Datasheet STTH1R06 Datasheet (ST)

Turbo 2 ultrafast high voltage rectifier

Features

■ Ultrafast switching

■ Low reverse recovery current

■ Low thermal resistance

■ Reduces switching and conduction losses

Description

The STTH1R06, which is using ST Turbo 2 600 V technology, is specially suited as boost diode in power factor correction circuitry.

The device is also intended for use as a free wheeling diode in power supplies and other power switching applications.

STTH1R06

A

K

DO-41

STTH1R06

K

STTH1R06U

Table 1. Device summary

Symbol Value

STTH1R06A

A

SMB

A

K

SMA

I

F(AV)

V

RRM

(max) 75 µA

I

R

T

j

(typ) 1.0 V

V

F

(max) 25 ns

t

rr

600 V

175 °C

1 A

October 2009 Doc ID 10203 Rev 5 1/9

www.st.com

9

Characteristics STTH1R06

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

V

Repetitive peak reverse voltage 600 V

RRM

DO-41 10

I

F(RMS)

I

F(AV)

I

T

Table 3. Thermal resistance

Forward rms current

SMA / SMB 7

DO-41 T

Average forward current

SMB T

= 100 °C δ = 0.5

c

= 125 °C δ = 0.5

c

= 135 °C δ = 0.5

c

DO-41

Surge non repetitive forward current

FSM

Storage temperature range -65 to + 175 °C

stg

T

Maximum operating junction temperature 175 °C

j

SMA / SMB 20

tp = 10ms sinusoidal

1ASMA T

25

Symbol Parameter Value (max) Unit

L = 10 mm DO-41 45

R

th(j-l)

Junction to lead

°C/WSMA 30

SMB 25

R

1. R

Table 4. Static electrical characteristics

Junction to ambient

th(j-a)

is measured with a copper area S = Scm2 (see Figure 14).

th(j-a)

(1)

L = 10 mm DO-41 70 °C/W

A

Symbol Parameter Test conditions Min. Typ. Max. Unit

= 25 °C

T

I

Reverse leakage current

R

V

Forward voltage drop

F

j

= 150 °C 10 75

T

j

T

= 25 °C

j

= 150 °C 1.0 1.25

T

j

V

R

= 1A

I

F

= V

RRM

To evaluate the conduction losses use the following equation: P = 1.03 x I

F(AV)

+ 0.27 I

1

1.7

F2(RMS)

2/9 Doc ID 10203 Rev 5

µA

V

STTH1R06 Characteristics

Table 5. Dynamic characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

Reverse recovery

t

rr

time

Forward recovery

t

fr

time

V

Forward recovery

FP

voltage

= 25 °C

T

j

= 25 °C

T

j

T

= 25 °C

j

Figure 1. Conduction losses versus average

forward current

P(W)

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.0 0.2 0.4 0.6 0.8 1.0 1.2

δ = 0.05

δ = 0.1

I (A)

F(AV)

δ = 0.2

IF = 0.5A Irr = 0.25A IR =1A 25

= 1A dIF/dt = -50 A/µs VR =30V 30 45

I

F

= 1A dIF/dt = 100 A/µs

I

F

= 1.1 x V

V

FR

= 1A dIF/dt = 100 A/µs

I

F

VFR = 1.1 x V

Fmax

Figure 2. Forward voltage drop vs forward

current

I (A)

FM

15

δ = 0.5

δ

δ = 1

=tp/T

T

tp

14

13

12

11

10

9

8

7

6

5

4

3

2

1

0

012345

(typical values)

T=125°C

j

T=125°C

j

(maximum values)

V (V)

FM

100 ns

10 V

T=25°C

j

(maximum values)

ns

Figure 3. Relative variation of thermal

impedance junction to case vs pulse duration (DO-41)

Z/R

th(j-c) th(j-c)

1.0

0.9

0.8

0.7

0.6

δ = 0.5

0.5

0.4

0.3

δ = 0.2

0.2

δ = 0.1

0.1

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

Single pulse

t (s)

p

δ

T

=tp/T

Figure 4. Relative variation of thermal

impedance junction to case vs pulse duration (SMA)

Z/R

th(j-c) th(j-c)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

tp

0.1

0.0

2

S = 1cm

δ = 0.5

δ

=tp/T

T

tp

δ = 0.2

δ = 0.1

Single pulse

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

Doc ID 10203 Rev 5 3/9

Characteristics STTH1R06

Figure 5. Relative variation of thermal

impedance junction to case vs pulse duration (SMB)

Z/R

th(j-c) th(j-c)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

S = 1cm

= 0.5

δ

= 0.2

δ

= 0.1

δ

Single pulse

2

T

tp

t (s)

p

δ

=tp/T

Figure 7. Reverse recovery time versus dIF/dt

(typical values)

t (ns)

rr

140

130

120

110

100

90

80

70

60

50

40

30

20

10

0

0 50 100 150 200 250 300 350 400 450 500

I =2 x I

F F(AV)

I=I

F F(AV)

dI /dt(A/µs)

F

I =0.5 x I

F F(AV)

V =400V

R

T=125°C

j

Figure 6. Peak reverse recovery current vs

dI

/dt (typical values)

F

I (A)

RM

9

V =400V

R

8

T=125°C

j

7

6

5

I =0.25 x I

4

F F(AV)

3

2

1

0

0 50 100 150 200 250 300 350 400 450 500

I =0.5 x I

F F(AV)

I=I

F F(AV)

dI /dt(A/µs)

F

I =2 x I

F F(AV)

Figure 8. Reverse recovery charges versus

dI

/dt (typical values)

F

Q (nC)

rr

250

V =400V

R

225

T=125°C

j

200

175

150

125

100

75

50

25

0

0 50 100 150 200 250 300 350 400 450 500

dI /dt(A/µs)

F

I =2 x I

F F(AV)

I=I

I =0.5 x I

F F(AV)

R

j

vs dI

/dt (typical values)

F

Figure 10. Relative variations of dynamic

1.0

0.9

0.8

Figure 9. Reverse recovery softness factor

S factor

6

I=I V =400V T=125°C

5

0.7

4

3

2

1

dI /dt(A/µs)

0

0 50 100 150 200 250 300 350 400 450 500

F

0.6

0.5

0.4

0.3

0.2

0.1

0.0

25 50 75 100 125

4/9 Doc ID 10203 Rev 5

parameters vs junction temperature

S factor

I

RM

Q

RR

I=I

F F(AV)

V =400V

T (°C)

j

R

Reference:T =125°C

j

STTH1R06 Characteristics

0

5678910

Figure 11. Transient peak forward voltage vs

V (V)

FP

25

20

15

10

5

0

0 20 40 60 80 100 120 140 160 180 200

Figure 13. Junction capacitance versus

C(pF)

100

10

1

1 10 100 1000

dI

/dt (typical values)

F

I=I

F F(AV)

T=125°C

j

dI /dt(A/µs)

reverse voltage applied (typical values)

F

V (V)

R

F=1MHz

V =30mV

OSC

T =25°C

j

Figure 12. Forward recovery time vs dI

F

(typical values)

t (ns)

fr

200

180

160

140

120

100

80

60

40

20

0

0 20 40 60 80 100 120 140 160 180 200

dI /dt(A/µs)

F

I=I

F F(AV)

V =1.1 x V max.

FR F

T=125°C

j

Figure 14. Thermal resistance junction to

ambient versus copper surface under each lead

R (°C/W)

th(j-a)

110

100

90

80

70

60

50

40

30

20

10

0

1234

(epoxy FR4, Cu = 35 µm) (DO-41, SMB)

DO-41

Lleads = 10mm

SMB

S(cm²)

Figure 15. Thermal resistance junction to ambient versus copper surface under each lead

(epoxy FR4, Cu = 35 µm) (SMA)

/dt

R (°C/W)

th(j-a)

140

130

120

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

SMA

S(cm²)

Doc ID 10203 Rev 5 5/9

Package information STTH1R06

2 Package information

● Epoxy meets UL94, V0

● Lead-free packages

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 6. SMA dimensions

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

.

Dimensions

Ref.

E1

Millimeters Inches

Min. Max. Min. Max.

D

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

E

A1

C

L

A2

b

c 0.15 0.40 0.006 0.016

D 2.25 2.90 0.089 0.114

E 4.80 5.35 0.189 0.211

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

Figure 16. Footprint (dimensions in mm)

1.4

(0.055) (0.055)

2.63

(0.103)

1.4

5.43

(0.214)

6/9 Doc ID 10203 Rev 5

1.64

(0.064)

STTH1R06 Package information

Table 7. SMB dimensions

Dimensions

E1

D

E

A1

C

L

A2

b

Figure 17. Footprint (dimensions in mm)

1.62

(0.064) (0.102)

2.60

5.84

(0.300)

Ref.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

c 0.15 0.40 0.006 0.016

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

D 3.30 3.95 0.130 0.156

L 0.75 1.50 0.030 0.059

1.62

(0.064)

2.18

(0.086)

Table 8. DO-41 (plastic) dimensions

ØD

CC

A

ØB

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 4.07 5.20 0.160 0.205

B 2.04 2.71 0.080 0.107

C25.4 1

D 0.71 0.86 0.028 0.034

Doc ID 10203 Rev 5 7/9

Ordering information STTH1R06

3 Ordering information

Table 9. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STTH1R06 STTH1R06 DO-41 0.34 g 2000 Ammopack

STTH1R06RL STTH1R06 DO-41 0.34 g 5000 Tape and reel

STTH1R06A HR6 SMA 0.068 g 5000 Tape and reel

STTH1R06U BR6 SMB 0.11 g 2500 Tape and reel

4 Revision history

Table 10. Document revision history

Date Revision Changes

Apr-2003 1 First issue.

07-Sep-2004 2 DO-41 and SMA packages added.

24-Feb-2005 3

02-Jul-2007 4

30-Sep-2009 5 Updated table 8 package dimensions.

SMA package dimensions update. Reference A1 max. changed from 2.70 mm (0.106 inc.) to 2.03 mm (0.080).

Reformatted to current standards. Added cathode bars to cover illustrations. Updated dimensions and footprint illustrations for SMA and SMB packages. Corrected part number in Table 9.

8/9 Doc ID 10203 Rev 5

STTH1R06

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Doc ID 10203 Rev 5 9/9