INFICON SID-142 User Manual
SID-142
Sigma
instruments
Thin Film Deposition Controller
SQM-142
Deposition Control Card
SQS-142
Deposition Control Software
Version 2.16
User’s Guide
© Copyright Sigma Instruments, Inc. 1998-2001
ΣΣ
Safety Information
Read this manual before installing, operating, or servicing equipment. Do not install
substitute parts, or perform any unauthorized modification of the product. Return the
product to Sigma Instruments for service and repair to ensure that safety features are
maintained.
Safety Symbols
WARNING: Calls attention to a procedure, practice, or condition that could
possibly cause bodily injury or death.
CAUTION: Calls attention to a procedure, practice, or condition that could
possibly cause damage to equipment or permanent loss of data.
Refer to all manual Warning or Caution information before using this product
to avoid personal injury or equipment damage.
Hazardous voltages may be present.
Earth ground symbol.
Chassis ground symbol.
Equipotential ground symbol.
Warranty Information
This Sigma Instruments product is warranted against defects in material and
workmanship for a period of 1 year from the date of shipment, when used in accordance
with the instructions in this manual. During the warranty period, Sigma Instruments will,
at its option, either repair or replace products that prove to be defective.
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cause other than defective materials or workmanship are not covered by this warranty.
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LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS
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Sigma Instruments
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Table of Contents
Chapter 1 Introduction
1.0 SID-142 Introduction...................................................................................1-1
1.1 SRC Series Computer................................................................................1-1
1.2 SQM-142 Deposition Control Card ..............................................................1-2
1.3 SQS-142 CoDeposition Control Software.....................................................1-2
1.4 Digital I/O..................................................................................................1-3
Chapter 2 Quick Start
2.0 Introduction................................................................................................2-1
2.1 Installation.................................................................................................2-1
2.2 Front Panel................................................................................................2-2
2.3 Program Startup ........................................................................................2-3
2.4 Single Layer Process Setup........................................................................2-4
2.5 Single Layer Process Simulation.................................................................2-8
2.6 SoftKey Functions ......................................................................................2-10
2.7 Multi-Layer CoDeposition Process...............................................................2-11
2.8 Conclusion.................................................................................................2-15
Chapter 3 SQS-142 Software
3.0 Introduction................................................................................................3-1
3.1 Installation.................................................................................................3-2
3.2 Operation...................................................................................................3-2
3.3 File Menu...................................................................................................3-4
3.4 Edit Menu..................................................................................................3-5
3.4.1 Processes.............................................................................................3-6
Layers...............................................................................................3-7
Rate Ramps......................................................................................3-9
Deposition.........................................................................................3-10
Conditioning ......................................................................................3-12
Sources and Sensors.........................................................................3-13
3.4.2 Films.....................................................................................................3-15
3.4.3 Materials...............................................................................................3-16
Chapter 3 SQS-142 Software (continued)
3.4.4 System.................................................................................................3-17
Sensors.............................................................................................3-17
Sources.............................................................................................3-18
Digital I/O..........................................................................................3-19
PLC Setup.........................................................................................3-22
SQM-142 Setup.................................................................................3-23
RS232 Setup.....................................................................................3-24
3.4.5 Security ................................................................................................3-25
3.5 View Menu.................................................................................................3-27
3.6 Specifications.............................................................................................3-28
Chapter 4 SQM-142 PC Card
4.0 Introduction................................................................................................4-1
4.1 Installation.................................................................................................4-2
4.2 Sensor Connection.....................................................................................4-2
4.3 Power Supply Connection...........................................................................4-3
4.4 Demo Programs.........................................................................................4-3
4.5 SQM32C.DLL ............................................................................................4-3
4.6 Specifications..............................................................................................4-5
Chapter 5 Digital I/O
5.0 Introduction................................................................................................5-1
5.1 PLC Installation..........................................................................................5-1
5.2 PLC Setup and Test...................................................................................5-2
Chapter 6 Computer Interface
6.0 Introduction................................................................................................6-1
6.1 Serial Interface...........................................................................................6-1
6.2 SerialComm Program.................................................................................6-1
6.3 Protocol.....................................................................................................6-2
6.4 Command Summary...................................................................................6-4
Appendix
A. Material Parameters
Chapter 1 Introduction
1.0 Introduction
This manual covers both the hardware and software associated with the SID-142 Thin
Film Deposition Controller. The SID-142 consists of four main elements, integrated into
a complete deposition control system:
SRC Series Rack-mount Computer
SQM-142 PC Card(s)
SQS-142 Windows CoDeposition Software
PLC for Digital I/O (option)
While the focus of this manual is on the SID-142 Controller package, it also covers each
of these components separately. If you have purchased only the SQS-142 Software
and/or the SQM-142 Card, we suggest that you also review Chapters 1 and 2 of this
manual for important information.
1.1 SRC Series Computer
Sigma’s SRC Series computers are Pentium class (or better) computers running the
Windows 98 or NT operating system. The SRC computer series uses standard off-theshelf components and Sigma’s custom rack-mount chassis to provide a compact, low
cost instrument.
Included in the 5.25” or 7” high rack-mount chassis are an LCD Display, a TouchPad
pointing device, a setting Knob, and six SoftKeys. A keyboard is provided for initial
setup, but is not necessary for normal operation of the SQS-142 deposition control
software. An optional rack-mount keyboard is also available.
1-1
Chapter 1 Introduction
1.2 SQM-142 Deposition Control Card
Sigma’s SQM-142 card installs in a computer ISA slot, and provides the interface to the
vacuum deposition system. Each card measures up to four quartz sensors via BNC
inputs, and supplies the control signal for two evaporation sources via a dual phone
plug output. Up to two cards can be installed in a computer, creating an eight input, four
output, codeposition controller.
The SQM-142 card is supplied with demonstration software written in Visual Basic and
LabView, including complete source code. The SQM-142 card and a Pentium computer
with Windows form a basic deposition control system (without digital I/O capabilities).
1.3 SQS-142 CoDeposition Control Software
Included with the SID-142 is Sigma’s SQS-142 software, a Windows-based program
that provides all of the functions required for an eight sensor, four output, codeposition
process. It is optimized for use with the Setting Knob and six SoftKeys of our SID-142
controller. However, it will run on any Win9X system with our SQM-142 card installed.
1-2
Chapter 1 Introduction
The six SoftKeys provide easy access to the common operating functions. A single
tabbed dialog box provides all of the settings required for a thin film process. Material
parameters, sensor/source setup, pre/post conditioning, and error conditions are all
visible on a single screen. Process settings, numeric data, and graphical displays are
displayed during all phases of deposition.
The SQS-142 software stores process parameters in a Microsoft Access compatible
database. This provides virtually unlimited access to desktop tools for building and
analyzing thin film processes.
1.4 Digital I/O
Digital I/O for the SID-142 is provided through an inexpensive, external, programmable
logic controller (PLC). This allows the PLC, and the associated I/O wiring, to be placed
in a convenient location in a wiring cabinet. A single, serial communications cable runs
to the SID-142 computer. The PLC provides electrical isolation, fail-safe operation, and
extensive I/O processing capabilities through its ladder logic programming.
1-3
Chapter 1 Introduction
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1-4
Chapter 2 Quick Start
2.0 Introduction
This section covers the minimum system connections and initial setup required to run
the SID-142 Deposition Controller. Consult later chapters of this manual for more
detailed setup and operational instructions.
2.1 Installation
All electrical connections to the SID-142 are made at the back panel of the instrument.
WARNING: Care should be exercised to route SID-142 cables as far as practical from
other cables that carry high voltages or generate noise. This includes other line voltage
cables, wires to heaters that are SCR-controlled, and cables to source power supplies
that may conduct high transient currents during arc down conditions.
Rack
Installation
Power
Connection
Sensor Input
Connections
Source Output
Connections
Digital I/O
Connections
The SID-142 occupies a 5.25” high (4U) rack space. Install the
unit in a 19” rack with the supplied hardware.
WARNING: Verify that the Voltage Selector Switch, located next
to the power switch, matches your mains supply voltage.
WARNING: Verify that the power cable provided is connected to
a properly grounded mains receptacle.
Connect the BNC cables and oscillators from your vacuum
chamber feedthrough to the desired SQM-142 Card Input(s).
Refer to Chapter 4 for detailed instructions on system hookup
to the SQM-142 card(s).
Connect the dual phone plug from the SQM-142 output jack to
your evaporation supply control input. Refer to Chapter 4 for
detailed instructions on wiring the SQM-142 output phone plug.
Digital I/O is not required for initial operation of the SID-142.
Perform initial setup and checkout of the SID-142 before
connecting your digital I/O. Refer to Chapter 5 for detailed
information on wiring the SID-142 for digital I/O.
Keyboard
Connection
A keyboard is supplied for initial user setup of Windows.
Attach the keyboard to the keyboard input jack on the rear of
the SID-142. Once Windows is setup, use of the keyboard is
optional.
2-1
Chapter 2 Quick Start
2.2 Front Panel
SoftKeys TouchPad Control Knob Floppy Disk
SoftKeys
TouchPad
Control
Knob
Floppy
Disk
Keyboard
(not shown)
Front Panel Controls
Provide basic instrument operations within the SQS-142
deposition program. The SoftKeys are functional only in
programs written specifically for the SRC computer.
Provides mouse functions in all Windows programs, including
the SQS-142 software. Move your index finger along the
touchpad surface to move the mouse. Press the left or right
buttons below the touchpad surface to “click.”
Used to adjust values within the SQS-142 software. Pushing
the control knob stores the current setting, and moves to the
next setting. Functional only in programs written specifically for
the SRC computer.
1.44 MB floppy disk for upgrades, backup, and data
storage/transfer.
Required for Windows data entry, and useful during initial SID142 setup. Not required for SQS-142 software operation. The
F1 through F6 keys on the keyboard provide the same
functions as the six SoftKeys on the front panel.
2-2
Chapter 2 Quick Start
2.3 Program Startup
This section will start the SID-142 and run the SQS-142 deposition control program.
Power On the
Computer
Start the
Program
User Login
Screen
Process
Database
Move the rear panel power switch on the SID-142 to the On (|)
position.
The SID-142 will boot Windows from the internal hard disk and
start the SQS-142 deposition program. If the SQS-142
program does not start automatically, use the touchpad to
double-click the desktop icon.
The SID-142 displays a progress bar during program startup,
then a User Login screen. Select a User Name from the drop
down box, enter the Password, then click OK.
The SID-142 ships with one pre-assigned user. The user
name is Super, with no Password. Depending on the access
level of the selected user, a different set of program functions
will be available. See Chapter 3 for more information on users,
passwords, and access levels.
The SID-142 normally starts with the last active process
database. If that database is not found, a Database Open
dialog will be displayed. Use the touchpad to navigate to the
desired database.
Main Display
Simulate Mode
The main display shows a set of labels associated with the
function of the six SoftKeys. As you operate the SID-142,
these labels will change to display appropriate functions.
Along the top of the display is a menu of less commonly used
functions. This menu is available only when the SID-142 is
stopped (i.e. not running a deposition process).
Simulate Mode allows you to familiarize yourself with SID-142
operation, and test process recipes. If the first SoftKey is
labeled “Start Simulate” then the Simulate mode is active.
If the first SoftKey is labeled “Start” then normal mode is
selected. Use the touchpad to select the Setup menu, then
click System. Click the Simulate option button on the System
tab. With the touchpad click the “Save” SoftKey label, or press
the top SoftKey to activate simulate mode.
2-3
Chapter 2 Quick Start
2.4 Single-Layer Process Setup
A thin film deposition process consists of one or more layers of material evaporated
onto a substrate. Let’s build a simple single-layer process.
Open
Process Edit
Add A New
Process
Edit
Film
Edit Rate and
Thickness
Use the touchpad to click on the “Edit” menu selection along
the top of the display, then click “Process.” The Process Edit
dialog will display the setup for the last process run.
To better understand process setup, see section 3.4.1.
Click the “New” button in the dialog box. An on-screen
keyboard appears, displaying the next numbered Process.
Click “Backspace” several times to delete the name. Now
“type” a new Process name using the touchpad and on-screen
keyboard. Click “Enter” to save the new name.
Click the “Layer” tab to assure the layer parameters are
displayed. Select “Gold Sample” in the Film dropdown box.
Click the “Initial Rate” setting, and then use the Control Knob to
adjust the Initial Rate to 10 A/s. Adjust the “Final Thickness” to
1.000 kA.
2-4
Chapter 2 Quick Start
The diagram below illustrates a complete deposition cycle for a single layer. Refer to
this diagram as we set the remaining process setup parameters.
Edit
Rate Ramps
Edit Pre/Post
Conditioning
It may be desirable to vary the deposition rate during a layer.
For example, to deposit slowly at first, then more quickly once
the initial material is deposited. Click the “Rate Ramps” tab,
then click “Insert Ramp.” Adjust the “Start Thickness” to 0.400
kA, “Ramp Time” to 5 seconds, and “New Rate” to 15 A/s.
Before deposition begins, the source material is often brought
to a ready state by raising the evaporation source power.
Select the “Condition” tab and set each parameter to the
values shown below.
2-5
Chapter 2 Quick Start
Edit
Deposition
Select the “Deposition” tab. This tab establishes the gain (P
Term), time constant (I Term), and dead time (D Term) for your
process. Set these values to 55, .7, and 0 respectively.
Be sure Shutter Delay Enabled is not selected. Select Ignore
for Control Error, and Continuous for Rate Sampling (see
picture below).
2-6
Chapter 2 Quick Start
Edit
Source/Sensor
Select the “Source/Sensor” tab. This tab contains parameters
associated with the physical layout of your evaporation system.
For now, be sure that “Output 1” is selected and “Max Power”
and “Slew Rate” are set to 100. Set the “Tooling” value to 100.
Leave the Source Index as it is.
Save Edits
Your new single-layer process is now the active process in the main window. Notice the
process, layer, and time information above the graph.
Click “Close Form” or press the first SoftKey to save this onelayer process. If you are prompted “Do you want to
change….,” answer Yes to make this the current process.
2-7
Chapter 2 Quick Start
2.5 Single-Layer Process Simulation
If you have followed this chapter, you are ready to simulate a deposition process.
Setup
Displays
Start
Process
The process will start with preconditioning (i.e. Ramp1, Soak1, Ramp2, Soak2) as
shown below. Once preconditioning is complete, the process will enter the Deposit
phase. You may want to select “ABORT SIMULATE,” then “START SUMULATE”
several times to familiarize yourself with the on-screen displays during preconditioning.
You may also want to use the settings ribbon to adjust parameters while the process is
running.
Click the “View” menu and assure that these options are
selected: Film Settings, Film Readings, and Automatic. Note
that the settings “ribbon” along the right displays the preconditioning parameters you entered in the previous section.
Verify that the top SoftKey label displays “START SIMULATE.”
If only “START” is displayed, follow the instructions at the end
of Section 2.2 to enable simulate mode. Press the “START
SIMULATE” SoftKey, or click the label with the touchpad, to
start the process.
Preconditioning Phases
Because we selected “Automatic,” in the View menu, the graph displays Output Power
during preconditioning, then switches to Rate during the deposition phase.
2-8
Chapter 2 Quick Start
As shown below, the initial deposition rate was 10 A/s until a thickness of .400 kA.
Then the deposition rate was ramped up to 15 A/s, and held until the desired final
thickness of 1.000 kA is achieved. At this point, this single-layer process is finished.
Deposition Phase with one Rate Ramp
You should adjust the PID parameters on the setting ribbon, then Start/Stop the process
several times to become familiar with their effect on control loop response.
2-9
Chapter 2 Quick Start
2.6 SoftKey Functions
As you have seen, the SoftKey functions remain constant during deposition. Spend a
few minutes to become familiar with each of these SoftKey functions.
STOP/ABORT
START/STOP
LAYER
AUTO->
MAN
Starts the first layer of a process when START is displayed.
Aborts the process when ABORT is shown.
Once aborted, a process restarts at the pre-conditioning phase
of the first layer.
Restarts a stopped layer, or starts a layer that has been
designated “Manual Start” in the process database. During
deposition, stops the current layer.
Once a layer is stopped, pressing START LAYER restarts the
current layer at the preconditioning phase.
Toggles the source output between PID and manual control.
When AUTO->MAN is shown, pressing this switch causes the
source output to hold at the current power. You may adjust the
output using the settings ribbon. Because the PID loop is not
running, you can manually set the output power to different
levels and observe the associated deposition rate.
ZERO
NEXT
FILM
NEXT
SETTING
When MAN->AUTO is shown, pressing the switch places the
output under PID control as defined by the process database.
Resets the thickness reading to zero. This is useful in
Simulate Mode for preventing the deposition phase from
ending because final thickness has been reached. As you
change PID parameters, press “ZERO” from time to time to
keep the process running.
Sequences the setting ribbon through each Film in a
codeposition layer.
When the settings ribbon is shown, sequences the setting knob
action through each of the displayed parameters.
2-10
Chapter 2 Quick Start
2.7 Multi-Layer CoDeposition Process
Our final example builds on the previous sections. If you have modified the setup of
your process, return to Section 2.4 and adjust the process to those values. When your
single-layer process matches Section 2.4, complete these steps:
Duplicate a
Layer
Select a
CoDep Film
Add a
CoDep Layer
Open the Edit Process dialog. Click on Layer 1, click the
“Layer” tab, then click “Copy Layer.” Now click “Paste Layer.”
A duplicate Gold Sample film will be added as Layer 2. Click
“Paste Layer” again to add a third Gold Sample layer.
Select Layer 3 in the layers list. Now select “Silver Sample” in
the films dropdown. The layers list will update to show the new
Silver Sample film assigned to Layer 3.
Select Layer 3 in the layers list, then click “Cut Layer.” Now
select Layer 1. Click “Paste CoDep.” The Silver Sample film
will be added below Gold Sample as a codeposition layer.
(Your setup should match the picture below.)
We now have two layers in our process. Layer 1 has Gold being deposited from source
Output 1 and Silver is being codeposited on Output 2. Layer 2 is Gold alone.
2-11
Chapter 2 Quick Start
Hint: It’s usually best to copy a layer, then paste several temporary layers of that
type. Next, assign the films that you want to each of the pasted layers. When
selecting films for codeposition, remember that each film in a codeposited layer must
be assigned to a different source output! Now use “Cut Layer” on the temporary
layers, and “Paste CoDep” to assign the film to the desired codeposition layers.
Review this example until you are comfortable with these concepts.
Edit Layer 1
Rate & Thickness
Edit Layer 2
Rate & Thickness
Set Layers to
Auto Start
Click Silver Sample in the list of layers. Set “Initial Rate” to 15
A/s, “Final Thickness” to 1.000 kA. Click the Rate Ramps tab
and adjust “Start Thickness” to 0.400 kA, “Ramp Time” to 15
seconds, and “New Rate” to 0 A/s.
Click the Layer Tab, then click Layer 2. Set Final Thickness to
.5000 kA.
At the end of deposition, you may choose to have the next
layer wait for a Start Layer command, or to start automatically.
Select each Layer in the layers list, then click Auto to set that
layer to start automatically.
Verify that your process matches the one shown above.
Edit Silver
Deposition
Select the “Deposition” tab and the Silver Sample layer. Set
each parameter to the values shown below.
2-12
Chapter 2 Quick Start
2-13
Chapter 2 Quick Start
Edit Silver
Conditioning
Select the “Condition” tab and the Silver Sample layer. Set
each parameter to the values shown below.
Save Edits
Start
Process
Preconditioning of the two materials is entirely independent. If the preconditioning of
one layer takes longer than the other, the start times are adjusted so that the end times
coincide.
When preconditioning ends, codeposition of the two materials begins.
Click “Close Form” or press the first SoftKey to save this twolayer codeposition process. Answer Yes if it displays the “Do
you want to change….” message box to make this the current
process.
Press the “START SIMULATE” SoftKey to start the first layer
preconditioning phases. Note that two outputs are displayed
for this codeposition layer.
2-14
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