INFICON SID-242 User Manual

SID-242

Thin Film Deposition Controller

SQS-242

Deposition Control Software

Version 3.00

User’s Guide

Sigma

instruments



Safety Information

Read this manual before installing, operating, or servicing equipment. Do not install substitute parts, or perform any unauthorized modification of the product. Return the product to Sigma Instruments for service and repair to ensure that safety features are maintained.

Safety Symbols

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AUTION: Calls attention to a procedure, practice, or condition that could

possibly cause damage to equipment or permanent loss of data. Refer to all manual Warning or Caution information before using this product

to avoid personal injury or equipment damage. Hazardous voltages may be present.

Earth ground symbol.

Chassis ground symbol.

Equipotential ground symbol.

Warranty Information

This Sigma Instruments product is warranted against defects in material and workmanship for a period of 2 years from the date of shipment, when used in accordance with the instructions in this manual. During the warranty period, Sigma Instruments will, at its option, either repair or replace products that prove to be defective.

Limitation of Warranty

Defects from, or repairs necessitated by, misuse or alteration of the product, or any cause other than defective materials or workmanship are not covered by this warranty. NO OTHER WARRANTIES ARE EXPRESSED OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. UNDER NO CIRCUMSTANCES SHALL SIGMA INSTRUMENTS BE LIABLE FOR CONSEQUENTIAL OR OTHER DAMAGES RESULTING FROM A BREACH OF THIS LIMITED WARRANTY, OR OTHERWISE.

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The purchaser may return this product in new condition within 30 days after shipment for any reason. In case of return, purchaser is liable and responsible for all freight charges in both directions.

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Table of Contents

Chapter 1 Introduction

1.0 SID-242 Introduction ........................................................................................1-1

1.1 SRC Series Computer ......................................................................................1-1

1.2 SQM-242 Deposition Control Card ...................................................................1-2

1.3 SQS-242 CoDeposition Control Software ........................................................1-2

1.4 Digital I/O .........................................................................................................1-3

Chapter 2 Quick Start

2.0 Introduction ......................................................................................................2-1

2.1 Installation ........................................................................................................2-1

2.2 Front Panel ......................................................................................................2-2

2.3 Program Startup ...............................................................................................2-3

2.4 Single Layer Process Setup .............................................................................2-4

2.5 Single Layer Process Simulation ......................................................................2-8

2.6 SoftKey Functions ............................................................................................2-10

2.7 Multi-Layer CoDeposition Process ...................................................................2-11

2.8 Conclusion .......................................................................................................2-15

Chapter 3 SQS-242 Software

3.0 Introduction ......................................................................................................3-1

3.1 Installation and Registration .............................................................................3-2

3.2 Operation .........................................................................................................3-2

3.3 File Menu .........................................................................................................3-4

3.4 Edit Menu .........................................................................................................3-5

3.4.1 Processes....................................................................................................3-6

Layers .....................................................................................................3-7

Rate Ramps ............................................................................................3-9

Deposition ...............................................................................................3-10

Conditioning ............................................................................................3-12

Sources and Sensors ..............................................................................3-13

3.4.2 Films ............................................................................................................3-15

3.4.3 Materials ......................................................................................................3-16

Chapter 3 SQS-242 Software (continued)

3.4.4 System ........................................................................................................3-17

Sensors ...................................................................................................3-17

Sources ...................................................................................................3-18

Digital I/O .................................................................................................3-19

PLC Setup ...............................................................................................3-22

SQM-242 Setup .......................................................................................3-23

RS232 Setup ...........................................................................................3-24

3.4.5 Security .......................................................................................................3-25

3.5 View Menu .......................................................................................................3-27

3.6 Specifications ...................................................................................................3-28

Chapter 4 SQM-242 PC Card

4.0 Introduction ......................................................................................................4-1

4.1 Installation ........................................................................................................4-2

4.2 Sensor Connections .........................................................................................4-4

4.3 Power Supply Connection ................................................................................4-4

4.4 TroubleShooting ...............................................................................................4-4

4.5 Demo Programs ...............................................................................................4-7

4.6 SQM32C.DLL ...................................................................................................4-7

4.7 Specifications ...................................................................................................4-7

Chapter 5 Digital I/O

5.0 Introduction ......................................................................................................5-1

5.1 PLC Installation ................................................................................................5-2

5.2 PLC Setup and Test .........................................................................................5-3

5.2 PLC Programming ............................................................................................5-4

Chapter 6 Computer Interface

6.0 Introduction ......................................................................................................6-1

6.1 Serial Interface .................................................................................................6-1

6.2 Ethernet Interface .............................................................................................6-1

6.3 SQS-242 Comm Program ................................................................................6-2

6.4 Protocol ............................................................................................................6-3

6.5 Command Summary ........................................................................................6-5

Appendix

A. Material Parameters B. Loop Tuning

Chapter 1 Introduction

1.0 Introduction

This manual covers both the hardware and software associated with the SID-242 Thin Film Deposition Controller. The SID-242 consists of four main elements, integrated into a complete deposition control system:

SRC Series Rack-mount Computer SQM-242 PC Card(s) SQS-242 Windows CoDeposition Software PLC for Digital I/O (option)

While the focus of this manual is on the SID-242 Controller package, it also covers each of these components separately. If you have purchased only the SQS-242 Software and/or the SQM-242 Card, we suggest that you also review Chapters 1 and 2 of this manual for important information.

1.1 SRC Series Computer

Sigma’s SRC Series computers are Celeron (or better) class computers running the Windows operating system. The SRC computer series uses standard off-the-shelf components and Sigma’s custom rack-mount chassis to provide a compact, low cost instrument.

Included in the 5.25” or 7” high rack-mount chassis are an LCD Display, a TouchPad pointing device, a setting Knob, and six SoftKeys. A keyboard is provided for initial setup, but is not necessary for normal operation of the SQS-242 deposition control software. An optional rack-mount keyboard is also available.

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Chapter 1 Introduction

1.2 SQM-242 Deposition Control Card

Sigma’s SQM-242 is a PCI expansion card for use in computers running the Windows operating system. Each card measures up to four quartz sensors via BNC inputs, and supplies the control signal for two evaporation sources via a dual phone plug output. Up to two cards can be installed in a computer, creating an eight input, four output, codeposition controller.

The SQM-242 card is supplied with demonstration software written in Visual Basic and LabView, including complete source code. The SQM-242 card and a Windows based computer form a basic deposition control system (without digital I/O capabilities).

1.3 SQS-242 CoDeposition Control Software

Included with the SID-242 is Sigma’s SQS-242 software, a Windows-based program that provides all of the functions required for an eight sensor, four output, codeposition controller. It is optimized for use with the Setting Knob and six SoftKeys of our SID-242 controller. However, it will run on any Win98 or later system with our SQM-242 card installed.

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Chapter 1 Introduction

The six SoftKeys provide easy access to the common operating functions. A single tabbed dialog box provides all of the settings required for a thin film process. Material parameters, sensor/source setup, pre/post conditioning, and error conditions are all visible on a single screen. Process settings, numeric data, and graphical displays are displayed during all phases of deposition.

The SQS-242 software stores process parameters in a Microsoft Access compatible database. This provides virtually unlimited access to desktop tools for building and analyzing thin film processes.

The SQS-242 software can be controlled from another computer using the RS-232 or Ethernet command protocol.

1.4 Digital I/O

Digital I/O for the SID-242 is provided through an inexpensive, external, programmable logic controller (PLC). This allows the PLC, and the associated I/O wiring, to be placed in a convenient location in a wiring cabinet. A single, serial communications cable runs to the SID-242 computer. The PLC provides electrical isolation, fail-safe operation, and extensive I/O processing capabilities through its ladder logic programming.

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Chapter 1 Introduction

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Chapter 1 Quick Start

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Chapter 2 Quick Start

2.0 Introduction

This section covers the minimum system connections and initial setup required to run the SID-242 Deposition Controller. Consult later chapters of this manual for more detailed setup and operational instructions.

2.1 Installation

All electrical connections to the SID-242 are made at the back panel of the instrument. WARNING: Care should be exercised to route SID-242 cables as far as practical from

other cables that carry high voltages or generate noise. This includes other line voltage cables, wires to heaters that are SCR-controlled, and cables to source power supplies that may conduct high transient currents during arc down conditions.

Rack Installation

Power Connection

Sensor Input Connections

Source Output Connections

Digital I/O Connections

Keyboard Connection

The SID-242 occupies a 5.25” high (4U) rack space. Install the unit in a 19” rack with the supplied hardware.

ARNING: Verify that the Voltage Selector Switch, located next

to the power switch, matches your mains supply voltage. WARNING: Verify that the power cable provided is connected to

a properly grounded mains receptacle. Connect the BNC cables and oscillators from your vacuum

chamber feedthrough to the desired SQM-242 Card Input(s). Refer to Chapter 4 for detailed instructions on system hookup to the SQM-242 card(s).

Connect the dual phone plug from the SQM-242 output jack to your evaporation supply control input. Refer to Chapter 4 for detailed instructions on wiring the SQM-242 output phone plug.

Digital I/O is not required for initial operation of the SID-242. Perform initial setup and checkout of the SID-242 before connecting your digital I/O. Refer to Chapter 5 for detailed information on wiring the SID-242 for digital I/O.

A keyboard is supplied for initial user setup of Windows. Attach the keyboard to the keyboard input jack on the rear of the SID-242. Once Windows is setup, use of the keyboard is optional.

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Chapter 2 Quick Start

2.2 Front Panel

Floppy Disk SoftKeys TouchPad Control Knob

Front Panel Controls

KeyLock

SoftKeys

TouchPad

Control Knob

Floppy Disk

Keyboard (not shown)

Insert key and turn clockwise to enable the power and reset buttons. Turn counterclockwise to disable the power and reset.

Provide basic instrument operations within the SQS-242 deposition program. The SoftKeys are functional only in programs written specifically for the SRC computer.

Provides mouse functions in all Windows programs, including the SQS-242 software. Move your index finger along the touchpad surface to move the cursor. Press the left or right buttons below the touchpad surface to “click.”

Used to adjust values within the SQS-242 software. Pushing the control knob stores the current setting, and moves to the next setting. Functional only in programs written specifically for the SRC computer.

1.44 MB floppy disk for upgrades, backup, and data storage/transfer.

Required for Windows data entry, and useful during initial SID242 setup. Not required for SQS-242 software operation. The F1 through F6 keys on the keyboard provide the same functions as the six SoftKeys on the front panel.

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Chapter 2 Quick Start

2.3 Program Startup

This section will start the SID-242 and run the SQS-242 deposition control program.

Power On the Computer

Start the Program

User Login Screen

Process Database

Main Display

Insert the and turn clockwise to enable the power and reset buttons. Push the power button to start the computer.

The SID-242 will boot Windows from the internal disk and start the SQS-242 deposition program. If the SQS-242 program does not start automatically, use the touchpad to double-click the desktop icon.

Note: If you are prompted to register the software, just press Cancel for now.

Note: The SID-242 ships with one pre-assigned user. The user name is Super, with no Password.

The SID-242 displays a progress bar during program startup, then a User Login screen. Select a User Name from the drop down box, enter the Password, then click OK.

See Chapter 3 for more information on users, passwords, and access levels and registartion.

The SID-242 normally starts with the last active process database. If that database is not found, a Database Open dialog will be displayed. Use the touchpad to navigate to the desired database.

The main display shows a set of labels associated with the function of the six SoftKeys. As you operate the SID-242, these labels will change to display appropriate functions. Along the top of the display is a menu of less commonly used functions. This menu is available only when the SID-242 is stopped (i.e. not running a deposition process).

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Chapter 2 Quick Start

Simulate Mode

Simulate mode allows you to familiarize yourself with SID-242 operation, and test process recipes. If the first SoftKey is labeled “START SIMULATE” then the Simulate mode is active.

If the first SoftKey is labeled “START PROCESS" then normal mode is selected. Use the touchpad to select the Setup menu, then click System. On the SQM-242 tab, click the Simulate option button. Click the “Save” SoftKey label, or press the top SoftKey to activate Simulate mode.

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Chapter 2 Quick Start

2.4 Single-Layer Process Setup

A thin-film deposition process consists of one or more layers of material evaporated onto a substrate. Let’s build a simple single-layer process.

Open Process Edit

Add A New Process

Edit Film

Edit Rate and Thickness

Use the touchpad to click on the “Edit” menu selection along the top of the display, then click “Process.” The Process Edit dialog will display the setup for the last process run. To better understand process setup, see section 3.4.1.

Click the “New” button in the dialog box. An on-screen keyboard appears, displaying the next numbered Process. Click “Backspace” several times to delete the name. Now “type” a new Process name using the touchpad and on-screen keyboard. Click “Enter” to save the new name.

Click the “Layer” tab to assure the layer parameters are displayed. Select “Gold Sample” in the Film dropdown box.

Click the “Initial Rate” setting, and then use the Control Knob to adjust the Initial Rate to 10 Å/s. Adjust the “Final Thickness” to

1.000 kÅ.

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Chapter 2 Quick Start

The diagram below illustrates a complete deposition cycle for a single layer. Refer to this diagram as we set the remaining process setup parameters.

Edit Rate Ramps

Edit Pre/Post Conditioning

It may be desirable to vary the deposition rate during a layer. For example, to deposit slowly at first, then more quickly once the initial material is deposited. Click the “Rate Ramps” tab, then click “Insert Ramp.” Adjust the “Start Thickness” to 0.400 kÅ, “Ramp Time” to 5 seconds, and “New Rate” to 15 Å/s.

Before deposition begins, the source material is often brought to a ready state by raising the evaporation source power. Select the “Condition” tab and set each parameter to the values shown below.

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Chapter 2 Quick Start

Edit Deposition

Select the “Deposition” tab. This tab establishes the gain (P Term), time constant (I Term), and dead time (D Term) for your process. Set these values to 55, .7, and 0 respectively.

Be sure Shutter Delay Enabled is not selected. Select Ignore for Control Error, and Continuous for Rate Sampling (see picture below).

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Chapter 2 Quick Start

Edit Source/Sensor

Select the “Source/Sensor” tab. This tab contains parameters associated with the physical layout of your evaporation system. For now, be sure that “Output 1” is selected and “Max Power” and “Slew Rate” are set to 100. Set the “Tooling” value to 100. Leave the Source Index as it is.

Save Edits

Your new single-layer process is now the active process in the main window. Notice the process, layer, and time information above the graph.

Click “Close Form” or press the first SoftKey to save this onelayer process. If you are prompted “Do you want to change….,” answer Yes to make this the current process.

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Chapter 2 Quick Start

2.5 Single-Layer Process Simulation

If you have followed this chapter, you are ready to simulate a deposition process.

Setup Displays

Start Process

The process will start with preconditioning (i.e. Ramp1, Soak1, Ramp2, Soak2) as shown below. Once preconditioning is complete, the process will enter the Deposit phase. You may want to select “ABORT SIMULATE,” then “START SUMULATE” several times to familiarize yourself with the on-screen displays during preconditioning. You may also want to use the settings ribbon to adjust parameters while the process is running.

Click the “View” menu and assure that these options are selected: Film Settings, Film Readings, and Automatic. Note that the settings “ribbon” along the right displays the preconditioning parameters you entered in the previous section.

Verify that the top SoftKey label displays “START SIMULATE.” If “START PROCESS” is displayed, follow the instructions at the end of Section 2.2 to enable simulate mode. Press the “START SIMULATE” SoftKey, or click the label, to start the process.

Preconditioning Phases

Because we selected “Automatic,” in the View menu, the graph displays Output Power during preconditioning, then switches to Rate during the deposition phase.

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Chapter 2 Quick Start

As shown below, the initial deposition rate was 10 Å/s until a thickness of .400 kÅ. Then the deposition rate was ramped up to 15 Å/s, and held until the desired final thickness of 1.000 kÅ is achieved. At this point, this single-layer process is finished.

Deposition Phase with one Rate Ramp

You should adjust the PID parameters on the setting ribbon, then Start/Stop the process several times to become familiar with their effect on control loop response.

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Chapter 2 Quick Start

2.6 SoftKey Functions

As you have seen, the SoftKey functions remain constant during deposition. Spend a few minutes to become familiar with each of these SoftKey functions.

START PROCESS

ABORT PROCESS

START LAYER

STOP LAYER

NEXT LAYER

AUTO->MAN

MAN->AUTO

ZERO

NEXT FILM

NEXT SETTING

Starts the first layer of a process when START is pushed. If AUTO->MAN is shown on the third SofKey (AUTO Mode) the process starts PreConditioning. If MAN->AUTO is shown on the third Softkey (MANUAL mode) the process immediatly starts Deposition under PID loop control.

Aborts the process. The process can only restart at the first layer.

Starts a stopped layer, or a layer that has been designated “Manual Start” in the process database. Starts the layer based on the state of the AUTO->MAN SoftKey as described above.

Stops the current layer. Also changes the function of the first SoftKey to NEXT LAYER.

Abandons the current layer and moves to the next layer in the process. If it is the last layer of a process, the same as pushing ABORT PROCESS.

When AUTO->MAN is pushed, the source output is set to manual control.. You may adjust the output using the settings ribbon. Because the PID loop is not running, you can manually set the output power to different levels and observe the associated deposition rate.

Returns the output to PID loop control. If the process is running (ABORT PROCESS and STOP LAYER shown on the first two SoftKeys) depsoition continues. If the process is stopped, sets the output to zero and awaits a start command.

Resets the thickness reading to zero.

Sequences the setting ribbon through each Film in a codeposition layer.

When the settings ribbon is shown, sequences the setting knob action through each of the displayed parameters.

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Chapter 2 Quick Start

2.7 Multi-Layer CoDeposition Process

Our final example builds on the previous sections. If you have modified the setup of your process, return to Section 2.4 and adjust the process to those values. When your single-layer process matches Section 2.4, complete these steps:

Duplicate a Layer

Select a CoDep Film

Add a CoDep Layer

Open the Edit Process dialog. Click on Layer 1, click the “Layer” tab, then click “Copy Layer.” Now click “Paste Layer.” A duplicate Gold Sample film will be added as Layer 2. Click “Paste Layer” again to add a third Gold Sample layer.

Select Layer 3 in the layers list. Now select “Silver Sample” in the films dropdown. The layers list will update to show the new Silver Sample film assigned to Layer 3.

Select Layer 3 in the layers list, then click “Cut Layer.” Now select Layer 1. Click “Paste CoDep.” The Silver Sample film will be added below Gold Sample as a codeposition layer. (Your setup should match the picture below.)

We now have two layers in our process. Layer 1 has Gold being deposited from source Output 1 and Silver is being codeposited on Output 2. Layer 2 is Gold alone.

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Chapter 2 Quick Start

Hint: It’s usually best to copy a layer, then paste several temporary layers of that type. Next, assign the films that you want to each of the pasted layers. When selecting films for codeposition, remember that each film in a codeposited layer must be assigned to a different source output! Now use “Cut Layer” on the temporary layers, and “Paste CoDep” to assign the film to the desired codeposition layers. Review this example until you are comfortable with these concepts.

Edit Layer 1 Rate & Thickness

Edit Layer 2 Rate & Thickness

Set Layers to Auto Start

Click Silver Sample in the list of layers. Set “Initial Rate” to 15 Å/s, “Final Thickness” to 1.000 kÅ. Click the Rate Ramps tab and adjust “Start Thickness” to 0.400 kÅ, “Ramp Time” to 15 seconds, and “New Rate” to 0 Å/s.

Click the Layer Tab, then click Layer 2. Set Final Thickness to .5000 kÅ.

At the end of deposition, you may choose to have the next layer wait for a Start Layer command, or to start automatically. Select each Layer in the layers list, then click Auto to set that layer to start automatically.

Verify that your process matches the one shown above.

Edit Silver Deposition

Select the “Deposition” tab and the Silver Sample layer. Set each parameter to the values shown below.

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Chapter 2 Quick Start

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Chapter 2 Quick Start

Edit Silver Conditioning

Select the “Condition” tab and the Silver Sample layer. Set each parameter to the values shown below.

Save Edits

Start Process

Preconditioning of the two materials is entirely independent. If the preconditioning of one layer takes longer than the other, the start times are adjusted so that the end times coincide.

When preconditioning ends, codeposition of the two materials begins.

Click “Close Form” or press the first SoftKey to save this twolayer codeposition process. Answer Yes if it displays the “Do you want to change….” message box to make this the current process.

Press the “START SIMULATE” SoftKey to start the first layer preconditioning phases. Note that two outputs are displayed for this codeposition layer.

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Chapter 2 Quick Start

Your response should be similar to the graph shown below (your vertical scale may be slightly different). The slight ringing on the waveforms indicates some further tuning may be desired. However, this is an example of a reasonably well tuned loop.

At .400kÅ thickness, the Silver Sample deposition rate ramps down from 15Å/s to 0. Similarly, at .400 kÅ thickness the Gold Sample film ramps to a higher deposition rate of 15Å/s. Because the initial rate for Gold was set lower than the initial rate for Silver, Gold reached its .400 kÅ thickness rate ramp trigger later in the deposition cycle.

Try a P Term in the 25-30 range (less gain) for both Gold and Silver to decrease the loop susceptibility to noise. Increasing the I Term a little, say toward 1.0, will lessen overshoot during rate changes. The D term can be thought of as a “dead band” term. Most systems require little or no D term.

2.8 Conclusion

Once again, spend some time with this process to become familiar with its setup, and the effect of changes on deposition performance.

Because we selected Simulate Mode at the beginning of this Quick Start session, the SQM-242 card is “faking” an actual process. You can use the Simulate feature at any time to become familiar with SID-242 operation, and the effect of various settings on process performance. It is also a very useful feature for pre-testing your process setups. Return to the Setup menu, then select System and set the Mode to Normal to begin running your process with the SID-242 controller.

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Chapter 2 Quick Start

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