INFICON SQC-122C User Manual

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SQC-122c

Sigma

instruments

Thin Film Deposition Controller

User’s Guide

Version 2.0

Safety Information

Read this manual before installing, operating, or servicing equipment. Do not install substitute parts, or perform any unauthorized modification of the product. Return the product to Sigma Instruments for service and repair to ensure that safety features are maintained.

Safety Symbols

WARNING: Calls attention to a procedure, practice, or condition that could possibly cause bodily injury or death.

CAUTION: Calls attention to a procedure, practice, or condition that could possibly cause damage to equipment or permanent loss of data.

Refer to all manual Warning or Caution information before using this product to avoid personal injury or equipment damage.

Hazardous voltages may be present.

Earth ground symbol.

Chassis ground symbol.

Equipotential ground symbol.

Warranty Information

This Sigma Instruments product is warranted against defects in material and workmanship for a period of 1 year from the date of shipment, when used in accordance with the instructions in this manual. During the warranty period, Sigma Instruments will, at its option, either repair or replace products that prove to be defective.

Limitation of Warranty

Defects from, or repairs necessitated by, misuse or alteration of the product, or any cause other than defective materials or workmanship are not covered by this warranty. NO OTHER WARRANTIES ARE EXPRESSED OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. UNDER NO CIRCUMSTANCES SHALL SIGMA INSTRUMENTS BE LIABLE FOR CONSEQUENTIAL OR OTHER DAMAGES RESULTING FROM A BREACH OF THIS LIMITED WARRANTY, OR OTHERWISE.

Return Policy

The purchaser may return this product in new condition within 30 days after shipment for any reason. In case of return, purchaser is liable and responsible for all freight charges in both directions.

Sigma Instruments 120 Commerce Drive, Unit 1 Fort Collins, CO 80524 USA 970-416-9660 970-416-9330 (fax)

Table of Contents

Chapter 1 Quick Start

1.0 Introduction................................................................................................1-1

1.1 Thin Film Process Overview........................................................................1-1

1.2 System Connections...................................................................................1-2

1.3 Front Panel................................................................................................1-3

1.4 Rear Panel ................................................................................................1-4

1.5 Installation.................................................................................................1-5

1.6 Process Setup ...........................................................................................1-6

1.7 Depositing a Film .......................................................................................1-8

Chapter 2 Operation

2.0 Introduction................................................................................................2-1

2.1 Definitions..................................................................................................2-1

2.2 Defining a Film...........................................................................................2-1

2.3 Defining a Process.....................................................................................2-5

2.4 Sensor Setup.............................................................................................2-7

2.5 Source Setup.............................................................................................2-10

2.6 Running a Process.....................................................................................2-11

2.7 Loop Tuning...............................................................................................2-15

2.8 Troubleshooting .........................................................................................2-17

Chapter 3 Menus

3.0 Introduction................................................................................................3-1

3.1 Main Menu.................................................................................................3-2

3.2 Next Menus...............................................................................................3-4

3.3 Quick Setup Menu......................................................................................3-5

3.4 Process Menus..........................................................................................3-7

3.5 Film Menus................................................................................................3-11

3.6 System Parameters Menu...........................................................................3-18

3.7 I/O Setup...................................................................................................3-21

Chapter 4 Options

4.0 Introduction................................................................................................4-1

4.1 Options Cards............................................................................................4-1

4.2 Full Rack Extender Installation....................................................................4-1

Appendix

A. Material Parameters B. Specifications C. I/O Connections D. Handheld Remote Controller E. Declaration of Conformity

Chapter 1 Quick Start

1.0 Introduction

The SQC-122c is a multi-channel quartz crystal monitor and deposition controller. It measures up to six 1MHz to 6 MHz quartz crystal sensors, and controls two evaporation sources. Twenty-five processes, consisting of 250 layers and 25 materials, can be stored for easy retrieval. Eight process control relays, and eight digital inputs are easily configured to support a broad range of external functions, including source pocket rotation.

The SQC-122c can also be controlled via the standard RS-232 interface and Windows control program. An optional handheld remote power control is also available.

Note: The SQC-122 (color display) replaces our original (monochrome) SQC-122. Operation and programming of the two models are identical.

This chapter will aid you in the initial setup and operation of your system. Please review the entire manual for detailed operational, programming, and safety information.

1.1 Thin Film Process Overview

The SQC-122c stores the recipes, and provides the operating functions, required to control thin film deposition processes. A typical thin film deposition cycle is shown below.

The cycle can be broken into three distinct phases: pre-conditioning (ramp/soak), deposition, and post-conditioning (feed/idle). During pre-conditioning, power is supplied in steps to prepare the evaporation source for deposition. Once the material is near the desired deposition rate, material deposition begins. During deposition, the PID loop adjusts the evaporation source power as required to maintain the desired deposition rate. When the desired thickness is reached, the evaporation source is set to idle power. At this point the process may be complete, or deposition of another film layer may begin.

1-1

Chapter 1 Quick Start

1.2 Front Panel

SoftKeys Control Knob Remote Jack

Front Panel Controls

SoftKeys

Control Knob

Remote Jack

Provide access to instrument operations and setup menus. The functions of the SoftKeys change to adapt to different operations and are displayed on the left of the screen.

Used to adjust values and select menu items. Pushing the control knob stores the current setting and moves to the next.

Connection jack for the optional handheld remote control module. See Appendix D.

1-2

Chapter 1 Quick Start

1.3 Rear Panel

Sensor 1 & 2

Output 1 & 2

I/O (1-8)

Manufactured By

Sigma

instruments

Sensor 3 Sensor 4 Output 3 Output 4

Sensor 1 Sensor 2 Output 1 Output 2

SQC-122c Deposition Controller Serial No.

Rear Panel Connections

Connects to quartz crystal sensor remote oscillator.

Connects the SQC-122c output to your evaporation supply control input.

Connects 8 relays and 8 digital inputs to external equipment for process control. See Appendix C for connections.

I/O 9-16

I/O 1-8

100-120/200-240 V~

50/60 Hz

25 VA

Fuse T.5A 250V

RS-232

Sensor 3 & 4 Output 3 & 4 I/O 9-16

Power Input and Fuse

Connects to computer for programming and data acquisition.

This option card is available only on SQC-222 controllers. Contact Sigma for upgrade information.

Measurement ground terminal useful for common system and cable grounding.

WARNING: For continued protection, replace fuses with the proper type and rating.

WARNING: Use removable power cords only of the specified type and rating, attached to a properly grounded receptacle.

1-3

Chapter 1 Quick Start

1.4 System Connections

Sensor

In-Vac Cable

Feedthrough

Source Shutter

Evaporation Supply

Output Control Input

6" BNC Cable

Oscillator

BNC Cables

Ground Wire

This section identifies typical system components and their connection:

System Components

Sensor

Holds the quartz crystal used to measure rate and thickness. Crystals must be replaced occasionally.

In-Vac Cable

Feedthrough

A coaxial cable that connects the sensor to the feedthrough.

Provides isolation between vacuum and atmosphere for electrical and cooling lines.

6” BNC Cable

Provides a flexible connection from the feedthrough to the oscillator. Keep this cable as short as possible.

Oscillator

Sensor Input BNC Cable

Control Output BNC Cable

Ground Wire

Contains the electronics to operate the quartz crystal. Total cable length to the crystal should be under 40”.

Connects the oscillator to the SQC-122c input. Lengths up to 100’ are acceptable.

Connects the SQC-122c output to the evaporation source’s control voltage input. Keep the length below 10’.

A wire, typically braided, that connects the vacuum system to the SQC-122c ground terminal.

1-4

Chapter 1 Quick Start

1.5 Installation

WARNING: Care should be exercised to route SQC-122c cables as far as practical from other cables that carry high voltages or generate noise. This includes other line voltage cables, wires to heaters that are SCR-controlled, and cables to source power supplies that may conduct high transient currents during arc down conditions.

Rack Installation

Power Connection

Sensor Input Connections

Source Output Connections

Digital I/O Connections

Computer Connection

The SQC-122c occupies a 5.25” high, half-rack space. An optional installation kit is available to adapt to a full rack (see Chapter 4). Install the unit in a 19” rack with the supplied hardware.

The SQC-122c automatically detects mains voltages of 100120 and 200-240VAC, 50/60Hz.

WARNING: Verify that the power cable provided is connected to a properly grounded mains receptacle.

Connect the BNC cables and oscillators from your vacuum chamber feedthrough to the desired SQC-122c sensor inputs.

Connect the BNC cables from the SQC-122c output connectors to your evaporation supply control input.

Refer to Appendix C for details on wiring digital I/O to the SQC122c Relay I/O connectors.

If you would like to use the Windows software to collect data or program the SQC-122c, attach a 9 pin straight-thru cable from the RS-232 connector to your computer’s serial port.

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Chapter 1 Quick Start

1.6 Process Setup

Follow these steps to build a process from the main (also called “power up”) screen.

Note: If you are prompted for a password, use the switches along the left of the screen to enter the password. The top switch is “1”, the bottom switch is “6”. If you forget the password, see the System Parameters section for password setup.

Power On

Select Quick Setup

Menu Quick

Setup

Move the rear panel power switch to the On (|) position. The SQC-122c will briefly display its initialization information, then go to normal operating mode.

Press the Quick Setup SoftKey to view the quick setup parameters for the current process.

If no Quick Setup option is visible, no processes are defined in the SQC-122c. In that case, press Film Menu, then scroll the cursor until an <Empty> film is selected. Press Create to create a new film, then press Main Screen. Now press Process Menu, then Create, then Edit. Select Insert Layer, scroll to your new film and press Enter. Now press Prev Menu

twice to return to the Main Menu.

THICKNESS(kA)

0.000

100.0

RATE(A/s)

0.0

POWER(%)

0.0

Process

Film

System Params

Start

50.0

0.0

0.0 25.0 50.0

Process: My Process 1 Layer: 1 of 1

Film : Aluminum

12.5 37.5 Power (% vs. Time)

PHASE: Stopped

Run Time: 0:00:00 Final Thick: 0.1011

Layer Rate : 11.1

Main Screen

1-6

Chapter 1 Quick Start

Max. Power

Layer

Main

Parameter

Value

Units

Edit Mode

Edit Layer 1

Exit to

To edit a setting in any menu, turn the control knob to scroll to the desired setting, then press the Edit SoftKey.

In Edit mode, the cursor moves to the setting value and the SoftKey functions change to show:

Next: Store the parameter and move to next parameter for editing.

Cancel: Stop editing and return the selected parameter to its previous value.

Enter: Stop editing and save values for selected parameter.

In Edit mode, adjust the control knob to set the desired parameter value.

Spend some time navigating through the Quick Setup parameters and editing values. When you are comfortable, be sure your values for Layer 1 match those shown below.

THICKNESS(kA)

0.000

My Process 1 -> Layer 1 ->

RATE(A/s)

0.0

POWER( %)

0.0

Init Rate 11.1 A/s

Edit

Fnl Thk P Term 50 None

I Term

D Term Sensor 1 Sensor 2 Output

Slew Rate

Material

0.101

0.7

0.0 On On

Out1

76.0

10.0

Copper

Quick Setup Menu

Sec. Sec. On/Off On/Off

Out1/Out2

Exit to Main Press Exit to Main to return to the main screen.

1-7

Chapter 1 Quick Start

1.7 Depositing a Film

If you have followed this Quick Start chapter, you are ready to deposit a film.

Note: You can simulate the steps below, without actually depositing a film, by going to the System Parameters Menu and selecting Simulate Mode ON. Simulate mode is useful for testing processes before applying power to the evaporation supply. See Section 3.6 for System Parameters Menu information.

Verify Output Operation

Verify Sensor Operation

Enter Auto Mode

Show Power Graph

From the Main Menu, press the Next Menu SoftKey. Then, press Auto/Manual to display Manual/Auto. Slowly turn the control knob to increase the control voltage to your evaporation supply. Verify that the Power(%) reading in the display upper right-hand corner approximates the actual output of your evaporation supply. If not, check your hookup (1.5), and refer to Scale Voltage (3.6).

Press Next Menu until the Switch Displays option is shown. Press Switch Displays to display Sensor 1 and Sensor 2 in the lower status section of the screen. At least one sensor should be ON and display a % life of over 50%. If not, check your sensor connections (1.5), and refer to Min/Max Frequency (3.6).

Press the Next Menu key twice to display the output screen. Press Manual/Auto until Auto/Manual is displayed.

Press Next Menu once more. Press the Next Graph SoftKey until the graph shows Power (% vs. Time).

Start Process

If the rate and thickness readings do not match your expectations, refer to Appendix A for information on Density and Z-Factor, and Section 2.4 for Tooling.

Please take time to review the remainder of this manual for detailed operational, programming, and safety information.

Press the Start key to start the deposition process. Graphing of the output power should start.

Caution: Observe the output power versus your evaporation supply’s actual output. If there is a problem, press the Stop SoftKey immediately.

1-8

Chapter 1 Quick Start

This page left blank for your notes.

1-9

Chapter 2 Operation

2.0 Introduction

This chapter describes common tasks associated with operating the SQC-122c. It assumes that you understand basic operation of the menus and parameter setup as described in Chapter 1. Detailed definitions of unfamiliar setup parameters can be found under the appropriate menu description in Chapter 3.

2.1 Definitions

Several terms will be used repeatedly throughout this manual. It is important that you understand each of these terms.

Material: A physical material to be deposited. A database of approximately 100 materials is stored in the SQC-122c, and additional materials may be added using the setup software. Three parameters completely define a material: Name, Density, and ZFactor. A table of common materials, their density, and Z-Factor is listed in Appendix A.

Film: A film describes in detail how a material will be deposited. It includes the material definition and all of the preconditioning, deposition, and post conditioning variables necessary to accurately deposit the material. Because the film definition does not include rate and thickness information, a film can be used in several different processes. The SQC-122c stores up to 25 films.

Layer: Layers are the basic building blocks of processes. A layer consists of a film and the thickness and rate that it be deposited in a process.

Process: A deposition process is a sequence of layers (i.e. films, materials) to be deposited. The SQC-122c can store up to 25 processes, consisting of a total of 250 layers.

2.2 Defining a Film

A film is a material to be deposited, plus all of its associated setup parameters. Keep in mind that a film can be used in multiple processes. Editing a film’s parameters will cause changes to every process where the film is used.

To define a film, select Film Menu on the main screen. A list of 25 films (or <Empty>) will be displayed. To define a new film, scroll to <Empty> and press Create. A new Film# is added to the list of existing films (you can use the SQC-122c setup software later to assign descriptive film names). Press Edit to display the parameters for this film.

2-1

Chapter 2 Operation

The most commonly modified parameters are shown on the first film parameters screen. Additional parameters can be accessed by pressing Film Conds (film conditioning) or Deposit Controls.

Exit to

Main

Edit

Film

Conds.

Deposit

Controls

THICKNESS(kA)

0.000

My Process 1 Editing: Aluminum Parameter Value Units P Term 50 None

I Term D Term 0.0 Sec.

Sensor 1 Sensor 2

Film Tooling Output Pocket

Max Power Slew Rate

Crystal Quality

RATE(A/s)

0.7

On On

100 Out1

76.0

10.0 Disabled

0.0

Sec.

On/Off On/Off

% Out1/Out2

Film Edit Menu

POWER(%)

0.0

Scroll to the end of the list (Z-Factor), then scroll back up to Material. Press Edit to scroll through the list of available materials. Notice that the Density and Z-Factor are updated automatically as a new material appears.

Select the desired material and press Enter. You could change the Density and ZFactor for the selected material now, but it is unlikely those values are wrong. To add a material name that is not listed, you must use the SQC-122c setup software.

Once the material is selected, set up the source parameters. Scroll to Output and select the SQC-122c rear panel output that is connected to the source evaporation supply. If a source pocket indexer is being used, assign it also.

Now assign the Max Power and Slew Rate appropriate for this material and your power supply. For now, set both to 100%. Set them to lower values later if you find that small power changes cause excessively large changes in deposition rate.

The SQC-122c can use multiple sensors to measure a film’s deposition rate and thickness. If multiple sensors are selected, an average of the sensors is used. Set each sensor that will be used to measure this film to ON. Alternately, you might want to use a dual shuttered sensor in case of crystal failures. See the Film Menu section of Chapter 3 for instructions on setting up a primary/secondary dual sensor.

2-2

Chapter 2 Operation

The PID parameters control the response of the SQC-122c to changes in deposition rate. These values are unique to each deposition chamber setup, and to a lesser extent to each material.

The P Term is proportional (or gain), the % process rate change divided by the % input power change. The I Term (integral) sums the rate deviations over time to more accurately achieve the rate setpoint. The D Term (derivative) speeds response to sudden changes in rate. Volumes have been written on determining the proper PID settings. See the section on Loop Tuning later in this chapter for a common PID loop tuning procedure. For now, you should probably leave these values at their defaults.

Press Film Conds to enter the film conditioning menu. Film preconditioning is used to prepare a material for deposition. When the film deposition is complete, post conditioning ramps power down to an idle level. It may also ramp power to a level appropriate for wire feeding new material. Refer to the Thin Film Process Overview in Chapter 1 for an illustration of pre and post conditioning.

Exit to

Main

Edit

THICKNESS(kA)

0.000

My Process 1 Editing: Aluminum Parameter Value Units Ramp1 Power

Ramp1 Time Soak1 Time 0.0 h:mm:ss

Ramp2 Power

Ramp2 Time Soak2 Time

Feed Power Ramp Time Feed Time

Idle Power Ramp Time

RATE(A/s)

0.0

50 %

0.7

On On

Out1

75.0

10.0 0:00:00

2.90

0.950

POWER(%)

0.0

h:mm:ss

h:mm:ss h:mm:ss

h:mm:ss

Film Conditioning Menu

Set the Ramp 1 Power and Time to values that will slowly bring the material to a near molten state. Set the Soak 1 Time to a value that will allow the material to homogeneously achieve the state. Ramp 2 is used to slowly bring the material to a power level that nearly matches the desired deposition power. Use Soak 2 to hold the material at that level until deposition (i.e. rate control) begins.

If you use wire feed to replenish material after deposition, set the Feed Power and times as required. Idle typically ramps output power back toward zero at the end of a process.

2-3

Chapter 2 Operation

From the Film Conds menu, press Prev Menu to return to the main Film Params menu. Now press Deposit Controls. The Deposit Controls menu contains parameters that modify operation during the deposition phase.

Exit to

Main

Edit

THICKNESS(kA)

0.000

Current: Process 1 EDITING: Film 1

Parameter Value Units Shutter Delay

Capture Control Error

Setting Error

Rate Sampling Setting Accuracy Based

RATE(A/s)

0.0

0:01:00

20.0

(Ignore, Stop, Hold)

Hold

18.0

(Cont,Time,Acc based)

Undefined

0.0 %

POWER(%)

0.0

h:mm:ss

Deposition Controls Menu

Shutter delay causes the SQC-122c to delay opening the shutter until the process has stabilized at the desired deposition rate. The time value is the maximum amount of time to wait, before an error is sensed. Capture is the % rate deviation that must be achieved to open the shutter and go to the Deposit phase. Capture will override the shutter delay if accuracy is reached. Set Shutter Delay and Capture to zero to disable this feature.

If the SQC-122c is unable to maintain the desired deposition rate (for example, out of material or a bad sensor), one of three actions is possible. Keep trying (Ignore), set power to zero to halt deposition (Stop), or maintain constant power (Hold) and extrapolate thickness from the last good rate reading. Until your process is known and stable, it is best to leave the Control Error setting on Ignore.

Rate sampling can extend sensor life in high rate processes. Select Cont (continuous) to disable rate sampling. A Time selection closes the shutter for a fixed time, then opens the shutter for a fixed time to sample the rate. Acc Based (accuracy based) sampling closes the shutter for a fixed time, then opens the shutter until the desired rate is achieved. Rate Sampling assumes a very stable process!

Each film parameter has been set. Press Exit to Main to return to the Main Screen.

2-4

Chapter 2 Operation

2.3 Defining a Process

A process is a sequence of film layers deposited to achieve a particular thin film characteristic. A few processes, each consisting of a few layers, may be adequate for a production facility. For research or laboratory use, the SQC-122c can store up to 25 processes to a total of 250 layers.

You should define each of the films that will make up the layers of the process before starting process definition. See the previous section for instructions on defining films.

To define a process, select Process Menu on the main screen. A list of 25 processes (or <Empty>) will be displayed. To define a new process, scroll to <Empty> and press

Create. A new Process# is added to the list of existing processes (use the SQC-122c setup software to assign descriptive process names). Press Select, then Edit to display the sequence of layers and films that comprise the selected process.

To add a layer, scroll to the desired location in the layer sequence, and press Insert Layer. Select a film for this layer from the list and press Enter. Once a film is assigned to a process layer, you cannot change the film. Instead, cut the layer, then insert a new layer and select the desired film. To edit a layer, highlight it, then press Edit.

Exit to

Main

Edit

THICKNESS(kA)

0.000

My Process 1 Layer 1 -> Parameter Value Units Init. Rate 5.0 A/s

Fnl Thk Time Setpoint

Thickness Limit Start Mode

Ramp1 Start Thickness

Ramp Time New Rate

Ramp2

RATE(A/s)

0.0

0.500 0:01:00 h:mm:ss

0.400 Auto

Enabled

0.150 0:00:30

3.5 Disabled

kA Man/Auto

En/Dis kA

h:mm:ss

A/s

En/Dis

Layer Edit Menu

POWER(%)

0.0

Remember that most setup parameters are set in the Films Menu, and apply to every instance where the film is used. The layer parameters pertain only to this instance of the film, in this process.

2-5

Chapter 2 Operation

Initial Rate and Final Thickness are the main process setpoints for this layer of material. Keep in mind that the SQC-122c zeroes thickness at the beginning of each layer. It is not a cumulative value.

Time Setpoint and Thickness Limit are arbitrary values that will activate a relay when they are reached.

Start mode allows you to have this layer start immediately on completion of the previous layer, Auto mode. Manual mode waits for a user signal via the front panel, RS-232, or digital input to start the layer.

Rate Ramps allow the deposition rate to change over time, under PID control. Each rate ramp has a starting thickness, an elapsed time to ramp to the new rate, and a new rate setpoint. Each process layer can have up to two rate ramps.

Press Prev Menu to return to the list of layers, or Exit to Main to return to the Main Screen.

2-6

Chapter 2 Operation

2.4 Sensor Setup

The theory of operation for a quartz crystal sensor is quite simple. The sensor initially oscillates at its natural frequency, typically 6MHz. As material is deposited on the substrate, it is also deposited on the sensor. Depending on the density of the deposited material, and the amount of material deposited, the sensor’s frequency will drop from its initial frequency. The rate and thickness can be calculated from this frequency shift.

Sensor setup involves selecting the sensor(s) to be used, setting the Min/Max crystal frequencies, and adjusting the Tooling Factor. Sensors are assigned to each film, as described in Section 2.2, Defining a Film. See Section 3.5 for information on setting up dual shuttered sensors.

In the System Params menu, Max Frequency is the initial frequency of a new crystal, typically 6.0e+06 Hz (6 MHz). Due to manufacturing tolerances, some crystals may oscillate above 6MHz initially, which would be detected as a sensor error. Setting the Max Frequency slightly above the nominal value, to say 6.1MHz, will avoid this problem with no effect on instrument accuracy.

Min Frequency is the frequency where the SQC-122c will flag a sensor as bad. For a 6MHz crystal, the Min Frequency is typically 5 MHz.

Crystal failure is often predicted by brief periods of “mode hopping,” where the crystal briefly makes an abrupt change in frequency, or stops oscillating altogether. Some materials will cause crystals to fail or mode hop well before 5MHz. It is good practice to set the Min Frequency to a value that indicates crystal failure well before most crystals actually fail.

To better determine impending crystal failure, Crystal Quality and Stability parameters are also available for each Film. See Chapter 3, Film Menus for more information on setting Crystal Quality and Stability.

2-7

Chapter 2 Operation

Substrate

Sensor Tooling, also found in the System Params menu, adjusts for the difference in measured deposition rate between the sensor and the substrate being coated.

Substrate

Tooling

Over 100%

Tooling

Under 100%

In the illustration above (left), the sensor will measure less rate or thickness than is actually deposited on the substrate because of its positioning. In the right illustration, the sensor will measure high. Tooling is the ratio of the actual substrate deposition rate or thickness, to that measured by the sensor.

Let’s assume that at the end of deposition the sensor measures a thickness of 1.000 kA. But, suppose the actual substrate is deposited to 1.100 kA thickness (as determined by some other means, such as a stylus profilometer). Then the tooling for this sensor would be:

(1.100 / 1.000) x 100 = 110

A simple rule to remembers is: If the rate/thickness reading is low, then increase the tooling value. If the rate/thickness reading is high, then lower the tooling value.

Xtal Tool 1 and 2 adjust the tooling for each individual sensor. It is particularly important when using sensor averaging to balance multiple sensors so that their measurements match.

System Tooling applies to the overall Rate and Thickness measurements of all sensors. It is sometimes used to adjust for some systematic difference in the actual vs. measured readings. In general, Crystal Tooling (Xtal Tool 1 and 2) should be used instead.

2-8

Chapter 2 Operation

Once the sensor parameters are set, test your sensor setup to assure reliable readings at the SQC-122c. A typical single sensor setup is shown below:

On the SQC-122c, press Next Menu until the Sensor Info option is shown, then press Sensor Info.

Any connected sensor (whether programmed On or Off) should display its frequency and % remaining life, as defined by Min and Max Frequency setup. For a new sensor, the value should be near 100%. If the % Life is 0.00% or jumps around, check your cabling and the installation of the sensor in its holder.

Sigma supplies a small 5.5MHz “test crystal adapter” with each oscillator. If the % Life reading is not correct, remove the 6” BNC that is connected to your feedthrough at the oscillator. Connect the test crystal and adapter to the oscillator connector labeled feedthrough. For a typical setup of 6MHz Max Frequency and 5MHz Min Frequency, the % life display should be near 50%.

More information on locating system and sensor problems is described in the Troubleshooting section, later in this chapter.

2-9

Chapter 2 Operation

2.5 Source Setup

The SQC-122c controls deposition rate by varying the control voltage to an external evaporation (source) supply. The previous illustration for sensor wiring also shows source supply wiring.

The SQC-122c control voltage output range is set in the Systems Params menu. For the supply connected to Output 1, set Scale 1 to the control voltage that corresponds to 100% output on the source supply. The SQC-122c uses 0 volts as 0% output, and the programmed value as 100% output. Scale values from –10 volts to 10 volts are possible.

If you find that very small changes in control voltage yield large changes in deposition rate, you can lower the Scale value to decrease the dynamic range. Also, each Film has a Max Power and Slew Rate parameter that may be used to customize response to that film.

2-10

Chapter 2 Operation

2.6 Running a Process

Once a Process is defined with the desired Layers, and the sensors and source supply are properly connected, the deposition process is ready to run. The next section, on Loop Tuning, describes a method for initial process startup and optimization. This section describes the steps to select, start, and stop a process.

Note: It is best (and safest!) to place the SQC-122c in Simulate mode when a process is first run. If the bottom SoftKey does not show Start Simulate, press System Params and turn Simulate ON.

To select a process, the status bar must be showing Phase: Stopped. If any other phase is displayed, press the Abort SoftKey.

Press Process Menu, then use the scroll knob to highlight the desired process. If the third SoftKey shows Edit when a process is highlighted, then it is already the current

process. Otherwise, press Select to set the highlighted process as the current process. You can press Edit to review the current process layers and their associated films.

Press Main Screen to return to the main operating screen. Press Quick Setup to review the most commonly adjusted parameters for the first layer

of the process. Press Next Layer to review each layer in the current process.

Exit to

Main

Edit

Layer

THICKNESS(kA)

0.000

My Process 1 -> Layer 1-> Aluminum Parameter Value Units Init Rate

Fnl Thk P Term 50 None

I Term

D Term Sensor 1 Sensor 2 Output

Max. Power Slew Rate

Material Aluminum

RATE(A/s)

0.0

11.1 A/s

0.101

0.7

0.0 On On

Out1

76.0

10.0

Sec. Sec.

On/Off On/Off

Out1/Out2 % %

POWER(%)

0.0

Quick Setup Menu

Press Exit to Main to return to the main operating screen.

2-11

Chapter 2 Operation

While we’re on the Main Menu screen, and before starting the selected process, let’s cover the capabilities of the Next Menu screens.

Press Next Menu once to view the first Next Menu screen. This screen provides two important operator functions: Zero Thickness and Auto/Manual mode.

The Zero SoftKey can be used to zero the thickness reading at any time. It is not normally needed, since the SQC-122c automatically zeroes the thickness at the beginning of each layer. It is, however, useful when simulating a process and when operating in Manual mode.

The Auto/Manual key alternates between Automatic (PID) output control and Manual (user) output control. Auto/Manual indicates the process is in automatic control, and a key press will change to Manual control. Manual/Auto indicates Manual control; a key press changes to Automatic mode.

In Manual mode, the SQC-122c immediately starts the deposition phase for the current layer, whether the process was stopped or running. However, the PID loop is disabled and output power is controlled by the front panel control knob.

In Manual Mode, you will usually display the Rate Graph, then manually adjust the output power to achieve the desired deposition rate. It is easy to exceed a layer’s Final Thickness setpoint in Manual mode, so watch the Thickness reading carefully. Manual mode is particularly useful for determining preconditioning power levels, and loop gain (discussed later in Loop Tuning).

Moving from Manual mode to Auto mode places the SQC-122c into automatic (PID) control. The PID control loop will try to achieve rate setpoint, so there may be a rapid change in output power.

Press Next Menu again to view the second Next Menu screen. Next Graph selects which of three available graphs is displayed. The Power Graph is

useful during preconditioning. The Rate graph shows the response of the control loop to process changes, such as when moving from preconditioning to deposition. The Rate Deviation Graph shows the performance of the control system during deposition. The SQC-122c automatically displays the most useful graph for each phase of deposition.

Switch Displays toggles the process data display in the lower portion of the screen between two different process displays.

Sensor Info replaces the graph with a detailed display of sensor information.

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Chapter 2 Operation

Enough preliminaries, let’s start the process! Press Start from any of the main screen menus to start deposition. If the first layer

Start mode was programmed as Manual, you will need to press the Start Layer SoftKey now to start the layer.

Note: Don’t confuse Manual and Auto Start mode with the Manual/Auto SoftKey. Manual Start is a Process setup parameter that tells the SQC-122c to wait for operator intervention before starting a Layer.

Zero

Auto /

Manual

Stop

Layer

Abort

THICKNESS(kA)

100.0

Process: My Process 1 Layer: 1 of 4

Film : Film1

0.057

50.0

0.0

0.0 25.0 50.0

12.5 37.5

Preconditioning

RATE(A/s)

0.3

Power (% vs. Time)

PHASE: Soak 2

Run Time: 0:00:45 Final Thick: 1.100

Layer Rate : 8.00

POWER(%)

45.0

When Start is pushed, the process starts with the first layer preconditioning phase. When preconditioning is complete, the deposition phase begins. The deposition phase ends when Final Thickness is reached for the layer, then Feed and Idle phases run (if programmed).

If the second layer is Auto Start, its cycle begins immediately when the first layer is complete. If the second Layer is Manual Start, or it’s the last layer in the process, the process halts and waits for operator intervention.

While the process is running, a Stop Layer SoftKey is shown (see above). Pressing Stop Layer temporarily halts the current layer and displays two restart options, Start

Nxt Layer and Restart Layer.

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Chapter 2 Operation

Zero

Auto /

Manual

Start Nxt

Layer

Restart

Layer

Abort

THICKNESS(kA)

0.824

100.0

50.0

0.0

0.0 80.0 160.0

Process: My Process 1 Layer: 1 of 4

Film : Film1

40.0 120

Layer Stopped

RATE(A/s)

7.8

Rate (A/s vs. Time)

PHASE: Stop Layer

Run Time: 0:01:45 Final Thick: 1.100

Layer Rate : 8.00

POWER(%)

55.3

Restart Layer repeats the stopped layer, beginning with preconditioning. Start Nxt Layer skips the remainder of the current layer and immediately starts the next layer.

Note: Pressing the Abort SoftKey at any time completely aborts the process. You can only restart the process at Layer 1!

Spend some time in Simulate mode verifying that the process sequences through each phase of each layer as expected. If not, use the Quick Setup, Process, and Film menus to make corrections.

Because the process is being “simulated,” some parameters will not be correct for your process (particularly, PID). However, you can become familiar with the effect of each parameter in this simulated process. Also practice using the Next Menu options, especially Auto/Manual modes.

Once you have verified the process in Simulate Mode, you may return to the System Params menu and turn Simulate OFF to start testing your process. Use the next section to finalize the loop PID settings.

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Chapter 2 Operation

2.7 Loop Tuning

This section will help you adjust your control loop PID parameters to achieve a stable deposition process. Keep in mind that there is no “best” way to determine PID parameters, and no one set of settings that are “best.”

Setup System Parameters: Be sure that the output Scale and crystal Min/Max Frequency parameters are accurate for your system. All Tooling parameters are best set to 100% for now. A Period of .25 seconds is also a good starting point. Simulate should be OFF.

Create a One-Layer Test Process: Create a new film with all default values. Create a new process that has the new film as its only layer, and select it as the current process. In the Quick Setup menu set Init Rate to your desired rate and Final Thickness to a large value, say 10X your desired Final Thickness. Select the proper Sensor(s), Output, and Material. Set Max Power to 100% and Slew rate to 100%.

Test the Setup: Press Auto/Manual to start the layer in Manual mode. Slowly turn the control knob to a power of 10%, and verify that your power supply output is about 10% of full scale. Continue to turn the control knob until a Rate(A/s) above 0 is shown. Again, verify that the power supply output agrees with the SQC-122c Power(%) reading. If the readings don’t agree, check your wiring and process setup. In particular, verify that the System Parameters output scale agrees with your power supply input specifications.

Determine Open Loop Gain: Slowly adjust the control knob until the Rate(A/s) reading approximately matches your desired rate (Init Rate in the Quick Setup menu). Record the desired rate Power(%) reading as PWRDR. Slowly lower the power until the Rate(A/s) reading is just at (or near) zero. Record the zero rate Power(%) reading as PWR0R.

Determine Open Loop Response Time: Calculate 1/3 of your desired rate (RATE and 2/3 of the desired rate (RATE Rate(A/s) matches RATE

. Get ready to record the loop’s response to an input

1/3

) for this layer. Slowly increase the power until

2/3

1/3

change. Quickly adjust Power(%) to PWRDR. Measure the time for the Rate (A/s) reading to reach RATE

. You may want to do this several times to get an average

2/3

response time reading. Displaying the Rate graph will also help. Twice the measured time is the step response time, TIMESR. TIMESR is typically .7 to 1.5 seconds for EBeam evaporation, 5 to 20 seconds for thermal evaporation.

Return the output power to 0%, then press Manual/Auto to return to Auto mode. Follow these steps to set the loop PID parameters:

Set PID Values: In the Quick Setup menu set P=25, I= TIMESR, D=0. Exit the Quick Setup menu. Press Start and observe the Power graph. The power should rise from 0%, and stabilize near PWRDR with little ringing or overshoot. If there is more than

2-15

Chapter 2 Operation

about 10% overshoot, lower the P Term. If the time to reach PWRDR is very slow, increase the P Term. A lower I Term will increase response time, a higher value will eliminate ringing and setpoint deviations. It is unlikely you will need any D Term.

Continue to Start the process and adjust PID until steady-state response is smooth and the step response is reasonably controlled. You don’t need to totally eliminate ringing during the step if the steady-state response is smooth, preconditioning will minimize step changes.

Set Preconditioning: The power level you recorded as PWR0R is the power where deposition just begins. That’s a good value for Ramp 1 power. PWRDR, or slightly less, is a good value for Ramp 2 Power. This will eliminate a large step change when entering the deposition phase.

Once PID terms are established for a material, they will typically be similar for other materials. Only the P Term and preconditioning power levels may need adjustment.

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Chapter 2 Operation

2.8 Troubleshooting

Most SQC-122c problems are caused by defective crystals or improper film setup, particularly incorrect PID settings for the control loop. Follow the procedures below to identify and correct common problems.

2.8.1 No Readings, or Erratic Readings from Sensors:

Disconnect the deposition source supply. This eliminates the possibility that a noisy source, or poor loop tuning, are causing an unstable PID loop.

Verify that the sensors, oscillator and cabling are connected as shown in Section 1.5. Assure that a good ground connection has been made to the SQC-122c chassis.

Replace the quartz crystal. Crystals sometimes fail unexpectedly, or exhibit erratic frequency shifts before total failure. Depending on the material, crystals may fail well before the typical 5MHz value. If you find that crystals consistently fail early, you may want to set Min Frequency in the System Menu to a value higher then 5 MHz.

In the System Menu, assure that Simulate Mode is OFF, and Frequency Min/Max are set properly for your crystals (typically Freq Min=5.0 MHz, Freq Max=6.0 MHz). Some manufacturer's crystals exceed 6MHz when new. Setting Frequency Max to 6.1 Hz will correct that problem, with no bearing on instrument accuracy.

Press Film Menu, Edit, and assure that the proper sensors are enabled. Press Exit to Main, then Next Menu until the Sensor Info SoftKey shows. Press Sensor Info to show sensor frequency and % Life.

While not depositing, observe the % Life display for each active sensor. The value should be stable, between 20% and 100%.

If the % Life reading is zero or unstable: Recheck the wiring from the sensor to the SQC-122c, and verify that the SQC-122c is properly grounded. Also check that the crystal is seated properly in the sensor head.

Swap the sensor to the other SQC-122c input. If both SQM-122 inputs show zero or unstable readings, the problem is almost certainly a wiring or sensor problem.

If the % Life is less than 50%: Replace the crystal and assure that % Life is near 100%, very stable. If % Life is not near 100%, check the Frequency Min/Max limits.

If the problem is not corrected: Referring to Section 1.5, disconnect the 6” M/F BNC cable from the external oscillator module. A 5.5 MHz test crystal and BNC barrel adapter is supplied with each oscillator. Attach the test crystal to the oscillator Sensor connector. The display should read about 5.5 MHz, very stable. If not, contact Sigma Instruments technical support.

2-17

Chapter 2 Operation

When the frequency reading is stable, reconnect the source supply. Start the deposition process in Manual mode with 0% output. The % Life readings should remain stable.

Slowly raise the % Output until a rate reading is displayed above the graph. As material is deposited on the crystal, the % Life reading should remain stable, or drop slowly and consistently. If not, check your source supply for erratic output. Also assure that the sensor is not too close to the source (particularly in sputtering).

2.8.2 Incorrect Rate or Thickness Measurement:

First, complete the procedures in Section 2.8.1 to assure reliable sensor operation. Set the Xtal Tooling as described in the System Menu section of Chapter 3. Incorrect

Xtal Tooling values will cause consistently low or high rate/thickness values for every material.

Once the Xtal Tooling is set, set Film Tooling in the Film Menu to 100 unless you are certain that another value is needed for a specific film.

Verify that the Density and Z-Factor values match those in the Materials Parameters Appendix. If the material is not listed, check a materials handbook. Density has a significant effect on rate/thickness calculations.

Z-Factor corrects for stresses as a crystal is coated. If readings are initially accurate, but deteriorate as crystal life drops below 60-70%, you need to adjust the Z-Factor or replace crystals more frequently. The relationship between Z-Factor and Acoustic Impedance is discussed in the Materials Appendix.

2.8.3 Poor Rate Stability:

First, be sure that a stable rate can be achieved in Manual mode, as explained in Section 2.8.1. Once a stable rate is achieved in Manual mode, follow the Loop Tuning procedures of Section 2.7.

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Chapter 2 Operation

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2-19

Chapter 3 Menus

3.0 Introduction

SQC-122c operation during deposition is accomplished by pressing one of the six SoftKeys along the left of the display. Five menus provide access to all programmable and operating functions:

Main Menu

Quick Setup Menu

Process Menu

Film Menu

The Main Menu is displayed at power up. It provides the SoftKey functions and display information necessary to run a thin film deposition.

On the Main Menu, you can view additional sub-menus by repeatedly pressing the Next Menu SoftKey. These submenus are discussed in Section 3.2.

Provides immediate access to the most commonly adjusted parameters for the current process and layer.

A process is a sequence of layers of deposited film(s). Each layer in a process has a specific film, final thickness, and deposition rate(s) associated with it. These are accessed from the Process Menu.

A film is basically a material plus the setup information necessary to deposit that material. Settings on the Film Menu include pre/post conditioning, deposition error controls, and the physical chamber setup for that material.

System Parameters Menu

The remainder of this chapter provides a detailed explanation of each menu and its settings.

System parameters control the overall operation of the SQC122c. Tooling, crystal frequency, and operating modes are examples of settings found on the System Parameters Menu.

3-1

Chapter 3 Menus

3.1 Main Menu

The default, power-up Main Screen display is shown below.

Quick Setup

Process

Film

System Params

Start

THICKNESS(kA)

100.0

Process: My Process 1 Layer: 1 of 25

Film : Aluminum

0.000

50.0

0.0

0.0 25.0 50.0

12.5 37.5

RATE(A/s)

0.0

Power (% vs. Time)

PHASE: Stopped

Run Time: 0:00:00 Final Thick: 0.1011

Layer Rate : 11.1

Main Screen

POWER(%)

0.0

The measured Thickness, Rate, and output Power values are always displayed along the top of the screen.

The graph displays either Rate, Rate Deviation, or output Power. The next section of the manual describes graph selection.

The status bar below the graph displays the current deposition phase. In Manual mode, Manual Power is displayed in the status bar. In Auto mode, the status bar will automatically sequence through the pre-condition, deposit, and feed/idle phases for each layer, as defined by the Process setup.

Below the status bar, important settings for the current process are shown. The next section explains other parameters that can be displayed in this screen area.

3-2

Chapter 3 Menus

The Main Screen SoftKeys undergo subtle changes based on the current process status. The table below describes the function of each of the possible SoftKeys on the Main Screen.

Next Menu

Quick Setup

Process Menu

Film Menu

System Params

Start Layer

Displays additional Main Menu options as described in Section

3.2.

Displays the Quick Setup Menu of commonly changed process values.

Create, delete, and edit up to 25 processes. Also used to select the currently active process. When a process is running, this selection is not available.

Create, delete, and edit up to 25 films. A film is basically a material, and may appear in several processes.

Sets system-wide operating parameters. Also used to “map” the 8 digital inputs and 8 relays to process functions.

Each layer in a process can be defined as auto start or manual start. Auto start layers begin immediately on completion of the previous layer. Manual start layers wait for the operator to press the Start Layer SoftKey.

Restart / StartNxt Layer

Stop Layer

Start/Abort

During deposition, it may be necessary to halt a layer to correct a problem. These two SoftKeys allow the operator to either restart the current layer or skip to the next layer.

Temporarily halts deposition. Deposition is restarted with the Restart or Start Nxt keys.

Starts or aborts sequencing through the current process layers and deposition cycles. Abort sets both outputs to zero, and abandons the current process.

3-3

Chapter 3 Menus

12ONON5.543210 MHz

5.654321 MHz

54.32

3.2 Next Menu Screens

The Next Menu SoftKey provides access to two sub-menus of the Main Menu that control display and operating mode preferences.

Zero

Auto /

Manual

Start

Zero

Auto / Manual

THICKNESS(kA)

0.000

100.0

50.0

0.0

0.0 25.0 50.0

Run #: 1

5-16-00 8:22:39

RATE(A/s)

0.0

12.5 37.5 Power (% vs. Time)

PHASE: Stopped

Source: 1 Max Pow:: 100.00 % Slew: 100.00 %

Next Menu Screens

Zeros the thickness reading. Useful for resetting or extending the current deposition layer.

Toggles between Auto and Manual power control. When Auto/Manual is shown, output power is set by the SQC-122c to achieve the programmed deposition rate. When Manual/Auto is shown, the control knob sets the output power.

POWER(%)

0.0

Graph Switch

Displays

Sensor

Info

Start

THICKNESS(kA)

0.000

100.0

50.0

0.0

0.0 25.0 50.0

Run #: 1 5-16-00 8:22:39

RATE(A/s)

0.0

12.5 37.5 Power (% vs. Time)

PHASE: Stopped

Source: 1 Max Pow:: 100.00 % Slew: 100.00 %

POWER(%)

0.0

Next Graph

Switch Displays

Sensor Info

Cycles through options for the main display. Choose between Rate, Rate Deviation, and Power graphs.

Toggles between data display options at the bottom of the SQC-122c screen. Note the differences between the screens above, and the Main Menu screen in the previous section.

Replaces the graph with the sensor information screen:

THICKNESS(kA)

0.000

Sensor # Enable Frequency Life

RATE(A/s)

0.0

POWER( %)

0.0

65.43 %

3-4

Chapter 3 Menus

Cancel:

Stop editing and

undo changes to selected parameter.

3.3 Quick Setup Menu

The Quick Setup Menu provides access to the most commonly adjusted parameters for the current process and layer.

Main

Exit to

Screen

Main

Exit to

Main

Edit

Delete

Layer

THICKNESS(kA)

0.000

THICKNESS(kA)

My Process 1 -> Layer 1 -> Aluminum

Scroll Processes with Knob

1. My Process 1

2. My Process 2

3. My Process 3

4. My Process 4

5. My Process 5

6. My Process 6

Sensor 1

7. My Process 7

Sensor 2

Sensor 1

8. My Process 8

Output

Sensor 2

9. My Process 9

Output

10. My Process 10

Slew Rate

11. My Process 11

Slew Rate

0.000

Parameter Value Units

My Process 1 -> Layer 1-> Aluminum

Init Rate 11.1 A/s

Parameter Value Units

Fnl Thk

Init Rate 11.1 A/s

P Term 50 None

Fnl Thk

I Term

P Term 50 None

D Term

I Term D Term

Max. Power

Material

Material Aluminum

Process Select Menu

Quick Setup Menu

RATE(A/s)

0.0

RATE(A/s)

0.0

0.101

0.7

0.0

0.7

0.0

Out1

76.0

Out1

10.0

76.0

Copper

10.0

Quick Setup Menu

POWER(%)

0.0

POWER(%)

0.0

Sec.

Sec. Sec.

Sec.

On/Off

Sec.

On/Off

Out1/Out2

On/Off

Out1/Out2

% %

Exit to Main

Edit

Prev Layer

Next Layer

Returns to the Main Menu.

Selects the highlighted parameter for edit. SoftKey functions change to:

Next: Store parameter and move to next for editing. Enter: Stop editing and save values for selected parameter.

Control Knob: Turn to adjust value. Push to store value and

move to next parameter.

Displays the parameters for the previous layer in the process.

Displays the parameters for the next layer in the process.

3-5

Chapter 3 Menus

Quick Setup parameters are described below:

Initial Rate: The beginning rate of deposition for this layer. Final Thickness: The desired final thickness of this layer. The deposition phase of this

layer will end when this thickness is reached. P Term: Sets the gain of the control loop. High gains yield more responsive (but

potentially unstable) loops. Try a value of 50, then gradually increase/decrease the value to respond to step changes in rate setpoint.

I Term: The integral term controls the time constant of the loop response. A small I term, say .5 to 1 seconds, will smooth the response of most loops.

D Term: The differential term causes the loop to respond quickly to changes. Use 0 or a very small value to avoid oscillations.

Sensor 1: Allows quartz crystal Sensor 1 to be turned on or off for the selected layer. If more than one sensor is assigned to a layer, their readings are averaged. If multiple sensors are assigned to a layer, and one fails, it is excluded from measurements.

Sensor 2-6: Allows quartz crystal Sensor 2 to be turned on or off. If the four sensor option card is installed, Sensor 3 to 6 are also visible.

Output: Selects the control voltage output that is active for the selected layer. Max Power: The maximum output power allowed for the selected output. The Scale

output voltage is a function of the deposition power supply input specifications, and is set in the System Parameters menu. Max Power controls the maximum power that can be used by this process layer.

Slew Rate: The maximum power change allowed on an output, per second. If power or rate ramps exceed this value, an error will occur.

Material: Selects a material assigned to this film. As materials change, their density and Z-Factor are updated.

Density: Sets the density for this material. Material density has a significant impact on deposition calculations.

Z-Factor: Sets the Z-factor, an empirically determined measure of a material’s effect on quartz crystal frequency change. Z-Factor is the ratio of the acoustic impedance of the sensor to that of the deposited material. It is used to match the acoustic (oscillation) properties of the material to the quartz sensor. If you know the “acoustic impedance” of your material, divide it by 8.83 (the acoustic impedance of SiO2) to obtain the material’s Z-Factor.

3-6

Chapter 3 Menus

3.4 Process Menus

There are several tiers of Process Menus. The first menu (shown below) selects the current process. The current process is the process that is ready to run, and also the process that is selected for editing.

Main

Screen

Edit

Delete

THICKNESS(kA)

0.000

My Process 1 -> Layer 1 -> Aluminum

Scroll Processes with Knob

1. My Process 1

2. My Process 2

3. My Process 3

4. My Process 4

5. My Process 5

6. My Process 6

7. My Process 7

8. My Process 8

9. My Process 9

10. My Process 10

11. My Process 11

RATE(A/s)

0.0

Process Select Menu

POWER(%)

0.0

Main Screen

Prev Menu

Select / Edit

Delete

Control Knob

Returns to the Main Menu.

Steps back through the sequence of process menus: Process Select <–> Layer Select <–> Layer Edit. On the topmost Process Menu, returns to the Main Menu.

Select sets the highlighted process as the current process. Edit displays the Layer Select Menu for the current process.

Deletes the highlighted process and all of its layers.

Scrolls through the list of processes. When pressed, selects or begins editing the highlighted process.

3-7

Chapter 3 Menus

The second Process Menu shows the sequence of layers that will be deposited in the current process.

Main

Screen

Edit

Cut /

Paste Insert

Layer

THICKNESS(kA)

0.000

My Process 2 -> Layer 2 -> Aluminum Layer Layer 1

Layer 2

RATE(A/s)

0.0

Layer Select Menu

POWER(%)

0.0

Film Aluminum

AluminumOxide

Main Screen

Prev Menu

Edit

Cut / Paste

Insert Layer

Control Knob

Returns to the Main Menu.

Returns to the Process Select Menu.

Displays the Layer Edit Menu for the highlighted layer (see next page).

Used to develop the sequence of layers in a process. The highlighted layer may be Cut (removed from the process) or Copied to the clipboard. The layer on the clipboard can then be Pasted anywhere in the list of layers.

Shows the list of 25 films. Select a film, then press Enter to insert the film as a new layer.

Scrolls through the list of layers in the Layer Select Menu, and through the list of films in the Insert Layer mode. When pressed, begins editing of the highlighted layer.

3-8

Chapter 3 Menus

Cancel:

Stop editing and

undo changes to selected parameter.

Each layer consists of a film (i.e. a material), plus the deposition rate and thickness that are desired for this layer. The Layer Edit Menu provides access to these layer parameters:

Exit to

Main

Edit

Exit to Main

Prev Menu

THICKNESS(kA)

0.000

My Process 2 -> Layer 2 -> AluminumOxide

Parameter Value Units Init Rate 9.9 A/s

Fnl Thk Time Setpoint Thickness Limit

Start Mode

Ramp 1 Start Thkness Ramp Time New Rate

Ramp 2

RATE(A/s)

0.0

9.000 0:00:00 h:mm:ss

0.000 Manual Enabled

4.500 0:10:00

99.0 Disabled

A Auto/Man. En/Dis kA

h:mm:ss A/s En/Dis

Edit Layer Menu

Returns to the Main Menu.

Returns to the Layer Select Menu.

POWER(%)

0.0

Edit

Control Knob

Selects the highlighted parameter for edit. SoftKey functions change to:

Next: Store parameter and move to next for editing. Enter: Stop editing and save values for selected parameter.

Control Knob: Turn to adjust value. Push to store value and

move to next parameter.

Scrolls through the list of layer parameters.

3-9

Chapter 3 Menus

A description of each parameter on the Layer Edit Menu follows:

Initial Rate: The beginning rate of deposition for this layer. Final Thickness: The desired final thickness of this layer. The deposition phase of this

layer will end when this thickness is reached. Time Setpoint: Sets an arbitrary time, after deposition begins, when the time setpoint

relay is activated.

Thickness Limit: Sets an arbitrary thickness when the thickness limit relay is activated. Start Mode: Determines whether a layer begins automatically upon completion of the

previous layer. If Manual start is selected, the previous layer ends at its idle power and waits for the user to push the Start button.

Ramp 1: During the deposition of a layer, it may be desirable to change the deposition rate. For example, you may want to deposit slowly at first, then increase the rate once an initial thickness is reached. Enabling rate ramps provides that capability. Once enabled, these parameters are added to the list.

Start Thickness: The deposited thickness at which the new rate will begin. Ramp Time: Time allowed for the rate to change from initial rate to new rate. New Rate: The rate of deposition, which is reached at the end of Ramp 1. Ramp 2: Two rate ramps are available for each layer. The start thickness for Ramp 2

should be greater than the start thickness for Ramp 1.

3-10

Chapter 3 Menus

3.5 Film Menus

Each film has certain characteristics that determine how it should be deposited. The Film Menus allow you to set parameters that regulate the deposition of each film in a certain process.

Main

Screen

Edit

Delete

Main Screen

THICKNESS(kA)

0.000

My Process 1 Editing:

Scroll Films with Knob

1. Film 1

2. Film 2

3. Film 3

4. Film 4

5. Film 5

6. Film 6

7. Film 7

8. Film 8

9. Film 9

10. Film 10

11. Film 11

Film Select Menu

Returns to the Main Menu.

RATE(A/s)

0.0

POWER(%)

0.0

Prev Menu

Edit

Delete

Control Knob

Steps back through the film menus: Film Select <–> Film Edit <-> Film Conds/Deposit Controls. On the topmost Film Menu, returns to the Main Menu.

Displays the Film Edit Menu for the highlighted film.

Deletes the highlighted film. (Note: Films cannot be deleted if they are used in any process.)

Scrolls through the list of films. When pressed, begins editing of the highlighted film.

3-11

Chapter 3 Menus

RATE(A/s)

Film Edit Menu

Exit to

THICKNESS(kA)

POWER(

Parameter

Value

Units

100

Cancel:

Stop editing and

undo changes to selected parameter.

The material to be deposited is the most significant film parameter. However, a film definition also includes the setup parameters shown below:

Main Prev

Edit

Film

Conds.

Deposit

Controls

Exit to Main

0.000

My Process 1 Editing: Aluminum

P Term 50 None I Term

D Term 0.0 Sensor 1

Sensor 2

Film Tooling

Output Pocket

Max Power

Slew Rate

Crystal Quality Disabled

0.7

On On

Out1

76.0

10.0

0.0

Sec. Sec.

On/Off On/Off

Out1/Out2

% %

Returns to the Main Menu.

0.0

Prev Menu

Edit

Film Conds.

Deposit Controls

Control Knob

Returns to the Film Select Menu.

Selects the highlighted parameter for edit. SoftKey functions change to:

Next: Store parameter and move to next for editing. Enter: Stop editing and save values for selected parameter.

Control Knob: Turn to adjust value. Push to store value and

move to next parameter.

Displays pre/post conditioning settings (See 2.6).

Displays deposition control settings (See 2.2).

Scrolls through the list of film parameters.

3-12

Chapter 3 Menus

Cancel:

Stop editing and

undo changes to selected parameter.

The Film Conds SoftKey displays these additional film conditioning settings: (Refer to section 2.2 for definitions).

Exit to

Main

Edit

THICKNESS(kA)

0.000

My Process 1 Editing: Aluminum

Parameter Value Units

Ramp1 Power Ramp1 Time

Soak1 Time 0.0 h:mm:ss

Ramp2 Power Ramp2 Time

Soak2 Time

Feed Power Ramp Time Feed Time

Idle Power Ramp Time

RATE(A/s)

0.0

50 %

0.7

On On

Out1

75.0

10.0 0:00:00

2.90

0.950

POWER(%)

h:mm:ss

h:mm:ss h:mm:ss

h:mm:ss

Film Conditioning Menu

0.0

Exit to Main

Prev Menu

Edit

Control Knob

Returns to the Main Menu.

Returns to the Film Edit Menu.

Selects the highlighted parameter for edit. SoftKey functions change to:

Next: Store parameter and move to next for editing. Enter: Stop editing and save values for selected parameter.

Control Knob: Turn to adjust value. Push to store value and

move to next parameter.

Scrolls through the list of film conditioning parameters.

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Chapter 3 Menus

Cancel:

Stop editing and

undo changes to selected parameter.

The Deposit Controls SoftKey displays these additional film settings: (Refer to section

2.2 for deposition control definitions.)

Exit to

Main

Edit

THICKNESS(kA)

0.000

Current: Process 1 EDITING: Film 1

Parameter Value Units Shutter Delay

Capture Control Error

Setting Error

Rate Sampling Setting Accuracy Based

RATE(A/s)

0.0

0:01:00 h:mm:ss

20.0

(Ignore, Stop, Hold)

Hold

18.0

(Cont,Time,Acc based)

Undefined

0.0 %

Deposition Controls Menu

POWER(%)

0.0

Exit to Main

Prev Menu

Edit

Control Knob

Returns to the Main Menu.

Returns to the Film Edit Menu.

Selects the highlighted parameter for edit. SoftKey functions change to:

Next: Store parameter and move to next for editing. Enter: Stop editing and save values for selected parameter.

Control Knob: Turn to adjust value. Push to store value and

move to next parameter.

Scrolls through the list of deposition control parameters.

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Chapter 3 Menus

A description of each film parameter follows: P Term: The proportional term sets the gain of the control loop. High gains yield more

responsive (but potentially unstable) loops. Try a value of 50, then gradually increase/decrease the value to respond to step changes in rate setpoint.

I Term: The integral term controls the time constant of the loop response. A small I term, say .5 to 1 seconds, will smooth the response of most loops.

D Term: The differential term causes the loop to respond quickly to changes. Use 0 or a very small value to avoid oscillations.

Sensor 1: Allows quartz crystal Sensor 1 to be used for the selected film. If both sensors are assigned to a film, their readings are averaged. If two sensors are assigned to a film, and one fails, it is excluded from measurements.

Note: If a relay is assigned to Dual Crystal Shutter in the I/O Setup Menu, Sensor 1 becomes the primary sensor and Sensor 2 a secondary sensor. Sensor 1 is used until a crystal fail condition occurs. When Sensor 1 fails, measurement automatically switches to Sensor 2. Sensor 2 will be used until the process completes or is aborted. The next process run will return to Sensor 1.

Film Tooling: Compensates for sensor sensitivity to the selected material. Use Xtal Tooling in the System Params menu to compensate for each sensor individually.

Output: Selects the control voltage output that is active for the selected layer. Pocket: Indicates which pocket (1-8) should be used. For this parameter to have an

effect, you must assign the Pocket Relays and Pocket Ready input in System Parameters I/O setup (see section 3.7).

Max Power: The maximum output power allowed for the selected output. The Scale output voltage is a function of the deposition power supply input specifications, and is set in the System Parameters menu. Max Power controls the maximum power that can be used by this process layer.

Slew Rate: The maximum power change allowed on an output, per second. If power or rate ramps exceed this value, an error will occur.

Crystal Quality: The maximum allowed rate deviation, from the rolling average of the previous 16 rate readings. Each time the rate deviation exceeds the selected percent value, a counter is incremented. Each time the deviation is within the selected value, the counter is decremented (to 0 minimum). If the counter reaches 100 during a process, the process is aborted. Crystal Quality settings from 0 to 9 indicate:

3-15

Chapter 3 Menus

0 Disabled 5 12.5% 1 30.0% 6 10.0% 2 25.0% 7 7.5% 3 20.0% 8 5.0% 4 15.0% 9 2.5%

Note: The Crystal Quality setting is very sensitive to PID loop tuning. It is best to leave Crystal Quality disabled until you are confident of your process and PID settings.

Crystal Stability: As material is deposited on the crystal, the frequency normally decreases. However arcing, mode hopping, or external stresses may cause the crystal frequency to increase. If the accumulated value of these positive frequency shifts (or a single large positive shift) exceeds a threshold during a process, a crystal fail condition is indicated.

0 Disabled 5 200 Hz 1 5000 Hz (1250 Hz single shift) 6 200 Hz (100Hz single shift) 2 1000 Hz 7 100 Hz 3 500 Hz 8 100 Hz (50Hz single shift) 4 400 Hz 9 25Hz

Xtal Fail Mode: Programs the action when the last sensor assigned to a film fails. Selecting Halt stops the process. When Timed Power is selected, the instrument uses the last valid rate, thickness, and power readings to calculate the time required to reach final thickness. The power is fixed at the last valid reading and deposition continues for the calculated time. Because there are no sensor readings, this is only a rough estimate. The more stable the process, the more accurate the estimate.

Material: Selects a material assigned to this film. As materials change, their density and Z-Factor are updated.

Density: Sets the density for this material. Material density has a significant impact on deposition calculations.

Z-Factor: Sets the Z-Factor, an empirically determined measure of a material’s effect on quartz crystal frequency change.

Ramp 1: Ramp power sets the power level desired at the end of the ramp phase, in % of Scale 1,2. Ramp time sets the time to ramp linearly from the initial power to the Ramp power. Soak time sets the time the output remains at the ramp power level.

Ramp 2: Ramp 2 functions are the same as Ramp 1. Typically, Ramp 2 power is set near the power level required to achieve the desired initial deposition rate.

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Chapter 3 Menus

Feed: The feed phase holds output power at the level and time required to wire feed

new material. Idle: Idle power ramps output power back to zero, or holds the material at a state that is

ready for deposition (usually the same as Ramp 2 power). Shutter Delay: It is often desirable to obtain deposition control before the substrate

shutter opens. Enabling shutter delay requires that the system reach a specific capture accuracy before the shutter opens. If the capture accuracy is not reached within the shutter delay time, the process halts. Otherwise, the substrate shutter opens and deposition begins when control accuracy has been maintained for 5 seconds. The thickness reading is zeroed at the end of the shutter delay period.

Capture: The control accuracy (%) that must be reached to end the shutter delay. Control Error: If the control loop cannot maintain the desired deposition rate, due to

loss of source material, excess rate ramps, or equipment malfunction, a control error occurs. The error condition can be ignored, the process stopped (output power to 0%), or the output power held at the same level as when the error occurred. If hold is selected, PID control is abandoned, but the process will continue to be monitored for thickness setpoint.

Rate Sampling: Rate sampling can extend the life of crystals. With rate sampling, the deposition rate is sampled for a period of time, then the sensor shutter is closed. Power is then held at the same level as the final power setting during the sample period.

? Continuous selects no sampling, the sensor shutter remains open during deposition. ? Time based sampling opens the shutter for a fixed period of time, then closes it for a

? fixed time.

? Accuracy based sampling opens and closes the shutter at the rate required to maintain the desired accuracy during the hold phase.

3-17

Chapter 3 Menus

Cancel:

Stop editing and

undo changes to selected parameter.

3.6 System Parameters Menu

The System Parameters Menu contains settings that affect the basic operation of the SQC-122c. System parameters generally pertain to the physical setup of your vacuum system equipment.

Exit to

Main

Edit

I / O

Setup

Exit to Main

Edit

THICKNESS(kA)

0.000

My Process 1 -> Layer 1 -> Aluminum

Parameter Value Units

Period .25 Sec System Tooling

Xtal Tool 1 100 % Xtal Tool 2

Simulate Mode

Min Frequency

Max Frequency Scale 1

Scale 2 Contrast

Dev Graph Limit

RATE(A/s)

100

Off

5.0e+06

6.0e+06

2.5

2.6

1.5

20.0

0.0

POWER(%)

% On/Off

Hz Hz

Volts

0.0

Edit System Params Menu

Returns to the Main Menu.

Selects the highlighted parameter for edit. SoftKey functions change to:

Next: Store parameter and move to next for editing.

I / O Setup

Control Knob

Enter: Stop editing and save values for selected parameter. Control Knob: Turn to adjust value. Push to store value and

move to next parameter.

Displays menu for mapping of inputs and outputs.

Scrolls through the list of system parameters.

3-18

Chapter 3 Menus

Descriptions of each System Parameter follows: Period: Sets the measurement period between .1 second (10 readings per second) and

1 second. A longer period gives higher reading accuracy, especially in low rate and low density applications.

Period Frequency (seconds) Resolution (Hz) .1 .3 .25 .12 .5 .06 .75 .04 1 .03

System Tooling: Adjusts for overall sensor deposition rates that differ from the measured substrate deposition rate.

Xtal Tool 1-2: Adjusts for sensor deposition rates that differ from the measured substrate deposition rate, because of sensor location. If the rate/thickness reading is low, then increase the tooling value. If the rate/thickness reading is high, then lower the tooling value

Simulate Mode: Normal mode uses the quartz crystals as inputs to the SQC-122c for PID calculations and source output control. Simulate mode simulates the quartz crystals based on the crystal frequencies set on this. Simulate mode is useful for debugging process recipes.

Min/Max Frequency: The frequency values for the quartz crystal sensors used as inputs to the SQC-122c. The maximum frequency should be set to the frequency of a new crystal, typically 6MHz. Sensor readings outside the min/max values cause an error.

Scale 1 -2: The input voltage required by the deposition source power supply to produce 100% output power. Positive or negative Scale 1,2 values are possible.

Pocket Relay: Select Single to assign a single relay to each source pocket. Select Multi to allow relays to represent the BCD encoded value of the selected pocket.

For example, assume that a film has its Pocket parameter set to 3. In I/O Setup, set Relay 1, 2, & 3 to Pocket 1, 2, & 3. Then if this parameter is set to Single, Relay 3 will close when deposition begins. If this parameter is set to Multi then Relays 1 & 2 will close (representing a binary 3).

Dev Graph Limit: Sets the upper limit for the Rate Deviation graph Y axis.

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Chapter 3 Menus

Rate Alarm Low: Sets the % deviation below rate setpoint that causes an audible

alarm. Rate Alarm High: Sets the % deviation above rate setpoint that causes an audible

alarm. The tone of the high rate alarm is lower than that of the low rate alarm. Password Enable: If Password is enabled, the Quick Start, Film and System Menus

require a password. The Process Menu can be used to select a process, but a password is required to make any changes on the Process Menu.

Password: If password is enabled, this parameter sets the sequence of SoftKeys to press to enter menus. Press the desired sequence to set the password. Holding down the top and bottom switch while powering up the SQC-122c sets the password to “1111.”

System Time: Sets the SQC-122c clock to your local time. System time is battery backed up. Does not compensate for daylight savings time.

System Date: Sets the SQC-122c date to your local time. System date is battery backed up.

3-20

Chapter 3 Menus

Cancel:

Stop editing and

undo changes to selected parameter.

3.7 I/O Setup

The I / O Setup SoftKey displays a menu allowing you to map the eight digital inputs and the eight digital outputs.

Exit to

Main

Edit

THICKNESS(kA)

0.000

My Process 1 -> Layer 1 -> Aluminum Parameter Input 1

Input 2 Input 3 Input 4 Input 5 Input 6 Input 7 Input 8 Relay 1 Relay 2 Relay 3

RATE(A/s)

0.0

I / O Mapping Menu

POWER(%)

0.0

Value

None None None None None None None None None None None

Exit to Main

Prev Menu

Edit

Control Knob

Returns to the Main Menu.

Returns to the System Parameters Menu.

Selects the highlighted parameter for edit. SoftKey functions change to:

Next: Store parameter and move to next for editing. Enter: Stop editing and save value for selected parameter.

Control Knob: Turn to adjust value. Push to store value and

move to next parameter.

Scrolls through the list of inputs and relays.

3-21

Chapter 3 Menus

In the I/O Setup Menu, any number of “events” can be mapped to the eight digital inputs and eight relay outputs. Options are set by selecting a relay or input and then turning the control knob to select the desired setting. The following explains each event:

Relays Explanation (closes when)

Source 1 Shutter Deposit phase for films set to Output 1. Source 2 Shutter Deposit phase for films set to Output 2. Sensor 1 Shutter Shutter Delay and Deposit phases of films set to Sensor 1. Sensor 2 Shutter Shutter Delay and Deposit phases of films set to Sensor 2. All Crystal Fail All sensors assigned to this film have failed. Sensor 1 Fail Sensor 1 is assigned to this film, and has failed. Sensor 2 Fail Sensor 2 is assigned to this film, and has failed. PreCond Phase Process is in Ramp1, Soak1, Ramp2, or Soak2 phase. Deposit Phase Process is in Deposit phase. SoakHold Phase Process is in Soak/Hold phase. Process Active Process is running (not stopped). Stopped Process is stopped (not running). Manual Mode Process is in Manual mode (not under PID control). Max Power Active output is at maximum power (out of material?). Time Setpoint The process has been in Deposit phase the indicated time. Thickness Setpoint Thickness setpoint reached. Resets on start of next Layer. Final Thickness Final thickness reached. Resets on start of next Layer. Pocket 1-8 Source pocket # (Single Mode) or BCD bit # (Multi mode) Dual Crystal Shutter Primary sensor in a dual sensor has failed. None This relay is not assigned to any event.

Inputs Explanation (high input causes)

Abort Process Abort the process. Can only restart at Layer 1. Start Process Start the process at Layer 1. Stop Layer Stop the active layer. Restart Layer Start the active layer. Start Next Layer Start the next layer. Soak Hold Delay the start of deposition. Force Final Thickness End deposition. Zero Thickness Reset thickness reading to zero. Zero Time Reset time setpoint counter to zero. Start Process 1-25 Start the selected process. Pocket Ready The source indexer is on the desired pocket. None This input is not assigned.

3-22

Chapter 3 Menus

This page left blank for your notes.

3-23

Chapter 4 Options

4.0 Introduction

This section covers the installation of optional accessories.

4.1 Option Card

No option cards are available for the SQC-122c, although the rear panel has locations for an expansion card. To expand the SQC-122c, the unit can be upgraded to an SQC-222. Contact Sigma for information on this factory-only upgrade.

4.2 Full Rack Extender Installation

The Full Rack Extender option (PN 900-007) mounts a single SQC-122c into a full width 19” rack space.

Follow the steps below to assemble the extender and mount the SQC-122c:

Remove SQC-122c Mounting Ear

Assemble the Extender

Attach the Extender Place the extender next to the SQC-122c, and thread the

Attach the Mounting Ears

Mount the SQC-122c

Determine on which side of the SQC-122c you want to attach the rack extender. If a rack mount ear is attached to the SQC-122c on that side, remove the two 10-32 flat head screws that mount the ear, then remove the rack mount ear. Assemble the extender “box” using the eight 6-32 flat head screws, two end panels, and two main panels. Thread two socket head captive panel screws from the inside of one side of the extender. Continue to thread the captive screws until their threads are completely exposed on one side.

captive screws into the SQC-122c threaded holes that were previously used to mount the rack ear. Tighten the captive screws to secure the extender to the SQC-122c. Attach the mounting ear previously removed from the SQC122c to the extender using the same10-32 flat head screws. If rack mount ears were not already attached to the SQC-122c, attach the other mounting ear also. Slide the entire assembly into an empty 5 ¼” high 19” rack mount space. Secure the assembly with four 10-32 rack screws (not supplied).

4-1

Appendix

A. Material Parameters

Material Density ZFactor Material Density ZFactor Aluminum 2.73 1.08 Magnesium Fluoride 3 1 Aluminum Oxide 3.97 1 Manganese 7.2 0.377 Antimony 6.62 0.768 Manganese Sulfide 3.99 0.94 Arsenic 5.73 0.966 Mercury 13.46 0.74 Barium 3.5 2.1 Molybdenum 10.2 0.257 Beryllium 1.85 0.543 Neodymium Fluoride 6.506 1 Bismuth 9.8 0.79 Neodymium Oxide 7.24 1 Bismuth Oxide 8.9 1 Nickel 8.91 0.331 Boron 2.54 0.389 Niobium 8.57 0.493 Cadmium 8.64 0.682 Niobium Oxide 4.47 1 Cadmium Selenium 5.81 1 Palladium 12 0.357 Cadmium Sulfide 4.83 1.02 Platinum 21.4 0.245 Cadmium Teluridium 5.85 0.98 Potassium Chloride 1.98 2.05 Calcium 1.55 2.62 Rhenium 21.04 0.15 Calcium Fluoride 3.18 0.775 Rhodium 12.41 0.21 Carbon Diamond 3.52 0.22 Samarium 7.54 0.89 Carbon Graphite 2.25 3.26 Scandium 3 0.91 Cerium Fluoride 6.16 1 Selenium 4.82 0.864 Cerium Oxide 7.13 1 Silicon 2.32 0.712 Chromium 7.2 0.305 Silicon Dioxide 2.2 1.07 Chromium Oxide 5.21 1 Silicon Oxide 2.13 0.87 Cobalt 8.71 0.343 Silver 10.5 0.529 Copper 8.93 0.437 Silver Bromide 6.47 1.18 Copper Sulfide 4.6 0.82 Silver Chloride 5.56 1.32 Copper Sulfide B 5.8 0.67 Sodium 0.97 4.8 Copper Sulfide A 5.6 0.69 Sodium Chloride 2.17 1.57 Dysprosium 8.54 0.6 Sulfur 2.07 2.29 Erbium 9.05 0.74 Tantalum 16.6 0.262 Gadolinium 7.89 0.67 Tantalum Oxide 8.2 0.3 Gallium 5.93 0.593 Tellurium 6.25 0.9 Gallium Arsenide 5.31 1.59 Terbium 8.27 0.66 Germanium 5.35 0.516 Thallium 11.85 1.55 Gold 19.3 .381 Thorium Fluoride 6.32 1 Hafnium 13.1 0.36 Tin 7.3 0.724 Hafnium Oxide 9.63 1 Titanium 4.5 0.628 Holnium 8.8 0.58 Titanium Oxide 4.9 1 Indium 7.3 0.841 Titanium Oxide IV 4.26 0.4 Indium Intimnide 5.76 0.769 Tungsten 19.3 0.163 Indium Oxide 7.18 1 Tungsten Carbide 15.6 0.151 Iridium 22.4 0.129 Uranium 18.7 0.238 Iron 7.86 0.349 Vanadium 5.96 0.53 Lanthanum 6.17 0.92 Ytterbium 6.98 1.13 Lanthanum Fluoride 5.94 1 Yttrium 4.34 0.835 Lanthanum Oxide 6.51 1 Yttrium Oxide 5.01 1 Lead 11.3 1.13 Zinc 7.04 0.514 Lead Sulfide 7.5 0.566 Zinc Oxide 5.61 0.556 Lithium 0.53 5.9 Zinc Selenide 5.26 0.722 Lithium Fluoride 2.64 0.774 Zinc Sulfide 4.09 0.775 Magnesium 1.74 1.61 Zirconium Oxide 5.6 1.001

B. Specifications

Measurement

Number of Sensors Frequency Range Frequency Accuracy Frequency Resolution Rate Accuracy Rate Resolution Thickness Accuracy Thickness Resolution Measurement Period

Source

Number of Sources Control Voltage Resolution

Digital I/ O

Digital Inputs Functions Input Rating

Appendix

4.0 MHz to 6.0 MHz .01% @ 2 readings/sec. .06 Hz @ 2 readings/sec .5% typical .01/.1 ? /s .5% typical 1 ? .1 to 1 sec.

2 0 to ±10V into 2k? load

15 bits

8 User Programmed (See Chapter 3) 5VDC, non-isolated

Relay Outputs Functions Relay Rating

General Specifications

Mains Power Supply Power Consumption

Operating & Transportation Environment

Storage Environment Rack Dimensions (HxWxD)

Weight

8 User Programmed (See Chapter 3) 30Vrms or 30VDC, 2A maximum

100-120/200-240~, ±10% nominal 50/60 Hz 25W 0?C to 50?C 0 to 80% RH non-condensing 0 to 2,000 meters Indoor Use Only Class 1 Equipment (Grounded Type) Suitable for Continuous Operation Ordinary Protection (not protected ? against harmful ingress of moisture) Pollution Degree II Installation (Overvoltage) Category II ? for transient overvoltages

-40?C to 70?C

5.23 in. x 8.4 in. x 10.0 in.

132.8mm x 213.4m x 254.0mm 4 pounds (1.8 kg)

Appendix

Display

Graphs Rate, Deviation, Power Readouts Thickness, Rate, Power Process Parameters (a Process is a sequence of layers) # Processes 25 # Films 25 # Layers (total all processes) 250 Layer Parameters (Layer is a Film, plus these values) Initial Rate 0.0 to 999.9 ? /sec. Final Thickness Time Setpoint 0 to 30000 sec. Thickness Limit 0.0 to 999.9 ? Start Mode Auto/Manual # Rate Ramps 2 Rate Ramp Start 0.0 to 999.9 ? Rate Ramp Time 0 to 1000 sec. New Rate 0.0 to 999.9 ? /sec. Film Parameters (Film is a Material, plus these values) Material 100 stored Density 0.40 to 99.99 gm/cm Z-Factor 0.100 to 9.900 P Term 1 to 9999 I Term 0 to 99.9 sec. D Term 0 to 99.9 sec. Sensor (1,2) On/Off Output 1 or 2 Pocket 1 to 8 Max Power 0.0 to 100.0 % Slew Rate 0.0 to 100.0 %/sec. Crystal Quality Disabled to 30% Crystal Stability Disabled to 5000 Hz Crystal Fail Mode Halt or Timed Power Ramp1, Ramp2, Feed Ramp, Feed, Idle Ramp Time 0 to 30000 sec. Soak1, Soak2, Feed, Idle Power 0.0 to 100.0 % Shutter Delay Time 0 to 200 sec. Shutter Delay Error 0.0 to 30.0 % Control Error Ignore/Stop/Hold Control Error Setting 0 to 30.0 % Rate Sampling Continuous/Time/Accuracy Sample Time 10.0 to 999.0 sec. Hold Time 10.0 to 999.0 sec.

0.0 to 999.9 ?

Appendix

C. I/O Connections

A 25 pin D-sub connector, located on the rear of the SQC-122c, provides Input/Output connections. Refer to Section 3.6 for relay and input functional assignments.

Inputs can be activated either by connecting to a switch and shorting to Ground, or they can be driven by a TTL compatible signal.

WARNING: These are not isolated inputs! The voltage level applied must be limited to between 0 and +5 volts with respect to Ground.

WARNING: Output relays are rated for 30Vrms or 30VDC, at 2A maximum. Proper fusing, and adequate wiring insulation and separation, should be provided to assure these limits are not exceeded.

The pin assignments for the rear panel mounted I/O connector are shown below:

1 13

I/O Connector Wiring

Relay Pins Input Pins

Relay 1 14,15 Input 1 16 Relay 2 1,2 Input 2 17 Relay 3 3,4 Input 3 18 Relay 4 5,6 Input 4 19 Relay 5 7,8 Input 5 20 Relay 6 9,10 Input 6 21 Relay 7 11,12 Input 7 22 Relay 8 13,25 Input 8 23

Ground 24

Appendix

A Y adapter cable can be used to provide compatibility with older (non color) models of the SQC-122, as shown below. Contact Sigma for information on purchasing this adapter, or other custom I/O cables.

Appendix

D. Handheld Remote Controller

The Handheld Controller provides the capability of adjusting output power remotely when the SQC-122c is in Manual Mode.

ABORT

Sigma

instruments?

Handheld Controller

To use the handheld controller, attach the cable from the handheld controller to the Remote jack on the SQC-122c front panel. Select a Process using the SQC-122c front panel SoftKeys. Press Next Menu until the Auto/Manual SoftKey is displayed. Press Auto/Manual to change to Manual power mode (SoftKey shows Manual/Auto). Press Start to begin the film deposition.

You can now use either the front panel Control Knob or the Handheld Controller to adjust output power. Pressing Abort on the handheld controller stops the layer and returns output power to 0%.

E. EC Declaration of Conformity

Manufacturer’s Name: Sigma Instruments Manufacturer’s Address: 1318 Duff Drive

Fort Collins, CO 80524 USA

declares that the product:

Product Name: Deposition Rate Controller Product Model: SQC-122c Product Options: All Options

conforms to the following Directives:

Appendix

73/23/EEC (93/68/EEC) Low Voltage Directive 89/336/EEC Electromagnetic Compatibility Directive

uses the following standards:

EN 61010-1 Safety of Electrical Equipment for

Measurement, Control, and Laboratory Use EN 50081-2 Generic Standard for Emissions EN 55011 Radiated and Conducted Emissions (Class A) EN 50082-2 Generic Standard for Immunity EN 61000-4-2 Electrostatic Discharge EN 61000-4-3 Radiated RF Electro-Magnetic Field EN 61000-4-4 Electrical Fast Transient/Burst EN 61000-4-6 Conducted RF ENV 50204 Radiated RF

and complies with the Essential Health and Safety Requirements.

Gary L. Halcomb President

INFICON SQC-122C User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual