HP HMMC-5021DC, HMMC-5021RF, HMMC-5022DC, HMMC-5022RF, HMMC-5026DC Datasheet

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HP HMMC-5021DC, HMMC-5021RF, HMMC-5022DC, HMMC-5022RF, HMMC-5026DC Datasheet

2– 26.5 GHz GaAs MMIC

Traveling Wave Amplifier

Technical Data

Features

Wide-Frequency Range:

2 - 26.5 GHz

High Gain: 9.5 dB

Gain Flatness: 0.75 dB

Return Loss:

Input: -14 dB Output: -13 dB

Low-Frequency Operation Capability: < 2 GHz

Gain Control:

35 dB Dynamic Range

Moderate Power:

20GHz: P-1dB: 18 dBm

Psat: 20 dBm

26.5GHz: P-1dB: 15 dBm

Psat: 17 dBm

Description

The HMMC-5021/22/26 is a broadband GaAs MMIC Traveling Wave Amplifier designed for high gain and moderate output power over the full 2 to 26.5 GHz frequency range. Seven MESFET cascode stages provide a flat gain response, making the HMMC-5021/22/26 an ideal wideband gain block. Optical lithography is used to produce gate lengths of 0.4 μm. The HMMC-5021/22/26incorporates advanced MBE technology, Ti-Pt-Au gate metallization, silicon nitride passivation, and polyimide for scratch protection.

HMMC-5021 (2-22 GHz)

HMMC-5022 (2-22 GHZ)

HMMC-5026 (2-26.5 GHz)

Chip Size:

2980 x 770 μm (117.3 x 30.3 mils)

Chip Size Tolerance:

± 10μm(± 0.4mils)

Chip Thickness:

127± 15 μm (5.0 ± 0.6 mils)

Pad Dimensions:

75 x 75 μm (2.95 x 2.95 mils), or larger

Absolute Maximum Ratings

Symbol

Parameters/Conditions

Units

Min.

Max.[1]

VDD

Positive Drain Voltage

V

 

8.0

IDD

Total Drain Current

mA

 

250

VG1

First Gate Voltage

V

-5

0

IG1

First Gate Current

mA

-9

+5

V [2]

Second Gate Voltage

V

-2.5

+3.5

G2

 

 

 

 

IG2

Second Gate Current

mA

-7

 

PDC

DC Power Dissipation

watts

 

2.0

Pin

CW Input Power

dBm

 

23

Tch

Operating Channel Temp.

°C

 

+150

Tcase

Operating Case Temp.

°C

-55

 

TSTG

Storage Temperature

°C

-65

+165

Tmax

Maximum Assembly Temp.

°C

 

+300

(for 60 seconds maximum)

 

 

 

 

 

 

 

 

 

 

Notes:

1.Operation in excess of any one of these conditions may result in permanent damage to this device. TA = 25°C except for Tch, TSTG, and Tmax.

2.Minimum voltage on VG2 must not violate the following: VG2(min) > VDD - 9 volts.

5965-5449E

6-28

HMMC-5021/22/26 DC Specifications/Physical Properties,[1] applies to all part numbers

Symbol

Parameters and Test Conditions

Units

Min.

Typ.

Max.

 

 

 

 

 

 

IDSS

Saturated Drain Current

mA

115

180

250

(VDD = 7.0 V, VG1 = 0 V, VG2 = open circuit)

 

 

 

 

 

 

 

 

 

 

 

Vp

First Gate Pinch-off Voltage

V

-3.5

-1.5

-0.5

(VDD = 7.0 V, IDD = 16 mA, VG2 = open circuit)

 

 

 

 

 

 

 

 

 

 

 

VG2

Second Gate Self-Bias Voltage

V

 

2.1

 

(VDD = 7.0 V, VG1 = 0 V)

 

 

 

 

 

 

 

IDSOFF

First Gate Pinch-off Current

mA

 

4

 

(VG1)

(VDD = 7.0 V, VG1 = -3.5 V, VG2 = open circuit)

 

 

 

 

 

 

 

 

 

 

 

 

IDSOFF

Second Gate Pinch-Off Current

mA

 

8

 

(VG2)

(VDD = 5.0 V, VG1 = 0 V, VG2 = -3.5 V)

 

 

 

 

 

 

θch-bs

Thermal Resistance

°C/W

 

36

 

(Tbackside = 25°C)

 

 

 

 

 

 

 

Note:

 

 

 

 

 

1. Measured in wafer form with Tchuck = 25°C. (Except qch-bs.)

 

 

 

 

HMMC-5021/22/26 RF Specifications, V

DD

= 7.0 V, I

DD

(Q) = 150 mA, Z

in

= Z

o

= 50 Ω[1]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.0–22.0 GHz

 

 

 

2.0–26.5 GHz

Symbol

Parameters/Conditions

Units

 

HMMC-5021

 

 

HMMC-5022

 

 

 

HMMC-5026

 

 

 

 

 

 

 

Typ.

 

 

Min.

 

Typ.

 

Max.

 

Min.

 

Typ.

 

Max.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BW

Guaranteed Bandwidth

GHz

 

2-22

 

 

2

 

 

 

 

22

 

2

 

 

 

26.5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

S21

Small Signal Gain

dB

 

 

 

10

 

 

8.0

 

10

 

 

12

 

7.5

 

9.5

 

12

DS21

Small Signal Gain Flatness

dB

 

 

 

± 0.5

 

 

 

 

± 0.5

 

± 1.0

 

 

 

± 0.75

 

± 1.0

RLin(min)

Minimum Input Return Loss

dB

 

 

 

16

 

 

10

 

16

 

 

 

 

10

 

14

 

 

RLout(min)

Minimum Output Return Loss

dB

 

 

 

13

 

 

10

 

13

 

 

 

 

10

 

13

 

 

Isolation

Minimum Reverse Isolation

dB

 

 

 

32

 

 

20

 

32

 

 

 

 

20

 

30

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P-1dB

Output Power at 1 dB Gain Comp.

dBm

 

18

 

 

15

 

18

 

 

 

 

12

 

15

 

 

Psat

Saturated Output Power

dBm

 

20

 

 

17

 

20

 

 

 

 

14

 

17

 

 

 

Max. Second Harm. (2 <¦o<20),

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

H2(max)

[Po(¦o) = 17 dBm or P-1dB,

dBc

 

-25

 

 

 

 

-25

 

 

-20

 

 

 

-25

 

-20

 

whichever is less.]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Max. Third Harm. (2 <¦o< 20),

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

H3(max)

[Po(¦o) = 17 dBm or P-1dB,

dBc

 

-34

 

 

 

 

-34

 

 

-20

 

 

 

-34

 

-20

 

whichever is less.]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

NF

Noise Figure

dB

 

 

 

8

 

 

 

 

8

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes:

1.Small-signal data measured in wafer form with Tchuck = 25°C. Large-signal data measured on individual devices mounted in an HP83040 Series Modular Microcircuit Package @ TA = 25°C.

2.Performance may be extended to lower frequencies through the use of appropriate off-chip circuitry. Upper -3 dB corner frequency » 29.5 GHz.

6-29

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