The UC1825 family of PWM control ICs is optimized for high fre
quency switched mode power supply applications. Particular care
was given to minimizing propagation delays through the comparators
and logic circuitry while maximizing bandwidth and slew rate of the
error amplifier. This controller is designed for use in either cur
rent-mode or voltage mode systems with the capability for input volt
age feed-forward.
Protection circuitry includes a current limit comparator with a 1V
threshold, a TTL compatible shutdown port, and a soft start pin
which will double as a maximum duty cycle clamp. The logic is fully
latched to provide jitter free operation and prohibit multiple pulses at
an output. An under-voltage lockout section with 800mV of hysteresis
assures low start up current. During under-voltage lockout, the out
puts are high impedance.
These devices feature totem pole outputs designed to source and
sink high peak currents from capacitive loads, such as the gate of a
power MOSFET. The on state is designed as a high level.
Storage Temperature Range. . . . . . . . . . . . . . -65°C to +150°C
Lead Temperature (Soldering, 10 seconds) . . . . . . . . . . 300°C
SOIC-16 (Top View)
DW Package
CONNECTION DIAGRAMS
DIL-16 (Top View)
J or N Package
PLCC-20 & LCC-20
(Top View)
Q & L Packages
UC1825
UC2825
UC3825
PACKAGE PIN FUNCTION
FUNCTION
N/C1
INV2
NI3
E/A Out4
Clock5
N/C6
R
T7
C
T8
Ramp9
Soft Start10
N/C11
ILIM/SD12
Gnd13
Out A14
Pwr Gnd15
N/C16
V
C17
Out B18
V
CC19
V
REF 5.1V20
PIN
THERMAL RATINGS TABLE
PackageQ
DIL-16J80-12028
DIL-16N90
PLCC-2043-75(1)34
LCC-2070-8020
SOIC-1650-120
Q
Q
JA
(1)
(1)
Q
JC
(2)
45
(2)
35
2
UC1825
UC2825
UC3825
ELECTRICAL CHARACTERISTICS:
Unless otherwise stated, these specifications apply for , RT = 3.65k, CT = 1nF, VCC
= 15V, -55°C<TA<125°C for the UC1825, –40°C<TA<85°C for the UC2825, and 0°C<TA<70°C for the UC3825, TA=TO.
UC1825
PARAMETERSTEST CONDITIONSUC2825
UC3825
MINTOPMAXMINTOPMAX UNITS
Reference Section
Output VoltageT
Line Regulation10V < V
Load Regulation1mA < I
Temperature Stability*T
O = 25°C, IO = 1mA5.055.105.155.005.105.20V
CC < 30V220220mV
O < 10mA520520mV
MIN < TA <TMAX0.20.40.20.4mV/°C
Total Output Variation*Line, Load, Temperature5.005.204.955.25V
Output Noise Voltage*10Hz < f < 10kHz5050µV
Long Term Stability*T
Short Circuit CurrentV
Initial Accuracy*T
Voltage Stability*10V < V
Temperature Stability*T
J = 2°C360400440360400440kHz
CC < 30V0.220.22%
MIN < TA <TMAX55%
Total Variation*Line, Temperature340460340460kHz
Oscillator Section (cont.)
Clock Out High3.94.53.94.5V
Clock Out Low2.32.92.32.9V
Ramp Peak*2.62.83.02.62.83.0V
Ramp Valley*0.71.01.250.71.01.25V
Ramp Valley to Peak*1.61.82.01.61.82.0V
Error Amplifier Section
Input Offset Voltage1015mV
Input Bias Current0.630.63µA
Input Offset Current0.110.11µA
Open Loop Gain1V < V
CMRR1.5V < V
PSRR10V < V
Output Sink CurrentV
Output Source CurrentV
Output High VoltageI
Output Low VoltageI
High speed circuits demand careful attention to layout
and component placement. To assure proper perfor
mance of the UC1825 follow these rules: 1) Use a ground
plane. 2) Damp or clamp parasitic inductive kick energy
from the gate of driven MOSFETs. Do not allow the out
put pins to ring below ground. A series gate resistor or a
shunt 1 Amp Schottky diode at the output pin will serve
Error Amplifier Circuit
Simplified Schematic
UC1825
UC2825
UC3825
this purpose. 3) Bypass V
-
monolithic ceramic capacitors with low equivalent series
inductance. Allow less than 1 cm of total lead length for
each capacitor between the bypassed pin and the ground
-
plane. 4) Treat the timing capacitor, CT, like a bypass ca
pacitor.
CC,VC, and VREF. Use 0.1µF
-
Open Loop Frequency ResponseUnity Gain Slew Rate
PWM Applications
Conventional (Voltage Mode)
Current-Mode
5
Oscillator Circuit
UC1825
UC2825
UC3825
Deadtime vs CT(3k RT100k)
µ
Timing Resistance vs Frequency
Synchronized Operation
Two Units in Close Proximity
Deadtime vs Frequency
160
140
120
D
T (ns)
100
80
10k100k
1.0nF
470pF
FREQ (Hz)
Generalized Synchronization
1M
6
Forward Technique for Off-Line Voltage Mode Application
Constant Volt-Second Clamp Circuit
The circuit shown here will achieve a constant
volt-second product clamp over varying input voltages.
The ramp generator components, R
sen so that the ramp at Pin 9 crosses the 1V threshold
at the same time the desired maximum volt-second
product is reached. The delay through the functional
nor block must be such that the ramp capacitor can be
completely discharged during the minimum deadtime.
T and CR are cho
-
UC1825
UC2825
UC3825
Output Section
Simplified SchematicRise/Fall Time (CL=1nF)
Rise/Fall Time (CL=10nF)
Saturation Curves
7
Open Loop Laboratory Test Fixture
This test fixture is useful for exercising many of the
UC1825’s functions and measuring their specifications.
UC1825
UC2825
UC3825
UDG-92032-2
As with any wideband circuit, careful grounding and bypass procedures should be followed. The use of a
ground plane is highly recommended.
Design Example: 50W, 48V to 5V DC to DC Converter - 1.5MHz Clock Frequency
UDG-92033-3
8
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable DeviceStatus
5962-87681022AACTIVELCCCFK201TBDPOST-PLATE N / A for Pkg Type
5962-8768102EAACTIVECDIPJ161TBDA42 SNPBN / A for Pkg Type
5962-8768102V2AACTIVELCCCFK201TBDPOST-PLATE N / A for Pkg Type
5962-8768102VEAACTIVECDIPJ161TBDA42N / A for Pkg Type
5962-8768102XAOBSOLETETO-92LP28TBDCall TIN / A for Pkg Type
UC1825AJACTIVECDIPJ161TBDA42 SNPBN / A for Pkg Type
UC1825AJ883BACTIVECDIPJ161TBDA42 SNPBN / A for Pkg Type
UC1825AJQMLVACTIVECDIPJ16TBDCall TICall TI
UC1825ALACTIVELCCCFK201TBDPOST-PLATE N / A for Pkg Type
UC1825AL883BACTIVELCCCFK201TBDPOST-PLATE N / A for Pkg Type
UC1825ALP883BOBSOLETETO-92LP28TBDCall TIN / A for Pkg Type
UC1825ALQMLVACTIVELCCCFK20TBDCall TICall TI
UC2825DWACTIVESOICDW1640Green (RoHS &
UC2825DW/1PREVIEWSOICDW16Green (RoHS &
UC2825DWG4ACTIVESOICDW1640Green (RoHS &
UC2825DWTRACTIVESOICDW162000 Green (RoHS &
UC2825DWTRG4ACTIVESOICDW162000 Green (RoHS &
UC2825JACTIVECDIPJ161TBDA42 SNPBN / A for Pkg Type
UC2825NACTIVEPDIPN1625Green (RoHS &
UC2825NG4ACTIVEPDIPN1625Green (RoHS &
UC2825QACTIVEPLCCFN2046Green (RoHS &
UC2825QG3ACTIVEPLCCFN2046Green (RoHS &
UC2825QTRACTIVEPLCCFN201000 Green (RoHS &
UC2825QTRG3ACTIVEPLCCFN201000 Green (RoHS &
UC3825DWACTIVESOICDW1640Green (RoHS &
UC3825DWG4ACTIVESOICDW1640Green (RoHS &
UC3825DWTRACTIVESOICDW162000 Green (RoHS &
UC3825DWTRG4ACTIVESOICDW162000 Green (RoHS &
UC3825JACTIVECDIPJ161TBDA42 SNPBN / A for Pkg Type
UC3825NACTIVEPDIPN1625Green (RoHS &
UC3825NG4ACTIVEPDIPN1625Green (RoHS &CU NIPDAUN / A for Pkg Type
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-2-260C-1YEAR
CU NIPDAULevel-2-260C-1YEAR
CU NIPDAULevel-2-260C-1YEAR
CU NIPDAULevel-2-260C-1YEAR
CU NIPDAULevel-2-260C-1YEAR
CU NIPDAUN/ A for Pkg Type
CU NIPDAUN/ A for Pkg Type
CU SNLevel-2-260C-1 YEAR
CU SNLevel-2-260C-1 YEAR
CU SNLevel-2-260C-1 YEAR
CU SNLevel-2-260C-1 YEAR
CU NIPDAULevel-2-260C-1YEAR
CU NIPDAULevel-2-260C-1YEAR
CU NIPDAULevel-2-260C-1YEAR
CU NIPDAULevel-2-260C-1YEAR
CU NIPDAUN/ A for Pkg Type
21-Jan-2008
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable DeviceStatus
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
21-Jan-2008
(3)
no Sb/Br)
UC3825QACTIVEPLCCFN2046Green (RoHS &
CU SNLevel-2-260C-1 YEAR
no Sb/Br)
UC3825QG3ACTIVEPLCCFN2046Green (RoHS &
CU SNLevel-2-260C-1 YEAR
no Sb/Br)
UC3825QTRACTIVEPLCCFN201000 Green (RoHS &
CU SNLevel-2-260C-1 YEAR
no Sb/Br)
UC3825QTRG3ACTIVEPLCCFN201000 Green (RoHS &
CU SNLevel-2-260C-1 YEAR
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
MECHANICAL DATA
MPLC004A – OCT OBER 1994
FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER
20 PIN SHOWN
Seating Plane
0.004 (0,10)
D
D1
13
4
E1E
8
9
NO. OF
PINS
**
D/E
19
13
18
14
0.032 (0,81)
0.026 (0,66)
0.050 (1,27)
0.008 (0,20) NOM
D1/E1
MINMAXMIN
MAX
D2/E2
MIN
0.180 (4,57) MAX
0.120 (3,05)
0.090 (2,29)
0.020 (0,51) MIN
D2/E2
D2/E2
0.021 (0,53)
0.013 (0,33)
0.007 (0,18)
MAX
M
20
28
44
52
68
84
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018