UNITRODE UC1610, UC2610, UC3610 Technical data

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UNITRODE UC1610, UC2610, UC3610 Technical data

UC1610

UC1610

UC2610 UC3610

Dual Schottky Diode Bridge

FEATURES

Monolithic Eight-Diode Array

Exceptional Efficiency

Low Forward Voltage

Fast Recovery Time

High Peak Current

Small Size

CONNECTION DIAGRAMS

DESCRIPTION

This eight-diode array is designed for high-current, low duty-cycle applications typical of flyback voltage clamping for inductive loads. The dual bridge connection makes this device particularly applicable to bipolar driven stepper motors.

The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time.

This single monolithic chip is fabricated in both hermetic CERDIP and copperleaded plastic packages. The UC1610 in ceramic is designed for -55°C to +125°C environments but with reduced peak current capability. The UC2610 in plastic and ceramic is designed for -25°C to +125°C environments also with reduced peak current capability; while the UC3610 in plastic has higher current rating over a 0°C to +70°C temperature range.

ABSOLUTE MAXIMUM RATINGS

Peak Inverse Voltage (per diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50V Peak Forward Current

UC1610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A UC2610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A UC3610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3A Power Dissipation at TA = +70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1W Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C

Note: Consult Packaging Section of Databook for thermal limitations and considerations of package.

DIL-8 (TOP VIEW)

N or J Package

PLCC-20 (TOP VIEW)

Q Package

SOIC-16 (TOP VIEW)

DW Package

3/95

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