Datasheet STTH3BCF060 Datasheet (ST)

STTH3BCF060
600 V high voltage rectifier for BC2 topology
Features
optimized freewheel diode for BC
(ST patent)
low conduction losses
high voltage rectifier
improves efficiency by up to 2.5% compared to
conventional continuous mode PFC using standard ultrafast 600 V PN diodes
performance efficiency improved by up to 0.5%
compared to 600 V Schottky power diodes with no reverse recovery charges used in CCM PFC at 200 kHz
provides a cost/performance optimized
solution to meet the 80+ efficiency requirements
supports PFC working up to 300 kHz
suitable for PFC up to 400 W
compatible with standard PFC controller ICs
topology
Description
KA
SMB
STTH3BCF060U

Table 1. Device summary

Symbol Value
I
F(AV)
V
RRM
I
(max) 100 µA
R
T
j
3 A
600 V
175 °C
The STTH3BCF060 is a specific freewheel diode used in continuous mode power factor correction working in the BC especially designed for the dedicated BC
topology. This diode has been
topology. Therefore, its electrical characteristics offer the best possible efficiency with a P-N optimized structured diode. As a result, SMPS efficiency growth up to 2.5% can be produced at an optimized cost.
October 2010 Doc ID 17524 Rev 2 1/8
www.st.com
8
Characteristics STTH3BCF060

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit
V
I
F(RMS)
I
F(AV)
I
T

Table 3. Thermal resistance

Repetitive peak reverse voltage 600 V
RRM
Forward rms current 10 A
Average forward current δ = 0.5 TL = 55 °C 3 A
Surge non repetitive forward current tp = 10 ms sinusoidal 45 A
FSM
Storage temperature range - 65 to + 175 °C
stg
Maximum operating junction temperature 175 °C
T
j
Symbol Parameter Maximum Unit
R

Table 4. Static electrical characteristics

Junction to lead 25 °C/W
th(j-l)
Symbol Parameter Test conditions Min. Typ. Max. Unit
Reverse leakage
I
R
current
V
Forward voltage drop
F
= 25 °C
T
j
= 150 °C 15 100
T
j
= V
V
R
RRM
Tj = 25 °C
IF = 3 A
= 150 °C 1.0 1.25
T
j
3
1.7
To evaluate the maximum conduction losses use the following equation: P = 1.03 x I

Table 5. Dynamic electrical characteristics

F(AV)
+ 0.09 I
F2(RMS)
µA
V
Symbol Parameter Test conditions Min. Typ. Max. Unit
Reverse
t
rr
recovery time
Forward
t
fr
recovery time
V
Forward
FP
recovery voltage
T
= 25 °C
j
= 25 °C
T
j
= 1 A, VR = 30 V
I
F
/dt = -50 A/µs
dI
F
I
= 3 A,
F
/dt = 100 A/µs
dI
F
VFR = 1.1 x V
2/8 Doc ID 17524 Rev 2
Fmax
35 ns
100 ns
10 V
STTH3BCF060 Characteristics
0.00.5
0
5
0
53.03.5
0
Figure 1. Conduction losses versus average
current
P(W)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
δ = 0.05
δ = 0.1
δ = 0.2
I (A)
F(AV)
δ = 0.5
δ
δ = 1
T
=tp/T
Figure 3. Relative variation of thermal
impedance junction ambient versus
Figure 2. Forward voltage drop versus
forward current
I (A)
FM
50
45
40
35
30
25
20
15
10
tp
5
0
(typical values)
1.
T =150°C
j
1.
T =150°C
j
(maximum values)
V (V)
FM
2.
2.
Figure 4. Peak reverse recovery current
versus dI
/dt (typical values)
F
T =25°C
j
(maximum values)
4.
pulse duration
Z/R
th(j-a) th(j-a)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
SMB
S = 1cm
Cu
2
t (s)
p
Figure 5. Reverse recovery time versus dI
(typical values)
t (ns)
rr
160 150 140 130 120 110 100
90 80 70 60 50 40 30 20 10
0
0 50 100 150 200 250 300 350 400 450 500
I =2 x I
F F(AV)
dI /dt(A/µs)
F
I=I
F F(AV)
V =400V
R
T =125°C
j
I =0.5 x I
F F(AV)
F
/dt
I (A)
RM
13
V =400V
R
12
T =125°C
j
11
10
9
8
7
6
5
4
3
2
1
0
0 50 100 150 200 250 300 350 400 450 500
I =0.25 x I
F F(AV)
I =0.5 x I
F F(AV)
I=I
F F(AV)
dI /dt(A/µs)
F
I =2 x I
F F(AV)
Figure 6. Reverse recovery charges versus
dI
/dt (typical values)
F
Q (nC)
rr
450
V =400V
R
T =125°C
j
400
I =2 x I
350
300
250
200
150
100
50
0
0 50 100 150 200 250 300 350 400 450 500
F F(AV)
I=I
F F(AV)
I =0.5 x I
F F(AV)
dI /dt(A/µs)
F
Doc ID 17524 Rev 2 3/8
Characteristics STTH3BCF060
0.00.51.01.52.02.53.03.54.04.55.0
Figure 7. Softness factor versus dIF/dt
(typical values)
Figure 8. Relative variations of dynamic
parameters versus junction temperature
S factor
3.0
I=I
F F(AV)
V =400V
R
T =125°C
j
2.5
2.0
1.5
1.0
0.5
dI /dt(A/µs)
0.0
0 50 100 150 200 250 300 350 400 450 500
F
Figure 9. Transient peak forward voltage
versus dI
V (V)
FP
20
I=I
F F(AV)
18
T =125°C
j
16
14
12
10
8
6
4
2
0
0 20 40 60 80 100 120 140 160 180 200
/dt (typical values)
F
dI /dt(A/µs)
F
Figure 11. Junction capacitance versus
reverse voltage applied (typical values)
C(pF)
100
10
V (V)
1
1 10 100 1000
R
F=1MHz
V =30mV
OSC RMS
T =25°C
j
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
25 50 75 100 125
Q
RR
S factor
I
RM
I=I
F F(AV)
V =400V
R
Reference:T =125°C
T (°C)
j
Figure 10. Forward recovery time versus dI
(typical values)
t (ns)
fr
200
180
160
140
120
100
80
60
40
20
0
0 20 40 60 80 100 120 140 160 180 200
dI /dt(A/µs)
F
I=I
F F(AV)
V =1.1 x V max.
FR F
T =125°C
j
Figure 12. Thermal resistance junction to
ambient versus copper surface under lead
R (°C/W)
th(j-a)
110
100
90
80
70
60
50
40
30
20
10
0
Epoxy printed circuit board, FR4 copper thickness = 35 µm
S (cm²)
CU
j
/dt
F
4/8 Doc ID 17524 Rev 2
STTH3BCF060 Application information

2 Application information

Figure 13. Application schematic

L
MAIN
STTH8BC065
L
V
MAINS
Q
STTH3BCF060

2.1 BC2 topology description (ST patent)

No hard switching occurs at turn-on with BC2 topology. Inductor L in series with the power MOS Q configuration suppresses the switch-on losses. Added winding, coupled with the main boost inductor L both recovery current from the STTH8BC065 and damping current towards the power circuit. Another added winding in series with STTH8BC065 boost diode discharges the nominal current stored in inductor L flowing through STTH8BC060 diode towards output bulk capacitor.
These two added phases compared with conventional continuous mode PFC, bring back the current corresponding to the usual switching losses in the circuit, hence BC current circuit).
, in series with the STTH3BCF060 freewheel diode brings back
main
STTH8BC060
(back
Doc ID 17524 Rev 2 5/8
Package information STTH3BCF060

3 Package information

Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 6. SMB dimensions

®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
E1
Ref.
Millimeters Inches
Min. Max. Min. Max.
D
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
E
A1
C
L
A2
b
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
L 0.75 1.50 0.030 0.059

Figure 14. Footprint (dimensions in mm)

1.62
2.60
5.84
6/8 Doc ID 17524 Rev 2
1.62
2.18
STTH3BCF060 Ordering information

4 Ordering information

Table 7. Ordering information

Order code Marking Package Weight Base qty Delivery mode
STTH3BCF060U 3BC6 SMB 0.11 g 2500 Tape and reel

5 Revision history

Table 8. Document revision history

Date Revision Changes
18-May-2010 1 First issue.
28-Oct-2010 2 Updated document title. Modified Section 2.1.
Doc ID 17524 Rev 2 7/8
STTH3BCF060
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8/8 Doc ID 17524 Rev 2
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