Fujitsu MPG3153AT, MPG3102AT, MPG3307AT, MPG3204AT, MPG3409AT Manual

MPG3xxxAT

DISK DRIVES

PRODUCT MANUAL

C141-E110-03EN

			REVISION RECORD
Edition	Date published		Revised contents
01	July, 2000
02	Aug., 2000	As the result of evaluation
03	Oct., 2000	•	Specifications of positioning time (slow) were modified. (See Table 1.1)
		•	Description of data buffer value in Figure 4.2 were modified.
		•	The functions of X’D5’ and X’D6’ were modified. (See Table 5.8)
		•	The attribute ID and its description were modified. (See *2 in the Tables 5.9 and 5.10)
		•	Tables 5.11 and 5.13 were added.

Specification No.: C141-E110-**EN

The contents of this manual is subject to change without prior notice.

All Rights Reserved.

Copyright 2000 FUJITSU LIMITED

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PREFACE

This manual describes the MPG3xxxAT series, a 3.5-inch hard disk drive with a BUILT-IN controller that is compatible with the ATA interface.

This manual explains, in detail, how to incorporate the hard disk drives into user systems.

This manual assumes that users have a basic knowledge of hard disk drives and their application in computer systems.

This manual consists of the following six chapters:

Chapter 1	DEVICE OVERVIEW
Chapter 2	DEVICE CONFIGURATION
Chapter 3	INSTALLATION CONDITIONS
Chapter 4	THEORY OF DEVICE OPERATION
Chapter 5	INTERFACE
Chapter 6	OPERATIONS

In this manual, disk drives may be referred to as drives or devices.

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Conventions for Alert Messages

This manual uses the following conventions to show the alert messages. An alert message consists of an alert signal and alert statements. The alert signal consists of an alert symbol and a signal word or just a signal word.

The following are the alert signals and their meanings:

This indicates a hazardous situation likely to result in serious personal injury if the user does not perform the procedure correctly.

This indicates a hazardous situation could result in personal injury if the user does not perform the procedure correctly.

This indicates a hazardous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. This alert signal also indicates that damages to the product or other property, may occur if the user does not perform the procedure correctly.

This indicates information that could help the user use the product more efficiently.

In the text, the alert signal is centered, followed below by the indented message. A wider line space precedes and follows the alert message to show where the alert message begins and ends. The following is an example:

(Example)

IMPORTANT

HA (host adapter) consists of address decoder, driver, and receiver. ATA is an abbreviation of "AT attachment". The disk drive is conformed to the ATA-5 interface

The main alert messages in the text are also listed in the “Important Alert Items.”

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LIABILITY EXCEPTION

"Disk drive defects" refers to defects that involve adjustment, repair, or replacement.

Fujitsu is not liable for any other disk drive defects, such as those caused by user misoperation or mishandling, inappropriate operating environments, defects in the power supply or cable, problems of the host system, or other causes outside the disk drive.

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MANUAL ORGANIZATION

MPG3xxxAT		• DEVICE OVERVIEW
DISK DRIVES		• DEVICE CONFIGURATION
PRODUCT		• INSTALLATION CONDITIONS
MANUAL		• THEORY OF DEVICE OPERATION
(C141-E110)		• INTERFACE
<This manual>		• OPERATIONS
MPG3xxxAT		• MAINTENANCE AND DIAGNOSIS
DISK DRIVES		• REMOVAL AND REPLACEMENT PROCEDURE
MAINTENANCE
MANUAL
(C141-F045)

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CONTENTS

			page
CHAPTER 1		DEVICE OVERVIEW ..........................................................................................	1	- 1
1.1	Features	.................................................................................................................................	1	- 1
1.1.1	Functions ...................................................................................................and performance		1	- 1
1.1.2	Adaptability...........................................................................................................................		1	- 2
1.1.3	Interface.................................................................................................................................		1	- 2
1.2	Device Specifications ............................................................................................................		1	- 4
1.2.1	Specifications .........................................................................................................summary		1	- 4
1.2.2	Model and ...................................................................................................product number		1	- 5
1.3	Power Requirements..............................................................................................................		1	- 5
1.4	Environmental ................................................................................................Specifications		1	- 8
1.5	Acoustic ......................................................................................................................Noise		1	- 8
1.6	Shock and ..............................................................................................................Vibration		1	- 9
1.7	Reliability..............................................................................................................................		1	- 9
1.8	Error Rate..............................................................................................................................		1	- 10
1.9	Media Defects .......................................................................................................................		1	- 10
CHAPTER 2 .............................................................................		DEVICE CONFIGURATION	2	- 1
2.1	Device Configuration ............................................................................................................		2	- 1
2.2	System Configuration ............................................................................................................		2	- 3
2.2.1	ATA interface........................................................................................................................		2	- 3
2.2.2	1 drive connection .................................................................................................................		2	- 3
2.2.3	2 drives connection................................................................................................................		2	- 3
CHAPTER 3 ........................................................................		INSTALLATION CONDITIONS	3	- 1
3.1	Dimensions............................................................................................................................		3	- 1
3.2	Handling .................................................................................................................Cautions		3	- 3
3.2.1	General notes.........................................................................................................................		3	- 3
3.2.2	Installation.............................................................................................................................		3	- 3
3.2.3	Recommended ....................................................................................................equipments		3	- 3
3.3	Mounting ...............................................................................................................................		3	- 4
3.4	Cable Connections.................................................................................................................		3	- 8
3.4.1	Device connector...................................................................................................................		3	- 8

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3.4.2	Cable connector specifications ..............................................................................................		3	- 9
3.4.3	Device connection .................................................................................................................		3	- 9
3.4.4	Power supply connector (CN1) .............................................................................................		3	- 10
3.4.5	System configuration for Ultra DMA....................................................................................		3	- 10
3.5	Jumper Settings .....................................................................................................................		3	- 13
3.5.1	Location of setting jumpers ...................................................................................................		3	- 13
3.5.2	Factory default setting ...........................................................................................................		3	- 14
3.5.3	Jumper configuration.............................................................................................................		3	- 14
CHAPTER 4		THEORY OF DEVICE OPERATION ...............................................................	4	- 1
4.1	Outline...................................................................................................................................		4	- 1
4.2	Subassemblies .......................................................................................................................		4	- 1
4.2.1	Disk .......................................................................................................................................		4	- 1
4.2.2	Head ......................................................................................................................................		4	- 2
4.2.3	Spindle ..................................................................................................................................		4	- 3
4.2.4	Actuator.................................................................................................................................		4	- 3
4.2.5	Air filter.................................................................................................................................		4	- 3
4.3	Circuit Configuration.............................................................................................................		4	- 4
4.4	Power-on Sequence ...............................................................................................................		4	- 5
4.5	Self-calibration ......................................................................................................................		4	- 7
4.5.1	Self-calibration contents........................................................................................................		4	- 7
4.5.2	Execution timing of self-calibration ......................................................................................		4	- 8
4.5.3	Command processing during self-calibration ........................................................................		4	- 8
4.6	Read/write Circuit .................................................................................................................		4	- 9
4.6.1	Read/write preamplifier (PreAMP) .......................................................................................		4 - 9
4.6.2	Write circuit ..........................................................................................................................		4	- 9
4.6.3	Read circuit ...........................................................................................................................		4	- 9
4.6.4	Time base generator circuit ...................................................................................................		4	- 10
4.7	Servo Control ........................................................................................................................		4	- 12
4.7.1	Servo control circuit ..............................................................................................................		4	- 12
4.7.2	Data-surface servo format .....................................................................................................		4	- 15
4.7.3	Servo frame format................................................................................................................		4	- 16
4.7.4	Actuator motor control ..........................................................................................................		4	- 17
4.7.5	Spindle motor control............................................................................................................		4	- 18

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CHAPTER 5 INTERFACE .........................................................................................................		5	- 1
5.1	Physical Interface ..................................................................................................................	5	- 2
5.1.1	Interface signals.....................................................................................................................	5	- 2
5.1.2	Signal assignment on the connector.......................................................................................	5	- 3
5.2	Logical Interface ...................................................................................................................	5	- 6
5.2.1	I/O registers...........................................................................................................................	5	- 6
5.2.2	Command block registers ......................................................................................................	5	- 8
5.2.3	Control block registers ..........................................................................................................	5	- 13
5.3	Host Commands ....................................................................................................................	5	- 13
5.3.1	Command code and parameters.............................................................................................	5	- 14
5.3.2	Command descriptions ..........................................................................................................	5	- 16
5.3.3	Error posting..........................................................................................................................	5	- 75
5.4	Command Protocol................................................................................................................	5	- 76
5.4.1	Data transferring commands from device to host ..................................................................	5	- 76
5.4.2	Data transferring commands from host to device ..................................................................	5	- 78
5.4.3	Commands without data transfer ...........................................................................................	5	- 80
5.4.4	Other commands....................................................................................................................	5	- 81
5.4.5	DMA data transfer commands...............................................................................................	5	- 81
5.5	Ultra DMA Feature Set .........................................................................................................	5	- 83
5.5.1	Overview ...............................................................................................................................	5	- 83
5.5.2	Phases of operation................................................................................................................	5	- 84
5.5.3	Ultra DMA data in commands...............................................................................................	5	- 84
5.5.3.1	Initiating an Ultra DMA data in burst....................................................................................	5	- 84
5.5.3.2 The data in transfer................................................................................................................		5	- 85
5.5.3.3 Pausing an Ultra DMA data in burst .....................................................................................		5	- 85
5.5.3.4 Terminating an Ultra DMA data in burst ..............................................................................		5	- 86
5.5.4	Ultra DMA data out commands.............................................................................................	5	- 88
5.5.4.1 Initiating an Ultra DMA data out burst..................................................................................		5	- 88
5.5.4.2 The data out transfer..............................................................................................................		5	- 89
5.5.4.3 Pausing an Ultra DMA data out burst ...................................................................................		5	- 89
5.5.4.4 Terminating an Ultra DMA data out burst ............................................................................		5	- 90
5.5.5	Ultra DMA CRC rules...........................................................................................................	5	- 92
5.5.6	Series termination required for Ultra DMA...........................................................................	5	- 93
5.6	Timing ...................................................................................................................................	5	- 94
5.6.1	PIO data transfer ...................................................................................................................	5	- 94
5.6.2	Multiword data transfer .........................................................................................................	5	- 95

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5.6.3	Ultra DMA data transfer........................................................................................................		5	- 96
5.6.3.1	Initiating an Ultra DMA data in burst....................................................................................		5	- 96
5.6.3.2	Ultra DMA data burst timing requirements...........................................................................		5	- 97
5.6.3.3	Sustained Ultra DMA data in burst .......................................................................................		5	- 100
5.6.3.4	Host pausing an Ultra DMA data in burst .............................................................................		5	- 101
5.6.3.5	Device terminating an Ultra DMA data in burst....................................................................		5 - 102
5.6.3.6	Host terminating an Ultra DMA data in burst .......................................................................		5	- 103
5.6.3.7	Initiating an Ultra DMA data out burst..................................................................................		5	- 104
5.6.3.8	Sustained Ultra DMA data out burst .....................................................................................		5	- 105
5.6.3.9	Device pausing an Ultra DMA data out burst........................................................................		5	- 106
5.6.3.10	Host terminating an Ultra DMA data out burst .....................................................................		5 - 107
5.6.3.11	Device terminating an Ultra DMA data in burst....................................................................		5 - 108
5.6.4	Power-on and reset ................................................................................................................		5	- 109
CHAPTER 6		OPERATIONS ......................................................................................................	6	- 1
6.1	Device Response to the Reset................................................................................................		6	- 1
6.1.1	Response to power-on ...........................................................................................................		6	- 2
6.1.2	Response to hardware reset ...................................................................................................		6	- 3
6.1.3	Response to software reset ....................................................................................................		6	- 4
6.1.4	Response to diagnostic command..........................................................................................		6	- 5
6.2	Address Translation...............................................................................................................		6	- 6
6.2.1	Default parameters ................................................................................................................		6	- 6
6.2.2	Logical address......................................................................................................................		6	- 7
6.3	Power Save............................................................................................................................		6	- 8
6.3.1	Power save mode...................................................................................................................		6	- 8
6.3.2	Power commands ..................................................................................................................		6	- 10
6.4	Defect Management...............................................................................................................		6	- 10
6.4.1	Spare area..............................................................................................................................		6	- 11
6.4.2	Alternating defective sectors .................................................................................................		6	- 11
6.5	Read-Ahead Cache ................................................................................................................		6	- 13
6.5.1	Data buffer configuration ......................................................................................................		6	- 13
6.5.2	Caching operation .................................................................................................................		6	- 14
6.5.3	Usage of read segment...........................................................................................................		6	- 15
6.6	Write Cache...........................................................................................................................		6	- 20

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FIGURES

		page
1.1	Current fluctuation (Typ.) when power is turned on .............................................................	1 - 7
2.1	Disk drive outerview .............................................................................................................	2	- 1
2.2	1 drive system configuration .................................................................................................	2	- 3
2.3	2 drives configuration............................................................................................................	2	- 3
3.1	Dimensions............................................................................................................................	3	- 2
3.2	Handling cautions..................................................................................................................	3	- 3
3.3	Direction................................................................................................................................	3	- 4
3.4	Limitation of side-mounting ..................................................................................................	3	- 5
3.5	Mounting frame structure ......................................................................................................	3	- 5
3.6	Surface temperature measurement points ..............................................................................	3 - 6
3.7	Service area ...........................................................................................................................	3	- 7
3.8	Connector locations...............................................................................................................	3	- 8
3.9	Cable connections .................................................................................................................	3	- 9
3.10	Power supply connector pins (CN1)......................................................................................	3	- 10
3.11	Cable configuration ...............................................................................................................	3	- 11
3.12	Cable type detection using CBLIDsignal
	(Host sensing the condition of the CBLIDsignal) ...............................................................	3	- 12

3.13Cable type detection using IDENTIFY DEVICE data

	(Device sensing the condition of the CBLIDsignal)............................................................	3	- 12
3.14	Jumper location .....................................................................................................................	3	- 13
3.15	Factory default setting ...........................................................................................................	3	- 14
3.16	Jumper setting of master or slave device...............................................................................	3	- 14
3.17	Jumper setting of Cable Select ..............................................................................................	3	- 15
3.18	Example (1) of Cable Select..................................................................................................	3	- 15
3.19	Example (2) of Cable Select..................................................................................................	3	- 15
4.1	Head structure .......................................................................................................................	4	- 2
4.2	MPG3xxxAT Block diagram ................................................................................................	4 - 5
4.3	Power-on operation sequence................................................................................................	4	- 6
4.4	Block diagram of servo control circuit ..................................................................................	4	- 12
4.5	Physical sector servo configuration on disk surface ..............................................................	4 - 14
4.6	126 Servo frames in each track .............................................................................................	4	- 16
5.1	Execution example of READ MULTIPLE command ...........................................................	5 - 19
5.2	Read Sector(s) command protocol ........................................................................................	5	- 78

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5.3	Protocol for command abort..................................................................................................	5	- 79
5.4	WRITE SECTOR(S) command protocol ..............................................................................	5	- 80
5.5	Protocol for the command execution without data transfer ...................................................	5	- 81
5.6	Normal DMA data transfer....................................................................................................	5 - 83
5.7	Ultra DMA termination with pull-up or pull-down ...............................................................	5	- 94
5.8	PIO data transfer timing ........................................................................................................	5	- 95
5.9	Multiword DMA data transfer timing (mode 2) ....................................................................	5	- 96
5.10	Initiating an Ultra DMA data in burst....................................................................................	5	- 97
5.11	Sustained Ultra DMA data in burst .......................................................................................	5	- 101
5.12	Host pausing an Ultra DMA data in burst .............................................................................	5	- 102
5.13	Device terminating an Ultra DMA data in burst....................................................................	5	- 103
5.14	Host terminating an Ultra DMA data in burst .......................................................................	5	- 104
5.15	Initiating an Ultra DMA data out burst..................................................................................	5	- 105
5.16	Sustained Ultra DMA data out burst .....................................................................................	5	- 106
5.17	Device pausing an Ultra DMA data out burst........................................................................	5	- 107
5.18	Host terminating an Ultra DMA data out burst .....................................................................	5 - 108
5.19	Device terminating an Ultra DMA data out burst..................................................................	5	- 109
5.20	Power-on Reset Timing.........................................................................................................	5	- 110
6.1	Response to power-on ...........................................................................................................	6	- 2
6.2	Response to hardware reset ...................................................................................................	6	- 3
6.3	Response to software reset ....................................................................................................	6	- 4
6.4	Response to diagnostic command..........................................................................................	6	- 5
6.5	Address translation (example in CHS mode) ........................................................................	6 - 7
6.6	Address translation (example in LBA mode) ........................................................................	6	- 8
6.7	Sector slip processing............................................................................................................	6	- 11
6.8	Alternate cylinder assignment ...............................................................................................	6	- 12
6.9	Data buffer configuration ......................................................................................................	6	- 13

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TABLES

		page
1.1	Specifications ........................................................................................................................	1	- 4
1.2	Model names and product numbers.......................................................................................	1	- 5
1.3	Current and power dissipation...............................................................................................	1	- 6
1.4	Environmental specifications ................................................................................................	1	- 8
1.5	Acoustic noise specification ..................................................................................................	1	- 8
1.6	Shock and vibration specification..........................................................................................	1	- 9
3.1	Surface temperature measurement points and standard values..............................................	3	- 6
3.2	Cable connector specifications ..............................................................................................	3	- 9
4.1	Transfer rate of each zone .....................................................................................................	4	- 11
5.1	Interface signals.....................................................................................................................	5	- 2
5.2	Signal assignment on the interface connector........................................................................	5 - 3
5.3	I/O registers...........................................................................................................................	5	- 7
5.4	Command code and parameters.............................................................................................	5 - 14
5.5	Information to be read by IDENTIFY DEVICE command...................................................	5 - 29
5.6	Features register values and settable modes ..........................................................................	5 - 37
5.7	Diagnostic code.....................................................................................................................	5	- 41
5.8	Features Register values (subcommands) and functions........................................................	5	- 51
5.9	Device attribute data structure...............................................................................................	5	- 54
5.10	Warranty failure threshold data structure ..............................................................................	5	- 55
5.11	Log directory data structure...................................................................................................	5	- 59
5.12	Error logging data structure...................................................................................................	5	- 60
5.13	Self Test log data structure....................................................................................................	5	- 61
5.14	Contents of security password ...............................................................................................	5	- 63
5.15	Contents of SECURITY SET PASSWORD data..................................................................	5	- 68

5.16Relationship between combination of Identifier and Security level,

	and operation of the lock function.........................................................................................	5	- 68
5.17	Command code and parameters.............................................................................................	5	- 76
5.18	Recommended series termination for Ultra DMA.................................................................	5	- 94
5.19	Ultra DMA data burst timing requirements...........................................................................	5	- 98
5.20	Ultra DMA sender and recipient timing requirements...........................................................	5	- 100
6.1	Default parameters ................................................................................................................	6	- 6

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CHAPTER 1 DEVICE OVERVIEW

1.1Features

1.2Device Specifications

1.3Power Requirements

1.4Environmental Specifications

1.5Acoustic Noise

1.6Shock and Vibration

1.7Reliability

1.8Error Rate

1.9Media Defects

Overview and features are described in this chapter, and specifications and power requirement are described.

The MPG3xxxAT series are a 3.5-inch hard disk drive with a built-in ATA controller. The disk drive is compact and reliable.

1.1Features

1.1.1Functions and performance

(1)Compact

The disk drive has 1 or 2 disks of 95 mm (3.5 inches) diameter, and its height is 26.1 mm (1 inch).

(2)Large capacity

The disk drive can record up to 20.49 GB (formatted) on one disk using the 48/51 CC2EPRML recording method and 15 recording zone technology. The MPG3xxxAT series have a formatted capacity of 10.24 GB to 40.99 GB respectively.

(3)High-speed Transfer rate

The disk drive has an internal data rate up to 49.8 MB/s. The disk drive supports an external data rate up to 16.6 MB/s (PIO mode 4, DMA mode 2), 66.6 MB/s (ultra DMA mode 4) or 100 MB/s (ultra DMA mode 5).

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(4)Average positioning time

Use of a rotary voice coil motor in the head positioning mechanism greatly increases the positioning speed. The average positioning time is 9.5 ms (at read).

1.1.2Adaptability

(1)Power save mode

The power save mode feature for idle operation, stand by and sleep modes makes the disk drive ideal for applications where power consumption is a factor.

(2)Wide temperature range

The disk drive can be used over a wide temperature range (5°C to 55°C).

(3)Low noise and vibration

In Ready status, the noise of the disk drive is only about 3.4 bels (MPG3409AT, Typical Sound Power per ISO7779 and ISO9296).

1.1.3Interface

(1)Connection to interface

With the built-in ATA interface controller, the disk drive can be connected to an ATA interface of a personal computer.

(2)Data buffer

The disk drive uses a 512-KB or 2-MB data buffer to transfer data between the host and the disk media.

In combination with the read-ahead cache system described in item (3) and the write cache described in item (6), the buffer contributes to efficient I/O processing.

(3)Read-ahead cache system

After the execution of a disk read command, the disk drive automatically reads the subsequent data block and writes it to the data buffer (read ahead operation). This cache system enables fast data access. The next disk read command would normally cause another disk access. But, if the read ahead data corresponds to the data requested by the next read command, the data in the buffer can be transferred instead.

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(4)Master/slave

The disk drive can be connected to ATA interface as daisy chain configuration. Drive 0 is a master device, drive 1 is a slave device.

(5)Error correction and retry by ECC

If a recoverable error occurs, the disk drive itself attempts error recovery. The 42 bytes ECC has improved buffer error correction for correctable data errors.

(6)Write cache

When the disk drive receives a write command, the disk drive posts the command completion at completion of transferring data to the data buffer completion of writing to the disk media. This feature reduces the access time at writing.

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1.2Device Specifications

1.2.1Specifications summary

Table 1.1 shows the specifications of the disk drive.

			Table 1.1	Specifications
		MPG3153AT	MPG3307AT	MPG3102AT			MPG3204AT		MPG3409AT
Formatted Capacity (*1)		15.37 GB	30.74 GB	10.24 GB			20.49 GB		40.99 GB
Number of Disks		1	2		1		1		2
Number of Heads		2	4		1		2		4
Number of Cylinders		28,928 + 698				30,784 + 769
(User + Alternate & SA)
Bytes per Sector					512
Recording Method				48/51 CC2EPRML
Track Density		31,000 TPI					33,000 TPI
Bit Density		388,716 BPI					478,415 BPI
Rotational Speed				5400 rpm
Average Latency					5.56 ms
Positioning time (Fast)
•	Minimum		(Read) 1.0 ms typical, (write) 1.2 ms typical
•	Average		(Read) 9.5 ms typical, (write) 10.5 ms typical
•	Maximum		(Read) 17 ms typical, (write) 18 ms typical
Positioning time (Slow)
•	Minimum		(Read) 1.0 ms typical, (write) 1.2 ms typical
•	Average		(Read) 15.5 ms typical, (write) 16.5 ms typical
•	Maximum		(Read) 26 ms typical, (write) 27 ms typical
Start/Stop time
• Start (0 rpm to Drive			Typical: 8 sec. Maximum:			15 sec.
	Read)
•	Stop (at Power		Typical: 20 sec.		Maximum: 30 sec.
	Down)
Interface					ATA-5
			(Maximum Cable length: 0.46 m [18 inch])
Data Transfer Rate
• To/From Media		22.7 to 38.6 MB/s		27.5 to 49.8 MB/s
• To/From Host		16.6 MB/s Max. (burst PIO mode4, burst		16.6 MB/s Max. (burst PIO mode4, burst DMA mode2)
		DMA mode2)
		66.6 MB/s Max. (burst ultra DMA		66.6 MB/s Max. (burst ultra DMA mode4),
		mode4),
		100.0 MB/s Max. (burst ultra DMA		100.0 MB/s Max. (burst ultra DMA mode5)
		mode5)
Data buffer			512 KB (option: 2,048 KB)
Physical Dimensions			26.1 mm max. ×		101.6 mm × 146.0 mm
(Height × Width × Depth)			(1.03” max. × 4.0” × 5.75”)
Weight				600 g or less

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*1: Capacity under the LBA mode.

Under the CHS mode (normal BIOS specification), formatted capacity, number of cylinders, number of heads, and number of sectors are as follows.

				CHS Parameter
	Model	Formatted Capacity
			No. of Cylinder	No. of Heads	No. of Sectors
	MPG3102AT	10,248 MB	16,383	16	63
	MPG3153AT	15,371 MB	16,383	16	63
	MPG3204AT	20,496 MB	16,383	16	63
	MPG3307AT	30,743 MB	16,383	16	63
	MPG3409AT	40,992 MB	16,383	16	63

1.2.2Model and product number

Table 1.2 lists the model names and product numbers.

Table 1.2 Model names and product numbers

Model Name	Capacity	Mounting	Order No.	Remarks
	(User area)	Screw
MPG3102AT	10.24 GB	No. 6-32UNC	CA05761-B511	512 KB Data Buffer
MPG3153AT	15.37 GB	No. 6-32UNC	CA05761-B323	512 KB Data Buffer
MPG3204AT	20.49 GB	No. 6-32UNC	CA05761-B521	512 KB Data Buffer
MPG3307AT	30.74 GB	No. 6-32UNC	CA05761-B343	2,048 KB Data Buffer
MPG3409AT	40.99 GB	No. 6-32UNC	CA05761-B542	2,048 KB Data Buffer

1.3Power Requirements

(1)Input Voltage

• + 5 V ±5 %

• + 12 V ±8 %

(2)Ripple

	+12 V	+5 V
Maximum	200 mV (peak to peak)	100 mV (peak to peak)
Frequency	DC to 1 MHz	DC to 1 MHz

(3)Current Requirements and Power Dissipation

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Table 1.3 lists the current and power dissipation.

Table 1.3 Current and power dissipation

	Mode of Operation		Typical RMS current (*1) [mA]				Typical Power (*2) [watts]
			+12 V		+5 V
	Model		MPG3102AT	MPG3307AT			MPG3102AT	MPG3307AT
			MPG3153AT		All Models		MPG3153AT
				MPG3409AT				MPG3409AT
			MPG3204AT				MPG3204AT
	Spin up		1600	1600	570		22.1	22.1
			1800 peak	1800 peak	600 peak
	Idle (Ready) (*3)		230	270	460		5.1	5.5
	R/W (On Track) (*4)		300	330	460		5.9	6.3
	Seek (Random) (*5)		430	450	460		7.5	7.7
	Seek/W/R
	Standby		18	18	120		0.8	0.8
	Sleep		18	18	120		0.8	0.8
	Model			MPG3153AT	MPG3102AT		MPG3307AT	MPG3409AT
					MPG3204AT
	Energy efficiency (rank)(*6)[watt/GB]			0.332 (A)	0.249 (A)		0.179 (B)	0.134 (B)

*1 Current is typical rms except for spin up.

*2 Power requirements reflect nominal values for +12V and +5V power.

*3 Idle mode is in effect when the drive is not reading, writing, seeking, or executing any commands. A portion of the R/W circuitry is powered down, the spindle motor is up to speed and the Drive ready condition exists.

*4 R/W mode is defined as 50% read operations and 50% write operations on a single physical track.

*5 Seek/W/R mode is defined as 33% seek operations, 33% write operations and 33% read operations.

*6 Energy efficiency based on the Law concerning the Rational Use of Energy indicates the value obtained by dividing power consumption by the storage capacity. (Japan only)

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(4)Current fluctuation (Typ.) when power is turned on

[A]

0.5

+5VDC

(0.5A/div)

0.0

[A]

1.5

1.0

0.5

+12VDC

(0.5A/div)

0.0

0

1

2

3

4

5

6

[seconds]

Note:

Maximum current is 1.8 A.

Figure 1.1 Current fluctuation (Typ.) when power is turned on

(5)Power on/off sequence

The voltage detector circuit monitors +5 V and +12 V. The circuit does not allow a write signal if either voltage is abnormal. This prevents data from being destroyed and eliminates the need to be concerned with the power on/off sequence.

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1.4Environmental Specifications

Table 1.4 lists the environmental specifications.

	Table 1.4	Environmental specifications
Temperature
•	Operating		5°C to 55°C (ambient)
			5°C to 60°C (disk enclosure surface)
•	Non-operating		–40°C to 60°C
•	Thermal Gradient		20°C/hour or less
Humidity
•	Operating		8% to 80%RH (Non-condensing)
•	Non-operating		5% to 85%RH (Non-condensing)
•	Maximum Wet Bulb		29°C
Altitude (relative to sea level)
•	Operating		–60 to 3,000 m (–200 to 10,000 ft)
•	Non-operating		–60 to 12,000 m (–200 to 40,000 ft)

1.5Acoustic Noise

Table 1.5 lists the acoustic noise specification.

Table 1.5 Acoustic noise specification

			MPG3102AT
	Sound Power	Model	MPG3153AT	MPG3307AT	MPG3409AT
			MPG3204AT
	per ISO 7779 and
	ISO9296	Idle mode (DRIVE READY)	3.3 bels	3.4 bels	3.1 bels
	(Typical at 1m)
		Seek mode (Random)	3.6 bels	3.9 bels	3.6 bels
	Sound Pressure	Idle mode (DRIVE READY)	28 dBA	29 dBA	25 dBA
	(Typical at 1m)
		Seek mode (Random)	31 dBA	34 dBA	31 dBA

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1.6Shock and Vibration

Table 1.6 lists the shock and vibration specification.

	Table 1.6 Shock and vibration specification
Vibration (swept sine, one octave per minute)		4.9m/s2 (0.5 G0-p); 5 to 300 Hz
•	Operating
		(without non-recovered errors)
•	Non-operating	39.2m/s2 (4.0 G0-p); 5 to 400 Hz (no damage)
Shock (half-sine pulse, Operating)		392m/s2 (40G) (without non-recovered error)
•	2 ms duration
Shock (half-sine pulse, Non-operating)		2940m/s2 (300G) (Typical, no damage)
•	2 ms duration

1.7Reliability

(1)Mean time between failures (MTBF)

The mean time between failures (MTBF) is 500,000 POH (power on hours) or more (operation: 24 hours/day, 7 days/week).

This does not include failures occurring during the first three months after installation. MTBF is defined as follows:

	MTBF=	Total operation time in all fields	(H)
		number of device failure in all fields

"Disk drive defects" refers to defects that involve repair, readjustment, or replacement. Disk drive defects do not include failures caused by external factors, such as damage caused by handling, inappropriate operating environments, defects in the power supply host system, or interface cable.

(2)Mean time to repair (MTTR)

The mean time to repair (MTTR) is 30 minutes or less, if repaired by a specialist maintenance staff member.

(3)CSS cycle

The number of CSS must be less than 50,000.

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(4)Service life

In situations where management and handling are correct, the disk drive requires no overhaul for five years when the DE surface temperature is less than 48°C. When the DE surface temperature exceeds 48°C, the disk drives requires no overhaul for five years or 20,000 hours of operation, whichever occurs first. Refer to item (3) in Subsection 3.3 for the measurement point of the DE surface temperature.

(5)Data assurance in the event of power failure

Except for the data block being written to, the data on the disk media is assured in the event of any power supply abnormalities. This does not include power supply abnormalities during disk media initialization (formatting) or processing of defects (alternative block assignment).

1.8Error Rate

Known defects, for which alternative blocks can be assigned, are not included in the error rate count below. It is assumed that the data blocks to be accessed are evenly distributed on the disk media.

(1)Unrecoverable read error

Read errors that cannot be recovered by read retries without user's retry and ECC corrections shall occur no more than 10 times when reading data of 1015 bits. Read retries are executed according to the disk drive's error recovery procedure, and include read retries accompanying head offset operations.

(2)Positioning error

Positioning (seek) errors that can be recovered by one retry shall occur no more than 10 times in 107 seek operations.

1.9Media Defects

Defective sectors are replaced with alternates when the disk is formatted prior to shipment from the factory (low level format). Thus, the host sees a defect-free device.

Alternate sectors are automatically accessed by the disk drive. The user need not be concerned with access to alternate sectors.

Chapter 6 describes the low level format at shipping.

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CHAPTER 2 DEVICE CONFIGURATION

2.1Device Configuration

2.2System Configuration

2.1Device Configuration

Figure 2.1 shows the disk drive. The disk drive consists of a disk enclosure (DE), read/write preamplifier, and controller PCA. The disk enclosure contains the disk media, heads, spindle motors actuators, and a circulating air filter.

Figure 2.1 Disk drive outerview

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(1)Disk

The outer diameter of the disk is 95 mm. The inner diameter is 25 mm. The number of disks used varies with the model, as described below. The disks are rated at over 50,000 start/stop operations.

MPG3102AT, MPG3153AT, MPG3204AT: 1 disk MPG3307AT, MPG3409AT: 2 disks

(2)Head

The heads are of the contact start/stop (CSS) type. The head touches the disk surface while the disk is not rotating and automatically lifts when the disk starts.

(3)Spindle motor

The disks are rotated by a direct drive Hall-less DC motor.

(4)Actuator

The actuator uses a revolving voice coil motor (VCM) structure which consumes low power and generates very little heat. The head assembly at the tip of the actuator arm is controlled and positioned by feedback of the servo information read by the read/write head. If the power is not on or if the spindle motor is stopped, the head assembly stays in the specific CSS zone on the disk and is fixed by a mechanical lock.

(5)Air circulation system

The disk enclosure (DE) is sealed to prevent dust and dirt from entering. The disk enclosure features a closed loop air circulation system that relies on the blower effect of the rotating disk. This system continuously circulates the air through the recirculation filter to maintain the cleanliness of the air in the disk enclosure.

(6)Read/write circuit

The read/write circuit uses a LSI chip for the read/write preamplifier. It improves data reliability by preventing errors caused by external noise.

(7)Controller circuit

The controller circuit consists of an LSI chip to improve reliability. The high-speed microprocessor unit (MPU) achieves a high-performance AT controller.

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2.2System Configuration

2.2.1ATA interface

Figures 2.2 and 2.3 show the ATA interface system configuration. The drive has a 40-pin PC AT interface connector and supports the PIO transfer till 16.6 MB/s (PIO mode 4), the DMA transfer till 16.6 MB/s (Multiword DMA mode 2), the ultra DMA transfer till 66.6 MB/s (Ultra DMA mode 4), and the ultra DMA transfer till 100 MB/s (Ultra DMA mode 5).

2.2.21 drive connection

	Host	HA	Disk drive
		(Host adaptor)
		AT bus	ATA interface
		(Host interface)

Figure 2.2 1 drive system configuration

2.2.32 drives connection

	Host	HA	Disk drive #0
		(Host adaptor)

AT bus (Host interface)

Disk drive #1

ATA interface

Note:

When the drive that is not conformed to ATA is connected to the disk drive is above configuration, the operation is not guaranteed.

Figure 2.3 2 drives configuration

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IMPORTANT

HA (host adaptor) consists of address decoder, driver, and receiver. ATA is an abbreviation of "AT attachment". The disk drive is conformed to the ATA-5 interface.

At high speed data transfer (PIO mode 3, mode 4, DMA mode 2, ultra DMA mode 4, or ultra DMA mode 5), occurrence of ringing or crosstalk of the signal lines (AT bus) between the HA and the disk drive may be a great cause of the obstruction of system reliability. Thus, it is necessary that the capacitance of the signal lines including the HA and cable does not exceed the ATA-3 and ATA-4 standard, and the cable length between the HA and the disk drive should be as short as possible.

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CHAPTER 3 INSTALLATION CONDITIONS

3.1Dimensions

3.2Handling Cautions

3.3Mounting

3.4Cable Connections

3.5Jumper Settings

3.1Dimensions

Figure 3.1 illustrates the dimensions of the disk drive and positions of the mounting screw holes. All dimensions are in mm.

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