Panasonic TH-L32C10S Schematic

ORDER NO. MTV0901731CE

LCD TV

Model No. TH-L32C10S

Chassis: KM02

Destination: SINGAPORE

Specifications

	Power Source		AC AUTO 110 - 240V, 50/60 Hz
	Power Consumption
	Average use		113 W
	Standby condition		0.6 W
	Display panel
	Aspect Ratio		16:9
	Visible screen size		80 cm (diagonal)
			698 mm (W) × 392 mm (H)
	(No. of pixels)		1,049,088 (1,366 (W) × 768 (H))
	Sound
	Speaker		Full range × 2 pcs, 8 Ω
	Audio Output		20 W (10 W + 10 W), 10% THD
	PC Signals		VGA, SVGA, XGA
			SXGA ...... (compressed)
			Horizontal scanning frequency 31 - 69 kHz
			Vertical scanning frequency 59 - 86 Hz
	Receiving Systems / Band name		17 SYSTEMS	FUNCTIONS
	1		PAL B, G, H
	2		PAL I
	3		PAL D, K	Reception of broadcast transmission and
	4		SECAM B, G
				playback from video cassette tape recorders.
	5		SECAM D, K
	6		SECAM K1
	7		NTSC M (NTSC 3.58 / 4.5MHZ)
	8		NTSC 4.43 / 5.5 MHz
	9		NTSC 4.43 / 6.0 MHz
	10		NTSC 4.43 / 6.5 MHz
	11		NTSC 3.58 / 5.5 MHz	Playback from special VCR’s or DVD.
	12		NTSC 3.58 / 6.0 MHz
	13		NTSC 3.58 / 6.5 MHz
	14		SECAM I

© Panasonic Corporation 2009. Unauthorized copying and distribution is a violation of law

TH-L32C10S

	15	PAL 60 Hz / 5.5 MHz	Playback from Special Disc Players and
	16	PAL 60 Hz / 6.0 MHz	Special VCR’s or DVD.
	17	PAL 60 Hz / 6.5 MHz
Receiving Channels (Regular TV)
VHF BAND	2 - 12	(PAL / SECAM B, K1)
	0 - 12	(PAL B AUST.)
	1 - 9	(PAL B N.Z.)
	1 - 12	(PAL / SECAM D)
	1 - 12	(NTSC M JAPAN)
	2 - 13	(NTSC M U.S.A.)
UHF BAND	21 - 69	(PAL G, H, I / SECAM G, K, K1)
	28 - 69	(PAL B AUST.)
	13 - 57	(PAL D, K)
	13 - 62	(NTSC M JAPAN)
	14 - 69	(NTSC M U.S.A.)
CATV	S1 - S20	(OSCAR)
	1 - 125	(U.S.A. CATV)
	C13 - C49	(JAPAN)
	S21 - S41	(HYPER)
	Z1 - Z37	(CHINA)
	5A, 9A	(AUST.)
Aerial - Rear		VHF / UHF
Operating Conditions		Temperature : 0°C - 40°C
		Humidity : 20 % - 80 % RH (non-condensing)
Connection Terminals
AV1 Input	AUDIO L-R	RCA PIN Type × 2	0.5 V [rms]
	VIDEO	RCA PIN Type × 1	1.0 V [p-p] (75 Ω)
AV2 Input	AUDIO L-R	RCA PIN Type × 2	0.5 V [rms]
	VIDEO	RCA PIN Type × 1	1.0 V [p-p] (75 Ω)
	COMPONENT	Y	1.0 V[p-p] (including synchronization)
		PB/CB, PR/CR	± 0.35 V [p-p]
Others	HDMI 1 / 2 Input	TYPE A Connectors	• This TV supports “HDAVI Control 4” function.
			• HDMI2 is not available for TH-L32C12K.
	PC Input	HIGH-DENSITY D-SUB 15 PIN	R, G, B / 0.7 V[p-p] (75 Ω)
			HD, VD / TTL LEVEL 2.0-5.0 V[rms] (high impedance)
	Card Slot	SD Card slot × 1
Monitor	AUDIO L-R	RCA PIN Type × 2	0.5 V [rms] (High impedance)
Output	VIDEO	RCA PIN Type × 1	1.0 V [p-p] (75 Ω)
Dimension (W x H x D)		798 mm × 551 mm × 217 mm (With Pedestal)
		798 mm × 511 mm × 87 mm (TV only)
Mass		13.5 kg Net (With Pedestal)
		11.5 kg Net (TV only)
	Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

TABLE OF CONTENTS

	PAGE			PAGE
1 Safety Precautions -----------------------------------------------	4	2	Prevention of Electro Static Discharge (ESD) to
1.1. General Guidelines ----------------------------------------	4		Electrostatically Sensitive (ES) Devices	------------------ 6
1.2. Touch-Current Check--------------------------------------	4	3	About Lead Free Solder (PbF)--------------------------------	7
1.3. KM02 Chasis Block Diagram----------------------------	5	4	Power LED Blinking Timing-----------------------------------	8
		5	Chassis Board-----------------------------------------------------	9

2

		TH-L32C10S
5.1. Chassis Installation ---------------------------------------	9	11.2.30. A Board - Sheet : 007 (4 / 9) ---------------------	59
6 Location of Controls and Components ------------------	10	11.2.31. A Board - Sheet : 007 (5 / 9) ---------------------	60
6.1. Wire Dressing ---------------------------------------------	10	11.2.32. A Board - Sheet : 007 (6 / 9) ---------------------	61
7 Disassembly and Assembly Instructions ---------------	11	11.2.33. A Board - Sheet : 007 (7 / 9) ---------------------	62
7.1. AC Cord Installation--------------------------------------	11	11.2.34. A Board - Sheet : 007 (8 / 9) ---------------------	63
7.2. VESA Metal Assembly ----------------------------------	12	11.2.35. A Board - Sheet : 007 (9 / 9) ---------------------	64
7.3. VESA (BC) Installation ----------------------------------	13	11.2.36. A Board - Sheet : 008 (1 / 4) ---------------------	65
7.4. Pedestal Assembly---------------------------------------	14	11.2.37. A Board - Sheet : 008 (2 / 4) ---------------------	66
7.5. LED Panel Installation & Fitting -----------------------	15	11.2.38. A Board - Sheet : 008 (3 / 4) ---------------------	67
7.6. Control Panel Assembly --------------------------------	16	11.2.39. A Board - Sheet : 008 (4 / 4) ---------------------	68
7.7. A-PB-MTG & Control Button Fixing------------------	17	11.2.40. A Board - Sheet : 009 (1 / 2) ---------------------	69
7.8. Side AV Bracket Assembly-----------------------------	18	11.2.41. A Board - Sheet : 009 (2 / 2) ---------------------	70
7.9. Speaker Installation --------------------------------------	19	11.2.42. A Board - Sheet : 010 (1 / 5) ---------------------	71
7.10. LCD Panel--------------------------------------------------	20	11.2.43. A Board - Sheet : 010 (2 / 5) ---------------------	72
7.11. LCD Mouting Fixing --------------------------------------	21	11.2.44. A Board - Sheet : 010 (3 / 5) ---------------------	73
7.12. LCD Panel Assembly Installation---------------------	22	11.2.45. A Board - Sheet : 010 (4 / 5) ---------------------	74
7.13. EMI Spec (LVDS) -----------------------------------------	23	11.2.46. A Board - Sheet : 010 (5 / 5) ---------------------	75
7.14. Back Cover Assembly (Felt Sticking)----------------	24	11.2.47. A Board - Sheet : 011 (1 / 2)----------------------	76
8 Service Mode Adjustment ------------------------------------	25	11.2.48. A Board - Sheet : 011 (2 / 2)----------------------	77
8.1. Self Check Mode -----------------------------------------	25	11.2.49. A Board - Sheet : 012 (1 / 3) ---------------------	78
8.2. Hotel Mode Adjustment ---------------------------------	25	11.2.50. A Board - Sheet : 012 (2 / 3) ---------------------	79
8.3. Hotel Mode -------------------------------------------------	25	11.2.51. A Board - Sheet : 012 (3 / 3) ---------------------	80
9 Measurements and Adjustments---------------------------	26	11.2.52. A Board - Sheet : 013 (1 / 5) ---------------------	81
9.1. Voltage Chart of A Board -------------------------------	26	11.2.53. A Board - Sheet : 013 (2 / 5) ---------------------	82
9.2. Voltage Chart of P Board -------------------------------	26	11.2.54. A Board - Sheet : 013 (3 / 5) ---------------------	83
9.3. Target of White Balance adjustment value---------	26	11.2.55. A Board - Sheet : 013 (4 / 5) ---------------------	84
10 Printed Circuit Board-------------------------------------------	27	11.2.56. A Board - Sheet : 013 (5 / 5) ---------------------	85
10.1. A-Board -----------------------------------------------------	27	11.2.57. A Board - Sheet : 014 (1 / 4) ---------------------	86
10.2. A-Board -----------------------------------------------------	28	11.2.58. A Board - Sheet : 014 (2 / 4) ---------------------	87
11 Schematic Diagram ---------------------------------------------	29	11.2.59. A Board - Sheet : 014 (3 / 4) ---------------------	88
11.1. Schematic Diagram Notes -----------------------------	29	11.2.60. A Board - Sheet : 014 (4 / 4) ---------------------	89
11.2. A Board -----------------------------------------------------	30	11.2.61. A Board - Sheet : 015 (1 / 7) ---------------------	90
11.2.1. A Board - Sheet : 001 (1 / 1) ----------------------	30	11.2.62. A Board - Sheet : 015 (2 / 7) ---------------------	91
11.2.2. A Board - Sheet : 002 (1 / 8) ----------------------	31	11.2.63. A Board - Sheet : 015 (3 / 7) ---------------------	92
11.2.3. A Board - Sheet : 002 (2 / 8) ----------------------	32	11.2.64. A Board - Sheet : 015 (4 / 7) ---------------------	93
11.2.4. A Board - Sheet : 002 (3 / 8) ----------------------	33	11.2.65. A Board - Sheet : 015 (5 / 7) ---------------------	94
11.2.5. A Board - Sheet : 002 (4 / 8) ----------------------	34	11.2.66. A Board - Sheet : 015 (6 / 7) ---------------------	95
11.2.6. A Board - Sheet : 002 (5 / 8) ----------------------	35	11.2.67. A Board - Sheet : 015 (7 / 7) ---------------------	96
11.2.7. A Board - Sheet : 002 (6 / 8) ----------------------	36	11.2.68. A Board - Sheet : 016 (1 / 1) ---------------------	97
11.2.8. A Board - Sheet : 002 (7 / 8) ----------------------	37	11.3. K Board -----------------------------------------------------	98
11.2.9. A Board - Sheet : 002 (8 / 8) ----------------------	38	11.3.1. K Board (1 / 2) ---------------------------------------	98
11.2.10. A Board - Sheet : 003 (1 / 6) ----------------------	39	11.3.2. K Board (2 / 2) ---------------------------------------	99
11.2.11. A Board - Sheet : 003 (2 / 6) ----------------------	40	11.4. P Board ---------------------------------------------------	100
11.2.12. A Board - Sheet : 003 (3 / 6) ----------------------	41	11.4.1. P Board (1 / 7) -------------------------------------	100
11.2.13. A Board - Sheet : 003 (4 / 6) ----------------------	42	11.4.2. P Board (2 / 7) -------------------------------------	101
11.2.14. A Board - Sheet : 003 (5 / 6) ----------------------	43	11.4.3. P Board (3 / 7) -------------------------------------	102
11.2.15. A Board - Sheet : 003 (6 / 6) ----------------------	44	11.4.4. P Board (4 / 7) -------------------------------------	103
11.2.16. A Board - Sheet : 004 (1 / 2) ----------------------	45	11.4.5. P Board (5 / 7) -------------------------------------	104
11.2.17. A Board - Sheet : 004 (2 / 2) ----------------------	46	11.4.6. P Board (6 / 7) -------------------------------------	105
11.2.18. A Board - Sheet : 005 (1 / 5) ----------------------	47	11.4.7. P Board (7 / 7) -------------------------------------	106
11.2.19. A Board - Sheet : 005 (2 / 5) ----------------------	48	11.5. V Board ---------------------------------------------------	107
11.2.20. A Board - Sheet : 005 (3 / 5) ----------------------	49	11.5.1. V Board (1 / 4) -------------------------------------	107
11.2.21. A Board - Sheet : 005 (4 / 5) ----------------------	50	11.5.2. V Board (2 / 4) -------------------------------------	108
11.2.22. A Board - Sheet : 005 (5 / 5) ----------------------	51	11.5.3. V Board (3 / 4) -------------------------------------	109
11.2.23. A Board - Sheet : 006 (1 / 4) ----------------------	52	11.5.4. V Board (4 / 4) --------------------------------------	110
11.2.24. A Board - Sheet : 006 (2 / 4) ----------------------	53	12 Exploded View and Replacement Parts List ----------	111
11.2.25. A Board - Sheet : 006 (3 / 4) ----------------------	54	12.1. Exploded View and Mechanical Replacement
11.2.26. A Board - Sheet : 006 (4 / 4) ----------------------	55	Parts List --------------------------------------------------	111
11.2.27. A Board - Sheet : 007 (1 / 9) ----------------------	56	12.2. Electrical Replacement Parts List-------------------	111
11.2.28. A Board - Sheet : 007 (2 / 9) ----------------------	57	12.2.1. Replacement Parts List Notes ------------------	111
11.2.29. A Board - Sheet : 007 (3 / 9) ----------------------	58	12.2.2. Electrical Replacement Parts List --------------	112

3

TH-L32C10S

1 Safety Precautions

1.1.		General Guidelines
1.	When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
	damaged by the short circuit.
2.	After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
	installed.
3.	After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2.		Touch-Current Check

1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2.Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such as a water pipe as shown in Figure 1.

3.Use the Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4.Check each exposed metallic part and measure the voltage at each point.

5.The potential at any point (touch current) expressed as voltage U1 and U2, do not exceed the following values: For AC: U1 = 35 V (peak) and U2 = 0.35 V (peak);

For DC: U1 = 1.0 V,

NOTE :

The limit value of U2 = 0.35 V (peak) for AC and U1 = 1.0 V for DC correspond to the values 0.7 mA (peak) AC and 2.0 mA DC.

The limit value U1 = 35 V (peak) for AC correspond to the value 70 mA (peak) AC for frequencies greater than 100 kHz.

6.Should a measurement be out of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

4

5

IP-PCB: 32” IPS ONLY (Inverter & Power)

TNP4G455

P-PCB: 37” ONLY (Power)

TNP4G454

BT	Inspection

FOR TNP4G455 ONLY

*Adjust the frequency to 56 ± 1kHz by using VR7851 *Check to the output : J102 or TP7871

*Check to the Over Voltage protection *Check to the Arc protection

V-PCB	BT → Divide	Inspection
(LED)
TNPA4834
		LED CAT EYES,REMOCON RECEIVER

K-PCB

BT → Divide (Control)

TNPA4901

In coming check

LCD PANEL

A-PCB		IPK	Point Dip		Writing
TNP4G460
(Degital main)
				EEPROM Writing (On board)
				*GENX
PEAKS NOR Flash				• EEPROM (8k) x 1
(Writing IC)
				IC1101
256Mbit
IC8554				*PEAKS
Sum : only effective area				• EEPROM (16k) x 1
				IC8601
Add : 0 ~ 1FFFFFF
				<Write Protect command>
				*GENX : Protect OFF = 70,88,00
					Protect ON = 70,88,ff
				*PEAKS : Protect OFF = 70,8B,00
					Protect ON = 70,8B,ff

Assembly

A

Inspection

<Visual check>

*Voltage check

* LED Check Inverter (Blue LED)

<FACT-TEST>

*ANALOG TUNE *VCXO ADJ *LOCAL OSD *AV_SW CHECK

*AV1/AV2/AV3---CVBS *AV3---S(YC) *MONITOR-OUT *AV1/AV2---Component *PC

*HDMI1

*HDMI2

*CEC_(HDMI1/HDMI2) *Backlight

*SD Card

*Software & EEPROM version check by self check (1 set only)

Diagram Block Chasis KM02 .3.1

L32C10S-TH

TH-L32C10S

2 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some fieldeffect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminium foil to prevent electrostatic charge buildup or exposure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can generate electrical charges sufficient to damage ES devices.

5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it (most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or comparable conductive material).

7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution:

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8.Minimize bodily motions when handling unpackaged replacement ES devices (otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

6

TH-L32C10S

3 About Lead Free Solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead Solder and PbF will refer to Lead Free Solder.

The Lead Free Solder (PbF) used in our manufacturing process and discussed below is (Sn+Ag+Cu). Those are Tin (Sn), Silver (Ag) and Copper (Cu), although other types are available.

This model uses PbF in its manufacture due to environmental conservation issues. For service and repair work, we would suggest the use of PbF as well, although Pb may be used.

PCBs manufactured using lead-free will have the “PbF within a leaf Symbol” stamped on their back.

Caution

•PbF has a higher melting point than that of standard solder. Typically the melting point is 50 ~ 70°F (30~40°C) higher. Please use a high temperature soldering iron and set it to 700 ± 20°F (370 ± 10°C).

•PbF will tend to splash when heated too high (about 1100°F or 600°C).

If you must use Pb solder, please completely remove all of the PbF on the pins or solder area before applying Pb. If this is not practical, be sure to heat the PbF until it melts, before applying Pb.

•After applying PbF to double layered boards, please check the component side for excess solder which may flow onto the opposite side (see Figure 2).

Figure 2

Suggested PbF

There are several kinds of PbF available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper) and Sn+Zn+Bi (tin, zinc, bismuth) solders can also be used.

Figure 3

7

TH-L32C10S

4Power LED Blinking Timing

1.Subject

Information of LED Flashing timing.

2.Contents

When an abonormality has occurred in the unit, the protection circuit operates and resets to standby mode. At this time, the defective block can be identified by the number of blinking of the Power LED on the front panel of the unit as follow:

Blinking times	Contents
1	Lamp short circuit protection
	Lamp open protection
	Arc protection
2	Cooling fan SOS = incomplete connection - no function mode.
3	P board 30V / 18V / 9V decreased / short circuit detection.
4	DTV12V decreased / short circuit , main convertor stop detection.
5	Sub 5V decreased / short circuit detection.
6	Sub 5V decreased / short circuit detection. (same as 5 times LED blinking)
7	Sub 3.3V decreased / short circuit detection.
8	Sub 5V decreased / short circuit detection. (same as 5 times LED blinking)
9	Audio amp SOS.
10	HQ1 incomplete connection, no function mode.
13	When peaks communication error SOS.

8

TH-L32C10S

5 Chassis Board

5.1.Chassis Installation

1.Stick FELT to SIDE AV BRACKET.

-Stick the SIDE AV INDI. SHEET on the SIDE AV BRACKET.

-Insert the SIDE AV BRACKET from the side position of the A-PCB.

9

TH-L32C10S

6 Location of Controls and Components

6.1.Wire Dressing

1.Wiring No. 1 ~ No.7

2.Remove dust of terminal of LVDS and PB connector. (by ion blow) Pos. A11

3.Insert LVDS into A11.

	Wire						Clamper
		1	2	3	4	5	6	7	8	9	10	11

No.1 A10 ~ V10

No.2 A01 ~ K01

No.3 A12 ~ SP(L)

No.4 A12 ~ SP(R)

No.5 ~ P5

No.6 ~ P6

No.7 A20 ~ P4

10

TH-L32C10S

7 Disassembly and Assembly Instructions

7.1.AC Cord Installation

1.Put on the AC CORD BRACKET on the CABINET.

2.Fix the AC CORD BRACKET with SCREW.

3.AC CORD BARRIER setting.

4.Insert AC CORD connector into P-PCB connector.

5.Clamp the AC CORD.

6.Insert AC CORD bushing into the AC CORD BRACKET.

11

TH-L32C10S

7.2.VESA Metal Assembly

1.Assemble LCD TOP MTG(L,R) , VESA METAL(upper) and fix them with screw. Please use jig for vesa metal assembly preparation.

12

TH-L32C10S

7.3.VESA (BC) Installation

1.Put VESA METAL(BC) on the BACK COVER.

2.Fix them with SCREWS.

13

TH-L32C10S

7.4.Pedestal Assembly

Step 1

Setting BASE PLATE and PEDESTAL COVER with SCREWS.

Step 2

1.Stick the RUBBER FOOT at bottom PEDESTAL COVER and BASE PLATE.

2.RUBBER FOOT (TBL4GG3008 - 2 pcs) stick at BASE PLATE.

3.RUBBER FOOT (TBL4GG3009 - 2 pcs) stick at bottom PEDESTAL COVER.

14

TH-L32C10S

7.5.LED Panel Installation & Fitting

1.Put LED SHADE RIB on CABINET.

2.Fix LED PANEL on CABINET.

3.Wire connecting. (V10)

4.Put V-PCB on CABINET.

5.Fix them with SCREW.

6.Insert the CLAMPER.

15

TH-L32C10S

7.6.Control Panel Assembly

1.Wire connecting. (K1)

2.Assemble POWER BUTTON to the K-PRINT.

3.Assemble K-PRINT, CONTROL BUTTON, CONTROL PANEL BRACKET.

4.Fix them with SCREWS.

5.Stick the FELT.

16

TH-L32C10S

7.7.A-PB-MTG & Control Button Fixing

1.Stick P-PCB BARRIER and put all METAL part follow to the picture. Fix all metal part with screw.

2.Put CONTROL PANEL ASSY on the CABINET. Fix the CONTROL PANEL with SCREWS.

17

TH-L32C10S

7.8.Side AV Bracket Assembly

• STICK FELT TMK4G028 (7 X 240 X 0.55t) - 2 PCS.

18

TH-L32C10S

7.9.Speaker Installation

1.Stick the SPONGE. Follow the spec. below.

2.SP BRACKET slot at CABINET.

3.Insert the SP RUBBER BUSH into the SP UNIT.

4.Insert the SP UNIT to SP BRACKET.

5.Fix them with SCREWS.

19

TH-L32C10S

7.10. LCD Panel

1.Remove dust of terminal of LVDS. (by ion blow)

2.Remove dust of terminal of T-con connector. (by ion blow)

3.Insert LVDS into T-con connector.

4.Stick the tape to fix LVDS.

5.Stick the SPONGE at left and right lcd panel.

6.Stick 1pc SPONGE between lcd panel wire.

20

TH-L32C10S

7.11. LCD Mouting Fixing

Step 1

1.LCD SIDE MTG on the CABINET.

2.LCD BTM MTG on the CABINET.

3.LCD BOTTOM CORNER MTG on the CABINET.

4.Fix them with SCREW.

Step 2

1.Assemble LCD TOP MTG (L, R), VESA METAL (upper) and fix them with SCREWS.

2.Put on the VESA METAL ASSY on the LCD PANEL.

3.Fix the VESA METAL ASSY with SCREW.

21

TH-L32C10S

7.12. LCD Panel Assembly Installation

1. Put LCD panel to cabinet assembly.

22

TH-L32C10S

7.13. EMI Spec (LVDS)

1.When insert LVDS wire to T-con conector,make sure must center position follow bellow picture.

2.After fixing LVDS wire please bent again follow the picture.

23

TH-L32C10S

7.14. Back Cover Assembly (Felt Sticking)

Stick the FELT.

24

TH-L32C10S

8 Service Mode Adjustment

Set timer to 30min, press the “RECALL” button on the remote control and press “-” vol button on the LCD panel.

• Press button R and G for adjustment.

8.1.Self Check Mode

1.Press the “MENU” button (on the remote control ) and the “DOWN” button on the LCD panel.

2.Press ON/OFF button on the panel to Exit.

8.2.Hotel Mode Adjustment

1.Press the “VOLUME DOWN” button on the TV panel and simultaneously press the AV button on the remote control 3 times to enter Hotel Mode.

2.Set Hotel mode “on/off”, then press “EXIT” to come out.

8.3.Hotel Mode

1.Purpose

Restrict a function for hotels.

2.Access command to the Hotel mode setup menu.

In order to display the Hotel mode setup menu, please enter the following command (within 2 second).

[TV] : Hold Vol [Down] + [Remote] : Press AV button 3 times.

Then, the Hotel mode setup menu is displayed.

Item	Function
Hotel Mode	Select hotel mode ON/OFF
Initial INPUT	Select input signal modes.
	Set the input, when each time power is switched
	on.
	Selection :
	OFF/Analogue TV/Digital TV/AV1/AV2/AV3//PC/
	HDMI1/HDMI2/HDMI3
	• Off: give priority to a last memory.
	• Selectable input is depend on the model.
Initial POS	Select programme number.
	Selection :
	Off/0 to 100
	• Off: give priority to a last memory.
Initial VOL level	Adjust the volume when each time power is
	switched on.
	Selection/Range :
	Off/0 to 100
	• Off: give priority to a last memory.
Maximum VOL	Adjust maximum volume.
level	Range :
	0 to 100
Button lock	Select local key conditions.
	Selection :
	Off/SETUP/MENU/All
	• Off: altogether valid.
	• SETUP: only F-key is invalid.
	(Tuning guide (menu) can not be selected.)
	• MENU: only F-key is invalid.
	(only Volume/Mute can be selected.)
	• ALL: altogether invalid.
Remote lock	Select remote control key conditions.
	Selection :
	Off/SETUP/MENU
	• Off: altogether valid.
	• SETUP: only Setup menu is invalid.
	• MENU: Picture/Sound/Setup menu are invalid.

25

TH-L32C10S

9 Measurements and Adjustments

9.1.Voltage Chart of A Board

Set A-Board to a dummy set and check the satisfaction with the specified voltage as following table.

	Power Supply Name	Measurement Point	Specification (V)
			TNP4G460 / TNP4G461
	SUB1.2V	TP5602	1.22 - 1.32
	SUB1.8V	TP5601	1.78 - 1.91
	SUB3.3V	TP5600	3.21 - 3.45
	SUB9V	TP5409	8.76 - 9.45
	SUB5V	TP5405	4.82 - 5.18
	BT30V	TP5482	29.3 - 31.5

9.2.Voltage Chart of P Board

Set P-Board to a dummy set and check the satisfaction with the specified voltage as following table.

Power Supply name	Measurement Point	Normal condition (V)		Standby condition (V)
AUDIO_VCC	TP866	17.0	± 1.7	< 3.0
12V	TP865	12.0	± 0.6	< 1.0
5VS	TP854	5.6 ± 0.3		5.6 ± 0.3
STBY_6V	TP853	5.6 ± 0.3		5.6 ± 0.3
PFC Vout	TP801	400	± 10	NO CARE

After inspection, discharge the C7218 with 1kΩ resistor for 0.3 sec. or more.

9.3.Target of White Balance adjustment value

	Ambient Temp.	Colour Balance		White			Gray
			x	y	Y (cd/m2)	x	y	Y (cd/m2)
		Cool	0.271	0.275		0.271	0.275
	22.5 - 27.5 deg.				>300			Don’t Care
		Normal	0.284	0.297		0.284	0.297
		Warm	0.314	0.324		0.314	0.324

Clearance

x, y : +/-0.005 in Cool Colour Balance, +/-0.010 in Warm/Normal Colour Balance

26

TH-L32C10S

10 Printed Circuit Board

10.1. A-Board

A-Board (A Side)

TNP4G460

1

2

3

4

5

6

7

8

9

10

A

B

C

D

E

F

G

H

I

J

K

L

M

Parts Location

Ref. No	Location		Ref. No	Location		Ref. No	Location		Ref. No	Location
IC1100	K4		IC5441	M9		IC8404	J4		D3015	D7
IC1101	L3		IC5480	J5		IC8405	J3		D4513	H7
IC2750	L2		IC5600	B5		IC8408	J3		D4617	L8
IC2901	K10		IC5601	B5		IC8409	L2
IC2902	K9		IC8004	D4		IC8410	J2
IC3001	D8		IC8301	K8		IC8554	G3
IC4513	G7		IC8302	L8		IC8601	H5
IC5405	B4		IC8401	H2

27

TH-L32C10S

10.2. A-Board

A-Board (B Side)

TNP4G460

1

2

3

4

5

6

7

8

9

10

A

B

C

D

E

F

G

H

I

J

K

L

M

Parts Location

Ref. No	Location		Ref. No	Location		Ref. No	Location		Ref. No	Location
IC2008	E4		IC4512	G7		IC8002	C8		D3015	E5
IC2301	A4		IC5409	B5		IC8003	D9
IC4510	F5		IC5451	B9		IC8403	F10
IC4511	G7		IC8001	E9		IC8411	L9

28

TH-L32C10S

11 Schematic Diagram

11.1. Schematic Diagram Notes

Notes :

1.Resistor

Unit of resistance is OHM [Ω] (K = 1 000, M = 1 000 000).

2.Capacitor

Unit of capacitance is μF unless otherwise noted.

3.Coil

Unit of inductance is μF unless otherwise noted.

4.Test Point

: Test Point position

5.Earth Symbol

: Chassis Earth (Cold)

: Line Earth (Hot)

6.Voltage Measurement

Voltage is measured using DC voltmeter. Conditions of the measurement are the following :

Power Source....................AC AUTO 110-240 V, 50/60 Hz Receiving Signal................Colour Bar signal (RF)

All customer’s controls.......Maximum positions

7.Number in red circle indicates waveform number. (See waveform pattern table)

8.When an arrow mark ( ) is found, connection is easily found from the direction of the arrow.

9.Indicates the major signal flow: Video Audio

10.This schematic diagram is the latest at the time of printing and subject to change without notice.

Remarks :

1.The Power Circuit contains a circuit area which uses a separate power supply to isolate the earth connection. The circuit is defined by HOT and COLD indications in the schematic diagram. Take the following precautions: All circuits, except the Power Circuit are cold.

Precautions:

a.Do not touch the hot part or the hot and cold parts at the same time or you may be shocked.

b.Do not short-circuit the hot and cold circuits or a fuse may blow and parts may break.

c.Do not connect an instrument such as an oscilloscope to the hot and cold circuits simultaneously or a fuse may blow. Connect the earth of instruments to the earth connection of the circuit being measured.

d.Make sure to disconnect the power plug before removing the chassis.

29

TH-L32C10S

11.2. A Board

11.2.1.A Board - Sheet : 001 (1 / 1)

30