Telefunken TOIM3232, TFDU4100, TFDS4500 Datasheet

TELEFUNKEN

TFDU4100/TFDS4500/TFDT4500

Semiconductor

2.7–5.5V Serial Infrared Transceiver Module Family
(SIR, 115.2 kbit/s)

Features Applications

 Compliant to IrDA 1.2 (up to

115.2 kbit/s)

 Wide Operating Voltage Range

(2.7 to 5.5 V )

 Low Power Consumption

(1.3 mA Supply Current)

 Power Sleep Mode Through

/SD Pin (5 nA Sleep

V

CC1

Current)

 Long Range (up to 3.0 m at 115.2

kbit/s)

 Three Surface Mount Package

Options

– Universal (9.7 x 4.7 x 4.0 mm)
– Side View (13.0 x 5.95 x 5.3 mm)
– T op View (13.0 x 7.6 x 5.95 mm)

 BabyFace (Universal) Package

Capable of Surface Mount
Solderability to Side- and
T op-View Orientation

 Directly Interfaces with Various

Super I/O and Controller Devices
and TEMIC’s TOIM3000 and
TOIM3232 I/Os

 Few External Components

Required

 Backward Compatible to All

TEMIC SIR Infrared
Transceivers

 Built–in EMI Protection – No

External Shielding Necessary

Description

The TFDU4100, TFDS4500, and TFDT4500 are a family
of low-power infrared transceiver modules compliant to
the IrDA 1.2 standard for serial infrared (SIR) data
communication, supporting IrDA speeds up to 115.2
kbit/s. Integrated within the transceiver modules are a
photo PIN diode, infrared emitter (IRED), and a
low-power analog control IC to provide a total front–end
solution in a single package. TEMIC’s SIR transceivers
are available in three package options, including our
BabyFace package (TFDU4100), the smallest SIR
transceiver available on the market. This wide selection

 Notebook Computers, Desktop

PCs, Palmtop Computers (Win
CE, Palm PC), PDAs

 Digital Still and Video Cameras
 Printers, Fax Machines,

Photocopiers, Screen Projectors

 T elecommunication Products

(Cellular Phones, Pagers)

 Internet TV Boxes, Video

conferencing systems

 External Infrared Adapters

(Dongles)

 Medical and Industrial Data

Collection Devices

provides flexibility for a variety of applications and space
constraints.

The transceivers are capable of directly interfacing with
a wide variety of I/O chips which perform the pulse-width
modulation/demodulation function, including TEMIC’s
TOIM3000 and TOIM3232. At a minimum, a
current-limiting resistor in series with the infrared emitter
and a Vcc bypass capacitor are the only external
components required to implement a complete solution.

Package Options

TFDU4100

Baby Face (Universal)

This product is currently in devleopment. Inquiries regarding the status of this product should be directed to TEMIC Marketing.

Pending—Rev. A, 03-Apr-98 1

TFDS4500

Side View

TFDT4500

Top View

Pre-Release Information

TFDU4100/TFDS4500/TFDT4500

Functional Block Diagram

V

/SD

CC1

Driver

Amplifier Comparator

AGC

SC

Logic

Rxd

IRED Anode

TELEFUNKEN

Semiconductor

V

CC2

R

S

Txd

Open Collector Driver

GND

IRED Cathode

Pin Assignment and Description

Pin Number

“ U ”, “ T ”

Option

1 8 IRED Anode IRED anode, should be externally connected to V

2 1 IRED Cathode IRED cathode, internally connected to driver transistor
3 7 Txd Transmit Data Input I HIGH
4 2 Rxd Received Data Output, push–pull CMOS driver output capable of driving a

5 6 NC Do not connect
6 3 V
7 5 SC Sensitivity control I HIGH
8 4 GND Ground

“ S ”

Option

Function Description I/O Active

through a current

control resistor

standard CMOS or TTL load. No external pull–up or pull–down resistor is
required (20 kΩ resistor internal to device). Pin is inactive during
transmission.

/ SD Supply Voltage/Shutdown (see “Shutdown” on page 6)

CC1

CC2

O LOW

5678

IRED Detector

12345678

”U” Option

BabyFace (Universal)

123 4

IRED Detector

”S” Option

Side View

IRED Detector

1 2345678

”T” Option

Top View

2 Pending—Rev . A, 03-Apr-98

Pre-Release Information

TELEFUNKEN

V

A

°C

A

TFDU4100/TFDS4500/TFDT4500

Semiconductor

Ordering Information

Part Number Qty/ Reel Description

TFDU4100–TR3 1000 pcs Oriented in carrier tape for side view surface mounting
TFDU4100–TT3 1000 pcs Oriented in carrier tape for top view surface mounting

TFDS4500–TR3 750 pcs

TFDT4500–TR3 750 pcs

Absolute Maximum Ratings

Parameter Symbol Test Conditions

Supply Voltage Range V
Voltage Range of IRED Drive Output V
Input Currents
Output Sink Current 25
Power Dissipation
Junction Temperature T
Ambient Temperature Range (Operating) T
Storage Temperature Range T
Soldering Temperature t = 20 s 215 240
Average IRED Current I
Repetitive Pulsed IRED Current I
IRED Anode Voltage at Current Output V
Transmitter Data Input Voltage V
Receiver Data Output Voltage V
Virtual Source Size
Maximum Intensity for Class 1 Operation of

IEC 825 or EN60825

Notes
a. Reference point GND pin unless otherwise noted.
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. All pins except IRED cathode pin and IRED anode pin.
e. See Derating Curve
f. Method: (1-1/e) encircled energy.
g. Worst case IrDA SIR pulse pattern.

d

e

f

g

CC1
CC2

P

D

J

amb

stg

(DC) 100

IRED

(RP) t < 90µs, ton<20% 500

IRED

IREDA

Txd

Rxd

d 2.5 2.8 mm

IRED anode pin, Txd LOW – 0.5 6

EN60825, 1997 400 mW/sr

a

b

Min

– 0.5 6

–25 85
–25 85

– 0.5 6
– 0.5 V
– 0.5 V

Typ

c

Max

200 mW
125

cc
cc

10

+ 0.5
+ 0.5

b

Unit

m

°

m

V

Pending—Rev. A, 03-Apr-98 3

Pre-Release Information

TFDU4100/TFDS4500/TFDT4500

V

pp y ,

CC1

I

A

pp y ,

CC1

(g)

I

M

d

kW/

2

Rxd Output Volt

Electrical Characteristics

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Semiconductor

Parameter Symbol Test Conditions

a

Min

b

TypcMax

b

Unit

Transceiver

Supply Voltage V
Supply Voltage V

Supply Current, V
(Receive Mode)

Supply Current, V
(Transmit Mode)

CC1

CC1
d

Pin

Pin (avg)

Leakage Current of IR Emitter, IRED
Anode Pin

Transceiver Power On Settling Time I

CC1
CC1

S

S

I

S

S

V

CC1

Receive Mode 2.7 5.5

Transmit Mode, R2 = 51 Ω 2.0 5.5

V

= 5.5V 1.3 2.5

CC1

V

= 2.7V 1.0 1.5

CC1

V

= 5.5V 5.0 5.5

CC1

V

= 2.7V 3.5 4.5

CC1

= OFF, Txd = LOW , V

T = 25°– 85° C

CC2

= 6V,

0.005 0.5 µA
50 µs

m

Optoelectronic Characteristics

Parameter Symbol Test Conditions

a

Receiver

E

Min Detection Threshold Irradiance

Min Detection Threshold Irradiance

ax Detection Threshold Irradiance

e

d

d

Logic Low Receiver Input Irradiance E

age

emin

E

emin

E

emax

emax (low)

V

OL

V

OH

Output Current VOL < 0.8V 4 mA
Rise Time t
Fall Time t
Rxd Pulse Width of Output Signal P

f

Jitter
Latency t

r
f
w

t

j

L

Notes
a. T
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.

= 25_C, VCC = 2.7 – 5.5 V unless otherwise noted.

amb

c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. I
e. BER = 10

(peak) = 210 mA (At IRED Anode pin)

IRED

–8

(IrDA specification).

f. Leading edge of output signal.

α = ±15_, SIR Mode, SC = LOW 20 35
α = ±15_, SIR Mode, SC = LOW,

V

= 2.7V

CC1

α = ±15_, SIR Mode, SC = HIGH 6 10 15
α = ± 90_, SIR Mode, V
α = ± 90_, SIR Mode, V

= 5V 3.3 5

CC1

= 3V 8 15

CC1

SC = HIGH or LOW 4 mW/m

Active, C = 15 pF, R = 2.2 kΩ 0.5 0.8 V

Non–active, C = 15 pF, R = 2.2 kΩ VCC–0.5

C = 15 pF, R = 2.2 kΩ 20 1400
C = 15 pF, R = 2.2 kΩ 20 200

115.2 kbit/s mode 1.41 8

Over a period of 10 bit, 115.2 kbit/s 2

Min

b

TypcMax

100 500 µs

b

Unit

35

mW/m

2

2

m

2

ns

µs

4 Pending—Rev . A, 03-Apr-98

Pre-Release Information