HP HFBR-5113FDA, HFBR-5112FDS, HFBR-5112FDN, HFBR-5112FDM, HFBR-5112FDB Datasheet

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Low Cost, Industry Standard

FDDI MIC Transceivers

Technical Data

HFBR-5111 (2x11)

HFBR-5112 (Narrow 1x13)

HFBR-5113 (Standard 1x13)

Features

• Full Compliance with the

FDDI PMD Standard

• Full Compliance with the

Optical Performance

Requirements of the ATM

100 Mbps Physical Layer

• Full Compliance with the

Optical Performance

Requirements of the Fast

Ethernet Physical Layer

• Multisourced Package Style

with:

- 2x11 or 1x13 Pin

Configuration

- MIC Receptacle

- Field Changeable Keying

• Wave Solder and Aqueous

Wash Process Compatible

Package

• Internal Shielding for Low

EMI Emissions and High

EMI Immunity

• Single +5V Power Supply

• Shifted ECL Logic Interface

Directly Compatible with

FDDI PHY Circuits

• Manufactured in an ISO

9001 Certified Facility

Applications

• FDDI Concentrators,

Bridges, Routers, and

Network Interface Cards

• 100 Mbps ATM Interfaces

• Fast Ethernet Interfaces

• Point-to-Point Data

Communications

• Replaces DLX2012-FD and

DLX2020-FD Model

Transceivers

Description

The HFBR-511X family of trans-

ceivers from Hewlett-Packard

consists of high performance,

cost effective modules for optical

data communication applications

at the 100 Mbps/125 MBd rate.

The transceivers feature full

compliance with the Fiber

Distributed Data Interface (FDDI)

Physical Media Dependent (PMD)

standard. This standard has been

approved as an International

Standard, ISO/IEC 9314-3, and

an American National Standard,

ANSI X3.166 - 1990. The HFBR-

5111 represents the 2x11

package style. The “2x11”

denotes two rows of eleven pins.

The HFBR-5112 and HFBR-5113

represent the Narrow and

Standard 1x13 package styles,

respectively. The “1x13” denotes

one row of thirteen pins.

The modules are designed for 50

or 62.5 µm core multimode

optical fiber and operate at a

nominal wavelength of 1300 nm.

Each transceiver incorporates

our high-performance, reliable,

long-wavelength optical devices

and proven circuit technology to

give long life and consistent

performance.

The transceivers are optimized

for 125 MBd operation but can be

used over a wide range of signal

rates. The transceivers are

guaranteed to meet FDDI PMD

specifications when used within

the operating conditions specified

in this document.

These HFBR-511X Series trans-

ceivers are also useful for both

ATM 100 Mbps interfaces and

Fast Ethernet 100 Base-FX

interfaces. The ATM Forum User-

Network Interface (UNI)

Standard, Version 3.0, defines the

Physical Layer for 100 Mbps

Multimode Fiber Interface for

ATM in Section 2.3 to be the

5964-9019E (2/96)

FDDI PMD standard. Likewise,

the Fast Ethernet Alliance defines

the Physical Layer for the 100

Base-FX Version of IEEE 802.3u

to be the FDDI PMD standard.

Hewlett-Packard also provides

several other FDDI products

compliant with the FDDI Low

Cost Fiber (LCF) -PMD and

Single Mode (SM) -PMD

standards. These products are

available with ST, SC, and FC

connector styles. They are

available in the 1x9 transceiver

and 14- and 16-pin transmitter/

receiver package styles for those

designs that require these

alternate configurations. Contact

your Hewlett-Packard sales

representative for information on

these alternative FDDI products.

Transmitter Section

The transmitter section of the

HFBR-511X Series utilizes a 1300

nm surface emitting InGaAsP

LED. The LED is packaged in the

optical subassembly portion of

the transmitter section. It is dc-

coupled to a custom IC which

converts differential-input, PECL

logic signals, ECL referenced

(shifted) to a +5 V power supply,

into an analog LED drive current.

Receiver Section

The receiver section of the

HFBR-511X Series utilizes an

InGaAs PIN photodiode coupled

to a custom silicon transimped-

ance preamplifier IC. They are

packaged in the optical sub-

assembly portion of the receiver.

The PIN/preamplifier combina-

tion is ac-coupled to a custom

quantizer IC which provides the

final pulse shaping for the logic

output and the Signal Detect

function. Both the Data and

Signal Detect outputs are

differential. Also, both Data and

Signal Detect outputs are PECL

compatible, ECL referenced

(shifted) to a +5 V power supply.

Package

The overall package concept for

the HP transceiver consists of the

following basic elements: two

optical subassemblies, an

electrical subassembly, and the

housing with full compliance to

the FDDI PMD standard. A block

diagram is illustrated in Figure 1.

The package outline drawings

and pin-outs are shown in Figures

2 and 3. These are compliant with

the industry standard 2x11 and

1x13 pin configurations.

The optical subassemblies utilize

a high-volume assembly process

together with low-cost lens

elements which result in a cost-

effective building block.

The electrical subassemblies

consist of a high-volume, multi-

layer printed circuit board on

which the IC chips and various

surface-mounted passive circuit

elements are attached.

Each transceiver package

includes internal shields for the

electrical and optical subassem-

blies to ensure low EMI emissions

and high immunity to external

EMI fields.

The outer housings including the

MIC receptacles are molded of

filled non-conductive plastic to

provide mechanical strength and

electrical isolation. The solder

posts of each package design are

isolated from the circuit design of

the transceiver and do not require

connection to a ground plane on

the circuit board.

Each transceiver is attached to its

printed circuit boards with the

2x11 or 1x13 signal pins and the

solder posts which exit the

bottom of the housing. The solder

posts provide the primary

mechanical strength to withstand

the loads imposed on the

transceiver when mating with

MIC-connectored fiber cables.

Application Information

The Applications Engineering

group of the Optical Communica-

tion Division is available to assist

you with the technical under

Figure 1. HFBR-5111/-5112/-5113 Block Diagram.

DATA OUT

SIGNAL

DETECT OUT

DATA IN

ELECTRICAL SUBASSEMBLY

QUANTIZER IC

DRIVER IC

TOP VIEW

PIN PHOTODIODE

OPTICAL

SUBASSEMBLIES

LED

PREAMP

DIFFERENTIAL

MEDIA INTERFACE CONNECTOR

RECEPTACLE

39.94

(1.533)

LATCH

POINTS

33.02

(1.300)

MAX.

2.54

(0.100)

TYP.

34.46 (1.357)

29.00 (1.142)

13X ∅

LEADS

0.48

(0.019)

2X ∅

1.00

(0.039)

2X ∅

SOLDER POSTS

1.52

(0.060)

22.86

(0.900)

19.99

(0.787)

24.86

(0.979)

OPTICAL

REFERENCE

PLANE

5.79

(0.228)

9.14

(0.360)

41.30

(1.626)

16.00

(0.630)

MAX.

2X ∅

3.00

(0.118)

PLUG – REF.

66.16

(2.605)

MAX.

35.80

(1.409)

MAX.

2.95

(0.116)

3.68

(0.145)

0.80

(0.031)

11.87

(0.467)

9.40

(0.370)

MAX.

FDDI KEY

LOCATION

PART NUMBER

DATE CODE

COUNTRY OF ORIGIN

30.48 (1.200)

NOTES:

1. ALL DIMENSIONS ARE MILLIMETERS OVER INCHES.

2. ALL DIMENSIONS ARE NOMINAL UNLESS OTHERWISE SPECIFIED.

3. THE LEADS ARE TIN-LEAD PLATED PHOSPHOR BRONZE.

4. THE POSTS ARE TIN-LEAD PLATED BRASS.

5. THE HOUSING IS GLASS FIBER FILLED BLACK POLYETHERIMIDE.

6. THE MODULE IS SHOWN WITHOUT THE FIELD KEY INSTALLED.

PART NUMBER

DATE CODE

COUNTRY OF ORIGIN

35.80

1.409

MAX.

82.5

3.248

MAX.

2.54

0.100

TYP.

5.08

0.200

78.87

3.105

LATCH

POINTS

2.95

0.116

2.95

0.116

0.85

0.034

11.87

0.467

9.40

0.370

MAX.

FDDI KEY

LOCATION

33.02

1.300

MAX.

35.56

1.400

40.64

1.600

44.45

1.750

45.72

1.800

OPTICAL

REFERENCE

PLANE

81.32

3.202

63.5

2.500

1.52

0.060

SQ.2X

16.00

0.630

MAX.

PLUG – REF.

ACCEPTS SELF TAPPING

2X – M2X0.4 SCREW FOR

OPTIONAL MOUNTING

1.91

0.075

MAX.

2.54

0.100

1.22

0.050

X4X

1.52

0.060

3.80

0.150

34.34

1.352

30.48

1.200

1.50

0.060

4X SOLDER POSTS

0.48

0.019

22X LEADS

Figure 2(a). HFBR-5111 Outline Drawing.

Figure 2(b). HFBR-5112 Outline Drawing.

Figure 2(c). HFBR-5113 Outline Drawing.

46.56

(1.833)

LATCH

POINTS

33.02

(1.300)

MAX.

2.54

(0.100)

TYP.

38.10 (1.500)

34.46 (1.357)

29.00 (1.142)

13X ∅

LEADS

0.48

(0.019)

2X ∅

1.00

(0.039)

4X ∅

SOLDER POSTS

2.00

(0.079)

15.24

(0.600)

15.24

(0.600)

12.37

(0.487)

17.24

(0.679)

OPTICAL

REFERENCE

PLANE

13.41

(0.528)

16.76

(0.660)

48.92

(1.926)

16.00

(0.630)

MAX.

4X R

2.80

(0.110)

2X ∅

3.00

(0.118)

PLUG – REF.

66.16

(2.605)

MAX.

43.80

(1.724)

MAX.

35.80

(1.409)

MAX.

2.95

(0.116)

4.50

(0.177)

0.80

(0.031)

11.87

(0.467)

9.40

(0.370)

MAX.

NOTES:

1. ALL DIMENSIONS ARE MILLIMETERS OVER (INCHES).

2. ALL DIMENSIONS ARE NOMINAL UNLESS OTHERWISE SPECIFIED.

3. THE LEADS ARE TIN-LEAD PLATED PHOSPHOR BRONZE.

4. THE POSTS ARE TIN-LEAD PLATED BRASS.

5. THE HOUSING IS GLASS FIBER FILLED BLACK POLYETHERIMIDE.

6. THE MODULE IS SHOWN WITHOUT THE FIELD KEY INSTALLED.

FDDI KEY

LOCATION

PART NUMBER

DATE CODE

COUNTRY OF ORIGIN

30.48 (1.200)

GND 1

NC 2

GND 5

GND 6

SD 7

SD 8

DATA OUT 10

DATA OUT 11

22 GND

21 V

20 V

19 V

18 V

17 GND

16 GND

15 GND

14 V

13 DATA IN

12 DATA IN

TOP VIEW

Figure 3. Pin Assignments.

(a) HFBR-5111

(b) HFBR-5112/-5113

TOP VIEW

GND

DATA IN

TX V

GND

RX V

DATA OUT

GND

Hewlett-Packard LED technology

has produced 1300 nm LED

devices with lower aging charac-

teristics than normally associated

with these technologies in the

industry. The industry convention

is 1.5 dB aging for 1300 nm

LEDs, however HP 1300 nm

LEDs will experience less than 1

dB of aging over normal commer-

cial equipment mission life

periods. Contact your Hewlett-

Packard sales representative for

additional details.

Figure 4 was generated with a

Hewlett-Packard fiber-optic link

model containing the current

industry conventions for fiber

cable specifications and the FDDI

PMD optical parameters. These

parameters are reflected in the

guaranteed performance of the

transceiver specifications in this

data sheet. This same model has

been used extensively in the ANSI

and IEEE committees, including

the ANSI X3T9.5 committee, to

establish the optical performance

requirements for various fiber-

optic interface standards. The

cable parameters used come from

the ISO/IEC JTC1/SC 25/WG3

Generic Cabling for Customer

Premises per DIS 11801

document and the EIA/TIA-568-A

Commercial Building Telecom-

munications Cabling Standard per

SP-2840.

Transceiver Signaling

Operating Rate Range and

BER Performance

For purposes of definition, the

symbol rate (Baud), also called

signaling rate, is the reciprocal of

the symbol time. Data rate (bits/

sec) is the symbol rate divided by

the encoding factor used to

encode the data (symbols/bit).

When used in FDDI 100 Mbps

applications, the performance of

the 1300 nm transceivers is

guaranteed over the signaling

rate of 10 MBd to 125 MBd to the

full conditions listed in the

individual product specification

tables.

The transceivers may be used for

other applications at signaling

rates outside of the 10 MBd to

125 MBd range with some

penalty in the link optical power

budget primarily caused by a

reduction of receiver sensitivity.

Figure 5 gives an indication of

the typical performance of these

1300 nm products at different

rates.

These transceivers can also be

used for applications which

require different bit error rate

(BER) performance. Figure 6

illustrates the typical trade-off

between link BER and the

receiver’s input optical power

level.

Figure 5. Transceiver Relative

Optical Power Budget at Constant

BER vs. Signaling Rate.

TRANSCEIVER RELATIVE OPTICAL POWER

BUDGET AT CONSTANT BER – dB

0 200

3.0

SIGNAL RATE (MBd)

25 75 100 125

2.5

2.0

1.5

1.0

175

0.5

50 150

CONDITIONS:

1. PRBS 2

-1

2. DATA SAMPLED AT CENTER OF DATA SYMBOL.

3. BER = 10

-6

4. T

= 25° C

5. V

= 5 V

6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.

standing and design trade-offs

associated with this transceiver.

You can contact them through

your Hewlett-Packard sales

representative.

The following information is

provided to answer some of the

most common questions about

the use of these parts.

Transceiver Optical Power

Budget versus Link Length

The Optical Power Budget (OPB)

is the available optical power for

a fiber-optic link to accommodate

fiber cable losses plus losses due

to in-line connectors, splices,

optical switches, and to provide

margin for link aging and

unplanned losses due to cable

plant reconfiguration or repair.

Figure 4 illustrates the predicted

OPB associated with the trans-

ceivers specified in this data

sheet at the Beginning of Life

(BOL). This curve represents the

attenuation and chromatic plus

modal dispersion losses

associated with the 62.5/125 µm

and 50/125 µm fiber cables only.

The area under the curve

represents the remaining OPB at

any link length, which is available

for overcoming non-fiber cable

related losses.

Figure 4. Optical Power Budget at

BOL vs. Fiber Optic Cable Length.

OPB – OPTICAL POWER BUDGET – dB

0 4.0

FIBER OPTIC CABLE LENGTH – km

0.5 1.5 2.0 2.5

3.5

1.0 3.0

62.5/125 µm

50/125 µm

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