The high quality design of this diode has
produced a device with low leakage current,
regularly reproducible characteristics and intrinsic
ruggedness. These characteristics make it ideal
for heavy duty applications that demand long term
reliability.
KA
A
K
DO-247
STTH6012W
Order codes
Part NumberMarking
STTH6012WSTTH6012W
Such demanding applications include industrial
power supplies, motor control, and similar
mission-critical systems that require rectification
and freewheeling. These diodes also fit into
auxiliary functions such as snubber, bootstrap,
and demagnetization applications.
The improved performance in low leakage
current, and therefore thermal runaway guard
band, is an immediate competitive advantage for
this device.
Surge non repetitive forward current tp = 10 ms Sinusoidal400A
Storage temperature range-65 to + 175°C
stg
Maximum operating junction temperature175°C
T
j
SymbolParameterValueUnit
R
th(j-c)
Table 3.Static electrical characteristics
Junction to case0.6°C/W
SymbolParameterTest conditionsMin.TypMax.Unit
T
(1)
I
R
V
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: t
Reverse leakage current
(2)
Forward voltage drop
F
= 380 µs, δ < 2 %
p
= 25° C
j
= 125° C30300
T
j
T
= 25° C
j
= 150° C1.301.95
T
j
= V
V
R
= 60 A
I
F
RRM
30
2.25
µA
VTj = 125° C1.352.05
To evaluate the conduction losses use the following equation:
P = 1.50 x I
2/8
F(AV)
+ 0.0075 I
F2(RMS)
Page 3
STTH6012Characteristics
Table 4.Dynamic characteristics
SymbolParameter
t
Reverse recovery time
rr
I
Reverse recovery current
RM
SSoftness factor
t
Forward recovery time
fr
V
Forward recovery voltage
FP
Figure 1.Conduction losses versus
average current
P(W)
160
140
120
100
80
60
40
20
0
δ = 0.05
0 1020304050607080
δ = 0.1
δ = 0.2
I(A)
F(AV)
δ = 0.5
δ
=tp/T
Test conditions
IF = 1 A, dIF/dt = -50 A/µs,
VR = 30 V, Tj = 25° C
= 1 A, dIF/dt = -100 A/µs,
I
F
= 30 V, Tj = 25° C
V
R
= 1 A, dIF/dt = -200 A/µs,
I
F
VR = 30 V, Tj = 25° C
I
= 60 A, dIF/dt = -200 A/µs,
F
VR = 600 V, Tj = 125° C
= 60 A, dIF/dt = -200 A/µs,
I
F
= 600 V, Tj = 125° C
V
R
= 60 A dIF/dt = 100 A/µs
I
F
VFR = 1.5 x V
= 60 A, dIF/dt = 100 A/µs,
I
F
= 25° C
T
j
, Tj = 25° C
Fmax
Figure 2.Forward voltage drop versus
I (A)
FM
200
180
δ = 1
T
tp
160
140
120
100
80
60
(maximum values)
40
20
0
0.00.51.01.52.02.53.03.54.0
forward current
T=150°C
j
(typical values)
T=150°C
j
Min.TypMax.Unit
125
6385
ns
5070
3245A
1
750ns
4.5V
T= 25°C
j
(maximum values)
V (V)
FM
3/8
Page 4
CharacteristicsSTTH6012
Figure 3.Relative variation of thermal
impedance junction to case versus
pulse duration
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
Single pulse
0.2
0.1
0.0
1.E-031.E-021.E-011.E+00
t (s)
p
Figure 5.Reverse recovery time versus
dI
/dt (typical values)
F
t (ns)
rr
1000
900
800
I =2 x I
700
600
500
400
300
200
050100150200250300350400450 500
F F(AV)
I=I
F F(AV)
dI /dt(A/µs)
F
I =0.5 x I
FF(AV)
V =600V
R
T=125°C
j
Figure 4.Peak reverse recovery current
versus dI
I (A)
RM
80
V =600V
R
T=125°C
j
70
60
50
I =0.5 x I
40
30
20
10
FF(AV)
0
050100150200250300350400450500
/dt (typical values)
F
I =2 x I
F F(AV)
I=I
F F(AV)
dI /dt(A/µs)
F
Figure 6.Reverse recovery charges versus
dIF/dt (typical values)
Q (µC)
rr
12
V =600V
R
T=125°C
j
10
8
6
4
2
0
050100150200250300350400450500
I =2 x I
F F(AV)
I=I
F F(AV)
I =0.5 x I
FF(AV)
dI /dt(A/µs)
F
Figure 7.Softness factor versus dIF/dt
(typical values)
S factor
2.00
1.75
1.50
1.25
1.00
0.75
dI /dt(A/µs)
0.50
050100150200250300350400450500
F
4/8
I 2xI
≤
F F(AV)
V =600V
R
T=125°C
j
Figure 8.Relative variations of dynamic
parameters versus junction
temperature
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
255075100125
S factor
t
I
RM
Q
RR
rr
T (°C)
j
I=I
F F(AV)
V =600V
R
Reference:T =125°C
j
Page 5
STTH6012Characteristics
Figure 9.Transient peak forward voltage
versus dI
V (V)
FP
25
I=I
F F(AV)
T=125°C
j
20
15
10
5
0
0100200300400500
/dt (typical values)
F
dI /dt(A/µs)
F
Figure 11. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
1000
F=1MHz
V =30mV
OSCRMS
T=25°C
j
Figure 10.Forward recovery time versus dI
(typical values)
t (ns)
fr
1400
1200
1000
800
600
400
dI /dt(A/µs)
200
0100200300400500
F
I=I
F F(AV)
V =1.5 x V max.
FRF
T=125°C
j
F
/dt
100
V (V)
10
1101001000
R
5/8
Page 6
Package informationSTTH6012
2 Package information
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.80 Nm
Maximum torque value: 1.0 Nm
Table 5.DO-247 dimensions
DIMENSIONS
REF.
MillimetersInches
Min.MaxMin.Max.
A4.855.15 0.1910.203
D2.202.60 0.0860.102
V
V
Dia
E0.400.80 0.0150.031
F1.001.400.0390.055
F22.000.078
H
A
F32.002.40 0.0780.094
G10.900.429
L5
L
L2
L4
F2
L1
L3
V2
F3
F
G
D
ME
H15.4515.75 0.6080.620
L19.8520.15 0.7810.793
L13.704.30 0.1450.169
L218.500.728
L314.2014.80 0.5590.582
L434.601.362
L55.500.216
M2.003.00 0.0780.118
V5°5°
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
6/8
V260°60°
Dia.3.553.650.1390.143
Page 7
STTH6012Ordering information
3 Ordering information
Part NumberMarkingPackageWeightBase qtyDelivery mode
STTH6012WSTTH6012WDO-247
4 Revision history
DateRevisionDescription of Changes
02-Mar-20061First issue.
4.4 g
30Tube
7/8
Page 8
STTH6012
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