FBI2.5A4S1.......FBI2.5M4S1
2.5 Amp. Glass Passivated Bridge Rectifier
Dimensions in mm. |
Plastic |
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Case |
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20 |
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3.5 |
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+ |
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0.8 + 0.05
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L |
suffix |
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13.5 |
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4 |
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4 |
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4 |
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7 |
–4 |
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0.5 |
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1 |
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•Mounting Instructions
•High temperature soldering guaranteed: 260 ºC – 10 sc.
•Recommended mounting torque: 8 Kg.cm.
Voltage |
Current |
50 to 1000 V. |
2.5 A. |
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•Glass Passivated Junction Chips.
•UL recognized under component index file
number E130180.
•Lead and polarity identifications.
•Case: Molded Plastic.
•Ideal for printed circuit board (P.C.B.).
•The plastic material carries U/L recognition 94 V-O.
Maximum Ratings, according to IEC publication No. 134
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FBI2.5A |
FBI2.5B |
FBI2.5D |
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FBI2.5G |
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FBI2.5J |
FBI2.5K |
FBI2.5M |
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4S1 |
4S1 |
4S1 |
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4S1 |
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4S1 |
4S1 |
4S1 |
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VRRM |
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Peak recurrent reverse voltage (V) |
50 |
100 |
200 |
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400 |
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600 |
800 |
1000 |
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VRMS |
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Maximum RMS voltage (V) |
35 |
70 |
140 |
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280 |
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420 |
560 |
700 |
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IF(AV) |
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Max. Average forward current with heatsink |
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4.5 A at 65 ºC |
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without heatsink |
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2.5 A at 25 ºC |
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IFSM |
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8.3 ms. peak forward surge current |
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100 A |
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(Jedec Method) |
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I2t |
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Rating for fusing ( t<8.3 ms.) |
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15 A2 sec |
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VDIS |
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Dielectric strength (terminals to case, AC 1 min.) |
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1500 V |
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Tj |
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Operating temperature range |
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– 55 to + 150 °C |
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Tstg |
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Storage temperature range |
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– 55 to +150 ºC |
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Electrical Characteristics at Tamb = 25°C |
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VF |
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Max. forward voltage drop per element at IF = 2.5 A |
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1.0V |
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IR |
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Max. reverse current per element at VRRM |
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5 A |
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MAXIMUM THERMAL RESISTANCE |
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Rth (j-c) |
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Junction-Case. With Heatsink. |
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12 ºC/W |
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Rth (j-a) |
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Junction-Ambient. Without Heatsink. |
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40 ºC/W |
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Jan - 00