Datasheet STTH3002 Datasheet (ST)

Main product characteristics

STTH3002

Ultrafast recovery diode

I

F(AV)

V

RRM

T

(max) 175° C

j

V

(typ) 0.77 V

F

(typ) 22 ns

t

rr

30 A

200 V

Features and benefits

■ Very low conduction losses

■ Negligible switching losses

■ Low forward and reverse recovery time

■ High junction temperature

Description

The STTH3002 uses ST's new 200 V planar Pt
doping technology, and is specially suited for
switching mode base drive and transistor circuits.

Packaged in DO-247, DOP3I, and D²PAK, this
device is intended for use in low voltage, high
frequency inverters, free wheeling and polarity
protection.

A

A

K

DO-247

STTH3002W

K

NC

2

DPAK

STTH3002G

K

A

K

DOP3I

STTH3002PI

A

Order codes

Part Number Marking

STTH3002W STTH3002

STTH3002PI STTH3002

STTH3002G STTH3002

STTH3002G-TR STTH3002

May 2006 Rev 1 1/10

www.st.com

Characteristics STTH3002

1 Characteristics

Table 1. Absolute ratings (limiting values at T

= 25° C, unless otherwise specified)

j

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

I

F(AV)

I

FSM

T

Table 2. Thermal parameters

Repetitive peak reverse voltage 200 V

RMS forward current 50 A

= 135° C

c

= 115° C

c

Average forward current, δ = 0.5

DO-247 T

2

D

PAK Tc = 135° C

Surge non repetitive forward current tp = 10 ms Sinusoidal 300 A

Storage temperature range -65 to + 175 ° C

stg

T

Maximum operating junction temperature 175 ° C

j

30 ADOP3I T

Symbol Parameter Value Unit

DO-247 1.2

R

th(j-c)

Junction to case

D2PA K 1 .2

Table 3. Static electrical characteristics

° C/WDOP3I 1.8

Symbol Parameter Test conditions Min. Typ Max. Unit

(1)

I

R

V

1. Pulse test: tp = 5 ms, δ < 2 %

2. Pulse test: t

Reverse leakage current

(2)

Forward voltage drop

F

= 380 µs, δ < 2 %

p

= 25° C

j

Tj = 150° C 20 200

= 125° C IF = 25 A 0.77 0.85

T

j

= 25° C

j

T

= 150° C 0.8 0.88

j

= V

V

R

= 30 A

I

F

RRM

20

1.05

T

To evaluate the conduction losses use the following equation:
P = 0.67 x I

F(AV)

+ 0.007 I

F2(RMS)

µA

VT

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STTH3002 Characteristics

Table 4. Dynamic characteristics

Symbol Parameter

t

rr

I

RM

t

fr

V

FP

Reverse recovery time

Reverse recovery current

Forward recovery time

Forward recovery voltage

Test conditions

IF = 1 A, dIF/dt = -200 A/µs,
V

= 30 V, Tj = 25 °C

R

= 1 A, dIF/dt = -50 A/µs,

I

F

= 30 V, Tj = 25 °C

V

R

= 30 A, dIF/dt = 200 A/µs,

I

F

= 160 V, Tj = 125 °C

V

R

IF = 30 A, dIF/dt = 200 A/µs
V

= 1.1 x V

FR

, Tj = 25 °C

Fmax

IF = 30 A, dIF/dt = 200 A/µs,
VFR = 1.1 x V

, Tj = 25 °C

Fmax

Min. Typ Max. Unit

22 27

40 50

7.6 9.5 A

140 ns

2.5 V

Figure 1. Peak current versus duty cycle Figure 2. Forward voltage drop versus

forward current (typical values)

IM(A)

200

180

160

140

120

100

80

60

40

20

0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

P = 20 WP = 20 W

P = 10 WP = 10 W

P = 5 WP = 5 W

δ

T

T

I

I

M

M

=tp/T

=tp/T

d

δ

tp

tp

IFM(A)

200

180

160

140

120

100

80

60

40

20

0

0.0 0.4 0.8 1.2 1.6 2.0

Tj=150 °C

Tj=25 °C

VFM(V)

ns

Figure 3. Forward voltage drop versus

forward current (maximum values)

IFM(A)

200

180

160

140

120

100

80

60

40

20

0

0.0 0.4 0.8 1.2 1.6 2.0

Tj=150 °C

Tj=25 °C

VFM(V)

Figure 4. Relative variation of thermal

impedance, junction to case,
versus pulse duration

Z

th(j-c)/Rth(j-c)

1.0

Single pulse

D²PAK

0.1

1.E-03 1.E-02 1.E-01 1.E+00

3/10

tp(s)

Characteristics STTH3002

Figure 5. Junction capacitance versus

reverse voltage applied (typical
values)

C(pF)

1000

100

1 10 100 1000

V

osc

F=1 MHz

=30 mV

Tj=25 °C

VR(V)

RMS

Figure 7. Reverse recovery time versus

dI

/dt (typical values)

F

tRR(ns)

80

70

60

50

40

30

20

10

0

10 100 1000

Tj= 125 °C

Tj= 25 °C

IF=30 A

V

=160 V

R

dIF/dt(A/µs)

Figure 6. Reverse recovery charges versus

dI

/dt (typical values)

F

QRR(nC)

350

IF= 30 A

= 160 V

V

R

300

250

200

150

100

50

0

10 100 1000

Tj=125 °C

Tj=25 °C

dIF/dt(A/µs)

Figure 8. Peak reverse recovery current

versus dIF/dt (typical values)

IRM(A)

16

IF= 30 A

V

= 160 V

R

14

12

10

8

6

4

2

0

10 100 1000

Tj=125 °C

Tj=25 °C

dIF/dt(A/µs)

Figure 9. Dynamic parameters versus

junction temperature

QRR;IRM[Tj]/QRR;IRM[Tj=125°C]

1.4

IF=30 A

= 160 V

V

R

1.2

1.0

I

0.8

0.6

0.4

0.2

0.0

25 50 75 100 125 150

4/10

RM

Q

RR

Tj(°C)

Figure 10. Thermal resistance, junction to

ambient, versus copper surface
under tab (Epoxy printed circuit
board FR4, e

R

(°C/W)

th(j-a)

80

70

60

50

40

30

20

10

0

0 5 10 15 20 25 30 35 40

= 35 µm)

cu

SCU(cm²)

D²PAK

STTH3002 Ordering information scheme

2 Ordering information scheme

STTH 30 02 XXX

Ultrafast switching diode

Average forward current

30 = 30 A

Repetitive peak reverse voltage

02 = 200 V

Package

W = DO-247 in Tube
PI = DOP3I in Tube

2

G = D PAK in Tube
G-TR =

2

D PAK in Tape and reel

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Package information STTH3002

3 Package information

Epoxy meets UL94, V0

Cooling method: by conduction (C)

Recommended torque value: 0.8 Nm

Maximum torque value: 1.0 Nm

Table 5. DO-247 dimensions

DIMENSIONS

REF.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 4.85 5.15 0.191 0.203

D 2.20 2.60 0.086 0.102

V

E 0.40 0.80 0.015 0.031

V

Dia

F 1.00 1.40 0.039 0.055

F2 2.00 0.078

H

L5

L

L2

F2

L1

L3

V2

F3

F

G

A

L4

D

ME

F3 2.00 2.40 0.078 0.094

G 10.90 0.429

H 15.45 15.75 0.608 0.620

L 19.85 20.15 0.781 0.793

L1 3.70 4.30 0.145 0.169

L2 18.50 0.728

L3 14.20 14.80 0.559 0.582

L4 34.60 1.362

L5 5.50 0.216

M 2.00 3.00 0.078 0.118

V5° 5°

6/10

V2 60° 60°

Dia. 3.55 3.65 0.139 0.143

STTH3002 Package information

Table 6. DOP3I dimensions

DIMENSIONS

REF

E

E1

R

ØP

A

c

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

b 1.20 1.40 0.047 0.055

c 1.45 1.55 0.057 0.061

G

D

Y

c1 0.50 0.70 0.020 0.028

D 12.15 13.10 0.474 0.516

E 15.10 15.50 0.594 0.610

E1 7.55 7.75 0.297 0.305

L

e 10.80 11.30 0.425 0.445

G 20.4 21.10 0.815 0.831

b

e

c1

Q

L 14.35 15.60 0.565 0.614

P 4.08 4.17 0.161 0.164

Q 2.70 2.90 0.106 0.114

R 4.60 typ. 0.181 typ.

Y 15.80 16.50 0.622 0.650

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Package information STTH3002

Table 7 . D

L2

L

L3

2

PAK dimensions

E

A1

B2

B

G

2mm min.
FLAT ZONE

DIMENSIONS

REF.

Millimeters Inches

Min. Max Min. Max.

A 4.40 4.60 0.173 0.181

A

C2

A1 2.49 2.69 0.098 0.106

A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037

D

B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024

C2 1.23 1.36 0.048 0.054

C

R

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

A2

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

V2

L2 1.27 1.40 0.050 0.055

L3 1.40 1.75 0.055 0.069

M 2.40 3.20 0.094 0.126

R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

Figure 11. D2PAK footprint (dimensions in mm)

16.90

10.30

8.90

3.70

5.08

1.30

In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.

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STTH3002 Ordering information

4 Ordering information

Part Number Marking Package Weight Base qty Delivery mode

STTH3002W STTH3002 DO-247 4.4 g 30 Tube

STTH3002PI STTH3002 DOP3I 4.46 g 30 Tube

STTH3002G STTH3002 D

2

PAK 1.48 g 50 Tube

STTH3002G-TR STTH3002 D2PAK 1.48 g 1000 Tape and reel

5 Revision history

Date Revision Description of Changes

03-May-2006 1 First issue

9/10

STTH3002

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