|
|
Internal Use Only |
North/Latin America |
http://aic.lgservice.com |
|
Europe/Africa |
http://eic.lgservice.com |
|
Asia/Oceania |
http://biz.lgservice.com |
|
LCD MONITOR TV SERVICE MANUAL
CHASSIS : LD93D
MODEL : M197WDP M197WDP-PZL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS
CONTENTS .............................................................................................. |
2 |
PRODUCT SAFETY .................................................................................. |
3 |
SPECIFICATION ........................................................................................ |
6 |
ADJUSTMENT INSTRUCTION ............................................................... |
17 |
TROUBLE SHOOTING ............................................................................ |
21 |
BLOCK DIAGRAM................................................................................... |
29 |
EXPLODED VIEW .................................................................................. |
30 |
SVC. SHEET ............................................................................................... |
|
Copyright |
LG Electronics. Inc. All right reserved. |
- 2 - |
LGE Internal Use Only |
Only for training and service purposes |
|
|
|
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT.
•There are some special components used in LCD monitor that are important for safety. These parts are marked 
on the schematic diagram and the Exploded View It is essential that these critical parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.
•Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.
•Must mount the module using mounting holes arranged in four corners.
•Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.
•Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.
•Protect the module from the ESD as it may damage the electronic circuit (C-MOS).
•Make certain that treatment person’s body are grounded through wrist band.
•Do not leave the module in high temperature and in areas of high humidity for a long time.
•The module not be exposed to the direct sunlight.
•Avoid contact with water as it may a short circuit within the module.
•If the surface of panel become dirty, please wipe it off with a soft material. (Cleaning with a dirty or rough cloth may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.
WARNING
BE CAREFUL ELECTRIC SHOCK !
•If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.
•Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.
Leakage Current Hot Check Circuit
AC Volt-meter
Good Earth Ground such as WATER PIPE,
To Instrument's CONDUIT etc.
exposed 0.15uF METALLIC PARTS
1.5 Kohm/10W
When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1 Ω *Base on Adjustment standard
• Replaceable batteries
* CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS
Copyright |
LG Electronics. Inc. All right reserved. |
- 3 - |
LGE Internal Use Only |
Only for training and service purposes |
|
|
|
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1.Always unplug the receiver AC power cord from the AC power source before;
a.Removing or reinstalling any component, circuit board module or any other receiver assembly.
b.Disconnecting or re-connecting any receiver electrical plug or other electrical connection.
c.Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.
2.Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3.Do not spray chemicals on or near this receiver or any of its assemblies.
4.Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) is opropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of contacts in not required.
5.Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6.Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7.Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.
Always remove the test receiver ground lead last.
8.Use with this receiver only the test fixtures specified in this service manual.
CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the
unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
General Soldering Guidelines
1.Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500ºF to 600ºF.
2.Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3.Keep the soldering iron tip clean and well tinned.
4.Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5.Use the following unsoldering technique
a.Allow the soldering iron tip to reach normal temperature. (500ºF to 600ºF)
b.Heat the component lead until the solder melts.
c.Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6.Use the following soldering technique.
a.Allow the soldering iron tip to reach a normal temperature (500ºF to 600ºF)
b.First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.
c.Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d.Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
Copyright |
LG Electronics. Inc. All right reserved. |
- 4 - |
LGE Internal Use Only |
Only for training and service purposes |
|
|
|
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1.Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2.Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the IC.
Replacement
1.Carefully insert the replacement IC in the circuit board.
2.Carefully bend each IC lead against the circuit foil pad and solder it.
3.Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1.Remove the defective transistor by clipping its leads as close as possible to the component body.
2.Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3.Bend into a "U" shape the replacement transistor leads.
4.Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1.Heat and remove all solder from around the transistor leads.
2.Remove the heat sink mounting screw (if so equipped).
3.Carefully remove the transistor from the heat sink of the circuit board.
4.Insert new transistor in the circuit board.
5.Solder each transistor lead, and clip off excess lead.
6.Replace heat sink.
Diode Removal/Replacement
1.Remove defective diode by clipping its leads as close as possible to diode body.
2.Bend the two remaining leads perpendicular y to the circuit board.
3.Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4.Securely crimp each connection and solder it.
5.Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement
1.Clip each fuse or resistor lead at top of the circuit board hollow stake.
2.Securely crimp the leads of replacement component around notch at stake top.
3.Solder the connections.
CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).
1.Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2.carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3.Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4.Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1.Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2.Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.
3.Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Copyright |
LG Electronics. Inc. All right reserved. |
- 5 - |
LGE Internal Use Only |
Only for training and service purposes |
|
|
|
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application Range.
This spec sheet is applied to the 22”/ 23” LCD Monitor TV used LD93C chassis.
2. Specification
Each part is tested as below without special appointment
2.1Temperature : 25±5°C(77±9°F), CST : 40±5°C
2.2Relative Humidity : 65±10%
2.3Power Voltage : Standard input voltage (100~240V@ 50/60Hz)
• Standard Voltage of each products is marked by models
2.4Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM .
2.5The receiver must be operated for about 5 minutes prior to the adjustment.
3.Test method
3.1Performance : LGE TV test method followed.
3.2Demanded other specification
Safety : CE, IEC specification
EMC : CE, IEC
Safety : IEC/EN60065
EMI : EN55013
EMS : EN55020
4.Module Specification
4.1M197WDP-PZL : LGD / LM185WH1-TLD2 ( P/N : EAJ60795101 / P6E, ZBD) REPLACEMENT MODULE : LGD / LM185WH1-TLD1 ( P/N : EAJ60796501 / P6, ZBD)
No |
Item |
Specification |
Unit |
Remark |
|
|
|
|
|
1 |
Type |
TFT Color LCD Module |
|
|
|
|
|
|
|
2 |
Diagonal Size |
18.51 inches diagonal |
|
|
|
|
|
|
|
3 |
Active Display area |
409.8(H) 230.4(V) |
mm |
|
|
|
|
|
|
4 |
Outline Dimension |
430.4(H) x 254.6(V) x 13.0(D) |
mm |
Typ. (Without Inverter) |
|
|
|
|
|
5 |
Aspect Ratio |
16:9 |
|
|
|
|
|
|
|
6 |
Pixel Number |
1366 x RGB x 768 |
pixel |
|
|
|
|
|
|
7 |
Pixel Pitch |
0.30(H) x 0.30(V) |
mm |
|
|
|
|
|
|
8 |
Color arrangement |
RGB vertical Stripe |
|
|
|
|
|
|
|
9 |
Color Depth |
16.7M color (6bit with A-FRC) |
|
|
|
|
|
|
|
10 |
Electrical Interface |
LVDS 1Port |
|
|
|
|
|
|
|
11 |
Surface Treatment |
Hard coating(3H) & Anti-glare(Haze 25) |
|
|
|
|
|
|
|
12 |
Operating Mode |
Normally White |
|
|
|
|
|
|
|
13 |
Backlight Unit |
2 CCFL (2 lamps) |
|
|
|
|
|
|
|
14 |
Response Time |
Rising Time : 1.1 + Falling Time : 3.9 |
ms |
Typ. |
|
|
|
|
|
15 |
Color Gamut |
72% |
|
|
|
|
|
|
|
Copyright |
LG Electronics. Inc. All right reserved. |
- 6 - |
LGE Internal Use Only |
Only for training and service purposes |
|
|
|
4.2 M197WDP-PZL : AUO / M185XW01-V2 ( P/N : EAJ60796501/ ZBD)
No |
Item |
Specification |
Unit |
Remark |
|
|
|
|
|
1 |
Type |
TFT Color LCD Module |
|
|
|
|
|
|
|
2 |
Diagonal Size |
18.51 inches(470.1mm) diagonal |
|
|
|
|
|
|
|
3 |
Active Display area |
409.8(H) 230.4(V) |
mm |
|
|
|
|
|
|
4 |
Outline Dimension |
430.4(H) x 254.6(V) x 13.0(D) |
mm |
Typ. (Without Inverter) |
|
|
|
|
|
5 |
Aspect Ratio |
16:9 |
|
|
|
|
|
|
|
6 |
Pixel Number |
1366 x RGB x 768 |
pixel |
|
|
|
|
|
|
7 |
Pixel Pitch |
0.30(H) x 0.30(V) |
mm |
|
|
|
|
|
|
8 |
Color arrangement |
RGB vertical Stripe |
|
|
|
|
|
|
|
9 |
Color Depth |
16.7M color (6bit with A-FRC) |
|
|
|
|
|
|
|
10 |
Electrical Interface |
LVDS 1Port |
|
|
|
|
|
|
|
11 |
Surface Treatment |
Hard coating(3H) & Anti-glare(Haze 25) |
|
|
|
|
|
|
|
12 |
Operating Mode |
Normally White |
|
|
|
|
|
|
|
13 |
Backlight Unit |
2 CCFL (2 lamps) |
|
|
|
|
|
|
|
14 |
Response Time |
Rising Time : 1.1 + Falling Time : 3.9 |
ms |
Typ. |
|
|
|
|
|
15 |
Color Gamut |
72% |
|
|
|
|
|
|
|
Copyright |
LG Electronics. Inc. All right reserved. |
- 7 - |
LGE Internal Use Only |
Only for training and service purposes |
|
|
|
5.General Specification
5.1 TV
No |
Item |
Specification |
Remarks |
|
|
|
|
1 |
Market |
EU(PAL Market-26Countries) |
DTV & Analog |
|
|
|
UK, France, Germany, Spain, Sweden, Finland, |
|
|
|
Italy, Netherland, Belgium, Czech |
|
|
|
Luxemburg, Greece, Denmark, Austria, Hungary, |
|
|
|
Switzerland, Croatia, Turkey |
|
|
|
Analog Only - |
|
|
|
Poland, Portugal, Norway, Bulgaria, |
|
|
|
Serbia,Slovenia, Russia, Romania |
|
|
|
|
2 |
Broadcasting system |
1) PAL-BG |
|
|
|
2) PAL-DK |
|
|
|
3) PAL-I/I’ |
|
|
|
4) SECAM L/L’ |
|
|
|
5) DVB-T |
|
|
|
|
|
3 |
Receiving system |
Analog : Upper Heterodyne |
|
|
|
Digital : COFDM |
|
|
|
|
|
4 |
Scart Jack (2EA) |
PAL, SECAM |
Scart 1 Jack is Full scart and support RF-OUT(ATV) |
|
|
|
Scart 2 jack is Half scart and support MNT/DTV-OUT. |
|
|
|
|
5 |
Component Input (1EA) |
Y/Cb/Cr |
|
|
|
Y/Pb/Pr |
|
|
|
|
|
6 |
RGB Input |
RGB-PC |
Analog(D-SUB 15Pin) |
|
|
|
|
7 |
DVI Input |
DVI-D |
Digital |
|
|
|
|
8 |
HDMI Input (1EA) |
HDMI-DTV |
HDMI version 1.3 Support HDCP / Not support PC |
|
|
|
|
9 |
Audio Input (2EA) |
RGB/DVI Audio |
|
|
|
Component |
L/R Input |
|
|
|
|
10 |
SPDIF out (1EA) |
SPDIF out |
|
|
|
|
|
11 |
Earphone out (1EA) |
Antenna, AV1, AV2, Component, |
|
|
|
RGB, DVI, HDMI |
|
|
|
|
|
12 |
USB (1EA) |
Picture, Music |
Software Update + Picture + Music |
|
|
|
|
13 |
RS-232C (1EA) |
|
Commercial Mode |
|
|
|
|
Copyright |
LG Electronics. Inc. All right reserved. |
- 8 - |
LGE Internal Use Only |
Only for training and service purposes |
|
|
|
5.2 RGB / DVI
No |
Item |
|
|
|
|
|
Specification |
|
Remarks |
||
|
|
|
|
|
|
|
|
|
|
||
1 |
Supported Sync. Type |
|
|
Separate Sync., Digital |
|
|
|
||||
|
|
|
|
|
|
|
|
|
|
||
2 |
Operating Frequency |
|
|
Analog |
Horizontal |
30 ~ 61kHz |
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Vertical |
56 ~ 75 Hz |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Digital |
Horizontal |
30 ~ 61kHz |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Vertical |
56 ~ 75 Hz |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
3 |
Resolution |
|
|
|
Analog |
Max. |
|
1360 x 768 @ 60Hz |
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Recommend |
1360 x 768 @ 60Hz |
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Digital |
Max. |
|
1360 x 768 @ 60Hz |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Recommend |
1360 x 768 @ 60Hz |
|
||
|
|
|
|
|
|
|
|
|
|
|
|
4 |
Input Voltage |
|
|
|
Voltage :100 – 240 Vac, 50 or 60Hz |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
5 |
Inrush Current |
|
|
|
Cold Start : 50 A |
Hot : 120 A |
|
|
|||
|
|
|
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|
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|
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|
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|
|
|
|
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|
||
6 |
Operating Condition |
|
|
Sync (H/V) |
Video |
|
LED |
Wattage |
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
Power S/W On |
|
On |
|
Typ. |
On/On |
Active |
Blue |
35W |
|
|
|
|
|
|
||||||||
|
|
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|
|
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|
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|
|
mode |
|
Max |
On/On |
Active |
Blue |
40W |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Sleep |
|
mode |
Off/On |
Off |
|
Amber |
1W |
RGB/ |
|
|
|
|
|
|
|
|
||||
|
|
|
|
|
|
On/Off |
|
||||
|
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|
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|
|
|
|
|
|
|
|
|
|
|
|
Power S/W Off |
|
Off mode |
- |
Off |
|
Off |
0.5W |
|
||
|
|
|
|
|
|
|
|
|
|
|
|
7 |
MTBF |
|
|
|
50,000 HRS with 90% Confidence leve |
|
22”AUO:40,000 Hours(min) |
||||
|
|
|
|
|
|
|
|
|
|
|
Lamp Life 22”LGD:50,000 Hours(min) |
|
|
|
|
|
|
|
|
|
|
|
|
8 |
Using Altitude |
|
|
|
5,000 m (for Reliability) 3,000m(for FOS) |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
9 |
Operating Environment |
|
|
Temp : 10°C ~ 35°C |
|
|
|
|
|||
|
|
|
|
|
|
Humidity : 20 % ~ 80 % |
|
|
|
||
|
|
|
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|
|
|
|
|
||
10 |
Storage Environment |
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Temp : -10°C~60°C non condensing |
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Humidity : 5 % ~ 90 % non condensing |
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Copyright |
LG Electronics. Inc. All right reserved. |
- 9 - |
LGE Internal Use Only |
Only for training and service purposes |
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6.Chroma & Brightness
6.1 MM197WDP – LGD Module (for more details, refer to the module spec.)
No. |
Item |
Specification |
Min. |
Typ. |
Max. |
Remark |
|
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1 |
Viewing Angle[CR>10] |
Right/Left |
|
70/70 |
85/85 |
- |
CR >10 |
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Up/Downl |
|
60/70 |
75/85 |
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2 |
Luminance |
Luminance (cd/m2) |
200 |
250 |
- |
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Variation(%) |
|
75 |
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3 |
Contrst Ratio |
CR |
|
700 |
1000 |
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Full white/Full black |
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4 |
Color Coordinates [CIE1931] |
White |
WX |
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0.313 |
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WY |
Typ. |
0.329 |
Typ. |
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RED |
RX |
-0.03 |
0.642 |
+0.03 |
DVI or RGB |
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RY |
|
0.302 |
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Standard, 6500K |
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Green |
GX |
|
0.302 |
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Full white(100IRE) |
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GY |
|
0.611 |
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Backlight 100 |
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Blue |
BX |
|
0.144 |
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BY |
|
0.069 |
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5 |
Response Time(ms) |
Rise Time |
TrR |
|
1.1 |
2.6 |
Condition : DVI or RGB |
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Decay Time |
TrD |
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3.9 |
7.4 |
Standard, Backlight100 |
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6.2 M197WDP – AUO Module (for more details, refer to the module spec.)
No. |
Item |
Specification |
Min. |
Typ. |
Max. |
Remark |
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1 |
Viewing Angle[CR>10] |
Horizontal |
|
150 |
170 |
- |
CR >10 |
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Vertical |
|
140 |
160 |
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2 |
Luminance |
Luminance (cd/m2) |
200 |
250 |
- |
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Variation(%) |
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75 |
80 |
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3 |
Contrst Ratio |
CR |
|
600 |
1000 |
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Full white/Full black |
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4 |
Color Coordinates [CIE1931] |
White |
WX |
|
0.313 |
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WY |
Typ. |
0.329 |
Typ. |
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RED |
RX |
-0.03 |
0.648 |
+0.03 |
DVI or RGB |
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RY |
|
0.339 |
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Standard, 6500K |
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Green |
GX |
|
0.292 |
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Full white(100IRE) |
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GY |
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0.603 |
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Backlight 100 |
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Blue |
BX |
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0.143 |
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BY |
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0.070 |
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5 |
Response Time(ms) |
Rise Time |
TrR |
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3.8 |
5.5 |
Condition : DVI or RGB |
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Standard, Backlight100 |
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Copyright |
LG Electronics. Inc. All right reserved. |
- 10 - |
LGE Internal Use Only |
Only for training and service purposes |
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*Optical Test Condition
-Surrounding Brightness Level : dark
- Surrounding Temperature |
: 25±5°C |
- warm-up Time |
: 30 Min |
- Contrast, Brightness |
: Outgoing condition |
- *Incase of Vivid Mode, high level saturation may be occurred. Check gray linearity at standard mode.
* Active area
1.Active area of LCD PANEL is in bezel of cabinet.
2.Interval between active area and bezel |A-B|<1.0 mm , |C-D|<1.0 mm
A:Interval between left of active area and bezel
B:Interval between right of active area and bezel
C:Interval between top of active area and bezel
D:Interval between bottom of active area and bezel
C
Active Area
A |
B |
D
Bezel
Copyright |
LG Electronics. Inc. All right reserved. |
- 11 - |
LGE Internal Use Only |
Only for training and service purposes |
|
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7.SET Optical Feature
7.1 PC Mode (-Mode : Outgoing condition, Input signal : 100IRE White pattern(Pattern #4 : MSPG series))
No |
Item |
module |
Luminance (cd/m2) |
C/R(min) |
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Remark |
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Min |
Typ |
Max |
Min |
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Typ |
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1 |
M197WDP |
150 |
180 |
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500 |
700 |
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RGB & DVI |
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DFC 50000:1 |
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*If input signal is 100 IRE full white pattern, the luminance and color coordinate will depend on the panel. When testing DFC, please wait for at least 1 minutes after checking luminance at black pattern.
7.2 
Mode (-Mode : Outgoing condition, Input signal : 100IRE White pattern(Pattern #4 : MSPG series))
No |
Item |
module |
|
Luminance (cd/m2) |
C/R(min) |
|
Remark |
||
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Min |
Typ |
Max |
RF,AV, |
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COMPONENT,HDMI |
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1 |
M197WDP |
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120 |
150 |
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500 |
- |
RF,AV,COMPONENT,HDMI |
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Test condition |
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7.3 
-DFC Working Condition : Full Black Pattern(All Black, No pattern(MSPG Pattern#2)) signal in D-sub & DVI
No |
Item |
module |
Min |
Typ |
Max |
Remark |
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1 |
M197WDP |
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40000:1 |
50000:1 |
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PC Mode(D-sub, DVI) , Mode : Outgoing condition |
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Input signal : 100 IRE Full white pattern |
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8. Component Video Input (Y, PB, PR)
No. |
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Specification |
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Remark |
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Resolution |
H-freq(kHz) |
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V-freq(Hz) |
Pixel clock(MHz) |
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1. |
720*480 |
15.73 |
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59.94 |
13.500 |
SDTV, DVD 480I(525I) |
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2. |
720*480 |
15.75 |
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60.00 |
13.514 |
SDTV, DVD 480I(525I) |
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3. |
720*576 |
15.625 |
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50.00 |
13.500 |
SDTV, DVD 576I(625I) 50Hz |
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4. |
720*480 |
31.47 |
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59.94 |
27.000 |
SDTV 480P |
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5. |
720*480 |
31.50 |
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60.00 |
27.027 |
SDTV 480P |
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6. |
720*576 |
31.25 |
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50.00 |
27.000 |
SDTV 576P 50Hz |
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7. |
1280*720 |
44.96 |
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59.94 |
74.176 |
HDTV 720P |
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8. |
1280*720 |
45.00 |
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60.00 |
74.250 |
HDTV 720P |
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9. |
1280*720 |
37.50 |
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50.00 |
74.25 |
HDTV 720P 50Hz |
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10. |
1920*1080 |
33.72 |
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59.94 |
74.176 |
HDTV 1080I |
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11. |
1920*1080 |
33.75 |
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60.00 |
74.250 |
HDTV 1080I |
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12. |
1920*1080 |
28.125 |
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50.00 |
74.250 |
HDTV 1080I 50Hz, |
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13. |
1920*1080 |
56.25 |
|
50 |
148.5 |
HDTV 1080P |
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14. |
1920*1080 |
67.432 |
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59.94 |
148.350 |
HDTV 1080P |
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15. |
1920*1080 |
67.5 |
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60.00 |
148.5 |
HDTV 1080P |
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Copyright |
LG Electronics. Inc. All right reserved. |
- 12 - |
LGE Internal Use Only |
Only for training and service purposes |
|
|
|
9. RGB Input ( PC )
No. |
Resolution |
H-freq(kHz) |
V-freq(Hz) |
Pixel clock(MHz) |
Remark |
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1. |
640*480 |
31.469 |
59.94 |
25.175 |
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2. |
640*480 |
37.5 |
75 |
31.5 |
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3. |
800*600 |
37.879 |
60.317 |
40.0 |
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4. |
800*600 |
46.875 |
75.0 |
49.5 |
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5. |
1024*768 |
48.363 |
60.0 |
65.0 |
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6. |
1024*768 |
60.123 |
75.029 |
78.75 |
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7. |
1280*768 |
47.776 |
59.90 |
79.5 |
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8. |
1280*800 |
49.306 |
59.91 |
71.0 |
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9. |
1360*768 |
47.712 |
60.015 |
85.5 |
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10.RGB EDID Data
-M197WDP(Product ID : 19393)
**
Copyright |
LG Electronics. Inc. All right reserved. |
- 13 - |
LGE Internal Use Only |
Only for training and service purposes |
|
|
|
11. DVI Input ( PC )
No. |
Resolution |
H-freq(kHz) |
V-freq(Hz) |
Pixel clock(MHz) |
Remark |
1. |
640*480 |
31.469 |
59.94 |
25.175 |
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2. |
640*480 |
37.5 |
75 |
31.5 |
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3. |
800*600 |
37.879 |
60.317 |
40.0 |
|
4. |
800*600 |
46.875 |
75.0 |
49.5 |
|
5. |
1024*768 |
48.363 |
60.0 |
65.0 |
|
6. |
1024*768 |
60.123 |
75.029 |
78.75 |
|
7. |
1280*768 |
47.776 |
59.90 |
79.5 |
|
8. |
1280*800 |
49.306 |
59.91 |
71.0 |
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9. |
1360*768 |
47.712 |
60.015 |
85.5 |
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12.DVI EDID Data
-M197WDP(Product ID : 19394)
* **
****
Copyright |
LG Electronics. Inc. All right reserved. |
- 14 - |
LGE Internal Use Only |
Only for training and service purposes |
|
|
|
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