Datasheet STTH16003 Datasheet (ST)

Page 1
STTH16003
High frequency secondary rectifier
Features
■ Combines highest recovery and reverse
voltage performance
■ Ultra-fast, soft and noise-free recovery
– insulated voltage: 2500 V rms – capacitance: < 45 pF
■ Low inductance and low capacitance allow
simplified layout
Description
Dual rectifiers suited for switch mode power supply and high frequency DC to DC converters.
Packaged in ISOTOP, this device is intended for use in low voltage, high frequency inverters, free wheeling operation, welding equipment and telecom power supplies.
A1
A2
K1
K2
A2
ISOTOP™
STTH16003TV1

Table 1. Device summary

I
F(AV)
V
RRM
T
j
(typ) 0.95 V
V
F
(typ) 80 ns
t
rr
K1
K2
A1
2 x 60 A
300 V
150 °C
TM: ISOTOP is a registered trademark of
STMicroelectronics
June 2008 Rev 5 1/7
www.st.com
7
Page 2
Characteristics STTH16003

1 Characteristics

Table 2. Absolute ratings (limiting values, per diode, T
Symbol Parameter Value Unit
= 25 °C unless otherwise stated)
amb
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
I
RSM
T

Table 3. Thermal parameters

Repetitive peak reverse voltage 300 V
RMS forward current 180 A
Average forward current Tc = 85°C δ = 0.5
Per diode Per device
Surge non repetitive forward current tp = 10 ms Sinusoidal 800 A
Non repetitive peak reverse current tp = 100 µs square 5 A
Storage temperature range -55 to + 150 °C
stg
Maximum operating junction temperature 150 °C
T
j
60
160
Symbol Parameter Maximum Unit
Per diode 0.7
R
R
th(j-c)
th(c)
Junction to case
Coupling 0.1
When the diodes 1 and 2 are used simultaneously:
Δ T
j (diode1)

Table 4. Static electrical characteristics (per diode)

= P
(diode1)
x R
th(j-c) (per diode)
+ P
(diode2)
x R
th(c)
A
°C/WTotal 0.4
Symbol Parameter Test conditions Min. Typ Max. Unit
(1)
I
R
V
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
Reverse leakage current
(2)
Forward voltage drop
F
1. to evaluate the maximum conduction losses use the following equation: P = 0.75 x I
F(AV)
+ 0.0025 I
F2(RMS)
T
= 25 °C
j
= 125 °C 0.2 2
T
j
T
= 25 °C
j
= 125 °C 0.8 0.95
T
j
= 300 V
V
R
= 80 A
I
F
200 µA
1.2
2/7
mA
V
Page 3
STTH16003 Characteristics

Table 5. Recovery characteristics

Symbol Parameter
t
Reverse recovery time Tj = 25 °C
rr
Forward recovery time
t
fr
V
I
S
Forward recovery voltage 5 V
FP
Reverse recovery current
RM
factor
T
Tj = 125 °C
Figure 1. Conduction losses versus
average current (per diode)
= 25 °C
j
Test conditions
I
= 0.5 A, Irr = 0.25 A
F
Min. Typ Max. Unit
IR = 1 A
= 1 A, dIF/dt = 50 A/µs,
I
F
= 30 V
V
R
= 80 A dIF/dt = 200 A/µs
I
F
VFR = 1.1 x V
I
= 60 A, dIF/dt = 200 A/µs,
F
Vcc = 200 V
Fmax
0.3 -
Figure 2. Forward voltage drop versus
forward current (maximum values,
60 ns
80 ns
1000 ns
16 A
per diode)
P1(W)
100
90
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
80 70 60 50 40 30
T
20 10
0
0 102030405060708090100
IF(av) (A)
δ
=tp/T
Figure 3. Relative variation of thermal
impedance junction to case versus pulse duration
Zth(j-c)/Rth(j-c)
1.0
0.8
δ = 0.5
0.6
0.4
δ = 0.2
δ = 0.1
0.2
Single pulse
0.0 1E-3 1E-2 1E-1 1E+0 5E+0
tp(s)
δ
T
=tp/T
δ = 1
IFM(A)
200
100
10
tp
1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Tj=125°C
(Typical values)
Tj=125°C
Figure 4. Peak reverse recovery current
versus dI
/dt (90% confidence, per
F
diode)
IRM(A)
30
VR=200V
Tj=125°C
25
20
IF=0.5xIF(av)
15
10
5
tp
0
0 50 100 150 200 250 300 350 400 450 500
IF=IF(av)
dIF/dt(A/µs)
Tj=25°C
VFM(V)
IF=2xIF(av)
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Page 4
Characteristics STTH16003
Figure 5. Reverse recovery time versus
dI
/dt (90% confidence, per diode)
F
Figure 6. Softness factor (tb/ta) versus dI
(typical values, per diode)
F
/dt
trr(ns)
240 220 200 180 160 140 120 100
IF=2xIF(av)
IF=IF(av)
IF=0.5xIF(av)
80 60 40 20
0
0 50 100 150 200 250 300 350 400 450 500
dIF/dt(A/µs)
Figure 7. Relative variation of dynamic
parameters versus junction temperature (reference: T
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0 25 50 75 100 125
S factor
IRM
Tj(°C)
= 125°C)
j
VR=200V Tj=125°C
S factor
0.6
0.5
VR=200V Tj=125°C
0.4
0.3
0.2
0.1
0.0 0 50 100 150 200 250 300 350 400 450 500
dIF/dt(A/µs)
Figure 8. Transient peak forward voltage
versus dI
/dt (90% confidence, per
F
diode)
VFP(V)
8
IF=IF(av)
7
Tj=125°C
6
5
4
3
2
1
0
0 50 100 150 200 250 300 350 400 450 500
dIF/dt(A/µs)

Figure 9. Forward recovery time versus dIF/dt (90% confidence, per diode)

tfr(ns)
1000
900 800 700 600 500 400 300 200 100
0
0 50 100 150 200 250 300 350 400 450 500
dIF/dt(A/µs)
4/7
VFR=1.1 x VF max.
IF=IF(av)
Tj=125°C
Page 5
STTH16003 Package information

2 Package information

● Cooling method: by conduction (C)
● Recommended torque value: 0.9 to 1.2 N·m
● Epoxy meets UL 94,V0
In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com.

Table 6. ISOTOP dimensions

Dimensions
®
Ref.
Millimeters Inches
Min. Max. Min. Max.
E
G2
C
A 11.80 12.20 0.465 0.480
A1 8.90 9.10 0.350 0.358
A
A1
E2
F1 F
C2
B 7.8 8.20 0.307 0.323
C 0.75 0.85 0.030 0.033
C2 1.95 2.05 0.077 0.081
D 37.80 38.20 1.488 1.504
D1 31.50 31.70 1.240 1.248
E 25.15 25.50 0.990 1.004
P1
D1
S
D
B
G
E1 23.85 24.15 0.939 0.951
E2 24.80 typ. 0.976 typ.
G 14.90 15.10 0.587 0.594
G1 12.60 12.80 0.496 0.504
G2 3.50 4.30 0.138 0.169
ØP
G1
E1
F 4.10 4.30 0.161 0.169
F1 4.60 5.00 0.181 0.197
P 4.00 4.30 0.157 0.69
P1 4.00 4.40 0.157 0.173
S 30.10 30.30 1.185 1.193
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Page 6
Ordering information STTH16003

3 Ordering information

Table 7. Ordering information

Order code Marking Package Weight Base qty Delivery mode
STTH16003TV1 STTH16003TV1 ISOTOP

4 Revision history

Table 8. Document revision history

Date Revision Description of changes
Oct-1999 4D Last issue.
25-Jun-2008 5 Reformatted to current standards. Corrected marking in Ta bl e 7
27 g
(without screws)10(with screws)
Tube
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Page 7
STTH16003
y
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