru 9] [=10.0 .. 399] l [?]

Description: Set the tooling factor parameter for the film specified in the first argument. A "?" will

return the current value. The units are in percent.

COMPUTER INTERFACING Page 5 - 14

SECTION 6

MAINTENANCE

installing the STM-100 / MF instrument.

devices.

1. No Power LED

a. Blown fuse Replace Fuse

b. Power switch off Switch power on

c. Line cord loose or unplugged Tighten cord

2. Constant crystal fail message

a. Bad or severely oxidized sensor

crystal

b. Cable connections to oscillator or

sensor missing or loose

c. Severe material buildup on edges of

sensor

3. Large thickness deposition

a. Defective crystal b. Crystal near end of life

New Crystal

c. Particles or flakes on crystal seating

surface

4. Crystal stops

expectancy.

a. Crystal being hit by small droplets of

SECTION 6.1

MAINTENANCE

Warnings

WARNING

There are potentially lethal voltages present within the STM-100 / MF control unit with a line cord or a INPUT/OUTPUT cable attached. There are no operator serviceable components inside, do not remove any covers. Service should be performed by qualified personnel only. Disconnect all cables when removing or

CAUTION

The STM-100 / MF and remote oscillator contain static sensitive components. Use adequate and appropriate precautions when attempting any service to these

CONTROL UNIT

SYMPTOM CAUSE REMEDY

New Crystal Check Cables

jumps during

suddenly during deposition before reaching typical life

Page 6 - 1 MAINTENANCE

crystal holder causing a short at the

molten material source.

Clean Sensor

New Crystal

Clean Sensor Move farther from

source.

5. Thermal instability

warm-up)

a. Poor crystal seating

b. Poor or no water flow Correct flow

c. Excessive heating due to secondary

sputtering systems

6. Poor thickness

a. Poor source emission pattern move sensor

b. Material adhesion to sensor poor New crystal

7. Computer interface failure

a. Baud rate wrong

b. Format wrong Correct cfgr

c. Device address bad Correct cfgr

d. Cable connection Check wiring

crystal. This will avoid surface contamination of the cr ystal possible poor film adhesion.

SECTION 6.2

SYMPTOM CAUSE REMEDY

(large changes in thickness reading during source

electron formation in some

reproducibility

Clean sensor

Increase water flow to sensor.

Check source

Correct cfgr

REPLACING A SENSOR CRYSTAL

The procedure for replacing the 6 MHz sensor crystal is the same for any type sensor head. Use caution in handling the crystals as they are very fragile. Chipped, cracked, dirty or stained crystals should not be used.

CAUTION

Crystals should never be handled by bare hands! Always use clean lab gloves and plastic tweezers to handle a

that might lead to poor electrical sur face contact and

Dielectric films sometimes do not adhere strong ly to the cr ystal sur face and can cause erratic readings. Some dielectric will peel off the crystal when it is exposed to air. This is caused by gas absorption great ly changing the film stress characteristics. I f peeling is observed, change to a new clean crystal.

Follow the procedures outlined below to change a sensor crystal.

1. Grip the sensor cap with a gloved hand and pull to unsnap the cap. The sensor crystal is captured in the cap. Place the sensor cap on a flat surface with the front face up and pop the crystal out by pressing gently down on the coated crystal surface with clean plastic tweezers or a similar type instrument. The crystal should come out eas ily. Take care not to damage the cap aperture opening to the crystal. Turn the cap over and place a new crystal with the fully coated surface towards the aperture opening (this side receives the evaporant stream) in the s ensor c ap. Use plastic tweezers to handle the new crystal.

2. Gently press the crystal into the finger spring holders us ing the plastic tweezers. This operation does not require much force. The crystal movement to become held by the finger springs is only about 25 thousandths of an inch. The sensor cap now holds the sensor cr ystal firmly in place. The cap may now be snapped into the sensor body.

MAINTENANCE Page 6 - 2

3. Verify that the newly installed crystal is operating by looking at the

OSC-100A OSCILLATOR

Push to Test

Serial No.

4571

instruments

East Syracuse, NY

SECTION 6.3

STM-100 / MF "CRYSTAL FAIL" indicator legend. The flashing legend should not be present. If the " CRYSTAL FAI L" legend is present check for damaged cables, a cracked or broken crystal, or dirty contact s ur faces in the sensor cap.

Persistent Crystal Fail Indication

If you replaced the sensing crystal and the BAD CRYSTAL indication persists, the problem is most probably somewhere in the electr ical connections. There exist approximately 12 mechanical electrical connections between the sensing crystal and the oscillator unit.

Figure 6.1: Sensor and Feed Through Connect ions.

Remote os cillator s s hipped after Sept. 1992 have a test feature t o help isolate this type of problem, ref er to Figure 6.2. A test push-button is pr ovided on the oscillator. This button connects an int er nal t est c r ystal locat ed inside the remote oscillator in place of the nor m al sensing head. If the STM-100/MF and remote oscillator are functioning c or r ec t ly the X TAL FAIL indicator will go away while this button is depressed. If this is observed while this button is depressed the problem of the persist ent Bad Crystal indication has been isolated to be in the path between the remote oscillator and the sensing crystal. If the bad crystal indication continues while this button is depr ess ed then the failure is either the prog r amming of the sensor selection or in the electronics of the remote oscillator of the STM-100/MF unit itself. This pushbutton can be activated by inserting a small rod or wire, like an unbent paper clip in the 'push to test' hole and depres sing the switch.

Figure 6.2: Test Oscillator OSC-100A.

The fastest and easiest way to check for g ood c onnectivity is to Ohm out the cable with a Ohm meter capable of reading 0.10 Ω. Remove the oscillator

Page 6 - 3 MAINTENANCE

from the 6" BNC cable, and remove the sensor c over and sensing crystal from the sensing head. Measure the resistance fr om one of the center push spring contacts inside the sensor unit to the cent er conduc t or of the cable normally connected to the oscillator. The reading s hould be less t han 0. 20 Ω. The center conductor to the cable shield should be open (gr eat er than 30 MΩ) with respect to the outside ground shield of the cable. This check will verify all the connections from the sensor, t he InVac cable, the vacuum feedthrough, and the BNC cable.

Figure 6.3: SM75, MicroDot Connector.

If the reading from the continuity test is not as stated, disconnect one part of the chain and repeat the test. Repeat t his last step until the bad connection is isolated. From experience, most oft en when a problem occur s it has been found that the SM75, MicroDot, connectors on the InVac cable are not connected securely to the sensor or the f eed t hr ough. If this is not true then the cable should be replaced. Also the center pin on the InVac cable can become damaged and not make contac t with the m at ing connector, Refer to Figure 6.3. The center pin of the connector should extend slightly beyond the end of threaded ferrule. I f the pin is damaged the cable should be replaced.

MAINTENANCE Page 6 - 4

APPENDIX A

Communication Demo Disk

Communication Demo Di s k

Section A-1

Section A-2

Enclosed on this disk are several routines used to communicate with the STC-200 Controller and STM-100 Monitor. Source code is provided for the STCPARAM and RATE (STM-100) programs . The STCPARAM program will upload and download parameters to the STC-200 . The RATE pr ogram will upload and download parameters and data to the Host computer. The programs are written in the languag e " C" and can be c om piled using Bor lands Turbo C compiler.

If you are new to programming and are looking for an inexpensive C compiler, we recommend purchasing Borlands. T he list pr ice is under $100 and is available from many mail-order software houses at a discount . This provides a well integrated environment for writing C progr am s . I f you already have another C compiler, there should be no problems in using it. I f you do have any compiler problems, we will be happy to help you resolve them.

The two most common problems associated with RS-232 communication are baud rate settings and cable problems. Please make sure your RS-232 cable is wired up according to the drawings in the manual. The program SYCCOM.EXE is a simple way to ensure that the communication link is up and running. It operates from the COM1: port of your PC and uses interrupts. You type in a command and the response will appear on the screen. All of Sycon's products respond to the "@" comm and by telling you what the product is and what the version is.

The following lines are specific to the STC-200 Controller: There are several other programs on this disk t hat you may find useful. SCAN is a batch file that appends processes accounting information to a file. STCCKOUT is used to obtain various parameters from the STC. It is also used to upload and download I/O programs and film programs between the PC and the STC-200. The other executable files on this disk are us ed within the SCAN.BAT bat ch file.

TURBT ERM is a program that converts your PC into a dumb terminal. It works with COM1: and is useful in debugging RS-232 problems. PC-COM is used to find out what the status of your com munications ports in the PC are. It lists baud rate, data bits, parity, etc.

If you get stumped, give us a call and we will help you get up and running.

STM-100 /MF Specific Programs

STM-100 / MF Checkout Program

STMCKOUT.EXE Program to exercise the communication commands of the

STM-100 / MF and display related hardware settings.

STM-100 / MF Rate Progr am

RATE.EXE Program to gat her r at e information from the ST M-100 / MF

and present it in convenient forms.

Page A- 1 Communication Demo Disk

Usage: RATE.EXE [x] Where [x] is t he CO M port ( 1 or 2) that the STM-100 is connected to. This program is a text based routine and r uns in one window on the screen.

The Rate Program Display Shows:

1. THICKNESS Thickness value from t he unit in Ang s t r om s .

2. TIMER Timer value fr om t he unit .

3. TIME ON The time in minutes since the start button [ F1]

was pressed.

4. TOTAL THICKNESS The total thickness since the start button was

pressed. This corresponds to the Time On value.

5. RATES a. INSTANT Angstrom per sec ond. Cor r esponds

to the Instantaneous rate that is r ead from the unit. b. BY THE MINUTE Angstroms per minute. This is

the average rate for the past minute of operation, converted to angstroms per minut e.

c. BY THE HOUR Angstroms per hour. This is the average rate for the past hour of operation, converted to angstroms per hour.

d. TOTAL Angstrom s per minute. This is the total rate calculated from the t ime the start button was pressed. Converted to Angstroms per m inut e.

6. CRYSTAL LIFE This is the crystal life, in percent, that rem ains for

the current crystal.

7. USER PARAMETERS: Parameter values follow the same rules as the

STM-100 / MF. a. Density. < F3 > b. Tooling < F4 > c. Zfactor < F5 > d. Timer Set Point < F6 > e. Thickness Set Point < F7 > f. End Thickness Set Point < F8 > g. Zero the Timer < F9 > h. Zero the Thickness < F10 > i. Data Save file <SHIFT F1> Functions i.1. Prompts user for t he nam e of the file and the time interval for saving the data, minimum 1 second. i.2. Toggles the Save feat ur e.

8. DYNAMIC KEYS a. < F1 > Start / Stop

b. < F2 > Open / Close The Shutter. c. ESC To Exit the Program.

Communication Demo Disk Page A-2

APPENDIX B

Technical Drawings

APPENDIX C

SHMX-4 Users Guide

SHMX-4 Operation

SHMX-4

SENSOR HEAD MULTIPLEXER

instruments

ACTIVE SENSOR

Introduction

The Sensor Head Multiplexer (SHMX-4) used with a custom software version of the STM-100/MF Thin Film Thickness/Rate Monitor allows the individual monitoring of film thicknes s and depos ition r at es occ ur r ing upon up to four crystal sensing heads. The SHMX-4 allows the signals from 1 of 4 active sensors to be displayed on the controlling STM-100. This combination of the STM-100/MF and the SHMX-4 is useful in many multi-sensor monitor ing applications. While only one of t he four sensors can be actively measuring the rate and thickness, the accumulat ed t hickness on each of these sensors can be calculated and displayed as the sensors are selected during a deposition process. This is because the initial frequency of the sensing crystal along with its film parameters are st ored for each sensor. The custom version software for the STM-100 which accompanies this multiplexer provides the method and means for storing t hese initial condit ions for each sensing crystal. This allows the user to switch between sensing crystals and display the correct thick nes s reading for each sensor along with the cur r ent deposition rate occurring at the selected sensor.

The front panel of the SHMX-4 is shown below, LED's indicate the active sensor. During operation a Crystal fail condition in the s ensor s will be indicated by a flashing LED.

Figure C.1: SHMX-4 Front Panel

Special firmware is required in the controlling ST M-100, and t he two relay outputs

1. Elapsed Timer

2. Thickness Setpoint have been disabled to allow access to the 4, individual sensors. The firmware

version of the controlling STM-100 must be ST M100 VI6 or above. The version can be verified by inspecting the label on the ROM Chip U15 on the

printed circuit board. The label will look like the diagram below.

Page C- 1 SHMX-4 Operation

Sycon 520-001

STM100 VI6

240VAC FUSE 1/8 AMP SB

120VAC FUSE 1/4 AMP SB

4 Sensor Head Multiplexer

SHMX-4

POWER

instruments

Control

Unit

GND

CHANNEL

SELECT

RELAY

OUTPUT

Operation

Installation

Figure C.2: Firmware ROM Label

To ac ces s t he individual sensors use t he m ult iple film capability of the STM-100 / MF. Selecting film 1 from t he front panel, or by external computer control, will select sensor 1. By selecting different films the active sensor will change according to the f ollowing table.

Films Sensor

1, 5, 9 1 2, 6 2 3, 7 3 4, 8 4

Sensor and Contr oller connections to the SHMX-4 are made on the back panel, shown below.

Figure C.3: SHMX-4 Back Panel

The BNC connect or s labeled S1 thr ough S4 are the individual Crystal sensor connections. The connection to the c ont r olling ST M-100 is made via 2 connection cables. The first is t he control cable which goes between the Channel Select 9 Pin D connector on the SHMX-4 to the Input / Out put 15 Pin D connector on the STM-100. The control cable is shown below. The Sensor BNC on the STM-100 and the SHMX's Control Unit BNC are connected.

SHMX-4 Operation Page C - 2

SHMX-4

9 PIN Female

STM-100

5 GND

1 Sensor Fail

3 B Select 4 A Select

Pin 2

Pin 4

Pin 15

Pin 8

Ground

Control Cable, SHMX-4 to STM-100

15 PIN Female

Optional Inputs

Pin 9, Zero Timer Pin 10, Zero Thickness Pin 11,Shutter Close

Pin 12, Shutter Open

Pins 13, 14 GND

Pin 1

Pin 3

Pin 7

Pins 1, 3 and 7 tied to pin 15

6 ,7, 8, 9 Internal GND

Channel Select

Input / Output

Figure C.4: SHMX-4 to STM-100 Control Cable

The Optional inputs for opening and closing the shutt er and zeroing the timer and thickness can still be accessed by rewiring the 15 pin connector.

SHMX-4 Relay Output 9 pin D male.

Function Pins

Sensor 1 Active 1 and 2 Sensor 2 Active 3 and 4 Sensor 3 Active 5 and 6 Sensor 4 Active 7 and 8

GND 9

The Relay Output Connection provides external active channel indication. The connector pins map as follows. The corresponding relays will open and close when the active sensor is changed.

Page C- 3 SHMX-4 Operation

INFICON STM-100-MF User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Preface

Warranty

EQUIPMENT RETURN

Table of Contents

List of Figures

List of Tables

GENERAL INFORMATION

SECTION 1.1

SECTION 1.2

INTRODUCTION

UNPACKING

SECTION 1.3

STM-100 / MF SPECIFICATIONS

SECTION 1.4

OPERATION

WATER

ELECTRICAL

MATERIALS (IN VAC)

SECTION 1.5

SENSOR SPECIFICATIONS

Figure 1.1: Standard Sensors.

FEEDTHROUGH INSTALLATION

SENSOR SPARE PARTS

STM-100 / MF PARTS & ACCESSORIES

SECTION 1.6

MONITOR

FEEDTHROUGHS

SENSORS

OPTIONS

ACCESSORIES

SENSOR CRYSTALS

SECTION 2.1

SECTION 2.2

Shutter Keys

OPERATION AND PROGRAMMING

KEYBOARD DESCRIPTION

Figure 2.1: STM-100 / MF Front Panel.

SYSTEM CONTROL KEY GROUP

Figure 2.2: System Control Keys.

ZERO Key

Crystal Life Key

SECTION 2.3

Program Key

DATA ENTRY AND PROGRAMMING GROUP

Figure 2.3: Data Entry And Programming Keys.

Enter Key

Arrow Keys

SECTION 2.4

LCD Data Displays

FILM PARAMETERS

Film Number Parameter

Figure 2.4: LCD Data Areas.

Figure 2.5: LCD Variable Parameter Legends.

Figure 2.6: Film Number Parameter.

Density Parameter

Figure 2.7: Density Parameter.

Figure 2.8: Z-Factor Parameter.

Z-Factor Parameter

End Thickness

Figure 2.9: End Thickness Param et er .

Setpoint Thickness Parameter

Setpoint Timer

Figure 2.10: Set Point Thicknes s Par am et er.

Figure 2.11: Set Point Timer Parameter.

Tooling Factor Parameter

SECTION 2.5

Figure 2.12: Tooling Paramet er .

USER CONFIGURATION SWITCHES

CONFIGURATION

Figure 2.13: Configuration Switch Settings.

SWITCH FUNCTION DEFINITIONS

Table 2.1: Baud Rate Switch Settings

SECTION 2.6

Enabling the Test Mode

Table 2.2: Configuration Switch Address Sett ings

TEST MODE