Datasheet STTH3R04 Datasheet (ST)

STTH3R04

Ultrafast recovery diode

Features

■ Negligible switching losses

■ Low forward and reverse recovery times

■ High junction temperature

Description

The STTH3R04 series uses ST's new 400 V planar Pt doping technology. The STTH3R04 is specially suited for switching mode base drive and transistor circuits.

Packaged in axial and surface mount packages, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection.

KA

DO-15

STTH3R04Q

Band indicates cathode side.

SMB

STTH3R04U

Table 1. Device summary

I

F(AV)

V

RRM

T

j (max)

V

F (typ)

t

rr (typ)

DO-201AD STTH3R04

SMC

STTH3R04S

3 A

400 V

175 °C

0.9 V

18 ns

May 2008 Rev 1 1/10

www.st.com

Characteristics STTH3R04

1 Characteristics

Table 2. Absolute ratings (limiting values at 25 °C, unless otherwise specified)

Symbol Parameter Value Unit

V

RRM

I

F(AV)

I

FSM

T

1. On infinite heatsink with 10 mm lead length

Table 3. Thermal parameters

Symbol Parameter Value Unit

Repetitive peak reverse voltage 400 V

Average forward current, δ = 0.5

DO-15 T

DO-201AD T

SMB T

SMC T

= 70 °C

lead

= 80 °C

lead

= 70 °C

lead

= 100 °C

lead

Surge non repetitive forward current tp = 10 ms Sinusoidal 60 A

Storage temperature range -65 to +175 °C

stg

Maximum operating junction temperature

T

j

(1)

3.0 A

175 °C

R

th(j-l)

Junction to lead

Lead length = 10 mm on infinite heatsink

DO-15 25

DO-201AD 22

°C/W

SMB 25

R

th(j-l)

Table 4. Static electrical characteristics

Junction to lead

SMC 17

Symbol Parameter Test conditions Min Typ Max Unit

(1)

I

V

1. Pulse test: tp = 5 ms, δ < 2 %

2. Pulse test: tp = 380 µs, δ < 2 %

Reverse leakage current

R

(2)

Forward voltage drop

F

= 25 °C

j

= 125 °C 5 50

T

j

T

= 25 °C

j

T

= 150 °C 0.9 1.15

j

= V

V

R

= 3.0 A

I

F

RRM

5

1.5

T

To evaluate the conduction losses use the following equation: P = 0.9 x I

+ 0.083 x I

F(AV)

F2(RMS)

µA

VTj = 100 °C 1.0 1.25

2/10

STTH3R04 Characteristics

Table 5. Dynamic characteristics (Tj = 25 °C unless otherwise stated)

Symbol Parameter

Test conditions

I

= 1 A, dIF/dt = -50 A/µs,

F

VR = 30 V, Tj = 25 °C

t

I

RM

t

V

Figure 1. Conduction losses versus

P(W)

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

Reverse recovery time

rr

Reverse recovery current

Forward recovery time

fr

Forward recovery voltage

FP

average forward current

= 1 A, dIF/dt = -100 A/µs,

I

F

= 30 V, Tj = 25 °C

V

R

= 3.0 A, dIF/dt = -200 A/µs,

I

F

VR = 320 V, Tj = 125 °C

I

= 3.0 A dIF/dt = 100 A/µs

F

VFR = 1.1 x V

= 3.0 A dIF/dt = 100 A/µs

I

F

δ=0.05 δ=0.1 δ=0.2 δ=0.5 δ=1

T

=tp/T

I

(A)

F(AV)

δ

, Tj = 25 °C

Fmax

Figure 2. Forward voltage drop versus

forward current

IFM(A)

50

45

40

35

30

25

20

15

10

tp

5

0

0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2

TJ=150°C

(Maximum values)

TJ=150°C

(Typical values)

Min Typ Max Unit

35

ns

18 25

45.5 A

75 ns

2.5 V

TJ=25°C

(Maximum values)

VFM(V)

Figure 3. Relative variation of thermal

impedance junction to lead versus pulse duration, DO-15 (epoxy FR4, copper thickness = 35 µm)

Z

th(j-l)/Rth(j-l)

1.0

DO-15

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

=10mm

L

leads

Single pulse

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

tP(s)

Figure 4. Relative variation of thermal

impedance junction to ambient versus pulse duration, DO-201AD (epoxy FR4, copper thickness = 35 µm)

Z

th(j-a)/Rth(j-a)

1.0

DO-201AD

=10mm

L

0.9

leads

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

tP(s)

3/10

Characteristics STTH3R04

Figure 5. Relative variation of thermal

impedance junction to ambient versus pulse duration, SMB (epoxy FR4, copper thickness = 35 µm)

Z

th(j-a)/Rth(j-a)

1.0

SMB

=1cm²

S

0.9

Cu

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

Single pulse

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

tP(s)

Figure 7. Junction capacitance versus

reverse voltage applied (typical values)

C(pF)

100

10

1

1 10 100 1000

VR(V)

V

F=1MHz

OSC

Tj=25°C

=30mV

Figure 9. Reverse recovery time versus

dI

/dt (typical values)

F

tRR(ns)

100

90

80

70

60

50

40

30

20

10

0

10 100 1000

Tj=125 °C

Tj=25 °C

dIF/dt(A/µs)

IF= 3 A

V

R

=320 V

Figure 6. Relative variation of thermal

impedance junction to ambient versus pulse duration, SMC

Z

th(j-a)/Rth(j-a)

1.0

SMC

0.9

=1cm²

S

Cu

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

Single pulse

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

tP(s)

Figure 8. Reverse recovery charges versus

dI

/dt (typical values)

F

QRR(nC)

100

IF= 3 A

90

V

=320 V

RMS

R

80

70

60

50

40

30

20

10

0

10 100 1000

Tj=125 °C

Tj=25 °C

dIF/dt(A/µs)

Figure 10. Peak reverse recovery current

versus dIF/dt (typical values)

IRM(A)

8

IF= 3 A

=320 V

V

R

7

6

5

4

3

2

1

0

10 100 1000

Tj=125 °C

Tj=25 °C

dIF/dt(A/µs)

4/10

STTH3R04 Characteristics

Figure 11. Relative variations of dynamic

parameters versus junction

Figure 12. Transient peak forward voltage

versus dI

/dt (typical values)

F

temperature

QRR;IRM[Tj]/QRR;IRM[Tj=125°C]

1.4

IF= 3 A

V

=320 V

R

1.2

1.0

I

RM

0.8

Q

0.6

RR

0.4

0.2

0.0

25 50 75 100 125 150

Tj(°C)

Figure 13. Forward recovery time versus

dI

/dt (typical values)

F

tFR(ns)

130

120

110

100

90

80

70

60

50

40

30

20

10

0

0 50 100 150 200 250 300 350 400 450 500

dIF/dt(A/µs)

T

j

IF=3 A =125 °C

VFp(V)

25

IF=3 A

T

=125 °C

j

20

15

10

5

0

0 50 100 150 200 250 300 350 400 450 500

dIF/dt(A/µs)

Figure 14. Thermal resistance versus

lead length, DO-15

R

(°C/W)

th(j-a)

120

100

80

60

40

20

L

(mm)

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

leads

DO-15

Figure 15. Thermal resistance junction to

ambient versus copper surface under each lead, DO-201AD (epoxy FR4, copper thickness = 35 µm)

R

(°C/W)

th(j-a)

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

SCu(cm²)

DO-201AD

Figure 16. Thermal resistance versus lead

length, DO-201AD

Rth(°C/W)

100

90

80

70

60

50

40

30

20

10

0

5 10152025

R

th(j-a)

R

th(j-l)

L

(mm)

leads

5/10

DO-201AD

Package information STTH3R04

Figure 17. Thermal resistance junction to ambient versus copper surface under

each lead, SMB, SMC (epoxy FR4, copper thickness = 35 µm)

R

(°C/W)

th(j-a)

120

100

80

60

SMC

40

20

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

2 Package information

● Epoxy meets UL94, V0

● Cooling method: by conduction (C)

In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com.

Table 6. DO201AD dimensions

SMB

SCU(cm²)

®

BB

Note 1 Note 1

ØD

A

EE

Note 2

ØC

6/10

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 9.50 0.374

B 25.40 1.000

C 5.30 0.209

D 1.30 0.051

E 1.25 0.049

Notes 1 - The lead diameter ø D is not

controlled over zone E 2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15mm)

STTH3R04 Package information

Table 7. DO-15 dimensions

Dimensions

CC

D

Table 8. SMB dimensions

E1

E

C

A

B

D

L

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 6.05 6.75 0.238 0.266

B 2.95 3.53 0.116 0.139

C 26 31 1.024 1.220

D 0.71 0.88 0.028 0.035

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

c 0.15 0.40 0.006 0.016

A1

A2

b

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

L 0.75 1.50 0.030 0.059

Figure 18. Footprint, dimensions in mm (inches)

2.60

1.62

(0.064) (0.102)

5.84

(0.300)

1.62

(0.064)

2.18

(0.086)

7/10

Package information STTH3R04

Table 9. SMC dimensions

Dimensions

Ref.

E1

A1 1.90 2.45 0.075 0.096

D

A2 0.05 0.20 0.002 0.008

b 2.90 3.20 0.114 0.126

E

c 0.15 0.40 0.006 0.016

D 5.55 6.25 0.218 0.246

A1

C

LE2

A2

b

E 7.75 8.15 0.305 0.321

E1 6.60 7.15 0.260 0.281

E2 4.40 4.70 0.173 0.185

L 0.75 1.50 0.030 0.059

Figure 19. Footprint, dimensions in mm (inches)

(0.061) (0.201)

Millimeters Inches

Min. Max. Min. Max.

1.545.111.54

(0.061)

3.14

(0.124)

8.19

(0.322)

8/10

STTH3R04 Ordering information

3 Ordering information

Table 10. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STTH3R04 STTH3R04 DO-201AD 1.16 g 600 Ammopack

STTH3R04RL STTH3R04 DO-201AD 1.16g 1900 Tape and reel

STTH3R04Q STTH3R04Q DO-15 0.4 g 1000 Ammopack

STTH3R04QRL STTH3R04Q DO-15 0.4 g 6000 Tape and reel

STTH3R04S R4S SMC 0.243 g 2500 Tape and reel

STTH3R04U 3R4U SMB 0.12 g 2500 Tape and reel

4 Revision history

Table 11. Document revision history

Date Revision Description of changes

30-May-2008 1 First issue

9/10

STTH3R04

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