HP HLMA-PH00, HLMA-PL00, HLMA-QH00, HLMA-QL00, HLMT-PH00 Datasheet
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H
Subminiature High Performance
AlInGaP LED Lamps
Technical Data
Features
•Subminiature Flat Top Package
Ideal for Backlighting and Light Piping Applications
•Subminiature Dome Package
Nondiffused Dome for High Brightness
•Wide Range of Drive Currents
•Colors: 590 nm Amber, 615 nm Reddish-Orange
•Ideal for Space Limited Applications
•Axial Leads
•Available with Lead Configurations for Surface Mount and Through Hole PC Board Mounting
Description
Flat Top Package
The HLMX-PXXX flat top lamps use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications.
SunPower Series HLMA-PH00 HLMT-PH00 HLMA-PL00 HLMT-PL00 HLMA-QH00 HLMT-QH00 HLMA-QL00 HLMT-QL00
Dome Packages
The HLMX-QXXX dome lamps use an untinted, nondiffused lens to provide a high luminous intensity within a narrow radiation pattern.
Lead Configurations
All of these devices are made by encapsulating LED chips on axial lead frames to form molded epoxy subminiature lamp packages. A variety of package configuration options is available. These include special surface mount lead configurations, gull wing, yoke lead, or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm (0.200 inch) center spacing are available for through hole mounting. For more information refer to Standard SMT and Through Hole Lead Bend Options for Subminiature LED Lamps data sheet.
Technology
These subminiature solid state lamps utilize one of the two newly
developed aluminum indium gallium phosphide (AlInGaP) LED technologies, either the absorbing substrate carrier technology (AS = HLMA-Devices) or the transparent substrate carrier technology (TS = HLMTDevices). The TS HLMT-Devices are especially effective in very bright ambient lighting conditions. The colors 590 nm amber and 615 nm reddish-orange are available with viewing angles of 15° for the domed devices and 125° for the flat top devices.
5964-9364E |
1-161 |
Device Selection Guide
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Viewing Angle |
Amber |
Reddish-Orange |
Package |
Package Description |
2θ1/2 |
λd = 590 nm |
λd = 615 nm |
Outline |
Domed, Nondiffused |
28° |
HLMA-QL00 |
HLMA-QH00 |
B |
Untinted |
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HLMT-QL00 |
HLMT-QH00 |
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Flat Top, Nondiffused, |
125° |
HLMA-PL00 |
HLMA-PH00 |
A |
Untinted |
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HLMT-PL00 |
HLMT-PH00 |
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Package Dimensions
(A) Flat Top Lamps
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1.40 (0.055) |
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0.50 (0.020) REF. |
1.65 (0.065) |
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CATHODE |
1.14 (0.045) |
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0.58 (0.023) |
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11.68 |
(0.460) |
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0.43 (0.017) |
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10.67 |
(0.420) |
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1.40 (0.055) |
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BOTH SIDES |
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1.91 (0.075) |
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2.41 (0.095) |
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0.46(0.018) |
0.76 (0.030) MAX. |
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ANODE |
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0.56(0.022) |
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1.65 (0.065) DIA. |
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CATHODE |
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0.25 (0.010) MAX. |
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STRIPE |
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1.91 (0.075) |
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0.18 (0.007) |
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2.08 (0.082) |
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NOTE 2 |
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1.91 (0.075) |
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0.20 (0.008) MAX. |
0.23 (0.009) |
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2.34 (0.092) |
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2.16 (0.085) |
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(B) Domed Lamps, Diffused and Nondiffused
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0.18 (0.007) |
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0.76 (0.030) |
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0.89 (0.035) R. |
0.94 (0.037) |
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0.50 (0.020) REF. |
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0.23 (0.009) |
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CATHODE |
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1.24 (0.049) |
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11.68 |
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(0.460) |
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10.67 |
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(0.420) |
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2.03 (0.080) |
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BOTH SIDES |
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1.78 (0.070) |
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2.92 (0.115) |
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MAX. |
ANODE |
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0.46 (0.018) |
0.79 (0.031) |
0.63 (0.025) |
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CATHODE |
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1.65 (0.065) DIA. |
0.56 (0.022) |
0.38 (0.015) |
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0.53 (0.021) |
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STRIPE |
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1.91 (0.075) |
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0.25 (0.010) MAX. |
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1.91(0.075) |
2.08(0.082) |
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0.20 (0.008) MAX. |
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NOTE 2 |
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2.34(0.092) |
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2.16(0.085) |
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NOTES:
1.ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2.PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.
1-162
Absolute Maximum Ratings at TA = 25°C
HLMA-QL00/QH00/PL00/PH00
Peak Forward Current[2] ........................................................... |
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200 mA |
Average Forward Current (I |
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= 200 mA)[1,2] |
......................... 45 mA |
PEAK |
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DC Forward Current[3,5,6] ........................................................... |
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50 mA |
Power Dissipation .................................................................... |
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105 mW |
HLMT-QL00/QH00/PL00/PH00 |
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Peak Forward Current[2] ........................................................... |
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100 mA |
Average Forward Current (I |
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= 100 mA)[1,2] ......................... |
37 mA |
PEAK |
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DC Forward Current[3,5,6] ........................................................... |
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50 mA |
Power Dissipation .................................................................... |
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120 mW |
All Devices |
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Reverse Voltage (IR = 100 μA) |
........................................................ |
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5 V |
Transient Forward Current (10 μs Pulse)[5] .............................. |
500 mA |
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Operating Temperature Range ....................................... |
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- 40 to +100°C |
Storage Temperature Range .......................................... |
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- 55 to +100°C |
LED Junction Temperature .......................................................... |
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110°C |
Lead Soldering Temperature |
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260 ° C for 5 seconds |
[1.6 mm (0.063 in.) from body .......................... |
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SMT Reflow Soldering Temperatures |
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Convective Reflow ............. |
235°C Peak, above 183°C for 90 seconds |
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Vapor Phase Reflow ........................................... |
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215 ° C for 3 minutes |
Notes:
1.Maximum IAVG at f = 1 kHz.
2.Refer to Figure 6 to establish pulsed operating conditions.
3.Derate linearly as shown in Figure 4.
4.The transient peak current is the maximum non-recurring peak current these devices can withstand without damaging the LED die and wire bonds. Operation at currents above Absolute Maximum Peak Forward Current is not recommended.
5.Drive currents between 5 mA and 30 mA are recommended for best long term performance.
6.Operation at currents below 5 mA is not recommended, please contact your HewlettPackard sales representative.
1-163
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