Datasheet STTH1L06 Datasheet (ST)

Turbo 2 ultrafast high voltage rectifier

Features

■ Ultrafast switching

■ Low reverse recovery current

■ Reduces switching and conduction losses

■ Low thermal resistance

Description

The STTH1L06/U/A, which is using ST Turbo 2
600 V technology, is specially suited as boost
diode in discontinuous or critical mode power
factor corrections.
The device is also intended for use as a free
wheeling diode in power supplies and other power
switching applications.

STTH1L06

DO-41

STTH1L06

SMA

STTH1L06A

Table 1. Device summary

SMB

STTH1L06U

Symbol Value

I

F(AV)

V

RRM

I

(max) 75 µA

R

(max) 175 °C

T

j

(max) 1.05 V

V

F

t

(max) 80 ns

rr

1 A

600 V

October 2009 Doc ID 8321 Rev 4 1/9

www.st.com

9

Characteristics STTH1L06

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

V

Repetitive peak reverse voltage 600 V

RRM

DO-41 10

I

F(RMS)

I

F(AV)

I

T

Table 3. Thermal parameters

Forward rms voltage

SMA / SMB 7

DO-41 T

Average forward current δ = 0.5

SMB T

= 10 ms sinusoidal DO-41

t

Surge non repetitive forward current

FSM

Storage temperature range -65 to + 175 °C

stg

T

Maximum operating junction temperature 175 °C

j

p

= 10 ms sinusoidal SMA / SMB

t

p

= 120 °C

c

= 135 °C

c

= 145 °C

c

1ASMA T

30
20

Symbol Parameter Value (max) Unit

L = 10 mm DO-41 45

R

th(j-l)

Junction to lead

SMA 30

°C/W

SMB 25

R

1. Rth(j-a) is measured with a copper area S = 5 cm2 (see Figure 14.)

Table 4. Static electrical characteristics

Junction to ambient

th(j-a)

(1)

L = 10 mm DO-41 70

A

A

Symbol Parameter Test conditions Min. Typ. Max. Unit

I

Reverse leakage current

R

V

Forward voltage drop

F

T

j

= 150 °C 10 75

T

j

T

= 25 °C

j

= 150 °C 0.85 1.05

T

j

V

= 600 V

R

= 1 A

I

F

1

1.3

= 25 °C

To evaluate the conduction losses use the following equation:
P = 0.89 x I

2/9 Doc ID 8321 Rev 4

F(AV)

+ 0.165 I

F2(RMS)

µA

V

STTH1L06 Characteristics

0

00

03

Table 5. Dynamic characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

I

= 1 A, dIF/dt = -50, A/µs,

=tp/T

δ

=tp/T

F

VR = 30 V

= 1 A, dIF/dt = 100 A/µs

I

F

= 3.5 V

V

FR

Figure 2. Forward voltage drop versus

IFM(A)

100.0

δ = 1

T

tp

10.0

1.0

0.1

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5

Figure 4. Relative variation of thermal

Zth(j-a)/Rth(j-a)

1.0

0.9

0.8

0.7

0.6

δ = 0.5

0.5

0.4

δ = 0.2

T

tp

0.3

δ = 0.1

0.2

0.1

Single pulse

0.0

1.E-

1 1.E+

55 80 ns

50 ns

forward current

Tj=150°C

Tj=150°C

(Maximum values)

(Maximum values)

Tj=150°C

Tj=150°C

(Typical values)

(Typical values)

Tj=25°C

(Maximum values)

VFM(V)

impedance junction ambient versus
pulse duration

SMB

epoxy FR4, S = 1 cm²

tp(s)

1.E+01 1.E+02 1.E+

δ

=tp/T

T

tp

t

Reverse recovery time Tj = 25 °C

rr

t

Forward recovery time Tj = 25 °C

fr

V

Forward recovery

FP

voltage

T

= 25 °C IF = 1 A, dIF/dt = 100 A/µs 10 V

j

Figure 1. Conduction losses versus

average current

P(W)

1.50

δ = 0.05

1.25

1.00

0.75

0.50

0.25

0.00

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3

δ = 0.1

δ = 0.2

IF(av)(A)

δ = 0.5

Figure 3. Relative variation of thermal

impedance junction ambient versus
pulse duration

Zth(j-a)/Rth(j-a)

1.0

DO-41

Lleads = 10mm

0.9

0.8

0.7

0.6

δ = 0.5

0.5

0.4

0.3

δ = 0.2

0.2

δ = 0.1

0.1

Single pulse

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

epoxy FR4, Lead = 10 mm

tp(s)

δ

Doc ID 8321 Rev 4 3/9

Characteristics STTH1L06

Figure 5. Relative variation of thermal

impedance junction ambient versus
pulse duration (epoxy FR4)

Zth(j-a)/Rth(j-a)

1.0

SMA

0.9

0.8

0.7

0.6

= 0.5

δ

0.5

0.4

= 0.2

δ

0.3

= 0.1

δ

0.2

0.1

Single pulse

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

tp(s)

δ

=tp/T

T

tp

Figure 7. Reverse recovery time versus dIF/dt

(90% confidence)

trr(ns)

800

700

600

500

400

300

200

100

0

0 5 10 15 20 25 30 35 40 45 50

IF=2 x IF(av)IF=2 x IF(av)

IF=IF(av)IF=IF(av)

dIF/dt(A/µs)

IF=0.5 x IF(av)IF=0.5 x IF(av)

VR=400V
Tj=125°C

Figure 9. Softness factor versus dIF/dt

(typical values)

S factor

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0 5 10 15 20 25 30 35 40 45 50

dIF/dt(A/µs)

IF=IF(av)
VR=400V
Tj=125°C

Figure 6. Peak reverse recovery current

versus dI

IRM(A)

2.5

VR=400V
Tj=125°C

2.3

2.0

1.8

1.5

1.3

IF=0.25 x IF(av)IF=0.25 x IF(av)

1.0

0.8

0.5

0.3

0.0

0 5 10 15 20 25 30 35 40 45 50

IF=0.5 x IF(av)IF=0.5 x IF(av)

/dt (90% confidence)

F

IF=2 x IF(av)IF=2 x IF(av)

IF=IF(av)IF=IF(av)

dIF/dt(A/µs)

Figure 8. Reverse recovery charges versus

dI

/dt (90% confidence)

F

Qrr(nC)

220

VR=400V

200

Tj=125°C

180

160

140

120

100

80

60

40

20

0

0 5 10 15 20 25 30 35 40 45 50

dIF/dt(A/µs)

IF=2 x IF(av)

IF=IF(av)

IF=0.5 x IF(av)

Figure 10. Relative variations of dynamic

parameters versus junction
temperature

1.25

1.00

0.75

0.50

0.25

0.00

25 50 75 100 125

S factor

IRM

QRR

Tj(°C)

IF=IF(av)
VR=400V

Reference: Tj=125°C

4/9 Doc ID 8321 Rev 4

STTH1L06 Characteristics

Figure 11. Transient peak forward voltage

versus dI

VFP(V)

25

IF=IF(av)
Tj=125°C

20

15

10

5

0

0 20 40 60 80 100 120 140 160 180 200

/dt (90% confidence)

F

dIF/dt(A/µs)

Figure 13. Junction capacitance versus

reverse voltage applied
(typical values)

C(pF)

100

10

VR(V)

1

1 10 100 1000

F=1MHz

Vosc=30mV

Tj=25°C

Figure 12. Forward recovery time versus dI

(90% confidence)

tfr(ns)

200

180

160

140

120

100

80

60

40

20

0

0 20 40 60 80 100 120 140 160 180 200

dIF/dt(A/µs)

IF=IF(av)

VFR=1.1 x VF max.

Tj=125°C

Figure 14. Thermal resistance junction to

ambient versus copper surface
under each lead

Rth(j-a)(°C/W)

110

100

90

80

70

60

50

40

30

20

10

0

012345678910

Epoxy printed circuit board FR4, copper thickness: 35 µm

DO-41

Lleads=10mm

SMB

S(cm²)

F

/dt

Figure 15. Thermal resistance junction to ambient versus copper surface under each lead

(Epoxy printed circuit board FR4, copper thickness: 35 µm)

Rth(j-a)(°C/W)

140

130

120

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

S(cm²)

Doc ID 8321 Rev 4 5/9

SMA

Package information STTH1L06

2 Package information

● Epoxy meets UL 94, V0

● Band indicates cathode

● Bending method (DO-41): see Application note AN1471

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK

Table 6. SMA dimensions

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

.

Dimensions

Ref.

E1

Millimeters Inches

Min. Max. Min. Max.

D

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

E

A1

C

L

A2

b

c 0.15 0.40 0.006 0.016

D 2.25 2.90 0.089 0.114

E 4.80 5.35 0.189 0.211

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

Figure 16. Footprint (dimensions in mm)

1.4

2.63

1.4

5.43

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1.64

STTH1L06 Package information

Table 7. SMB dimensions

Dimensions

E1

D

E

A1

C

L

A2

b

Figure 17. Footprint (dimensions in mm)

1.62

2.60

5.84

Ref.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

c 0.15 0.40 0.006 0.016

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

L 0.75 1.50 0.030 0.059

1.62

2.18

Table 8. DO-41 (plastic) dimensions

ØD

CC

A

ØB

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 4.07 5.20 0.160 0.205

B 2.04 2.71 0.080 0.107

C25.4 1

D 0.71 0.86 0.028 0.034

Doc ID 8321 Rev 4 7/9

Ordering information STTH1L06

3 Ordering information

Table 9. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STTH1L06 STTH1L06 DO-41 0.34 g 2000 Ammopack

STTH1L06RL STTH1L06 DO-41 0.34 g 5000 Tape and reel

STTH1L06U BL6 SMB 0.11 g 2500 Tape and reel

STTH1L06A HL6 SMA 0.068 g 5000 Tape and reel

4 Revision history

Table 10. Document revision history

Date Revision Changes

Jul-2002 3C Last issue.

30-Sep-2009 4 Updated table 8 package dimensions.

8/9 Doc ID 8321 Rev 4

STTH1L06

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