FES26A ...... FES26C
1 Amp. Surface Mounted Very Fast Soft Recovery Glass Passivated Avalanche Diode
Dimensions in mm.
5.1 ± 0.3 |
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1.25 ± 0.25 |
1.25 ± 0.25 |
Week code
CASE:
SMA/DO-214AC
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2.0 |
Year code |
4.2 |
Type No. Closs |
Standard soldering pad |
Voltage |
Current |
200 to 600 V. |
1.0 A at 55 ºC. |
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® |
•Glass Passivated Junction
•High current capability
•The plastic material carries U/L 94 V-0
•Low profile package.
•Easy pick and place.
•High temperature soldering 260 ºC 10 sec.
MECHANICAL DATA
Terminals: Solder plated, solderable per IEC 68-2-20. Standard Packaging: 4 mm. tape (EIA-RS-481). Weight: 0.064 g.
Maximum Ratings, according to IEC publication No. 134
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FES26A |
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FES26B |
FES26C |
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Marking Code |
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E1 |
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E2 |
E3 |
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VRRM |
Peak Recurrent reverse voltage (V) |
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200 |
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400 |
600 |
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VRMS |
Maximum RMS voltage |
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140 |
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280 |
420 |
VDC |
Maximum DC blocking voltage |
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200 |
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400 |
600 |
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IF(AV) |
Forward current at Tamb = 55 °C |
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1 A |
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IFRM |
Recurrent peak forward current |
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10 A |
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IFSM |
10 ms. peak forward surge current |
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30 A |
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(Jedec Method) |
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trr |
Max. reverse recovery time from |
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30 ns |
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IF = 0.5 A ; IR = 1 A ; IRR = 0.25 A |
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VBR |
Avalanche breakdown voltage at 100 µ A (V) |
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>300 |
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>500 |
>700 |
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Tj |
Operating temperature range |
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– 55 to + 150 °C |
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Tstg |
Storage temperature range |
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– 55 to + 150 °C |
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ERSM |
Maximum non repetitive peak |
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10 mJ |
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reverse avalanche energy. |
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IR = 1A ; TJ = 25 ºC |
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Electrical Characteristics at Tamb = 25 °C |
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VF |
Max. forward voltage drop at IF = 1 A |
at 25 ºC |
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2.5 V |
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at 150 ºC |
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1.3 V |
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IR |
Max. reverse current at VRRM |
at 25 ºC |
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5 µA |
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at 100 ºC |
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100 µA |
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Rthj-l |
Typical thermal resistance |
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27 °C/W |
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Rthj-a |
(5 x 5 mm2 x 130 µm Copper Area) |
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75 °C/W |
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Jun - 03