INFICON STC-2002 User Manual

Sycon Instruments

STC-2002

Thin Film

Thickness and Rate Controller

STOP

START

instruments

RATE-A/SEC POWER-% THICKNESS-KA

MANUAL

CONTROL

MANUAL

ZERO

STC-2002

STATUS

DEPOSITION CONTROLLER

Users Manual

June 7 2003,

518-029 Preliminary

I/O 4 1/O 3 I/O 2 I/O 1

INPUTS / OUTPUTS

SENSORS

7 5 3 1

8 6 4 2

7 5 3 1 8 6 4 2

SOURCE

RS232

MEM

COMM OPTION

instruments

FUSE: 2 x 2.00 AMP

QUICK-ACTING (F) 250v

90-264 vac, 50-60 Hz, 230VA MAX

WARNING

The power cord protective

connected to ground. No user serviceable parts inside. Refer servicing to qualified personnel.

grounding conductor must be

Made in the U.S.A

Sycon Instruments

6757 Kinne Street

East Syracuse, New York 13057

v 315.463.5297 f 315.463.5298

www.sycon.com

p STC-2002 DEPOSITION CONTROLLER y

TFC-2002

USERS MANUAL 518-029

Rev <preliminary> June 7, 2003

.current:

Sycon STC-2002 Deposition Controller

RATE-A/SEC POWER-% THICKNESS-KA

MANUAL

CONTROL

MANUAL

SENSORS

7 5 3 1

8 6 4 2

7 5 3 1 8 6 4 2

SOURCE

instruments

I/O 4 1/O 3 I/O 2 I/O 1

INPUTS / OUTPUTS

ZERO

RS232

MEM

COMM OPTION

STC-2002

DEPOSITION CONTROLLER

instruments

FUSE: 2 x 2.00 AMP

QUICK-ACTING (F) 250v

90-264 vac, 50-60 Hz, 230VA MAX

WARNING

The power cord protective

connected to ground. No user serviceable parts inside. Refer servicing to qualified personnel.

grounding conductor must be

STOP

START

.overview w/ generalizations only

intro to user interface, overview from general to specific = overview w/ generalizations and intro to specifics as generalizations are developed.

Sycon reserves the right to change any information contained in this manual without notice

AMPHENOL

is a registered trademark of Tyco/Amp, Inc.

AMP ConFlat

Is a registered trademark of IBM Corporation

IBM Microsoft Microdot SWAGELOK Windows

is a registered trademark of Allied Corporation

is a registered trademark of Varian Associates, Inc.

is a registered trademark of Microsoft Corporation

is a registered trademark of Microdot Inc.

is a trademark owned by Crawford Fitting Company

is a registered trademark of Microsoft Corporation

STATUS

SECTION 0.XX

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Warranty

Sycon Instruments, Inc. (Sycon) warrants that all electronic instrumentation equipment manufactured by Sycon shall be free from defects in materials and workmanship for a period of 2 years from date of shipment. Mechanical vacuum components such as feedthroughs, sensors, cables, and shutters shall be warranted for a period of six months from the date of shipment. For the duration of the warranty period Sycon will, at its option, either repair or replace any part which is defective in materials or workmanship without charge to the purchaser. The foregoing shall constitute the exclusive and sole remedy of the purchaser for any breach by Sycon of this warranty. This warranty does not apply to any equipment which has not been used in accordance with the specifications recommended by Sycon for the proper and normal use of the equipment. Sycon shall not be liable under any circumstances for consequential or incidental damages in connection with, or arising out of the sale, performance, or use of, the equipment covered by this warranty. This warranty is in lieu of all other warranties by Sycon, expressed or implied, including the implied warranty of merchantability, the implied warranty of fitness for a particular purpose, and warranty against infringement of any patent. This warranty shall not apply if repair has been performed or an alteration made by anyone other than an authorized Sycon representative or if a malfunction occurs through abuse, misuse, negligence, or accident. No charge will be made for repairs made under warranty at Sycon's facilities.

Equipment Return

Before returning any equipment to Sycon contact the Product Service Department in your area for instructions. You must obtain a RA (Return Authorization) number from Sycon Instruments and indicate this number on all shipping cartons and correspondence. Failure to do so will delay the processing of your returned unit. Ship all items in suitable containers with adequate protection from outside damage. Also include a short description of the problem or condition to facilitate processing.

Sycon Instruments, Inc. 6757 Kinne Street Syracuse, New York 13057-1215

Phone (315) 463-5297 Fax (315) 463-5298 service@sycon.com

User Responsibility

The user is responsible for proper operation an ordinary maintenance of the equipment, following procedures described in this manual. Proper operation includes timely replacement of parts that are missing, broken, or plainly worn. If the user has a reasonable doubt about understanding the use or installation of a component, Sycon be called.

Safety Warning

General Precautions: Human contact with the voltages present within and around a vacuum system can be fatal. Make sure that the input power is turned off before opening the doors or removing panels. Short all HV feedthrough connections with a grounding hook before accessing the controller main body.

Reproduction of this information and equipment described herein is prohibited without prior written consent from Sycon.

SECTION 0.XX

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SECTION 1.0

.specifications/included materials

(no intro here) unpacking.

Introduction

Unpacking

The STC-2002 interfaces and analog outputs (see the following spare parts included list). If the essential OSC-100A oscillator or crystals were ordered at the same time, they will also be included. The unit operates from 90 to 264 VAC with no adjustments required. If it is ever necessary to return the unit to Sycon, for any reason, call and obtain a Return Authorization number (RA#).

comes with a power cord and connectors for the RS-232 interface, the I/O

Description

The STC-2002 provides both automatic control of single or multi-layer film deposition in either a production or development environment and improved predictability and repeatability of deposited film characteristics through dependable digital control of the deposition process. It runs unattended in the fully automatic mode and provides a wide number of benefits including performance limit access and setting by the end user.

SECTION 1.1

.[please read and understand this manual before proceeding w/ equipment useage].

Please read and understand the contents of this manual before proceeding with equipment useage in a working system. This manual will take the reader through the appropriate setup and example steps, providing along the way, an understanding of how the STC-2002 instrument is used. A test mode is available from the SERVICE menu for simulated out of system experiments. Crystal sensor head information is simulated (actually rate info is simulated for the film) allowing setup of various parameters/programming elements without crystal failure halting the simulated process. The power supply control voltage output is, however, active while in the test mode. All these terms will be described shortly. This manual is organized into a number of main sections: specifications, generalized overview, menu programming specifics and setup, hardware setup, detailed host communications, microbalance theory and maintenance. If any further assistance is needed, please contact Sycon (see section 1.6).

The specifications section describes STC-2002 product specifics, both hardware and software, along with related necessary and optional product specifics. The software specifics include programmable parameter lists. The generalized overview section answers the what, the how is it used and the how does it work questions about the STC-2002, that is, the solutions this product can provide. This section is intended to discuss the concepts of main functions and elements with only enough detail to make the conceptualization clear. In addition, rudimentary specifics are given in a number of other areas as an introduction or a primer for the next section. This is information you typically only need to look at once. Experienced users (those familiar with deposition controllers) should at least thumb through this section to take an inventory of what is available. The menu programming specifics and operational details section provides detailed information about product programming. Experienced users (those familiar with deposition controllers) may decide to start here. If some elements are unclear, check back to the previous section. The table of contents and index are helpful in this pursuit. This section provides descriptions for the programming of film parameters and process steps, descriptions of menu navigation, descriptions of screens, descriptions of fixed front panel keys, descriptions of run modes, parameter details, memory defaults, programming summaries, etc. The hardware setup section describes and illustrates connectors, interconnections, peripherals, mechanical connections, and the STC-2002 as a component in a larger system. Detailed host communications are found in the following section x6. See section x7 for

MANUAL DESCRIPTION

SECTION 1.XX

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Microbalance theory and thickness reading calibration with its attendant density, z factor (a material reference table of elements is included) and tooling determination. Each section builds on the previous sections such that no new elements are used that haven't been defined.

.Some sage advice that is

seldom heeded.

If all else fails read the manual.

You can lead a customer to water

ut you can't make them read the

manual.

SECTION 1.2 DESCRIPTION OF SYMBOLS

Please familiarize yourself with the following warning/safety/caution symbols found within this manual and their general meaning:

Note

Caution

Static Sensitive

.note the following warning/safety/caution symbols [desc. of each].

Note: Highlights an important fact or condition.

Caution: Warns of a condition that could cause damage to deposition controller, connected or

associated equipment. Also warns if some action taken could result with an undesireable and/or unexpected outcome.

: Warns of a condition that will likely cause damage to the deposition controller, connected or

associated equipment. Also warns of a possible unsafe situation for the user. Examples are static sensitivities, maximum component ratings, broken fuses, etc.

Hazardous Voltages Present

SECTION 1.XX



: Warns of a condition that is hazardous to user, deposition controller, connected or associated

equipment.

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SECTION 1.3

TABLE OF CONTENTS

TITLE PAGE................................................................................................................................................ 1

WARRANTY................................................................................................................................................ 2

INTRODUCTION [1.XX] ............................................................................................................................ 3

ECTION

1.0 ................................................................................................................................................ 3

Unpacking Instructions........................................................................................................................... 3

ECTION

1.1 ................................................................................................................................................ 3

Manual Description: Usage, Organization, Section Contents Summary ............................................... 3

1.2

ECTION

Description of Symbols Found in Manual

ECTION

.................................................................................................................................................... 4

1.3

 TABLE OF CONTENTS

1.4 .............................................................................................................................................. 11

........................................................................................................... 4

...................................................................................................... 5

STC-Spare Parts (included w/ STC-2002)............................................................................................ 11

STC-Optional Parts .............................................................................................................................. 11

ECTION

1.5 .............................................................................................................................................. 11

STC-Optional Crystal Sensor Parts...................................................................................................... 11

ECTION

1.6 .............................................................................................................................................. 12

Contact Information ............................................................................................................................. 12

ECTION

1.7 .............................................................................................................................................. 13

Product Specifications.......................................................................................................................... 13

ECTION

1.8 ............................................................................................................................................. 14

Programmable Parameter Lists........................................................................................................... 14

Programmable Parameter Dependency Lists ..................................................................................... 17

ECTION

1.9 .............................................................................................................................................. 19

Sensor Specifications............................................................................................................................ 19

SIMPLE QUICK GENERALIZED OVERVIEW [2.XX]

ECTION

2.0 .............................................................................................................................................. 21

.................................................. 21

For What Is The STC-2002 Used? [The Problem, The Solution]......................................................... 21

ECTION

2.1 .............................................................................................................................................. 22

How Is It Used?.................................................................................................................................... 22

ECTION

2.2 .............................................................................................................................................. 26

How Does It Work? .............................................................................................................................. 26

Hardware Setup Discussion ................................................................................................................. 29

Sensor Head: Hardware Generalizations............................................................................................. 30

Power Supply Connection .................................................................................................................... 32

Strip Chart Recorder Connection......................................................................................................... 32

RS-232 Communications Connection................................................................................................... 32

Grounding Stud .................................................................................................................................... 33

Input Card Options............................................................................................................................... 33

Installation/Removal Of Sensor Cards, Input Cards, Output Cards .................................................... 34

Pendant (hand controller) .................................................................................................................... 35

LCD Contrast/Bias ............................................................................................................................... 35

Graphical Display ................................................................................................................................ 35

Mounting .............................................................................................................................................. 35

System Hardware Connections............................................................................................................. 35

Programmable Hardware Setup Discussion ........................................................................................ 36

Select RunTime Mode: Sequencing/Non-Sequencing, Manual Mode, Test Mode............................................ 36

Memory Storage of Menu Parameters ............................................................................................................... 36

Films & Processes / Active, Non-Active ........................................................................................................... 36

Menu Parameter Dependencies.......................................................................................................................... 36

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Tooling: Material Density & Z-Factor............................................................................................................... 37

Power Related Menu Parameters....................................................................................................................... 37

Power Related Menu Parameter Dependencies ................................................................................................. 38

Initial Programming Setups (menu parameters) .................................................................................. 40

Menu Parameter Values & Programming After Memory Purge........................................................................ 40

Menu Parameter Values & Programming After Factory Restored Memory ...................................................... 41

I/O Programming Introduction ............................................................................................................ 42

Boolean Logic Discussion ................................................................................................................................. 43

Simple I/O Program Examples .......................................................................................................................... 44

How To Develop I/O Programs............................................................................................................ 48

MENU PROGRAMMING AND OPERATION DETAILS [3.XX]

ECTION

3.0

................................................................................................................................................ 49

................................................................. 49

LCD Touch Panel Overlay ................................................................................................................... 49

Front Panel Definitions ........................................................................................................................ 50

ECTION

3.1 .............................................................................................................................................. 56

Navigating Through STC-2002 Menus................................................................................................. 56

Menu Tree............................................................................................................................................. 57

ECTION

3.2 .............................................................................................................................................. 58

RunTime Screen Description................................................................................................................ 58

ECTION

3.3 .............................................................................................................................................. 60

Main Menu Description........................................................................................................................ 60

ECTION

3.4 .............................................................................................................................................. 63

Films And Processes............................................................................................................................. 63

ECTION

3.5 .............................................................................................................................................. 63

Film Edit/Review Mode ........................................................................................................................ 63

Film Parameter Checksum................................................................................................................................. 67

Film Parameter Lock Code................................................................................................................................67

Film Parameter: Source Sensor Map Select....................................................................................................... 68

Review SS MAP................................................................................................................................................ 68

Selecting the Active Film in Non-Sequencing Mode......................................................................................... 69

Detailed Film Parameter Descriptions ................................................................................................ 71

Detailed Map Parameter Descriptions................................................................................................. 79

ECTION

3.6 ............................................................................................................................................. 83

Editing Processes................................................................................................................................. 83

Process Lock Code ............................................................................................................................................ 93

Factory Restoration vs. Purged Settings ............................................................................................................ 93

Changing Memory Settings ............................................................................................................................... 93

ECTION

3.7 .............................................................................................................................................. 93

Set Active Process................................................................................................................................. 93

ECTION

3.8 .............................................................................................................................................. 94

Non-Sequencing Differences ................................................................................................................ 94

ECTION

3.9 .............................................................................................................................................. 96

Software Controlled RunTime Screen Keys.......................................................................................... 96

L/Q key (Crystal Quality).................................................................................................................................. 96

SMPL key (Sample and Hold)........................................................................................................................... 96

ECTION

3.10 ............................................................................................................................................ 97

Manual Power Control......................................................................................................................... 97

Using Pendent.................................................................................................................................................... 97

Using LCD keys ................................................................................................................................................ 98

ECTION

3.11 ............................................................................................................................................ 99

STC-2002 Shutter Delay....................................................................................................................... 99

ECTION

3.12 ............................................................................................................................................ 99

Deposition Source Control Loop Description ......................................................................................99

3.13

ECTION

Film Phases And Parameter Groups

ECTION

.............................................................................................................................................. 101

3.14 .......................................................................................................................................... 102

............................................................................................................. 101

System Configuration ......................................................................................................................... 102

SECTION 1.XX

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ECTION

3.15 .......................................................................................................................................... 103

Detailed System Configuration Related Parameters.......................................................................... 103

3.16 .......................................................................................................................................... 105

Communications Configuration Related Parameters......................................................................... 105

Detailed Communications Configuration Related Parameters......................................................................... 106

3.17 .......................................................................................................................................... 108

STC-2002 Crystal Failure Processing................................................................................................ 108

3.18 .......................................................................................................................................... 112

Process Accounting ............................................................................................................................ 112

3.19 .......................................................................................................................................... 114

OPTions/INFo .................................................................................................................................... 114

Checksum Validation ........................................................................................................................ 115

Checksums And Parameters After Purge............................................................................................116

3.20 .......................................................................................................................................... 118

Memory Module Programming & Usage........................................................................................... 118

Memory Module Data Transfer ....................................................................................................................... 120

Memory Module Placement............................................................................................................................. 121

3.21 .......................................................................................................................................... 122

Programming Example....................................................................................................................... 122

Entering The TEST Mode................................................................................................................................ 122

3.22 .......................................................................................................................................... 130

Product Programming Summary........................................................................................................ 130

ELECTRICAL CONNECTIONS AND DESCRIPTIONS [4.XX]

ECTION

4.0 ............................................................................................................................................ 135

............................... 135

Sensor Head Installation .................................................................................................................... 135

ECTION

4.1 ............................................................................................................................................ 138

Electrical Connections And Descriptions........................................................................................... 138

ECTION

4.2 ............................................................................................................................................ 138

Line Power ......................................................................................................................................... 138

ECTION

4.3 ............................................................................................................................................ 138

Rack Mounting.................................................................................................................................... 138

ECTION

4.4 ............................................................................................................................................ 138

Vacuum System Grounding ................................................................................................................ 138

ECTION

4.5 ............................................................................................................................................ 140

Sensor Connections ............................................................................................................................ 140

ECTION

4.6 ............................................................................................................................................ 140

Analog Control Voltage Connections................................................................................................. 140

Control Voltage Output Connection................................................................................................... 140

ECTION

4.7 ............................................................................................................................................ 141

Analog Recorder Output Connection ................................................................................................. 141

Analog Recorder Output Specifications ............................................................................................. 141

ECTION

4.8 ............................................................................................................................................ 143

I/O Interface ....................................................................................................................................... 143

ECTION

4.9 ............................................................................................................................................ 146

Relay Outputs (Factory I/O Program) ............................................................................................... 146

ECTION

4.10 .......................................................................................................................................... 147

Remote Inputs (Factory I/O Program) ............................................................................................... 147

ECTION

4.11 .......................................................................................................................................... 147

RS-232 Serial Communications Interface........................................................................................... 147

ECTION

4.12 .......................................................................................................................................... 148

Communications Options ................................................................................................................... 148

I/O PROGRAMMING [5.XX]

ECTION

5.1 ............................................................................................................................................ 149

..................................................................................................... 149

I/O Programming Introduction .......................................................................................................... 149

SECTION 1.XX

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ECTION

5.2 ............................................................................................................................................ 153

Boolean Definitions............................................................................................................................ 153

5.3 ............................................................................................................................................ 154

States And Events ............................................................................................................................... 154

5.4 ............................................................................................................................................ 159

Steady State vs. Edges ........................................................................................................................ 159

5.5 ............................................................................................................................................ 159

Input Functions................................................................................................................................... 159

5.6 ............................................................................................................................................ 160

Output Functions................................................................................................................................ 160

5.7 ............................................................................................................................................ 160

Softnodes And Sync Events................................................................................................................. 160

5.8 ............................................................................................................................................ 161

Internal Operations ............................................................................................................................ 161

5.9 ............................................................................................................................................ 162

Operate Menu..................................................................................................................................... 162

5.10 .......................................................................................................................................... 162

Memory Menu..................................................................................................................................... 162

5.11 .......................................................................................................................................... 163

Editing An I/O Program ..................................................................................................................... 163

I/O Programming Tree....................................................................................................................... 165

5.12 .......................................................................................................................................... 168

I/O Setup Edit Menu ........................................................................................................................... 168

5.13 .......................................................................................................................................... 169

Edit/Change Menu.............................................................................................................................. 169

COMPUTER INTERFACING [6.XX]

ECTION

6.0 ............................................................................................................................................ 191

..................................................................................... 191

Host Port Interface............................................................................................................................. 191

THEORY AND CALIBRATION [7.XX]

ECTION

EASUREMENT THEORY

7.0 M

.................................................................................................... 261

................................................................................ 261

Equation 1 .......................................................................................................................................... 261

ECTION

7.1 C

ALIBRATION

..................................................................................................................... 262

Thickness ............................................................................................................................................ 262

Density Determination....................................................................................................................... 262

Z-Factor Determination ..................................................................................................................... 262

Tooling Dtermination ......................................................................................................................... 262

Material Reference Table:.................................................................................................................. 264

Aluminum Through Indium............................................................................................................................. 264

Indium Intimonide Through Terium................................................................................................................ 265

Thallium Through Zirconium Oxide................................................................................................................ 266

MAINTENANCE/PROBLEM SOLUTIONS [8.XX]

ECTION

8.0 ............................................................................................................................................ 267

......................................................... 267

Warnings/Cautions ............................................................................................................................. 267

User Correctable System Problems.................................................................................................... 267

ECTION

8.1 R

EPLACING

ENSOR CRYSTAL

A S

....................................................................................... 268

Cautions/Procedural Steps................................................................................................................. 268

ECTION

8.2

PERSISTENT CRYSTAL FAIL INDICATION

........................................................................ 268

Discussion .......................................................................................................................................... 268

Hardware Issues ................................................................................................................................. 269

ECTION

8.3

8.4

SYSTEM BATTERY AND MEMORY CONSIDERATIONS

................................................................................................................................270

FAQ

..................................................... 270

Procedure to Change Battery ............................................................................................................. 270

SECTION 1.XX

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GLOSSARY .............................................................................................................................................. 271

INDEX....................................................................................................................................................... 273

COPY PARAMETER LISTS.................................................................................................................. 274

FIGURES

Standard Sensors.................................................................................................................................. 20

Sequencing / Non-Sequencing Modes................................................................................................... 23

Process / Film / Map Relationships...................................................................................................... 25

Back Panel Connections (Overview).................................................................................................... 29

Electrical Connections From Crystal Through Remote Oscillator (Overview) ................................... 30

Input Bd. Jumpers (Overview).............................................................................................................. 33

Installation/Removal Of Back Panel PCB Cards ................................................................................. 35

I/O Programming Notation .................................................................................................................. 44

I/O Programming Description.............................................................................................................. 44

I/O Programming: User Programmable Front Panel Keys/LEDs....................................................... 45

Example I/O Programs......................................................................................................................... 45

I/O Programming: Modulo 100 Counter Addresses............................................................................. 47

Touch Panel Overlay............................................................................................................................ 49

Front Panel and Key Descriptions ....................................................................................................... 50

Typical RunTime Screen....................................................................................................................... 50

Status Key Screens................................................................................................................................ 51

Manual Mode Screens .......................................................................................................................... 52

Status Screen Selector Function ........................................................................................................... 54

Start Key Menu..................................................................................................................................... 54

Start (Key) Process Flowchart ............................................................................................................. 55

Menu Tree............................................................................................................................................. 57

RunTime Screen.................................................................................................................................... 58

Main Menu Screen................................................................................................................................ 60

Executive Menu .................................................................................................................................... 62

Films & Process Storage...................................................................................................................... 63

Review Film Menu................................................................................................................................ 64

Non-Sequencing Mode Screen.............................................................................................................. 69

Rate Sampling, Sample And Hold Operation ....................................................................................... 75

Main Process Review/Edit Screen........................................................................................................ 83

Service Menu, Memory Configurations................................................................................................ 93

Setting the Active Process (Sequencing Mode)..................................................................................... 94

Setting The Active Film (Non-Sequencing Mode.................................................................................. 94

RunTime Screen (Non-Sequencing Mode)............................................................................................95

RunTime Screen: L/Q ........................................................................................................................... 96

RunTime Screen: Sample & Hold......................................................................................................... 96

Hand Controller/Pendent ..................................................................................................................... 97

Manual Power Control......................................................................................................................... 98

Typical Run Cycle............................................................................................................................... 101

System Configuration Screens............................................................................................................ 102

Communications Menu Screen ........................................................................................................... 105

Process Accounting Screens............................................................................................................... 112

Options Info Screens........................................................................................................................... 114

Memory Module.................................................................................................................................. 118

RunTime Screen With Test Mode Enabled ......................................................................................... 122

Electrical Connections To Back Panel............................................................................................... 135

Crystal Head Mounting ...................................................................................................................... 135

SECTION 1.XX

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Rear Panel.......................................................................................................................................... 138

Recommended System Grounding ...................................................................................................... 139

Rate Mode Recorder Output............................................................................................................... 142

I/O: Input Configuration Jumpers...................................................................................................... 143

I/O: Input Configuration Jumpers...................................................................................................... 145

RS232 Interface Cable........................................................................................................................ 148

I/O Programming Menu Screen.......................................................................................................... 149

Relay Ladder Notation........................................................................................................................ 153

Stack I/O Operations .......................................................................................................................... 161

I/O Programming Menu Screen Descriptions .................................................................................... 163

I/O Programming Menu Tree............................................................................................................. 165

I/O Programming Menu Descriptions................................................................................................ 166

I/O Programming Edit Menu Description.......................................................................................... 168

I/O Programming EDT/CHG Screens 1-5.......................................................................................... 171

I/O Programming: I/O program Entry ............................................................................................... 174

I/O Programming: Inserting An Empty Rung..................................................................................... 179

I/O Programming: Changing the Rung ..............................................................................................179

I/O Usage of Hand Controller/Pendent.............................................................................................. 188

Making An RS232 Cable..................................................................................................................... 191

Communications Setup Mode ............................................................................................................. 193

Equation 1 .......................................................................................................................................... 261

Density Calculation............................................................................................................................ 262

Z-Factor Calculation.......................................................................................................................... 262

Typical Tooling Factors ..................................................................................................................... 263

Sensor Feedthrough Connections....................................................................................................... 269

TABLES

ACTORY SETTINGS

OOLEAN LOGIC

ACTORY SETTINGS

HASES AND PARAMETERS

HECKSUMS AFTER PURGED

RODUCT PROGRAMMING SUMMARY TABLES

ACTORY RELAY OUTPUT PROGRAM

RUTH TABLE

VENT AND STATE

ACTORY INSTALLED

ODULO

IXED DELAY

ESPONSE CHARACTER TABLE

ATERIAL REFERENCE TABLE

......................................................................................................................................... 154

OUNTER PROGRAM

6 C

& P

ROCESS PROGRAMS

, P

............................................................................................... 41

....................................................................................................................................... 43

ROCESS PROGRAMS

, P

............................................................................................... 93

..................................................................................................................... 101

FTER FACTORY RESTORED MEMORY

/ A

................................................... 116

........................................................................................ 130

...................................................................................................... 146

IST

ID L ID L

.................................................................................................................... 155

IST

.................................................................................................................... 158

ROGRAM

I/O P

....................................................................................................... 181

............................................................................................................. 185

ULSE WIDTH

I/O P

ROGRAM

........................................................................................ 186

............................................................................................................... 194

................................................................................................................ 264

SECTION 1.XX

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SECTION 1.4

.included parts: STC-2002, power cord, spare parts.

p STC-2002 DEPOSITION CONTROLLER y

STC-2002 Spare Parts

POWER CORD [120 VAC] (1) 600-004 FUSES (2 x 2.00A 250VAC F-type) 356-014 OPTOCOUPLED INPUTS 25 PIN MALE CONNECTOR (1) 402-222 RELAY OUTPUTS 25 PIN FEMALE CONNECTOR (1) 404-020

EMI HOOD FOR 25 PIN CONNECTORS (2)..........................404-021

RS-232 9 PIN MALE CONNECTOR (1)..................................404-011

EMI HOOD FOR 9 PIN CONNECTOR (1)..............................404-009

RACK MOUNT EARS (2) ........................................................016-012

RACK MOUNT HDWR (4) ......................................................094-006

MANUAL (this manual)............................................................518-029

CONNECTOR KIT / PARTS ....................................................516-017

HAND CONTROLLER (1) .......................................................500-198

COMMUNICATIONS SOFTWARE TOOLS DISK (1)...........500-046

ASSEMBLY PART NUMBER

(included with STC-2002)

Optional STC-2002 Hardware / Software

MEMORY MODULE/STRIP CHART INTERFACE PCB 500-212

TRANSPORTABLE MEMORY MODULE (32K) ..................500-210

TRANSP. MEMORY MODULE SOFTWARE FOR PC..........500-TBD

TRANSP. MEMORY MODULE CABLE FOR PC..................500-TBD

SECTION 1.5

Optional Sensor Parts

Description................................................................. Sycon Part Number

Sensor Body (Low Profile) .......................................................550-222

Sensor Cap (Low Profile)...........................................................550-223

30 inch In-Vacuum Coax Cable ................................................500-024

10 inch In-Vacuum Coax Cable ................................................500-023

Crystals (box of 10) ...................................................................500-117

Standard Feedthroughs

1" BOLT STANDARD .............................................................500-016

2 3/4" ConFlat STANDARD ....................................................500-017

Standard Sensors

LOW PROFILE .........................................................................500-042

RIGHT ANGLE.........................................................................500-088

SECTION 1.XX

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Cables

10' OSC TO CONTROL UNIT CABLE ...................................500-026

30' OSC TO CONTROL UNIT CABLE ...................................500-027

6" OSC TO FEEDTHROUGH COAX CABLE ........................500-025

Crystal / Oscillator Package

6" OSC TO FEEDTHROUGH COAX CABLE ........................500-025

10' OSC TO CONTROL UNIT CABLE ...................................500-026

OSCILLATOR UNIT ...............................................................OSC-100A

10 CRYSTALS ..........................................................................500-117

(includes the following 4 item numbers)

500-109

SECTION 1.6 Contact Information

STC-2002

STC-2002 DEPOSITION RATE CONTROLLER

Sensor Package and Feedthrough Not Included

All prices FOB East Syracuse, New York Terms: Net 30 days

Sycon Instruments, Inc.

6757 Kinne Street East Syracuse, New York 13057-1215 Telephone (315) 463-5297 Fax (315) 463-5298

Website WWW.SYCON.COM

.optional STC-2002 parts (1.7)

optional sensor parts (1.6)

STC-2002 specifications (1.3).

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SECTION 1.7 PRODUCT SPECIFICATIONS

STC-2002 Thin-Film Thickness and Rate Controller Specifications

High Resolution ±0.02Hz(5-6MHz), 0.0088 Angstroms/Measurement (for Aluminum) High Accuracy ±0.5% thickness + 1 count High Speed Ten measurements/second Measurement Range 500KA Aluminum Equivalent Standard Sensor Crystal 6 MHz AT cut, Plano/Convex Sensor Capacity 2 per sensor PCB card [4 PCB cards max.] Displays 240 x 64 pixel monochrome LCD with Backlight

12 digit LED display (7 segments each digit)

4 discrete indicator LEDs Operation Menu driven "Windowing Type" LCD Touch Panel (12 x 4 key matrix) with 6 fixed function membrane keys and 4 user programmable fixed membrane keys Film Storage (Standard) 1 Active Film Program 98 Alternate Film Programs (with 30 Sensor maps) 9 Sequence recipes, 99 steps per recipe, system total is 250 steps External Storage (Optional) Film Parameters for films 1-99 and System Parameters I/O programs,

and Process Accounting Can be stored in Transportable Data Module

(Optional) Hardware I/O (Standard) per card: 8 SPDT Relays, 1.0 Amp @ 24 VDC Maximum

per card: 8 Optocoupled Inputs (Electrically Isolated), 5-24VDC [4

slots for input and/or output cards] Computer Interface RS-232C (Sycon Format or ASCII) Protocols Communication Options DeviceNet, PROFIBUS, CANopen, others Analog Outputs: 12 bit resolution (2 per sensor card, each for use as control or recorder)

As Control Outputs 2.5, 5, 10 volt @10ma. isolated output with range

menu programmable (maximum 2 control outputs per sensor card)

As Recorder Outputs 0 to 10 volt @ 10ma, isolated, function programmable

(rate, thickness, power, deviation, computer remote) (maximum 1

recorder output per sensor card and per system) Power Control:

Automatic Three Mode Closed Loop Control (PID)

Manual Hand Controller Rack Mount full width rack mount (std.). 3 Power Requirements 90-264VAC, 50-60Hz (

1.4A rms@120VAC, 0.7A rms@230VAC)

Weight (without options) 6 lbs. [with: 1 Sensor card, 1 Input Card, 1 Output Card]

card=0.216 lbs., Input card=0.135 lbs., Output card=0.14 lbs.

Operating Range 0 to 50°C ambient (power supply/LCD display) Humidity non-condensing: 5% - 85% RH

1/2

" H, 8

5/8

" D

Sensor

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SECTION 1.8

.programmable parameter list (1.4).

__________________________________________________________________

key examples:

Full Parameter Name

Parameter Name ⇒ Param N

(text) ⇒ implied parameter text in parenthesis

__________________________________________________________________

Film Parameter List:

Review Film (Edit Film)

(Material) Density 0.40 to 99.99 gm/cc

(Material) Z-Factor 0.100 to 9.999

Setpoint Thickness Limit 0.000 to 999.999 KÅ

Final Thickness Limit (Trigger) 0.000 to 999.999 KÅ (non-sequencing only)

Setpoint Time Limit 0:00 to 99:59 MM:SS Soak 1 Power level Value 0.0 to 100.0% Power Ramp 1 Time (to pwr level) 0 to 99:59 MM:SS Power Soak 1 Time (@ pwr level) 0 to 99:59 MM:SS Soak 2 Power level Value 0.0 to 100.0% Power Ramp 2 Time (to pwr level) 0 to 99:59 MM:SS Power Soak 2 Time (@ pwr level) 0 to 99:59 MM:SS Soak 3 Power level Value 0.0 to 100.0% Power Ramp 3 Time (to pwr level) 0 to 99:59 MM:SS Deposit Rate (requested) 0.0 to 999.9 A/S Rate Ramp Mode OFF / ON New Deposit Rate (Value) 0.0 to 999.9 A/S Rate Ramp Time (Duration) 0:00 to 99:59 MM:SS Rate Ramp (Thickn) Trigger Point 0 to 999.999 KÅ Control Loop –Proportional term- 1 to 9999 Control Loop –Integral term- 0.0 to 99.9 sec Control Loop –Derivative term- 0.0 to 99.9 sec Max Power Limit 0.0 to 100.0% Abort Max Power SWitch OFF/ON Max Power Dwell 0:01-99:59 MM:SS Shutter Delay Mode OFF, ON Shutter Delay TIMEOUT 0:01-99:59 MM:SS Shutter Delay QUALITY 1-50%

(XTAL) RATE SAMPLING OFF,TIMED,INTELL. (XTAL) SAMPLE INTERVAL 0:01-99:59 MM:SS (XTAL) SAMPLE DWELL TIME 0:01-99:59 MM:SS (XTAL) SAMPLE QUAL 1-50% (XTAL) SAMPLE ALARM TIME 0:01-99:59 MM:SS

FILM Fail Mode ABORT IF FAIL, TIME POWER Control Loop Qual Limits 0 to 9 XTAL Stability S (Limits) 0 to 9 XTAL Life Bounds 0.0-100.0% Plot Vert Scale Volts 1, 5, 10, 50, 100 Plot Horiz Scale H 1 to 600 samples Data Plot Type Rate /Rate Deviation /Power

Programmable Parameter Lists

⇒ Abbreviated Menu Name

[Menu end point: Review Film Menu path: Main/Review Film]

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Source Sensor MAP SELECT 1 - 30 POCKET SELECT 0 – 63 Pockets ETCHING MODE OFF/ON

Process Step elements:

Review Processes (Edit Process) (Edit Process Steps [1-99]) Mode (Skip, Stop, Auto,

Main Menu values:

Next Active Process (Select)* 1 of 9 processes [sequencing mode only] Next Active Film (Select)* 1 of 99 films [non-sequencing mode only]

[*NOTE: press touch key enclosing digit to select 1 of the 9 processes or 99 films (press digits + ENTer on invoked submenu)]

RunTime Screen parameters:

(Crystal Quality Indicator Select) L/Q, Loop x, Qual xx (Crystal Sample Select) (not selected [blank]), SMPL, SMPL+Time, HOLD+Time

START key sequence STOP key MANUAL key ZERO key MENU key STATUS key

Zero Power

(fixed front panel)

[non-active process]

Zero Thickness Force Fail

Zero thickness does not affect film thickness value, only Source Sensor card value (use to set tooling factor, diagnose

problems, etc. )

If the PROCess X: status message does not change when the START key is pressed, check for "STOP: INValid XXX "

message or check the OPT/INF menu, page 2 for cards not installed which are enabled in software (MIA). Cycle AC power OFFON to re-sync.

[non-active process]

(fixed front panel)

Zeroes the thickness value

Switches from RunTime screen to MAIN menu screen

zero channel 1-8, zero all, re-verify

System Configuration values:

LCD Contrast / Bias LOW, MEDIUM, HIGH Password Lock # 0 - 9999

(Process) Run Number 0 to 9999

Recorder Function Recorder Out Channel

Real Clock Time HH/MM Real Clock Date MM/DD/YY

Need Source/Sensor Card 1 OFF/ON Need Source/Sensor Card 2 OFF/ON Need Source/Sensor Card 3 OFF/ON Need Source/Sensor Card 4 OFF/ON I/O Slot 1 Type UNUSED (DISABLED) / INPUT / OUTPUT I/O Slot 2 Type UNUSED (DISABLED) / INPUT / OUTPUT I/O Slot 3 Type UNUSED (DISABLED) / INPUT / OUTPUT I/O Slot 4 Type UNUSED (DISABLED) / INPUT / OUTPUT Memory Module IFC OFF/ON

Communication values:

COM/IO Lock Code 0 - 9999 Keyboard Beep OFF / ON RS232 Baud Rate 300, 1200, 2400, 9600 RS232 Protocol Sycon, ASCII

[Menu end point: Review Processes Menu path: Main/Review Processes]

End, Wait), Film# (1-99), Thickness (0.0 - 999.999 KÅ)

[Menu end point: Main Menu Menu path: fixed front panel MENU key/ Main Menu]

[Menu end point: RunTime screen Menu path: programming Menu/ fixed front panel STATUS key/RunTime screen]

(Note PROCess X: message change after each START process key press)

Stops the running process

(non-seq mode: stops the 1 inherent process [film])

Switches to manual mode from a running process only. Toggle action.

Switches to RunTime screen from any menu screen, to detailed power

and crystal info screens from RunTime screen

zero channel 1-8, zero all [1st STATUS key press from RunTime]

[2nd STATUS key press from RunTime]

fail channel 1-8, fail all, re-verify

[Menu end point: System Config Menu path: Main/Executive menu/System Configuration]

Absolute Rate, Rate Deviation, Power, Thickness, Computer Remote, I/O Control, Off

1 – 8 selects an analog output channel for use (if not off and not used as a source)

[Menu end point: Comm. Setup Menu path: Main/Executive menu/Communications Setup]

[2nd STATUS key press from RunTime]

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Source Sensor Map elements:

[Menu end point: Review SS Map Menu path: Main/Review SS Map]

Source Sensor Full Power Volts 2.5, 5, 10 full scale volts Source Sensor Max Power Value 0.0% - 100.0% Source Sensor Analog Output Chnl 1 – 8 Channel Selection Master Tooling Value 10.0% - 400.0% Minimum Start Xtal Channels 1 – 8 minimum channels Minimum Backup Xtal Channels 0 – 7 minimum channels Minumum Active Xtal Channels 1 – 8 minimum channels (Xtal) Channel Drop Filter NONE, BALANCE

[Mask dropped Xtal channel Failure] averaging mode only

Indexer Synchronization Mode NONE, DELAY, FEEDBACK Indexer Synchronization Time 2 – 999 seconds Channel 1 Start Mode OFF, ACTIVE, STANDBY Channel 1 Fail Action (Mode) NONE, ABORT FILM Channel 1 Backup List X – XXXXXXXX (1 item list to 8 item list), [where X = 1 to 8 (in

each position w/o redundancies, list extends to 0-8 for a 1 item list)] Channel 1 Tooling Value 10.0% - 400.0% Channel 1 Weight 10.0% - 400.0% Channel 2 Start Mode OFF, ACTIVE, STANDBY Channel 2 Fail Action (Mode) NONE, ABORT FILM Channel 2 Backup List X – XXXXXXXX,

[X = 1 to 8 (in each position w/o redundancies)] see CH1

Channel 2 Tooling Value 10.0% - 400.0% Channel 2 Weight 10.0% - 400.0%

Channel 3 Start Mode OFF, ACTIVE, STANDBY

[need 2nd Source Sensor Card for Channels 3 & 4]

Channel 3 Fail Action (Mode) NONE, ABORT FILM Channel 3 Backup List X – XXXXXXXX,

[X = 1 to 8 (in each position w/o redundancies)] see CH1

Channel 3 Tooling Value 10.0% - 400.0% Channel 3 Weight 10.0% - 400.0% Channel 4 Start Mode OFF, ACTIVE, STANDBY Channel 4 Fail Action (Mode) NONE, ABORT FILM Channel 4 Backup List X – XXXXXXXX,

[X = 1 to 8 (in each position w/o redundancies)] see CH1

Channel 4 Tooling Value 10.0% - 400.0% Channel 4 Weight 10.0% - 400.0% Channel 5 Start Mode OFF, ACTIVE, STANDBY

[need 3rd Source Sensor Card for Channels 5 & 6]

Channel 5 Fail Action (Mode) NONE, ABORT FILM Channel 5 Backup List X – XXXXXXXX,

[X = 1 to 8 (in each position w/o redundancies)] see CH1

Channel 5 Tooling Value 10.0% - 400.0% Channel 5 Weight 10.0% - 400.0% Channel 6 Start Mode OFF, ACTIVE, STANDBY Channel 6 Fail Action (Mode) NONE, ABORT FILM Channel 6 Backup List X – XXXXXXXX,

[X = 1 to 8 (in each position w/o redundancies)] see CH1

Channel 6 Tooling Value 10.0% - 400.0% Channel 6 Weight 10.0% - 400.0% Channel 7 Start Mode OFF, ACTIVE, STANDBY

[need 4th Source Sensor Card for Channels 7 & 8]

Channel 7 Fail Action (Mode) NONE, ABORT FILM Channel 7 Backup List X – XXXXXXXX,

[X = 1 to 8 (in each position w/o redundancies)] see CH1

Channel 7 Tooling Value 10.0% - 400.0% Channel 7 Weight 10.0% - 400.0% Channel 8 Start Mode OFF, ACTIVE, STANDBY Channel 8 Fail Action (Mode) NONE, ABORT FILM Channel 8 Backup List X – XXXXXXXX,

[X = 1 to 8 (in each position w/o redundancies)] see CH1

Channel 8 Tooling Value 10.0% - 400.0% Channel 8 Weight 10.0% - 400.0%

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I/O Function elements:

I/O Relay Functions user I/O program

[Menu end point: I/O Setup Menu path: Main/Executive menu/ I/O Setup]

(8 Form C Relays per card [4 slots available for I or O cards])

I/O Input Functions user I/O program + PCB jumpers

(8 Inputs per card [4 slots for I or O cards])

I/O Setup Memory: save/swap, Operate: run/stop I/O Programming Edit (Program): IN, NOT, AND, OR, XOR, POSitive, NEGative,

OUT, TRiP, SET, CLeaR, ARM, DRoP, (events/states/logical

operators), (softnodes) and (numeric elements).

Arithmetic operators/elements: KON# (to input constants), ADD,

SUBtract, MULtiply, DIVide, MODulus, EQUals, GReaTer than,

LESs than, and SELect. Editing: backspace, left/right arrows (to move

cursor), delete, undo, insert/delete line. (Front Panel LEDs [4 discrete]) I/O programming elements (see table x in section 5xx and Section 2.2) (User Front Panel Keys [4]) I/O programming elements (see table x in section 5xx and Section 2.2) Pendent Keys (beyond specified Manual Mode use: I/O programming elements

[see table xxx in section 5xx ])

Service Menu values:

[Menu end point: Service Menu path: Main/Service]

(Test Mode Select) Test Off, Test On [Test Mode won't remain in effect if power is cycled) (Seq/Non-seq Mode Select) Seq(uencing Mode Select en)able, Non-seq(uencing Select enabled) (Memory Contents) as is (no modification), purged, factory (defaults) [see section x.2.2xx ] (Reset) Arm reset, reset armed [Provide a product reset when back panel power

switch is not accessible. Also, use to generate ACCEPT key if not

present (e.g. to end the Test mode when in the Test mode).]



<<< move the following depenency lists to end of section 2.22? >>>

[Prerequisite states that must be in effect for the following parameters to be fully functional]

Film Parameter Dependency List:

Material Density Not Applicable Material Z-Factor N.A.

Setpoint Thickness Limit N.A.

Final Thickness Limit (Trigger) Service Menu Parameter: Non Seq / Accept

Setpoint Time Limit N.A. Soak 1 Power level Value N.A. Power Ramp 1 Time (to pwr level) N.A. Power Soak 1 Time (@ pwr level) N.A. Soak 2 Power level Value N.A. Power Ramp 2 Time (to pwr level) N.A. Power Soak 2 Time (@ pwr level) N.A. Soak 3 Power level Value N.A. Power Ramp 3 Time (to pwr level) N.A. Deposit Rate (requested) N.A. Rate Ramp Mode N.A. New Deposit Rate Value Film Parameter: Rate Ramp Mode = ON Rate Ramp Time Duration Film Parameter: Rate Ramp Mode = ON Rate Ramp (Thickn) Trigger Point Film Parameter: Rate Ramp Mode = ON Control Loop –Proportional term- N.A. Control Loop –Integral term- N.A. Control Loop –Derivative term- N.A. Max Power Limit N.A. Abort Max Power SW N.A. Max Power Dwell Film Parameter: Abort Max Power SW = ON

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Shutter Delay Mode N.A. Shutter Delay TIMEOUT Film Parameter: Shutter Delay Mode = ON Shutter Delay QUALITY Film Parameter: Shutter Delay Mode = ON

(XTAL) RATE SAMPLING N.A. (XTAL) SAMPLE INTERVAL (Film Parameter: (XTAL) RATE SAMPLING = Timed

or Film Parameter: (XTAL) RATE SAMPLING = Inteli)

(XTAL) SAMPLE DWELL TIME Film Parameter: (XTAL) RATE SAMPLING = Timed (XTAL) SAMPLE QUAL Film Parameter: (XTAL) RATE SAMPLING = Inteli (XTAL) SAMPLE ALARM TIME Film Parameter: (XTAL) RATE SAMPLING = Inteli

FILM Fail Mode N.A. Control Loop Qual Limits N.A. XTAL Stability S Limits N.A. XTAL Life Bounds N.A. Plot Vert Scale Volts N.A. Plot Horiz Scale H N.A. Data Plot Type N.A. Source Sensor MAP SELECT N.A. POCKET SELECT N.A. ETCHING MODE N.A.

Main Menu value Dependency List:

Next Active Process (Select) If N/A, must use START + Reset / Start Proc keys to start a process. Next Active Film (Select)

Service Menu: Sequence Able + Accept keys (for Sequencing Mode)2

Service Menu: Non-Sequence + Accept keys (Non-Sequencing Mode)2 Review Process (Select) Service Menu: Sequence Able + Accept keys (for Sequencing Mode) Review Film (Select) N.A. Review Source/Sensor Map (Sel)

[NOTE1: press to invoke number entry submenu, sequence of 1 or 2 digits is entered or discarded]

RunTime Screen parameter Dependency List:

(Crystal Quality Indicator Select) L/Q, Loop x, Qual xx Film Parameters (Crystal Sample Select) Film Parameter: (XTAL) Rate Sampling = Timed or Intelligent? Running in deposit mode (Crystal Select) System Config Parameter: Need Source/Sensor Card X Review Source Sensor Map Element Parameters: Minimum Start Xtal Channels

(Process X) Main Menu Parameter: [Next Process] Digit Fixed Front Panel START key: sequence from N/A to 1

Service Menu: SEQuence enABLE

Layer X (layer = step) Review Processes X: EDIT: CHANGE, INSERT, DELETE

Service Menu: SEQuence enABLE FILM Review Processes X: EDIT: CHANGE, INSERT, DELETE films

(Manual mode) Running Process + Pressing fixed front panel MANUAL key +

N.A.

Note2: [the Seq Able / Non Seq key shows the current mode upon entry into the Service menu, changing the mode toggles key text and generates the Accept key that in turn needs to be pressed to accept new mode described on the key in text]

Minumum Active Xtal Channels Channel X Start Mode

Review Film X:

[non-sequencing mode]

[sequencing mode]

Layers/steps

[sequencing mode]

attached Pendent

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MAP# Film Parameter: Review Source/Sensor Map Select SRC x Review Source/Sensor Map Parameter: Source Analog Output Channel

Film Parameter: Source/Sensor Map Select (select the map that contains the above selected Source Analog Output Channel)

NOTE: If SRC is zero, this is an indication that a source analog output control voltage has been assigned to a source sensor card that is not present, not working, etc. Remember that the System Configuration parameters: Need Source/Sensor Card X and I/O Slot X type are only evaluated on power up or on reset. Check the OPTions/INFo menu, page 2 and 3 to see what is currently in effect. To work correctly, the S/S x: line should end with OK. If it ends with EMPTY, the card is not present or not communicating. If the line ends with INCOMPATable!, the software versions in at least some of the various PCB cards is not compatible- check for field changed PCB cards. If the line ends with MIA, that sensor card is configured but is not present. [See OPTions/INFo menu]

RUN, PHASE automatic up/down timers. Function when process/film is started

(START key sequence). Effected by film parameters that control film

phases within the deposition cycle. RUN x System Configuration Parameter: Run Number TIME/Day of Week/DATE System Configuration Parameters: Clock Time, Clock Date Graph Film Parameters: Plot Vert Scale Volts, Plot Horiz Scale H,

Data Plot Type (process start) Carry out the following 2 key sequence up to 3 times.

Press the fixed front panel START key + 1 of 4 touch panel keys: Break Wait, Next Layer, Restart Layer, Reset / Start Process (see figure in end of section 3.0). Use the appropriate touch key for the task at hand. If unsure, use Reset / Start Process key in all 3 sequences. Please read and understand this manual before starting a live process. (Test mode) [to enter] Service Menu: Test Off ⇒ Test On (text toggles) + Accept (Test mode) [to exit] Service Menu: Arm Reset ⇒ Reset Armed (text toggles) + Accept

Password Dependencies:

(Communications values) Main Menu/ Executive Menu/ Communications Setup: Com/IO Lock

(I/O parameters) Main Menu/ Executive Menu/ Communications Setup: Com/IO Lock

(all other parameters) Main Menu/ Executive Menu/ System Configuration: Password Lock #

Code [non-zero value enables the password dependency and is itself the

password.]**

Code [non-zero value enables the password dependency and is itself the

password.]**

[non-zero value enables the password dependency and is itself the

password.]**

**Note: If password is forgotten and programming has not been saved in some

other media, call factory to eliminate passwords without purging memory.

SECTION 1.9

.sensor specs (1.5).

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Sensor Specifications

Low Profile P/N 500-042 Right Angle P/N 500-088

Figure 1.1: Standard Sensors.

Operation

Maximum Temperature............................................................. 200 °C

Water Line and Coax Length .................................................... 30 inches

Sensor Mounting ......................................................................Rear of Body, #4-40 Tapped

Feedthrough Installation

Water

Connections ................................................................ Two Required

Type ........................................................................... 1/8 inch OD. Stainless Tubing

Flow Rate .................................................................... 0.2 to 0.3 gal/min.

Water Temp................................................................. 50 °C max.

Electrical

Connections ................................................................ One Coaxial Line

Type ........................................................................... MicroDot Miniature

Materials (in VAC)

Body and Water Lines ............................................... 304 Stainless

Insulators .................................................................... Alumina

Coax Insulator ............................................................ Teflon

Coax Conductor and Shields ...................................... Copper/Silver

Braze Material ............................................................ High VAC Ni/CR/Cu Alloy

Crystal Quartz with Gold Electrodes

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SIMPLE QUICK GENERALIZED OVERVIEW

SECTION 2.0

for what is the STC-2002 used ? .(result). [the problem, the solution]

.deposit material on a target surface with a controlled and repeatable process.

The STC-2002 addresses the needs of thin film deposition within the vacuum coating industry. The main function of the STC-2002 is to provide the means for a controlled and repeatable process, which is the deposition of material on a target surface. [process in which material is deposited on a target surface] [process that deposits material on a target surface] (PVD)

<< ii, 2-1 >>

this product is the basis of a controlled and repeatable process.

Without such control, the power [supplies] used to start (or stop) the generation of deposits could be switched on (or off) at human reaction speeds. Once on, the power [supply] outputs could be altered to vary the deposit rate, again at human reaction speeds. From the human perspective, the relatively brief time intervals typically required would be unwieldy at best for accurate control of even a slow process. This kind of direct human control also assumes that a time versus deposition rate and final thickness is known for the various deposited materials. Factor in the many physical elements that effect deposition and the system user, with only time based control, would find it extremely difficult at best for even slowly accumulating thick depositions, and, for thin depositions, impossible to obtain the desired results, much less the consistent desired results. The first need is to at least monitor the deposition and know the thickness (and rate) at any point in time. The next is to be able to control the process based on the monitored information in real time such that the reaction time between monitor and control is at the needed speeds. Fortunately, the needed monitor/calculation/control speed is easily within the range of a moderately priced microprocessor.

The STC-2002 has a microprocessor: on each sensor card, on the user interface board (includes interconnected displays, keys, touchscreens, etc.) and on the communications/control/database board. This multiprocessor approach provides greater bandwidth and dedication to specialized functions with obvious benefits: speed, control, etc. The microprocessors used are actually microcontrollers, which can include A/D, D/A, communications, etc. thus providing cost savings and greater reliability because of the higher degree of integration. .[in speed and control].

.[Along with an oscillator and crystal sensor(s), the STC-2002 instrument is the basis of a controlled and

repeatable material deposition process system. ].

Along with an oscillator and crystal sensor(s), the STC-2002 instrument is the basis of process control and repeatability within a material deposition system. [of a material deposition system] The STC-2002 can be used to monitor and control the process manually, or to monitor and control the process automatically. Utilizing the inherent flexibility of the STC-2002, there are many possible levels of manual control (requiring human intervention at user determined points in the process). This is also true of the automatic process mode. During an automated process, for example, an input state or some other condition can be made to pause the process for user inspection. If satisfactory, the automated process can be resumed by another preprogrammed user input. In addition, reactions between monitor and control (response time, overshoot control, etching vs. depositing, etc.) can be tailored to meet various requirements by user programmable parameters (discussed in PID control section).

The material deposited on the target may be from a single element or a compound (alloy) to create single or multilayered metal deposits, lens coatings, the creation of an alloy combination that has special properties, metalized plastic, etc. The products range from sunglasses, jewelry, automotive decoration, CDs at the low end to optical lenses, mirrors, filters, semiconductors, superconductors, metallurgical research, etc. at the high end.

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SECTION 2.1

how is it used ?

First, a few terms and their definitions are needed.

.the material to be deposited is referred to as an evaporant source.

The material to be deposited shall be alternately and henceforth referred to in this manual as an evaporant source.

.the target surface is referred to as a substrate.

The target surface shall be alternately and henceforth referred to as a substrate.

.the material is known as an evaporant when it has reached sufficient temp/excitation to leave the

source material supply prior to deposition.

The material is known as an evaporant when it has reached sufficient temperature/excitation to leave the surface of the source material supply prior to deposition. The STC-2002 automatically, as it monitors material deposition rate and thickness, controls the power that generates the evaporant within the bounds of the user-defined parameters and other programming. The STC-2002 is programmed through an LCD screen with a touch panel overlay. [All choices are deterministic or bounded by a screen specified range.] All choices are made within groups of predetermined menu selection alternatives or, as in the case of some data entries, bounded by a screen specified range with software enforcing the range of entry acceptance.

.layered metal deposits, lens coatings, create alloy combinations that have special properties, etc.

With the crystal sensor[s] in the same space as, but not necessarily in relative close proximity to, the substrate, the crystal sensor[s] should accumulate the same amount (or a ratio) of deposited material as the substrate. As the crystal frequency is proportionally related to a deposited mass (within specific bounds), thickness on a substrate can be inferred and deposition rate can be calculated based on thickness values through the progression of time. Other dependent factors such as the type of material deposited (as reflected in material density and z factor) and the physical positioning of the crystal sensor[s] (see tooling factor discussion) are also part of the deposition calculations and are included among the user programmable parameters of the STC-2002.

In a typical case of evaporant stream generation, a high current (or high voltage) power supply is used to heat the material in a boat, crucible or coiled filament. This power supply is controlled by the control output voltage of the STC-2002 sensor card. This power supply can thus be controlled through the STC2002 either manually or automatically. Manual mode can be used to setup the system before the auto mode is employed. The power supply, in this case, is manually controlled while the deposition is monitored. In non-sequencing mode (defined shortly), the final thickness parameter can be set to terminate the process when reached (evaporant source shutter closure). The power could be switched off via an output relay (a poor man's controller). In the auto mode (sequencing mode), a user programmable PID loop can be used for process monitor/power supply control with a relatively high degree of precision based on needed system speed elements. All methods of evaporant stream generation need power supply control. A power supply that is controlled by the STC-2002 typically provides thermal excitation of the target material by laser, electron beam (accurate control), resistance heating (low cost/complexity) or sputter (large area) deposition, each process type having favorable attributes for specific process goals.

Regarding higher level system control, the STC-2002 can be programmed to function in this capacity (keeping in mind failsafe measures). [On a higher level of system control]. Using one of the four user programmable fixed front panel keys and output relays, gates/valves could be closed and pumps could be activated as a prelude to the previously described automated process. A pressure monitoring device would signal the STC-2002 through an opto-input when the pressure was correct and the automated deposition would begin. One of the user programmable front panel indicators could be used to show this and that of other points during the process had been reached.

[For additional information, search the web using "quartz crystal microbalances".]

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<< control loop=2-12 >>

simplest case (seq, non-seq / 1 crystal). 1 process, 1 film, 1 material, 1 crystal, 1 deposit.

Returning to STC-2002 specifics, some additional STC-2002 terminology definitions must now be given.

Beyond sensor information and power supply control voltage, the STC-2002 also allows the user to define the other parameters that are critical in the deposition process.

In STC-2002 terminology, a film is defined as a list of user programmable deposition related parameters (see XXX). Typically, one material deposition is accomplished per film (describes specific: material, mechanical setup, timing, etc.). The STC-2002 can store up to 99 films (referred to as a film recipe library). A process is a list of film implementations. Each film implementation is referred to as a layer (or step in the process). Process layers can use the same film many times or use any combination of different films (insert figure / see fig. xx).

The STC-2002 has 2 basic process control modes: sequencing mode and non-sequencing mode. While in either one of these modes, manual mode (manual control of power) may be invoked. In addition, a test mode can be employed to simulate (w/ simulated rate information) a crystal sensor input while in any combination of the modes just described. Simply put, the sequencing / non-sequencing mode difference is that of having or not having a process. Non-sequencing mode does not have a process (or at least nothing named as such). Non-sequencing mode uses 1 implicit process which can run 1 film. The non-sequencing mode is easiest to configure (user programs an active film). The sequencing mode is more complicated only by the additional programming of a process[es] that calls out a film or films.

The STC-2002 retains the non-sequencing mode for historical compatibility and for simple depositions.

On the subject of films and processes, that which is referred to as active is that which is queued to be run when the start sequence is initiated. In other words, except for a co-deposition process, only one film is being deposited at one time and one process (the active process) is calling out that one film in one of its steps. When a process is run (start key sequence), it uses the single process that was selected as the active process (on the Main Menu). Likewise, the film that was selected by the active process as the active film will become the running film. [The non-sequencing mode has only one inherent unspecified process and films are manually selected to be active. Only the film selected as active will be run (Main Menu in non seq mode).] Regardless of mode selection, an active process or active film can be edited (modified) while a process or film is running but only in a limited manner. This prevents potentially dangerous situations from occurring. The limitations, that is, the parameters that are not changeable while a process (or film ) is running include the following:

Film parameters: SS Map Select, Pocket Select, Etching Mode.

Map parameters: CH x Start Mode, Source full power, Source out channel, Indexer Sync Mode.

Min ~~~ XTALS

Process: Film# of current running step, Process length (no step insertion/deletion).<<<move?>>>

SEQ MODE

1 active process (process selects 1 or more films) Up to 9 programmable processes

[3 parameters]

(evaluated at start only except for RE-VERIFY key usage).

NON-SEQ MODE

1 implicit active process (user selects 1 active film)

1 ACTIVE FILM

(up to 99 programmable films) Film parameters define the constituent elements of the

osition

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In terms of STC-2002 usage, the simplest configurations would be either in sequencing mode with: 1 crystal, 1 oscillator, 1 process, 1 film, 1 material, and 1 deposit or in non-sequencing mode with: 1 crystal, 1 oscillator, 1 film, 1 material, and 1 deposit. Also for these simplest configurations, in either sequencing or non-sequencing mode, a single sensor input would be employed along with a single control voltage output (controls power to that which is generating the evaporant). The simplest means of evaporant stream generation would be resistive heating.

In terms of unit hardware, this translates into an STC-2002 with 1 sensor card, 1 output card and 1 input card.

In terms of unit software (menu programming), a specific film is either called by a process (in sequencing mode) or called directly (in non-sequencing mode). The film, in turn, calls out a specific sensor map. Except for co-deposition applications, which will be explained elsewhere, only 1 process, only 1 film, only 1 map can be active (running) at a single point in time. A process can call a different film at each of its steps (or layers) up to 99 steps.

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(SEQuencing Mode) Step# (or Layer#) Mode: Skip, Stop, Auto, End, Wait

Film #

Thickness

Implicit Process

(NON-SEQuencing Mode)

-OR-

.general case usage .(differences: few) traditional.

The typical usage would not be much beyond the simplest case as described above. This would include more films (implying more materials), multiple deposits of the same or different materials or more processes. In addition, a multiple crystal head with an integral either/or shutter is sometimes used as an input to 2 sensor inputs. Although these configurations represent most systems, the capabilities of the STC2002 are far beyond these necessities.

not supported with this product (no switching with zeroing on a single input, etc.).]

.adding complications (more inputs, relays, crystals, ext. voltages, recorders, comm. terminals,

indexer, etc.)

Examples of added usage complications would be using (or using more) digital inputs, relays, more crystals, more sensor channels, external I/O voltages, strip chart recorders, communication terminals, ebeam source indexer (model: SRT-400), etc. A pendent is supplied for some remote front panel functions and manual mode usage. The pendent plugs into the front panel of the STC-2002 and has a 6 foot coiled cord. A sensor card has 2 identical sensor inputs and 2 identical analog outputs. The 2 analog outputs, in a single sensor card system, are typically used as 1 control output voltage and 1 strip chart output voltage. When multiple sensor cards are used, the strip chart recorder output can be set up on any of the analog outputs but only one strip chart recorder function per system is programmatically allowed. Each of the two analog outputs arrive at the external connector in 2 polarities: isolated and a negative version of the isolated output. A less expensive non-isolated version of the card is TBD? There are slots for 4 sensor cards (1 sensor card is standard in the STC-2002). Crystal sensor and control voltage output usage has been described above. If one of the analog outputs is programmed for strip chart recorder output, a software menu change can convert the strip chart output into a second isolated control voltage output. There is another group of 4 slots for either input cards and/or output cards (1 of each type in the first 2 slots are standard in the STC-2002). Input cards have 8 opto-coupled inputs. Output cards have 8 form C (SPDT) relays. Inputs are typically used to trigger events at some meaningful point in the process or to

Density Z Factor Setpoint Limits Rate Ramp Power/Time Soak Power/Time Deposit Rate Values PID Loop Max Power Values Shutter Parameters Rate Sampling Values Film Fail Mode Xtal Loop Stability/Quality Xtal Life Bounds Graph Plotting Values

Map Select

Pocket Select

[A multiple crystal head that is used as an input to a single sensor input is

Source Power Options Master Tooling Xtals: Start, Backup, Active Xtal Drop Filter Mask Indexer Channel X: Start mode Fail action Backup List Tooling

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indicate to the system user that some point has been reached. Outputs (relays) are typically used to open/close shutters on material sources and crystal sensors, but are also used to control many other valves, relays, solenoids, etc. The card IDs (software addresses) of the PCBs (sensor, input, output cards) are not unique within their types nor are they programmed by hardware or software. It is the location into which they are connected that gives them their unique identity (software address). A communication port is used to interrogate the STC-2002. By using a set of commands, various information can be downloaded or uploaded, front panel control can be simulated, process control can be modified/stopped/started/driven, etc. .other useages (i.e. limp along).

There are also other useages and subuseages. Some other useages would be test mode and rate sample/hold mode. Multiple material co-deposition are also possible with additional hardware and different software described in a different manual.

SECTION 2.2

how does it work ?

crystal osc, crystal sensor

Be forewarned that the general information contained herein is meant only as an overview of the system. The information presented here does not adequately describe the many hazardous situations that could occur brought about by the incorrect constellation of valve states, temperatures, pressures and voltages. The system needs to have safety provisions should inadvertent human intervention cause changes or should a power failure of any or all parts of the system occur. Safety concerns include electrocution and explosion.

techniques) needs a number of components. A vacuum chamber provides the space and environment in which the deposition process will occur. A vacuum is necessary to provide a decreased potential for atomic collisions and contamination (better dispersion with less impurities). Vacuum pumps are needed: roughing pump (starts vacuum), cryogenic pump (provides final high vacuum), etc. Relays, valves and solenoids to control the pumps, pump valves and seal/vent the chamber are needed. A vacuum gauge is needed to monitor the chamber vacuum. Additional vacuum gauges may be used to monitor other points in the vacuum system. At the appropriate pressures, the system user can close/open valves, start the deposition process, etc. A heat/excitation source (electron beam, resistive filament, etc.) to react with the source material to be deposited, the source material itself, a boat, coil or crucible, etc. into which the source material is placed, a power supply for the heat/excitation source, and the target (substrate) material are all needed. A source of water for cooling various components is also needed. An air compressor is necessary to activate solenoid controlled valves, shutters, etc. Various traps can be used to keep gases clean. Crystal sensor[s] and attendant oscillator need to be connected to the STC_2002. Shutters are usually placed to shield the crystal sensors or the source material's evaporant stream, at least during process startup. The STC-2002 typically acts to tie most, or all, of these elements together to control the deposition process. For e-beam use, a sweeper control unit may also be needed. In multipocket e-beam gun systems, a pocket indexer or rotator would also be needed.

The roughing pump creates a low vacuum in the chamber first through the open gate valve, the cryopump and the open rough valve with the purge valve closed. When the desired level of low vacuum is attained, the roughing pump is powered off as the rough valve between the cryopump and roughing pump is closed. The cryopump begins to pump the chamber to a higher vacuum (by condensing gas molecules on an

extremely cold surface of a container). When the cryopump reaches saturation, the gate valve is closed and

the purge valve is opened so that the cryopump can be regenerated (a heater may be needed). After cryopump regeneration is complete (condensed gases have been dissipated), the purge valve is closed, the gate valve is opened and the pump-down to a higher vacuum using the cryopump continues.

vacuum deposition: vacuum chamber, roughing pump, heat source, evaporated material, p.s., cryogenic pump (which condenses gas molecules on an extremely cold surface of a container). uniform deposition of material in a vacuum, material deposition on crystal and target substrate.

A generalized, simple, thin film vacuum deposition system (using physical vapor deposition

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<< crystals 2.2 >>

cal and theory (ch 4, 1

When the chamber is appropriately pumped down, the source material is heated/excited such that molecules become the evaporant stream and are dispersed.

To reiterate, the source material is known as an evaporant when it has reached sufficient temperature/excitation to leave the surface of the source material supply prior to deposition. A vacuum is necessary to provide a decreased potential for atomic collisions and contamination (better dispersion with less impurities). The STC-2002 automatically, as it monitors material deposition rate and thickness, controls the power that generates the evaporant within the bounds of the user-defined parameters and other programming. The STC-2002 is programmed through an LCD screen with a touch panel overlay. All choices are deterministic or bounded by a screen-specified range with software enforcing the range of entry acceptance. The STC-2002 can also be programmed through the communication port. The STC-2002 monitors material deposition rate and thickness by means of the crystal sensor, which occupies the same space as the substrate.

.<< control loop=2-12 >>.

As the deposition process is transpiring within a vacuum chamber, the resonant frequency of a quartz crystal sensor, also exposed to the same evaporant as the substrate within the chamber, accumulates deposited film[s] on its surface. The equation in section x7 describes the relationship between the mass of such a film deposition and the measured frequency of the sensor crystal. Knowing the frequency change due to accumulated mass, the film thickness can be determined. The rate of accumulated material thickness can be calculated using the film thickness along with other elements and progression through time. Contributing factors include crystal sensor placement, material characteristics, etc. The STC-2002 numerically displays rate, thickness and power. It graphically displays rate, power or rate deviation.

Chamber

Gate Valve

Cryopump

Purge Valve Rough Valve

page) [keep ch 4-like intact, repetition ok, use see ch 4 to link].

Roughing Pump

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As the STC-2002 measures the rate of material deposition (in auto deposit mode), it compares this measured value to a user programmed rate setting. If there is a difference between the actual rate and the user programmed rate, the control voltage (from the sensor card) is used to generate a feedback to adjust the deposition source power supply keeping it in compliance with the user programmed rate setpoint value. This method of STC-2002 control has automatic compensation for changing source conditions.

Since there are many different types of deposition power supplies and sources in use today, the deposition control voltage provided by the STC-2002 has been made user configurable: can be wired positive isolated or negative isolated and menu scaled for 2.5, 5 or 10 volts full scale. The sense of the control loop can also be set for either deposition or etching applications by menu programming.

To accommodate the extremely wide range of control loop responses required for the diverse deposition sources available today, a P-I-D type of control loop has been implemented. With this type of control loop available to the user, it should be possible to achieve very good control of any deposition source (see section X3X).

All the control loop parameters interact to some degree in the overall response of the control loop resulting in many combinations of settings that will give equally satisfactory results. Also, the control loop that is optimized for steady state control will have quite different settings from one requiring fast control acquisition with minimal overshoot. By supplying real time rate, rate deviation, or control power to the graph on the STC-2002 RunTime display, determination of control loop settings and performance can be made. By introducing a change into the control system and observing the graphical display responses, it is quite easy to "tune" the control loop. Source response is another contributing control consideration. Sources can be categorized as fast responding (electron beam), medium responding (resistive type boats, baskets, or filaments), or slow responding (Knudsen or induction heated types). User programmable shutter delay can also be used to achieve good deposition rate control before exposing substrates to the evaporant stream. Refer to the I/O programming information later in this section and in section x5x of this manual for a guide on selecting or implementing the logic used to control the substrate and/or sensor shutter[s].

There are several phases during a deposition layer of the STC-2002 related to the source and deposition rate control. There are three main parts to a deposition layer: pre-deposition, deposition control, and post-deposition. The pre-deposition parameters control the source and material conditioning prior to the film deposition. The STC-2002 can control a variety of different types of deposition sources. The typical run cycle phases (rise/soak/rise/soak/shutter delay/deposit/rate ramp/deposit/idle ramp/idle) are for an electron-beam, resistive element or other thermal source. There are also several film parameters (such as DENSITY and Z FACTOR) and associated map parameters (TOOLING, WEIGHT) which relate to the deposition material and sensor calibration. All of these issues will be described in greater detail later in this manual.

.<< co-dep 3-31 >>.

Co-deposition is the running of 2 process layers simultaneously (2 materials, 2 evaporants, 1 or more crystals for each of the 2 co-deposition processes). One of the 2 co-deposition processes will be designated as the one with a final thickness parameter that will terminate the entire co-deposition process. The codeposition process without the final thickness parameter designation will have a parameter specifying its percentage of the thickness rate of the other process. Another parameter unique to co-deposition is codeposition interaction which specifies quantitatively [by] how much each process contributes (is seen by) to the other process (the other crystal sensor). Multiple material co-deposition is possible with additional hardware (2

In addition to the typical configuration of 1 crystal sensor, 1 oscillator, 1 control voltage output, the STC2002 can utilize (by means of the 2 evaporant stream data at various locations, insuring greater repeatability of process control as well as better process control (compensating for the vicissitudes of the evaporant stream in location and in time). A number of user programmable parameters effect multiple sensor depositions. Review Source Sensor Map

set of LED/LCD displays) and different software that is described in a different manual.

.<< multi-sensor dep >>.

sensor channel and optional sensor cards) multiple sensors to acquire

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+ 248 hidden pages