Datasheet STTH310S Specification

Page 1
Features
Low forward voltage drop
High reliability
High surge current capability
Planar technology
Description
The STTH310, which uses ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications.
STTH310
High voltage ultrafast rectifier
SMC
STTH310S
DO-201AD
STTH310

Table 1. Device summary

I
F(AV)
V
RRM
T
j
(max) 1.42 V
V
F
t
(max) 75 ns
rr
DO-201AD C2
STTH310
3 A
1000 V
175 °C
December 2009 Doc ID 9346 Rev 3 1/7
www.st.com
7
Page 2
Characteristics STTH310

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit
V
RRM
Repetitive peak reverse voltage 1000 V
TL = 75 °C, δ = 0.5 DO-201AD 3
I
F(AV)
Average forward current, δ = 0.5
= 75 °C, δ = 0.5 SMC 3
T
L
DO-201AD 55
I
FSM
T

Table 3. Thermal parameters

Forward surge current tp = 8.3 ms sinusoidal
SMC 45
Storage temperature range - 50 to + 175 °C
stg
Maximum operating junction temperature + 175 °C
T
j
Symbol Parameter Value Unit
L = 10 mm DO-201AD 20
R
th(j-l)
R
th(j-a)

Table 4. Static electrical characteristics

Junction to lead
°C/WSMC 20
Junction to ambient L = 10 mm DO-201AD 75
Symbol Parameter Test conditions Min. Typ. Max. Unit
A
A
I
Reverse leakage current
R
V
Forward voltage drop
F
= 125 °C - - 50
T
j
T
= 25 °C
j
= 150 °C - 0.98 1.42
T
j
VR = V
= 3 A
I
F
RRM
To evaluate the conduction losses use the following equation: P = 1.20 x I
Tj = 25 °C

Table 5. Dynamic electrical characteristics

Symbol Parameter
t
rr
t
fr
V
FP
Test conditions
= 0.5 A, Irr = 0.25 A
I
Reverse recovery time
Forward recovery time
Forward recovery voltage - - 12 V
F
= 1 A, Tj = 25 °C
I
R
I
= 3 A, dIF/dt = 50 A/µs
F
VFR = 1.1 x V
, Tj = 25 °C
Fmax
--10
--1.7
+ 0.075 I
F(AV)
F2(RMS)
Min. Typ. Max. Unit
- - 75 ns
--300ns
µA
V
2/7 Doc ID 9346 Rev 3
Page 3
STTH310 Characteristics
Figure 1. Conduction losses versus
average current
P(W)
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
δ = 0.05
δ = 0.1
I (A)
F(AV)
δ = 0.2
δ = 0.5
δ
=tp/T
Figure 3. Relative variation of thermal
impedance junction ambient versus pulse duration (DO-201AD)
Z/R
th(j-c) th(j-c)
1.0
Epoxy printed circuit board, FR4,
0.9
L = 10 mm
leads
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
0.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
t (s)
p
δ
T
=tp/T
T
δ = 1
Figure 2. Forward voltage drop versus
forward current
I (A)
FM
100.0
T=150°C
j
10.0
1.0
tp
0.1
0.0 0.5 1.0 1.5 2.0 2.5
(typical values)
T=150°C
j
(maximum values)
V (V)
FM
T=25°C
j
(maximum values)
Figure 4. Relative variation of thermal
impedance junction ambient versus pulse duration (SMC)
Z/R
th(j-c) th(j-c)
1.0
Epoxy printed circuit board, FR4,
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
tp
0.1
0.0
2
S = 1cm
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
t (s)
p
δ
=tp/T
T
tp

Figure 5. Thermal resistance junction to ambient versus copper surface under each lead

R (°C/W)
th(j-a)
110
100
90
80
70
60
50
40
30
20
10
0
012345
Doc ID 9346 Rev 3 3/7
Epoxy printed circuit board, FR4, copper thickness = 35 µm
SMB
DO-201AD
L =10mm
leads
S(cm²)
Page 4
Package information STTH310

2 Package information

Epoxy meets UL94, V0
Band indicates cathode
Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 6. SMC dimensions

®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref.
E1
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
D
E
A2 0.05 0.20 0.002 0.008
(1)
b
c
2.90 3.20 0.114 0.126
(1)
0.15 0.40 0.006 0.016
D 5.55 6.25 0.218 0.246
A1
C
LE2
A2
b
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
L 0.75 1.50 0.030 0.059
1. Dimensions b and c apply to plated leads

Figure 6. Footprint, dimensions in mm (inches)

(0.061) (0.201)
8.19
(0.322)
4/7 Doc ID 9346 Rev 3
1.545.111.54
(0.061)
3.14
(0.124)
Page 5
STTH310 Package information

Table 7. DO-201AD dimensions

Dimensions
BB
Note 1 Note 1
ØD

Table 8. DO-201AD C2 dimensions

E
B
K
F
I
R0.5
MIN
D
EE
Note 2
ØC
J
A
R0.5
H
A
55.9°
MAX
50.8°
G = D + 0.2 to 0.4 mm
(G = hole in the PCB)
10° max
Ref.
Millimeters Inches
Min. Max. Min. Max.
A - 9.50 - 0.374
B 25.40 - 1.000 -
C - 5.30 - 0.209
D - 1.30 - 0.051
E - 1.25 - 0.049
1 - The lead diameter ø D is not controlled over zone E
Notes
2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15mm)
Dimensions
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A - - 9.5 - - 0.374
B 13.75 - 17.75 0.541 - 0.699
C - - 5.3 - - 0.208
D - - 1.3 - - 0.051
C
E 3.1 3.6 4.1 0.122 0.142 0.161
F 2.4 3.15 3.9 0.094 0.124 0.153
G - 1.6 - - 0.063 -
H 14.9 - 15.6 0.587 - 0.614
I 0.5 0.6 0.8 0.019 0.024 0.031
J - 18.78 - - 0.739 -
K 3.8 - 4.8 0.150 - 0.189
The difference between E dimensions on both sides of resinous body (which
Note
express the bending centering) must not be larger than 0.7 millimeter.
Doc ID 9346 Rev 3 5/7
Page 6
Ordering information STTH310

3 Ordering information

Table 9. Ordering information

Order code Marking Package Weight Base qty Delivery mode
STTH310S S10 SMC 0.245 g 2500 Tape and reel
STTH310 STTH310 DO-201AD 1.16 g 600 Ammopack
STTH310RL STTH310 DO-201AD 1.16 g 1900 Tape and reel
STTH310-C2 STTH 310 DO-201AD C2 1.12 g 500 Box

4 Revision history

Table 10. Document revision history

Date Revision Changes
Jan-2003 1 First release.
03-Apr-2007 2
07-Dec-09 3 Updated Ta b l e 6 package dimensions.
DO-201AD C2 package added. SMC package information updated.
6/7 Doc ID 9346 Rev 3
Page 7
STTH310
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Doc ID 9346 Rev 3 7/7
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