Fujitsu MCM3130AP, MCM3064AP User Manual

0 (0)

C156-E227-01EN

MCM3064AP, MCM3130AP

OPTICAL DISK DRIVES

PRODUCT MANUAL

FOR SAFE OPERATION

Handling of This Manual

This manual contains important information for using this product. Read thoroughly before using the product. Use this product only after thoroughly reading and understanding especially the section "Important Alert Items" in this manual. Keep this manual handy, and keep it carefully.

FUJITSU makes every effort to prevent users and bystanders from being injured or from suffering damage to their property. Use the product according to this manual.

This product is designed and manufactured for use in standard applications such as office work, personal devices and household appliances. This product is not intended for special uses (atomic controls, aeronautic or space systems, mass transport vehicle operating controls, medical devices for life support, or weapons firing controls) where particularly high reliability requirements exist, where the pertinent levels of safety are not guaranteed, or where a failure or operational error could threaten a life or cause a physical injury (hereafter referred to as "mission-critical" use). Customers considering the use of these products for mission-critical applications must have safety-assurance measures in place beforehand. Moreover, they are requested to consult our sales representative before embarking on such specialized use.

First Edition March, 2002

The contents of this manual may be revised without prior notice.

The contents of this manual shall not be disclosed in any way or reproduced in any media without the express written permission of Fujitsu Limited.

All Rights Reserved, Copyright FUJITSU LIMITED 2002

Revision History

(1/1)

Edition

Date

Revised section (*1)

Details

(Added/Deleted/Altered)

 

 

 

 

 

 

 

01

March, 2002

 

 

 

 

 

 

 

 

*1 Section(s) with asterisk (*) refer to the previous edition when those were deleted.

C156-E227-01EN

This page is intentionally left blank.

Preface

This manual describes the MCM3064AP and MCM3130AP 3.5-inch optical disk drives.

This manual provides an overview of the above optical disk drives, and explains their specifications, the requirements and procedures for installing them in a system, and how to clean them.

The manual is intended for users who have a basic understanding of optical disk drives and their use in computer systems.

See "Manual Organization" for details of the organization of manuals related to optical disk drives and the scope of this manual. Use the other manuals shown in "Manual Organization" together with this manual when necessary.

The organization of this manual, related reference manual and conventions for alert messages follow.

Overview of Manual

This manual consists of the following six chapters, glossary, and abbreviation:

Chapter 1 General Description

This chapter introduces the MCM3064AP and MCM3130AP optical disk drives and describes their features, drive configuration, and system configuration.

Chapter 2 Specifications

This chapter describes the specifications of the MCM3064AP and MCM3130AP optical disk drives and the specifications of optical disk cartridges.

Chapter 3 Installation Requirements

This chapter describes the basic environmental, mounting, power supply, and connection requirements for installing the MCM3064AP and MCM3130AP optical disk drives in a user system.

Chapter 4 Host Interface

This chapter describes the host interface of the MCM3064AP and MCM3130AP optical disk drives.

Chapter 5 Operation and Cleaning

This chapter describes how to operate and clean MCM3064AP and MCM3130AP optical disk drives. This chapter also describes how to operate and clean optical disk cartridges.

Chapter 6 Diagnostics and Maintenance

This chapter describes the self-diagnostics functions and maintenance of the MCM3064AP and MCM3130AP optical disk drives.

C156-E227-01EN

i

Preface

Glossary

The glossary describes the technical terms that need to be understood to read this manual.

Acronyms and Abbreviations

This manual contains a list of the abbreviations used in this manual and their meanings.

CONVENTIONS USED IN THIS MANUAL

Throughout this manual, the MCM3064AP and MCM3130AP optical disk drives are described as an "ODD," "drive," "unit," "target (TARG)," or "device."

Decimal values are indicated without any modifiers added.

Hexadecimal values are indicated as X'17B9', 17B9h, 17B9H, and 17B9H.

Binary values are indicated as "010" and 010b.

If "BUSY LED" is described in this manual, this refers to the LED that is located on the front side (cartridge-loading side) and that indicates the BUSY state of the device. It is described as "LED on the front panel."

ii

C156-E227-01EN

Preface

Conventions for Alert Messages

This manual uses the following conventions to show the alert messages. An alert message consists of an alert signal and alert statements. The alert signal consists of an alert symbol and a signal word or just a signal word.

The following are the alert signals and their meanings:

This indicates a hazardous situation likely to result in serious personal injury if the user does not perform the procedure correctly.

This indicates a hazardous situation could result in serious personal injury if the user does not perform the procedure correctly.

This indicates a hazardous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. This alert signal also indicates that damages to the product or other property, may occur if the user does not perform the product correctly.

This indicates information that could help the user use the product more efficiently.

In the text, the alert signal is centered, followed below by the indented message. A wider line space precedes and follows the alert message to show where the alert message begins and ends. The following is an example:

(Example)

While the write cache feature is enabled, a write error is reported in the completion status of another command that is subsequent to the concerned write command. Note that, if the host performs only retry of an errorreporting command, data in the block in which the error has occurred is not correctly written.

The main alert messages in the text are also listed in the “Important Alert Items.”

Attention

Please forward any comments you may have regarding this manual.

To make this manual easier for users to understand, opinions from readers are needed. Please write your opinions or requests on the Comment at the back of this manual and forward it to the address described in the sheet.

C156-E227-01EN

iii

This page is intentionally left blank

Important Alert Items

Important Alert Messages

The important alert messages in this manual are as follows:

A hazardous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. Also, damage to the product or other property, may occur if the user does not perform the procedure correctly.

Task

 

 

Alert message

Page

 

 

 

Assembly and Installation

Device damage:

3-16

 

1)

Do not expose to the drive any shock or vibration exceeding the

 

 

 

specification because it will fatally damage the drive. Be

 

 

 

particularly careful of this point when unpacking the drive.

 

 

2)

Do not leave the drive in a dirty or contaminated environment.

 

 

3)

Since the drive contains CMOS components that may be

 

 

 

destroyed by static discharge, keep the following points in mind

 

 

 

after unpacking:

 

 

 

Use an antistatic mat and wear a wrist strap when handling

 

 

 

 

the drive.

 

 

 

Hold the mounting frame when handling the drive. Do not

 

 

 

 

touch the printed wiring board unit except when required to

 

 

 

 

make the settings.

 

 

4)

When handling the drive, hold both sides of the mounting

 

 

 

frame. When touching any part of the drive other than both

 

 

 

sides of the mounting frame, avoid applying force on the

 

 

 

location.

 

 

5)

When handling the drive or making settings, do not press hard

 

 

 

on the tip of the header pin of the printed circuit board unit.

 

 

 

 

 

 

C156-E227-01EN

v

Important Alert Items

Task

Alert message

Page

 

 

 

Assembly and Installation

Device damage: Before moving the drive, remove any optical

3-17

 

disk cartridge in it. If the drive is moved with the optical disk

 

 

cartridge loaded in it, the head may move back and forth in the

 

 

drive to damage the head or disk, consequently disabling data from

 

 

being read later.

 

 

Device damage: Do not connect or disconnect any cable except

3-22

 

the USB I/F cable while the drive power is on.

 

 

Device damage: Before demounting the optical disk drive, turn

3-23

 

off the system power. While the power is on, do not remove screws

 

 

securing the cables and drive.

 

 

 

 

Cleaning cartridge

Device Damage: Be sure to use the dedicated head cleaner

5-5

 

shown above.

 

 

Disk damage: To clean a disk, use the cleaning solution and

5-9

 

cleaning cloth specified in Table 5.2.

 

 

Disk damage: Do not use this cleaning kit on a floppy disk or an

5-10

 

optical disk cartridge to be used on other optical disk drives.

 

 

Disk damage: Clean a cartridge in a dust-free environment.

 

 

Fujitsu recommends wearing disposable gloves during cleaning so

5-10

 

 

 

that no fingerprints are left on a disk.

 

 

Disk damage: Do not press hard or apply excessive shock to an

 

 

optical disk cartridge case while setting it in the setting case.

5-11

 

Eye inflammation: If the cleaning solution gets into your eyes,

 

 

immediately wash the solution away with water.

 

 

 

5-11

 

 

 

Maintenance and Repair

Data loss: For a repair request, you normally do not need to

6-3

 

include any optical disk cartridge with an optical disk drive.

 

 

However, you do need to include a cartridge if errors keep

 

 

occurring with a specific cartridge. In such a case, be sure to save

 

 

data stored in the cartridge before sending it in. Fujitsu shall bear

 

 

no responsibility for any data lost during service or repair.

 

 

 

 

vi

C156-E227-01EN

 

MANUAL ORGANIZATION

 

 

 

 

 

 

 

 

 

 

 

 

 

 

OPTICAL DISK DRIVES

 

1.

GENERAL DESCRIPTION

 

PRODUCT MANUAL

 

2.

SPECIFICATIONS

 

(C156-E227)

 

3.

INSTALLATION REQUIREMENTS

 

<This manual>

 

4.

HOST INTERFACE

 

 

 

5.

OPERATION AND CLEANING

 

 

 

6.

DIAGNOSTICS AND MAINTENANCE

 

 

 

 

 

C156-E227-01EN

vii

REFERENCED STANDARDS

The product specifications and functions described in this manual conform to the following standards:

Specification

Name

Concerned organization

(document) number

 

 

 

 

 

X3T13/1321D

AT Attachment with Packet Interface -5

American National

Revision 3

(ATA/ATAPI-5)

Standards Institute (ANSI)

 

 

 

SFF-8070I

ATAPI Rmovavle Rewritable Media

Small From Factor

Revision 1.2

 

Committee (SFF)

 

 

 

ISO/IEC 10090

90mm Optical Disk Cartridges, rewritable and read

ISO/IEC (*1)

 

only, for data interchange.

 

 

 

 

ISO/IEC 13963

Data Interchange on 90mm Optical Disk cartridges

ISO/IEC (*1)

 

Capacity: 230 megabytes per cartridges.

 

 

 

 

ISO/IEC 15041

Data Interchange on 90mm Optical Disk Cartridges

ISO/IEC JTC1 (*1)

 

Capacity: 640 megabytes per cartridges.

 

 

 

 

Cherry Book Version

GIGAMO 1.3GB 90mm Magneto-Optical Disk

FUJITSU LIMITED

1.0

System.

SONY CORPORATION

 

 

 

*1 ISO=

International Organization for Standardization

IEC=

International Electrical for Commission

JTC1=

Joint Technical Committee 1

viii

C156-E227-01EN

Contents

CHAPTER 1

General Description..................................................................

1-1

 

1.1

 

Features ...................................................................................................

1-1

 

1.1.1

Performance and Functions...................................................................

1-1

 

1.1.2

Reliability..............................................................................................

1-3

 

1.1.3

Maintainability/operability ...................................................................

1-3

 

1.1.4

Adaptability...........................................................................................

1-3

 

1.1.5

Interface.................................................................................................

1-4

 

1.2

Configuration of Optical Disk Drive.......................................................

1-6

 

1.2.1

Appearance............................................................................................

1-6

 

1.2.2

Configuration ........................................................................................

1-7

 

1.2.3

Mechanical section................................................................................

1-7

 

1.2.4

Control circuit section ...........................................................................

1-8

CHAPTER 2

Specifications ...........................................................................

2-1

 

2.1

Specifications of Optical Disk Drives.....................................................

2-1

 

2.1.1 Catalog and order numbers ...................................................................

2-1

 

2.1.2

Specifications of drives .........................................................................

2-2

 

2.1.3 Environmental and power requirements ...............................................

2-4

 

2.1.4

Error rate ...............................................................................................

2-5

 

2.1.5

Reliability..............................................................................................

2-6

 

2.2

Specifications of Optical Disk Cartridges...............................................

2-7

 

2.2.1 Recommended optical disk cartridges ..................................................

2-7

 

2.2.2

Appearance............................................................................................

2-8

 

2.2.3

Specifications of disk ..........................................................................

2-10

 

2.3

 

Defect Management ..............................................................................

2-11

 

2.3.1 Defect management schematic diagram .............................................

2-11

CHAPTER 3

Installation Requirements ........................................................

3-1

 

3.1

 

Environmental Requirements ..................................................................

3-1

C156-E227-01EN

ix

Contents

 

3.1.1

Temperature measurement points .........................................................

3-1

 

3.1.2

Temperature requirements.....................................................................

3-2

 

3.1.3

Temperature rise....................................................................................

3-3

 

3.1.4

Air cleanliness .......................................................................................

3-3

 

3.2

 

Mounting Requirements ..........................................................................

3-3

 

3.2.1

Outer dimensions...................................................................................

3-3

 

3.2.2

Installation direction..............................................................................

3-9

 

3.2.3

Center of gravity..................................................................................

3-10

 

3.2.4

Precautions on mounting .....................................................................

3-11

 

3.3

 

Power Supply Requirements .................................................................

3-13

 

3.4

 

Cable Connections .................................................................................

3-14

 

3.4.1

Drive connectors..................................................................................

3-14

 

3.4.2

Cable connector specifications............................................................

3-15

 

3.4.3

Drive connections................................................................................

3-16

 

3.5

 

Jumper Settings......................................................................................

3-16

 

3.5.1

Factory shipment settings....................................................................

3-16

 

3.5.2

Mode settings ......................................................................................

3-17

 

3.6

Precautions on Handling of Drive .........................................................

3-19

 

3.7

 

Mounting of Drive .................................................................................

3-23

 

3.7.1

Mounting procedure ............................................................................

3-23

 

3.8

 

Cable Connections .................................................................................

3-24

 

3.9

Post-installation Operation Check and Preparation for Use..................

3-24

 

3.9.1

Initial operation check .........................................................................

3-24

 

3.9.2

Connection check ................................................................................

3-25

 

3.10

 

Demounting of Drive.............................................................................

3-26

CHAPTER 4

Host Interface.............................................................................

4-1

 

4.1

 

Pin Assignment........................................................................................

4-2

 

4.2

 

Signal Description ...................................................................................

4-4

 

4.3

 

Interface Registers ...................................................................................

4-6

x

C156-E227-01EN

 

 

Contents

4.3.1

I/O registers ...........................................................................................

4-6

4.4

Various Processes..................................................................................

4-13

4.4.1

Reset response .....................................................................................

4-13

4.4.2

Defect sector management ..................................................................

4-14

4.4.3

Automatic alternate sector assignment function .................................

4-14

4.4.4

Data error detection criteria ................................................................

4-15

4.4.5

Cache function ....................................................................................

4-16

4.4.6

Media status notification function ......................................................

4-18

4.4.7

Power management function...............................................................

4-18

4.4.8

LED Indications ..................................................................................

4-22

4.5

ATA Commands....................................................................................

4-23

4.5.1

IDENTIFY PACKET DEVICE (A1h)................................................

4-24

4.5.2

PACKET (A0h)...................................................................................

4-30

4.5.3

DEVICE RESET (08h) .......................................................................

4-31

4.5.4

CHECK POWER MODE (E5h)..........................................................

4-32

4.5.5

EXECUTE DEVICE DIAGNOSTIC (90h) ........................................

4-33

4.5.6

GET MEDIA STATUS (DAh)............................................................

4-34

4.5.7

IDLE IMMEDIATE (95h/E1h)...........................................................

4-35

4.5.8

NOP (00h) ...........................................................................................

4-36

4.5.9

SERVICE (A2h)..................................................................................

4-36

4.5.10

SET FEATURES (EFh) ......................................................................

4-37

4.5.11

SLEEP (99h/E6h) ................................................................................

4-41

4.5.12

STANDBY IMMEDIATE (94h-E0h).................................................

4-42

4.6

Packet Commands .................................................................................

4-43

4.6.1

Logical Unit Number ..........................................................................

4-44

4.6.2

ERASE command ...............................................................................

4-44

4.6.3

FORMAT UNIT command .................................................................

4-45

4.6.4

INQUIRY command ...........................................................................

4-46

4.6.5

MODE SELECT command.................................................................

4-48

4.6.6

MODE SENSE (10) command ...........................................................

4-60

4.6.7

MODE SENSE (6) command .............................................................

4-63

4.6.8

PREVENT/ALLOW MEDIUM REMOVAL command ....................

4-64

4.6.9

READ (10) command..........................................................................

4-65

4.6.10

READ (12) command..........................................................................

4-65

4.6.11

READ CAPACITY command ............................................................

4-66

4.6.12

READ FORMAT CAPACITIES command........................................

4-67

4.6.13

READ DEFECT DATA command .....................................................

4-68

4.6.14

READ LONG command .....................................................................

4-70

4.6.15

RECEIVE DIAGNOSTIC RESULTS command................................

4-70

C156-E227-01EN

xi

Contents

4.6.16

REQUEST SENSE command .............................................................

4-71

4.6.17 SEND DIAGNOSTIC command.........................................................

4-76

4.6.18

SEEK command ..................................................................................

4-76

4.6.19

START/STOP UNIT command ..........................................................

4-77

4.6.20

SYNCHRONIZE CACHE command..................................................

4-78

4.6.21

TEST UNIT READY command..........................................................

4-78

4.6.22

VERIFY command ..............................................................................

4-79

4.6.23

WRITE (10) command ........................................................................

4-79

4.6.24

Write (12) command ...........................................................................

4-80

4.6.25

WRITE AND VERIFY command.......................................................

4-81

4.6.26

WRITE BUFFER command................................................................

4-82

4.6.27

WRITE LONG command....................................................................

4-84

4.7

Timing ...................................................................................................

4-85

4.7.1

Register/PIO data transfer timing........................................................

4-85

4.7.2

Multiword DMA data transfer timing .................................................

4-87

4.7.3

Ultra DMA data in transfer (initialization timing)..............................

4-89

4.7.4

Ultra DMA data in transfer (continuous transfer timing) ...................

4-89

4.7.5

Ultra DMA data in transfer (host stop timing)....................................

4-90

4.7.6

Ultra DMA data in transfer (device end timing) .................................

4-90

4.7.7

Ultra DMA data in transfer (host end timing).....................................

4-91

4.7.8

Ultra DMA data out transfer (initialization timing)............................

4-92

4.7.9

Ultra DMA data out transfer (continuous transfer timing) .................

4-92

4.7.10

Ultra DMA data out transfer (device stop timing) ..............................

4-93

4.7.11

Ultra DMA data out transfer (host suspend timing)............................

4-94

4.7.12

Ultra DMA data out transfer (device end timing) ...............................

4-95

4.7.13

Power-on and Reset Timing ................................................................

4-97

CHAPTER 5 Operation and Cleaning ............................................................

5-1

5.1 Operation of Optical Disk Drive .............................................................

5-1

5.1.1

Appearance of optical disk drive...........................................................

5-1

5.1.2

Precautions ............................................................................................

5-2

5.1.3

Inserting an optical disk cartridge .........................................................

5-2

5.1.4

Removing an optical disk cartridge.......................................................

5-4

5.2 Cleaning of Optical Disk Drive ...............................................................

5-5

5.3 Operation of Optical Disk Cartridge .......................................................

5-6

5.3.1

Appearance ............................................................................................

5-6

5.3.2

Write protect tab....................................................................................

5-8

xii

C156-E227-01EN

 

 

 

Contents

5.3.3

Precautions ............................................................................................

5-9

5.4

Cleaning the Optical Disk Cartridge .....................................................

5-10

5.4.1 Cleaning tool for optical disk cartridge ..............................................

5-10

5.4.2 Cleaning of optical disk cartridge .......................................................

5-11

CHAPTER 6 Diagnostics and Maintenance .................................................

6-1

6.1

 

Diagnostics ..............................................................................................

6-1

6.1.1

Initial self-diagnostics ...........................................................................

6-1

6.1.2

Diagnostic command.............................................................................

6-2

6.1.3

Test program .........................................................................................

6-2

6.2

 

Maintenance Information ........................................................................

6-2

6.2.1

Maintenance requirements ....................................................................

6-2

6.2.2

Revision number ...................................................................................

6-3

C156-E227-01EN

xiii

Contents

Illustrations

FIGURES

Figure 1.1

The optical disk drive (with panel) ...............................................

1-6

Figure 1.2

The optical disk drive (without panel) ..........................................

1-6

Figure 1.3

Configuration of optical disk drive ...............................................

1-7

Figure 1.4

Block diagram of the control circuit section.................................

1-9

Figure 2.1

Optical disk cartridge ....................................................................

2-8

Figure 2.2

Algorithms for alternate processing............................................

2-11

Figure 2.3

Example of alternate processing .................................................

2-12

Figure 3.1

Surface temperature measurement point.......................................

3-2

Figure 3.2

Outer dimensions ..........................................................................

3-4

Figure 3.3

Outer dimensions ..........................................................................

3-6

Figure 3.4

Installation directions ....................................................................

3-9

Figure 3.5

Center of gravity .........................................................................

3-10

Figure 3.6

Mounting frame structure............................................................

3-11

Figure 3.7

Service areas................................................................................

3-12

Figure 3.8

MCM3130AP current waveform (+5 VDC) ...............................

3-13

Figure 3.9

Connector and terminal locations ...............................................

3-14

Figure 3.10

Cable connection diagram...........................................................

3-16

Figure 3.11

Jumper wire settings at factory shipment....................................

3-16

Figure 3.12

Master device setting...................................................................

3-17

Figure 3.13

Slave device setting.....................................................................

3-17

Figure 3.14

Cable selection mode setting.......................................................

3-18

Figure 3.15

Cable selection example..............................................................

3-18

Figure 3.16

Packing styles..............................................................................

3-21

Figure 4.1

Power mode.................................................................................

4-21

Figure 4.2

Register/PIO data transfer ...........................................................

4-85

Figure 4.3

Multiword DMA data transfer ....................................................

4-87

Figure 4.4

Ultra DMA data in transfer (initialization timing)......................

4-89

Figure 4.5

Ultra DMA data in transfer (continuous transfer timing) ...........

4-89

Figure 4.6

Ultra DMA data in transfer (host stop timing)............................

4-90

Figure 4.7

Ultra DMA data in transfer (device end timing).........................

4-90

Figure 4.8

Ultra DMA data in transfer (host end timing).............................

4-91

Figure 4.9

Ultra DMA data out transfer (initialization timing)....................

4-92

Figure 4.10

Ultra DMA data out transfer (continuous transfer timing) .........

4-92

Figure 4.11

Ultra DMA data out transfer (device stop timing)......................

4-93

Figure 4.12

Ultra DMA data out transfer (host suspend timing) ...................

4-94

xiv

C156-E227-01EN

 

 

Contents

Figure 4.13

Ultra DMA data out transfer (device end timing) ......................

4-95

Figure 4.14

Power-on and reset timing ..........................................................

4-97

Figure 5.1

Optical disk drive front view (with panel)....................................

5-1

Figure 5.2

Inserting an optical disk cartridge.................................................

5-3

Figure 5.3

Removing an optical disk cartridge ..............................................

5-5

Figure 5.4

Appearance of optical disk cartridge ............................................

5-7

Figure 5.5

Write protect tab ...........................................................................

5-8

Figure 5.6

Opening a shutter ........................................................................

5-11

Figure 5.7

Setting an optical disk cartridge into the setting case.................

5-12

Figure 5.8

Placing the setting case cover .....................................................

5-12

Figure 5.9

Cleaning of disk surface..............................................................

5-14

Figure 6.1

Revision label................................................................................

6-3

Figure 6.2

Revision number indication ..........................................................

6-4

TABLES

Table 2.1

Representative model names and order numbers .........................

2-1

Table 2.2

Specifications ................................................................................

2-2

Table 2.3

Environmental and power requirements .......................................

2-4

Table 2.4

Recommended optical disk cartridges ..........................................

2-7

Table 2.5

Disk specifications ......................................................................

2-10

Table 3.1

Temperature requirements at measurement points .......................

3-2

Table 3.2

Temperatures at measuring points (Reference) ............................

3-3

Table 3.3

Cable connector specifications ...................................................

3-15

Table 4.1

Connector pin assignments ...........................................................

4-2

Table 4.2

Signal description..........................................................................

4-4

Table 4.3

I/O port functions and mapping ....................................................

4-6

Table 4.4

Bit definitions of Alternate Status register ...................................

4-7

Table 4.5

Bit definitions of Device Control register ....................................

4-7

Table 4.6

Bit definitions of Drive Address register......................................

4-8

Table 4.7

Bit definitions of ATAPI Byte Count register ..............................

4-8

Table 4.8

Bit definitions of ATAPI Block Device Select register................

4-9

Table 4.9

Bit definitions of Error register.....................................................

4-9

Table 4.10

Bit definitions of ATAPI Features register.................................

4-10

Table 4.11 Bit definitions of ATAPI Interrupt Reason register ...................

4-10

Table 4.12

I/O and C/D.................................................................................

4-11

Table 4.13

Bit definitions of ATAPI Status register.....................................

4-11

Table 4.14

Alternate sector assignment criteria............................................

4-14

Table 4.15 ID and data error detection criteria and error processing

 

 

details ..........................................................................................

4-15

Table 4.16

LED indications ..........................................................................

4-22

C156-E227-01EN

xv

Contents

Table 4.17 Command codes and parameters.................................................

4-23

Table 4.18 IDENTIFY PACKET DEVICE command..................................

4-24

Table 4.19 Device parameter information ....................................................

4-25

Table 4.20

PACKET command.....................................................................

4-30

Table 4.21 DEVICE RESET command ........................................................

4-31

Table 4.22 CHECK POWER MODE command ...........................................

4-32

Table 4.23 Power mode indication................................................................

4-32

Table 4.24 EXECUTE DEVICE DIAGNOSTIC command .........................

4-33

Table 4.25 Self-diagnosis detailed code........................................................

4-34

Table 4.26 GET MEDIA STATUS command ..............................................

4-34

Table 4.27

Error register ...............................................................................

4-35

Table 4.28 IDLE IMMEDIATE command ...................................................

4-35

Table 4.29

NOP command ............................................................................

4-36

Table 4.30

SERVICE command ...................................................................

4-36

Table 4.31 SET FEATURES command........................................................

4-37

Table 4.32 FR register setting value..............................................................

4-38

Table 4.33 Transfer setting values in the SC register ...................................

4-39

Table 4.34 Cylinder High register.................................................................

4-40

Table 4.35

SLEEP command ........................................................................

4-41

Table 4.36 STANDBY IMMEDIATE command .........................................

4-42

Table 4.37 Packet command codes and parameters......................................

4-43

Table 4.38

ERASE command .......................................................................

4-44

Table 4.39 FORMAT UNIT command .........................................................

4-45

Table 4.40 FORMAT UNIT parameter list...................................................

4-45

Table 4.41 Defect list header.........................................................................

4-45

Table 4.42

Format Descriptor .......................................................................

4-46

Table 4.43

INQUIRY command ...................................................................

4-46

Table 4.44

INQUIRY data ............................................................................

4-47

Table 4.45 MODE SELECT command.........................................................

4-48

Table 4.46

Mode parameters .........................................................................

4-48

Table 4.47 Mode parameter list.....................................................................

4-49

Table 4.48 Mode parameter header...............................................................

4-49

Table 4.49

Block descriptor ..........................................................................

4-49

Table 4.50

Page Descriptor ...........................................................................

4-50

Table 4.51 Drive Operation Mode Page........................................................

4-50

Table 4.52 Drive Operation Mode Page variable..........................................

4-51

Table 4.53 Drive Operation Mode Page default value..................................

4-51

Table 4.54 Read-Write error recovery page..................................................

4-51

Table 4.55 Changeable values in the read-write recovery page....................

4-52

Table 4.56 Default values for the read-write recovery page .........................

4-53

Table 4.57 Flexible disk page .......................................................................

4-53

xvi

C156-E227-01EN

 

Contents

Table 4.58 Changeable values in flexible disk page.....................................

4-54

Table 4.59 Default values in flexible disk page............................................

4-55

Table 4.60 Caching page...............................................................................

4-56

Table 4.61 Changeable values in the caching page ......................................

4-56

Table 4.62 Default values for the caching page............................................

4-56

Table 4.63 Removable Block Access Capabilities Page ..............................

4-57

Table 4.64 Removable Block Access Capabilities variable .........................

4-57

Table 4.65 Removable Block Access Capabilities Page default value.........

4-58

Table 4.66 Timer & Protect Page..................................................................

4-58

Table 4.67 Inactivity Timer Multiplier values..............................................

4-59

Table 4.68 Timer & Protect Page variable....................................................

4-60

Table 4.69 Timer & Protect Page default value............................................

4-60

Table 4.70 MODE SENSE (10) command ...................................................

4-60

Table 4.71 Page Control field .......................................................................

4-61

Table 4.72 Mode Parameter List...................................................................

4-61

Table 4.73 Mode Parameter Header .............................................................

4-61

Table 4.74 Page Descriptor ...........................................................................

4-62

Table 4.76 MODE SENSE (6) command .....................................................

4-63

Table 4.77 Mode parameter list ....................................................................

4-63

Table 4.78 Mode parameter header...............................................................

4-63

Table 4.79 PREVENT/ALLOW MEDIUM REMOVAL command ............

4-64

Table 4.80 Response to Prevent/Allow/Eject ...............................................

4-64

Table 4.81 READ (10) command .................................................................

4-65

Table 4.82 READ command .........................................................................

4-65

Table 4.83 READ CAPACITY command ....................................................

4-66

Table 4.84 READ CAPACITY data (PMI=0) ..............................................

4-66

Table 4.85 READ CAPACITY data (PMI=1, MO media,

 

FROM medium)..........................................................................

4-66

Table 4.86 READ CAPACITY data (PMI=1, PROM medium)...................

4-67

Table 4.87 READ FORMAT CAPACITIES command ...............................

4-67

Table 4.88 READ FORMAT CAPACITIES data format.............................

4-67

Table 4.89 Capacity list header.....................................................................

4-67

Table 4.90 Current/Maximum capacity descriptor .......................................

4-68

Table 4.91 Descriptor code definition ..........................................................

4-68

Table 4.92 READ DEFECT DATA command .............................................

4-68

Table 4.93 Defect List Format ......................................................................

4-69

Table 4.94 Defect List Header ......................................................................

4-69

Table 4.95 Defect Descriptor ........................................................................

4-69

Table 4.96 READ LONG command .............................................................

4-70

Table 4.97 RECEIVE DIAGNOSTIC RESULTS command .......................

4-70

Table 4.98 REQUEST SENSE command.....................................................

4-71

C156-E227-01EN

xvii

Contents

Table 4.99

Request sense data.......................................................................

4-72

Table 4.100

Error code ....................................................................................

4-72

Table 4.101

Sense Key code ...........................................................................

4-73

Table 4.102

Logical block address format ......................................................

4-73

Table 4.103

ASC/ASCQ list ...........................................................................

4-74

Table 4.104

Format Progress Indication Bytes ...............................................

4-75

Table 4.105

SEND DIAGNOSTIC command ................................................

4-76

Table 4.106

SEEK command ..........................................................................

4-76

Table 4.107

START/STOP UNIT command ..................................................

4-77

Table 4.108

START/STOP/EJECT processing...............................................

4-77

Table 4.109

SYNCHRONIZE CACHE command..........................................

4-78

Table 4.110

TEST UNIT READY command .................................................

4-78

Table 4.111

VERIFY command......................................................................

4-79

Table 4.112

WRITE (10) command................................................................

4-79

Table 4.113

Write (12) command ...................................................................

4-80

Table 4.114

WRITE AND VERIFY command ..............................................

4-81

Table 4.115

WRITE BUFFER command .......................................................

4-82

Table 4.116

Code-ID .......................................................................................

4-83

Table 4.117

WRITE LONG command ...........................................................

4-84

Table 4.118 Register/PIO data transfer timing parameters.............................

4-86

Table 4.119 Multiword DMA data transfer timing parameters ......................

4-88

Table 4.120

Ultra DMA data out transfer parameter ......................................

4-96

Table 4.121

Power-on and reset timing ..........................................................

4-98

Table 5.1

Head cleaner ..................................................................................

5-5

Table 5.2

Cleaning kit .................................................................................

5-10

Table 5.3

Packing list for cleaning kit ........................................................

5-10

Table 6.1

Diagnostics function......................................................................

6-1

xviii

C156-E227-01EN

CHAPTER 1 General Description

1.1Features

1.2Configuration of Optical Disk Drive

This chapter describes the features and configuration of the MCM3064AP and MCM3130AP optical disk drives.

As successors to the MCE3064AP and MCE3130AP optical disk drives, the MCM3064AP and MCM3130AP optical disk drives (hereafter called the optical disk drives) achieve high-speed operation while maintaining compatibility with the MCE3064AP and MCE3130AP.

The flexibility and expandability realized through ATAPI interfaces as well as the high performance and command sets of the optical disk drives allow the user to construct disk subsystems featuring advanced functions, high performance, largescale storage and high reliability.

1.1 Features

This section describes the features of the optical disk drives in terms of performance, reliability, maintainability/operability, adaptability, and interface.

1.1.1 Performance and Functions

(1) Half-height standard 90mm(3.5-inch) size (25.4 mm height)

The optical disk drives can be directly connected to the system EIDE bus. The drive employs the same form factor as that for the 90mm(3.5-inch) 25.4-mm height hard disk drive.

(2) High-speed data transfer

The MCM3130AP rotates a disk at 3,637 revolutions per minute when a 1.3 GB disk is used. When other media are used, the speed is 5,455 revolutions per minute.

The MCM3064AP rotates a disk at 5,455 revolutions per minute.

In the disk drive, the MCM3130AP realizes high-speed data transfers at rates of 3.92 to 6.70 MB/s (1.3 GB) and the MCM3064AP realizes at rates of 3.52 to 5.87 MB/s (640 MB). The data transfer rates on the buses are 16.6 MB/s in PIO mode 4, 16.6 MB/s in multiword DMA mode 2, and 33.3 MB/s in Ultra-DMA mode 2.

The data transfer capacity can be used effectively through a large capacity data buffer of the optical disk drive.

C156-E227-01EN

1-1

General Description

(3) High-speed mean seek time

This drive features a linear voice coil motor for high-speed head positioning.

The average seek time per 1,000 random seeks is 23 ms. (However, this does not include command overhead or address check.)

(4) Compatibility with international standards (media interchangeability)

The MCM3130AP optical disk drive supports the use of 90mm(3.5-inch) optical disks in the 1.3 GB format as well as in the 128-MB, 230-MB, 540-MB and 640MB formats compatible with ISO standards.

The MCM3064AP optical disk drive supports the use of optical disks in the 128MB, 230-MB, 540-MB and 640-MB formats compatible with ISO standards.

(5) Direct-overwrite media support

The optical disk drive supports the use of optic modulation direct-overwrite (not requiring an erase operation) 230-MB, 540-MB and 640-MB disks compatible with ISO standards.

(6) Dust resistance

With this optical disk drive, the need for a cooling fan has been eliminated owing to its low power consumption. The optical disk drive also has a simple sealed structure. The device is sealed with a metal plate. The drive conforms to class 5 million or less particle level. (Class 5 million: This means there are 5 million dust particles of 0.5 mm diameter or larger per cubic foot. This is equivalent to

0.15mg/m3.)

(7)Lower power consumption

The power consumption of the MCM3130AP and MCM3064AP optical disk drive is 5.8 W, eliminating the need for a cooling fan. (These power consumption values are typical values during read and write operation.)

The minimum power consumption in the power save modes are 1.8 W.

(8) Automatic spindle stop function

If the optical disk drive is not accessed for a certain duration, it stops disk rotation to minimize dust accumulation on the disk. This duration can be specified using the MODE SELECT command.

1-2

C156-E227-01EN

1.1 Features

1.1.2 Reliability

(1) Mean time between failures (MTBF)

The mean time between failures (MTBF) for this optical disk drive is 120,000 hours or more.

(2) Enhanced error recovery

If an error occurs on the optical disk drive, the system executes appropriate retry processing to recover from it. This drive features enhanced Reed-Solomon error correction code (ECC) to assure error-free operation.

(3) Automatic allocation of alternate data blocks

This drive features a function which automatically allocates alternate data blocks in cases where defective data blocks are detected while data is being written to an optical disk.

1.1.3 Maintainability/operability

(1) Diagnostics function

This drive has a diagnostics function for checking optical disk drive operations. The diagnostics function facilitates test and restoration.

(2) Five-year service life (no overhaul)

This drive will not require overhaul within the first five years of installation if appropriately maintained (both disks and optical parts cleaned using cleaning tools) and handled as recommended.

1.1.4 Adaptability

(1) Wide-ranging operating environments

This drive, requiring low power consumption because of LSIs adopted, can be used in wide-ranging environments (5 to 45°C for drive's ambient environment and a general office environment). The ambient cleanliness must be class 5 million or less particle level.

(2) Low noise

This drive operates quietly at 30 dB or less (A-character) during seek operations and will not degrade the office environment (except when an optical disk is ejected).

C156-E227-01EN

1-3

General Description

(3) Safety standards

The optical disk drive is certified under the following standards:

UL1950 (U.S. safety standard)

CDRH (U.S. laser standard) (Class 1)

CSA C22.2 No. 950 (Canada safety standard)

EN60950 (European safety standard)

EN60825-1 (European laser standard) (Class 1)

(4) Radio wave standards

This optical disk device, while installed, is certified under the following standards:

EN55022 class B, EN55024 (European EMC standard)

AS/NZS3548 class B (Australian EMC standard)

CNS13438 class B (Taiwanese EMC standard)

1.1.5 Interface

(1) Conformation to ATA/ATAPI-5

The optical disk drives conform to the basic specifications of ATA/ATAPI-5.

ATAPI commands specify data with logical block addresses, thus allowing data to be manipulated independent of the physical characteristics of the optical disk derives. This facilitates easy development of software whose functions can be flexibly expanded in the future.

In the optical disk drives, PIO mode 4, multiword DMA mode 2, and Ultra-DMA mode 2 are supported.

(2) Continuous block processing

Logical block addresses are used for data block addressing. Irrespective of the physical attributes of track boundaries, you can have the initiator access data by specifying a block number in logically continuous data space.

(3) High-capacity data buffer

This drive has a 1,844-KB data buffer. This data buffer is used to transfer data between the EIDE bus and a disk. Since data is stored in this buffer, the host can execute input-output processing effectively by using the data transfer capability of the EIDE bus irrespective of the effective data transfer rate of the optical disk drive.

1-4

C156-E227-01EN

1.1 Features

(4) Read-ahead cache feature

The read-ahead cache feature enables high-speed sequential data access as follows:

After executing a command to read data from the disk, the drive automatically reads the next data block and stores it in the data buffer (pre-reading). If the next command requests this data, the drive can transfer data from the buffer without accessing the disk again.

(5) Write cache feature

When the host system issues the write command to the optical disk drive, this drive would report completion of the command after completion of the write and verify operations if the write cache feature were not used. If the write cache feature is used, this drive reports completion of the command when data transfer to buffer is completed, without waiting for completion of the write and verify operations. This drive performs the write and verify operations asynchronously with the interface operation. Therefore, enabling the write cache reduces the apparent write command processing time recognized by the host system and improves the I/O performance of the host system.

Enable or disable the write cache feature using the MODE SELECT command.

While the write cache feature is enabled, a write error is reported in the completion status of another command that is subsequent to the concerned write command. Note that, if the host performs only retry of an error-reporting command, data in the block in which the error has occurred is not correctly written.

(6) Defective block slipping

While initializing a disk, the optical disk drive slips defective data blocks to reallocate logical data blocks so they are physically continuous. This enables high-speed continuous data block processing without rotational delay due to defective data blocks.

C156-E227-01EN

1-5

Fujitsu MCM3130AP, MCM3064AP User Manual

General Description

1.2 Configuration of Optical Disk Drive

1.2.1 Appearance

Figures 1.1 and 1.2 show the optical disk drive.

Figure 1.1 The optical disk drive (with panel)

Figure 1.2 The optical disk drive (without panel)

1-6

C156-E227-01EN

1.2 Configuration of Optical Disk Drive

1.2.2 Configuration

Figure 1.3 shows the configuration of the optical disk drive.

The optical disk drive consists of a mechanical section, a fixed optics section, a control circuit section, and an actuator.

The mechanical section includes the spindle motor, actuator section, bias magnet, and cartridge holder vertical motion mechanism.

The fixed optics section consists of the optical components, position detector, and LD controller.

The control circuit section includes the drive control circuit section and I/F circuit section.

Mechanical section

Control circuit section

 

Spindle motor

Actuator

Fixed optics section

 

 

 

 

Figure 1.3 Configuration of optical disk drive

1.2.3 Mechanical section

(1) Loading and ejecting an optical disk cartridge

The optical disk drive includes a cartridge load mechanism and an auto eject mechanism. If an optical disk cartridge is manually inserted in the drive's slot as far as it will go, the cartridge load mechanism automatically lowers the cartridge and mounts it on the spindle motor. If the Eject button on the front panel is pressed, the auto eject mechanism automatically ejects the cartridge.

(2) Spindle motor

An optical disk cartridge hub and the spindle motor shaft are magnetically combined. Therefore, a disk rotates as fast as the spindle motor shaft rotates. The spindle motor, a DC brushless motor, provides high-speed rotation at 5,455 rpm and 3,637 rpm and high-accuracy rotation at ± 0.1%.

C156-E227-01EN

1-7

General Description

(3) Actuator section

The actuator section consists of a focus actuator and a tracking actuator. The former focuses a laser beam on the surface of an optical disk while the latter moves the beam spot along the radius, on the surface of an optical disk (seek operation).

The actuator section is directly driven by a linear voice coil motor. The tracking actuator is based on the pulse-width modulation (PWM) system and realizes low power consumption and high-speed access.

(4) Separate optical sections

The optical head section has a split structure in which the fixed optics section is separated from the moving optics section to minimize seek time and positioning error. This reduces the weight of the moving parts.

The fixed optics section consists of the laser diodes, collimator lens, separation prism, condensing lens, and the optical detector.

A laser diode for recording and playback transmits one laser beam to the actuator section.

(5) Panel

The central part of the panel is hollowed out to provide enough space to enable the cartridge to be inserted by pushing it with a finger, thereby facilitating insertion.

The panel is also simply designed using an eject button that also serves as LED light emitting part.

1.2.4 Control circuit section

Figure 1.4 is a block diagram of the control circuit section and the peripheral sections.

1-8

C156-E227-01EN

Loading...
+ 172 hidden pages