Datasheet STTH4R02 Datasheet (ST)

STTH4R02

Ultrafast recovery diode

Features

■ Very low conduction losses

■ Negligible switching losses

■ Low forward and reverse recovery times

■ High junction temperature

Description

The STTH4R02 uses ST's new 200 V planar Pt
doping technology, and it is specially suited for
switching mode base drive and transistor circuits.

Packaged in TO-220AC, TO-220FPAC, DPAK,
SMB, SMC, and DO-201AB, this device is
intended for use in low voltage, high frequency
inverters, free wheeling and polarity protection.

K

K

TO-220AC

STTH4R02D

K

NC

DPAK

STTH4R02B

K

A

A

A

A

DO-201AB
STTH4R02

K

A

K

TO-220FPAC

STTH4R02FP

A

K

SMB

STTH4R02U

A

K

SMC

STTH4R02S

Table 1. Device summary

I

F(AV)

V

RRM

T

j (max)

(typ) 0.76 V

V

F

(typ) 16 ns

t

rr

July 2010 Doc ID 12360 Rev 4 1/13

4 A

200 V

175 °C

www.st.com

13

Characteristics STTH4R02

1 Characteristics

Table 2. Absolute ratings (limiting values at T

Symbol Parameter Value Unit

= 25 °C, unless otherwise stated)

amb

V

Repetitive peak reverse voltage 200 V

RRM

TO-220AC

DPAK

I

F(RMS)

Forward rms current

SMB / SMC

70 A

TO-220FPAC

DO-201AB

I

F(AV)

I

T

Table 3. Thermal parameters

Average forward current,
δ = 0.5

Surge non repetitive forward

FSM

current

Storage temperature range -65 to + 175 °C

stg

T

Maximum operating junction temperature 175 °C

j

TO-220AC T

DPAK T

SMB T

SMC T

TO-220FPAC T

DO-201AB T

= 10 ms sinusoidal 70 A

t

p

= 160 °C

c

= 160 °C

c

= 95 °C

lead

= 95 °C

lead

= 150 °C

c

= 95 °C

lead

4A

Symbol Parameter Value Unit

TO-220AC / DPAK 3.5

th(j-c)

Junction to case

TO-220FPAC 6.5

R

SMB 20

R

th(j-l)

Junction to lead

DO-201AB 20

SMC 20

2/13 Doc ID 12360 Rev 4

°C/W

STTH4R02 Characteristics

Table 4. Static electrical characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

(1)

I

V

Reverse leakage current

R

(2)

Forward voltage drop

F

1. Pulse test: tp = 5 ms, δ < 2 %

2. Pulse test: t

= 380 µs, δ < 2 %

p

Tj = 25 °C

VR = V

= 125 °C 2 20

T

j

= 25 °C IF = 12 A 1.15 1.25

T

j

= 25 °C

j

= 150 °C 0.76 0.83

T

j

RRM

0.95 1.05

IF = 4 A

3

To evaluate the conduction losses use the following equation:
P = 0.67 x I

Table 5. Dynamic characteristics

Symbol Parameter

t

rr

Reverse recovery time

F(AV)

+ 0.04 I

F2(RMS)

I

= 1 A, dIF/dt = -50 A/µs,

F

VR = 30 V, Tj = 25 °C

I

= 1 A, dIF/dt = -100 A/µs,

F

VR = 30 V, Tj = 25 °C

Test conditions

Min. Typ. Max. Unit

24 30

16 20

µA

VT

ns

I

= 4 A, dIF/dt = -200 A/µs,

I

V

Reverse recovery current

RM

t

Forward recovery time

fr

Forward recovery voltage

FP

F

VR = 160 V, Tj = 125 °C

= 4 A, dIF/dt = 50 A/µs

I

F

= 1.1 x V

V

FR

= 4 A, dIF/dt = 50 A/µs,

I

F

= 25 °C

T

j

, Tj = 25 °C

Fmax

4.4 5.5 A

80 ns

1.6 V

Figure 1. Peak current versus duty cycle Figure 2. Forward voltage drop versus

forward current (typical values)

IM(A)

50

45

40

35

30

25

20

15

10

5

0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

P = 5 WP = 5 W

P = 2 WP = 2 W

P = 1 WP = 1 W

T

T

I

I

M

M

=tp/T

=tp/T

d

δ

tp

tp

δ

IFM(A)

100

75

50

25

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

Tj=150°C

Tj=25°C

VFM(V)

Doc ID 12360 Rev 4 3/13

Characteristics STTH4R02

Figure 3. Forward voltage drop versus

forward current (maximum values)

IFM(A)

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

Tj=150°C

Tj=25°C

VFM(V)

Figure 5. Relative variation of thermal

impedance, junction to case,
versus pulse duration

Z

th(j-c)/Rth(j-c)

1.0

Single pulse

TO-220FPAC

0.1

0.0

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

tp(s)

Figure 4. Relative variation of thermal

impedance, junction to case,
versus pulse duration

Z

th(j-c)/Rth(j-c)

1.0

Single pulse

TO-220AC

DPAK

0.1

1.E-03 1.E-02 1.E-01 1.E+00

tp(s)

Figure 6. Relative variation of thermal

impedance, junction to ambient,
versus pulse duration (SMB)

Z

th(j-a)/Rth(j-a)

1.0

SMB

0.9

S

=1cm²

Cu

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

tp(s)

Figure 7. Relative variation of thermal

Figure 8. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration

Z

(°C/W)

th(j-a)

100

Single pulse

DO201AB

10

1

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

tp(s)

4/13 Doc ID 12360 Rev 4

Z

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

impedance, junction to ambient,
versus pulse duration (SMC)

th(j-a)/Rth(j-a)

SMC

S

=1cm²

Cu

tp(s)

STTH4R02 Characteristics

Figure 9. Junction capacitance versus

reverse applied voltage
(typical values)

C(pF)

100

10

1 10 100 1000

V

osc

F=1MHz

=30mV

Tj=25°C

RMS

VR(V)

Figure 11. Reverse recovery time versus dIF/dt

(typical values)

tRR(ns)

80

70

60

50

40

30

20

10

0

10 100 1000

Tj=125°C

Tj=25°C

IF=4A

V

=160V

R

dIF/dt(A/µs)

Figure 10. Reverse recovery charges versus

dI

/dt (typical values)

F

QRR(nC)

120

IF=4A

V

=160V

R

100

80

60

40

20

0

0 50 100 150 200 250 300 350 400 450 500

Tj=125°C

Tj=25°C

dIF/dt(A/µs)

Figure 12. Peak reverse recovery current

versus dI

IRM(A)

10

IF=4A

V

=160V

R

8

6

4

2

0

0 50 100 150 200 250 300 350 400 450 500

/dt (typical values)

F

Tj=125°C

Tj=25°C

dIF/dt(A/µs)

Figure 13. Dynamic parameters versus

junction temperature

QRR;IRM[Tj]/QRR;IRM[Tj=125°C]

1.4

IF=4A

=160V

V

R

1.2

1.0

I

0.8

0.6

0.4

0.2

0.0

25 50 75 100 125 150

RM

Q

RR

Tj(°C)

Figure 14. Thermal resistance, junction to

ambient, versus copper surface
under tab - DPAK

R

(°C/W)

th(j-a)

100

90

80

70

60

50

40

30

20

10

0

0 5 10 15 20 25 30 35 40

Epoxy printed circuit board FR4,
copper thickness = 35 µm

Doc ID 12360 Rev 4 5/13

DPAK

SCU(cm²)

Ordering information scheme STTH4R02

Figure 15. Thermal resistance, junction to

Figure 16. Thermal resistance, junction to
ambient, versus copper surface
under tab - SMB

R

(°C/W)

th(j-a)

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Epoxy printed circuit board FR4,
copper thickness = 35 µm

SCU(cm²)

SMB

R

(°C/W)

th(j-a)

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Figure 17. Thermal resistance versus lead length - DO-201AB

Rth(°C/W)

90

R

80

70

60

50

40

30

20

10

0

5 10152025

th(j-a)

R

th(j-l)

ambient, versus copper surface
under tab - SMC

Epoxy printed circuit board FR4,
copper thickness = 35 µm

SCU(cm²)

DO201AB

L

(mm)

LEADS

SMC

2 Ordering information scheme

Figure 18. Ordering information scheme

STTH 4 R 02 XXX

Ultrafast switching diode

Average forward current

4 = 4 A

Model R

Repetitive peak reverse voltage

02 = 200 V

Packag e

Blank = DO-201 in Ammopack
RL = DO201 in Tape and reel
D = TO220AC in Tube
FP = TO-220FPAC in Tube
B = DPAK in Tube
B-TR = DPAK in Tape and reel
U = SMB in Tape and reel
S = SMC in Tape and reel

6/13 Doc ID 12360 Rev 4

STTH4R02 Package information

3 Package information

● Epoxy meets UL94, V0

● Cooling method: by conduction (C)

● Recommended torque value: 0.4 to 0.6 N·m

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK

Table 6. T0-220AC dimensions

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

.

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

H2

Ø I

L5

L6

L2

A

C

A 4.40 4.60 0.173 0.181

C 1.23 1.32 0.048 0.051

D 2.40 2.72 0.094 0.107

L7

E 0.49 0.70 0.019 0.027

F 0.61 0.88 0.024 0.034

F1 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202

F1

L9

L4

F

D

H2 10.00 10.40 0.393 0.409

L2 16.40 typ. 0.645 typ.

L4 13.00 14.00 0.511 0.551

M

E

L5 2.65 2.95 0.104 0.116

L6 15.25 15.75 0.600 0.620

G

L7 6.20 6.60 0.244 0.259

L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

Diam. I 3.75 3.85 0.147 0.151

Doc ID 12360 Rev 4 7/13

Package information STTH4R02

Table 7. DPAK dimensions

Dimensions

E

B2

L2

H

L4

B

G

0.60 MIN.

A2

V2

Figure 19. DPAK footprint

Ref.

Millimeters Inches

Min. Max Min. Max.

A

C2

A 2.20 2.40 0.086 0.094

A1 0.90 1.10 0.035 0.043

A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035

B2 5.20 5.40 0.204 0.212

R

D

C 0.45 0.60 0.017 0.023

C2 0.48 0.60 0.018 0.023

A1

R

C

D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.251 0.259

G 4.40 4.60 0.173 0.181

H 9.35 10.10 0.368 0.397

L2 0.80 typ. 0.031 typ.

L4 0.60 1.00 0.023 0.039

V2 0° 8° 0° 8°

6.7

6.7 3 3

1.6

1.6

2.3

2.3

Dimensions in mm

8/13 Doc ID 12360 Rev 4

STTH4R02 Package information

Table 8. T0-220FPAC dimensions

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A

H

B

A 4.4 4.6 0.173 0.181

B 2.5 2.7 0.098 0.106

D 2.5 2.75 0.098 0.108

Dia

L6

L2

L3

L5

F1

L4

D

E 0.45 0.70 0.018 0.027

F 0.75 1 0.030 0.039

F1 1.15 1.70 0.045 0.067

L7

G 4.95 5.20 0.195 0.205

G1 2.4 2.7 0.094 0.106

H 10 10.4 0.393 0.409

L2 16 Typ. 0.63 Typ.

L3 28.6 30.6 1.126 1.205

G1

F

E

L4 9.8 10.6 0.386 0.417

L5 2.9 3.6 0.114 0.142

G

L6 15.9 16.4 0.626 0.646

L7 9.00 9.30 0.354 0.366

Dia. 3.00 3.20 0.118 0.126

Doc ID 12360 Rev 4 9/13

Package information STTH4R02

Table 9. SMB dimensions

Dimensions

E1

D

Ref.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

E

A1

C

L

A2

b

c 0.15 0.40 0.006 0.016

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

L 0.75 1.50 0.030 0.059

Figure 20. Footprint, dimensions in mm (inches)

1.62

2.60

(0.064) (0.102)

1.62

(0.064)

5.84

(0.300)

Millimeters Inches

Min. Max. Min. Max.

2.18

(0.086)

10/13 Doc ID 12360 Rev 4

STTH4R02 Package information

Table 10. SMC dimensions

Dimensions

Ref.

E1

A1 1.90 2.45 0.075 0.096

D

E

A2 0.05 0.20 0.002 0.008

(1)

b

(1)

c

D 5.55 6.25 0.218 0.246

A1

C

LE2

A2

b

E 7.75 8.15 0.305 0.321

E1 6.60 7.15 0.260 0.281

E2 4.40 4.70 0.173 0.185

L 0.75 1.50 0.030 0.059

1. Dimensions b and c apply to plated leads

Figure 21. Footprint, dimensions in mm (inches)

1.545.111.54

(0.061) (0.201)

(0.061)

Millimeters Inches

Min. Max. Min. Max.

2.90 3.20 0.114 0.126

0.15 0.40 0.006 0.016

3.14

(0.124)

Table 11. DO-201AB dimensions

BB

ØD

A

ØC

8.19

(0.322)

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 8.5 9.5 0.335 0.374

B 25.4 1

Ø C 4.8 5.3 0.189 0.209

Ø D 0.96 1.06 0.038 0.042

Doc ID 12360 Rev 4 11/13

Ordering information STTH4R02

4 Ordering information

Table 12. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STTH4R02D STTH4R02 TO-220AC 1.86 g 50 Tube

STTH4R02FP STTH4R02 TO-220FPAC 2.2 g 50 Tube

STTH4R02B STTH4R02 DPAK 0.30 g 75 Tube

STTH4R02B-TR STTH4R02 DPAK 0.30 g 2500 Tape and reel

STTH4R02U 4R2U SMB 0.107 g 2500 Tape and reel

STTH4R02 STTH4R02 DO-201AB 0.876 g 600 Ammopack

STTH4R02RL STTH4R02 DO-201AB 0.876 g 1900 Tape and reel

STTH4R02S 4R2S SMC 0.243 g 2500 Tape and reel

5 Revision history

Table 13. Document revision history

Date Revision Changes

03-May-2006 1 First issue.

10-Oct-2006 2 Added SMC package

13-Apr-2010 3

01-Jul-2010 4

Updated ECOPACK statement. Updated dimensions tables
for SMB and SMC.

Separated junction to lead values from junction to case
values in Tab l e 3 .

12/13 Doc ID 12360 Rev 4

STTH4R02

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Doc ID 12360 Rev 4 13/13