Features
■ Combines highest recovery and reverse
voltage performance
■ Ultra-fast, soft and noise-free recovery
■ Insulated package TO-220FPAB:
– Electrical insulation: 2000 V DC
– Capacitance: 12 pF
STTH2003
High frequency secondary rectifier
A1
K
A2
K
Description
Dual center tap fast recovery epitaxial diodes
suited for switch mode power supply and high
frequency DC/DC converters.
Packaged in TO-220AB, TO-220FPAB, I
2
D
PAK, this device is especially intended for
secondary rectification.
2
PA K o r
A2
K
A1
TO-220FPAB
STTH2003CFP
A2
K
A1
TO-220AB
STTH2003CT
Table 1. Device summary
Symbol Value
I
F(AV)
V
RRM
(max) 175 °C
T
j
(max) 1 V
V
F
t
(typ) 35 ns
rr
A2
A1
D2PAK
STTH2003CG
I2PAK
STTH2003CR
2 x 10 A
300 V
A1
A2
K
February 2011 Doc ID 5377 Rev 9 1/11
www.st.com
11
Characteristics STTH2003
1 Characteristics
Table 2. Absolute ratings (limiting values, per diode)
Symbol Parameter Value Unit
V
I
F(RMS)
I
F(peak)
I
I
RSM
T
Table 3. Thermal resistance
Repetitive peak reverse voltage 300 V
RRM
Forward current rms 30 A
2
I
Peak working forward
TO-220AB
current δ = 0.5
TO-220FPAB Tc = 125 °C
PAK, D2PAK,
Surge non repetitive forward current tp = 10 ms sinusoidal 110 A
FSM
Non repetitive avalanche current
Storage temperature range -65 to + 175 °C
stg
Maximum operating junction temperature 175 °C
T
j
T
= 140 °C
c
t
= 10 µs square
p
Per diode
Per device
10
20
5A
Symbol Parameter Value (max) Unit
2
PAK, D2PAK, TO-220AB
I
Per diode 2.5
To ta l 1 .3
th(j-c)
Junction to case
TO-220FPAB
Per diode 4.6
°C/W
R
To ta l 4
2
I
R
th(c)
Coupling
PAK, D2PAK, TO-220AB 0.1
TO-220FPAB 3.5
A
Table 4. Static electrical characteristics (per diode)
Symbol Parameter Test conditions Min. Typ. Max. Unit
T
= 25 °C
(1)
I
V
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: t
Reverse leakage current
R
(2)
Forward voltage drop
F
= 380 µs, δ < 2%
p
j
Tj = 125 °C 30 300
= 300 V
V
R
Tj = 25 °C
IF = 10 A
= 125 °C 0.85 1
T
j
To evaluate the conduction losses use the following equation: P = 0.75 x I
2/11 Doc ID 5377 Rev 9
+ 0.025 I
F(AV)
20
1.25
F2(RMS))
µA
V
STTH2003 Characteristics
3
0
Z/R
Table 5. Recovery characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
= 0.5 A, Irr = 0.25 A
t
Reverse recovery time Tj = 25 °C
rr
F
IR = 1 A
= 1 A, VR = 30 V
I
F
/dt = -50 A/µs
dI
F
25
35
IF = 10 A
Forward recovery time Tj = 25 °C
t
fr
V
I
Peak forward voltage Tj = 25 °C
FP
Reverse recovery current
RM
Tj = 125 °C
S factor Softness factor 0.3 -
Figure 1. Conduction losses versus average
forward current (per diode)
dIF/dt = 100 A/µs
= 1.1 x V
V
FR
= 10 A,
I
F
Fmax
dIF/dt = 100 A/µs
I
= 10 A, VCC = 200 V
F
dIF/dt = 200 A/µs
Figure 2. Forward voltage drop versus
forward current (maximum values,
230 ns
3.5 V
8A
per diode)
P1(W)
14
12
10
8
6
4
2
0
024681012
δ = 0.05
δ = 0.1
δ = 0.2
I (A)
F(AV)
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Figure 3. Relative variation of thermal
impedance junction to case versus
pulse duration
Z/R
th(j-c) th(j-c)
1.0
TO-220AB, D2PAK, I2PAK
0.8
I (A)
FM
200
100
10
1
0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00
T =125°C
j
T =75°C
j
V (V)
FM
T =25°C
j
Figure 4. Relative variation of thermal
impedance junction to case versus
pulse duration (TO-22FP0AB)
th(j-c) th(j-c)
1.0
0.8
ns
0.6
0.4
0.2
0.0
1E-
Single pulse
t (s)
p
1E-2 1E-1 1E+
Doc ID 5377 Rev 9 3/11
0.6
0.4
0.2
0.0
Single pulse
-
t (s)
p
-
Characteristics STTH2003
Figure 5. Peak reverse recovery current
versus dI
/dt (90% confidence, per
F
diode)
I (A)
RM
16
V =200V
R
14
T =125°C
j
12
10
8
6
4
2
0
0 50 100 150 200 250 300 350 400 450 500
I =0.5 x I
F F(AV)
I=I
F F(AV)
dI /dt(A/µs)
F
I =2 x I
F F(AV)
Figure 7. Softness factor (tb/ta) versus dIF/dt
(typical values, per diode)
S factor
0.60
V =200V
R
T =125°C
0.50
0.40
0.30
0.20
0.10
dI /dt(A/µs)
0.00
0 50 100 150 200 250 300 350 400 450 500
F
j
Figure 6. Reverse recovery time versus dI
(90% confidence, per diode)
t (ns)
rr
100
V =200V
R
T =125°C
80
60
40
20
0
0 50 100 150 200 250 300 350 400 450 500
I=I
F F(AV)
I =2 x I
F F(AV)
dI /dt(A/µs)
F
I =0.5 x I
F F(AV)
j
Figure 8. Relative variation of dynamic
parameters versus junction
temperature (reference: T
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
25 50 75 100 125
S factor
I
RM
T (°C)
j
= 125 °C)
j
F
/dt
Figure 9. Transient peak forward voltage
versus dI
/dt (90% confidence, per
F
Figure 10. Forward recovery time versus dI
diode) (TO-220AB)
t (ns)
V (V)
FP
10
I=I
F F(AV)
T =125°C
j
8
6
4
2
dI /dt(A/µs)
0
0 50 100 150 200 250 300 350 400 450 500
F
4/11 Doc ID 5377 Rev 9
fr
500
400
300
200
100
0
0 50 100 150 200 250 300 350 400 450 500
(90% confidence, per diode)
I=I
F F(AV)
V =1.1 x V max.
FR F
T =125°C
j
dI /dt(A/µs)
F
F
/dt
STTH2003 Characteristics
Figure 11. Thermal resistance, junction to ambient, versus copper surface under tab (D2PAK )
R (°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
0 5 10 15 20 25 30 35 40
SCu(cm²)
Printed circuit board FR4,
copper thickness: 35 µm
Doc ID 5377 Rev 9 5/11
Package information STTH2003
2 Package information
● Epoxy meets UL94, V0
● Cooling method: by conduction (C)
● Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Table 6. D
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
2
PAK dimensions
.
Dimensions
Ref.
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A
L2
E
C2
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
L
L3
G
A1
B2
B
C
A2
D
R
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
M
*
V2
* FLAT ZONE NO LESSTHAN 2mm
Figure 12. Footprint (dimensions in mm)
16.90
10.30
8.90
6/11 Doc ID 5377 Rev 9
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
V2 0° 8° 0° 8°
5.08
1.30
3.70
STTH2003 Package information
Devices in I2PAK with nickel-plated back frame must NOT be mounted by frame soldering
like SMDs. Such devices are intended to be through-hole mounted ONLY and in no
circumstances shall ST be held liable for any lack of performance or damage arising out of
soldering of nickel-plated back frames.
Table 7. I2PAK dimensions
Dimensions
L2
Ref.
Millimeters Inches
Min. Max. Min. Max.
A
E
c2
A 4.40 4.60 0.173 0.181
A1 2.40 2.72 0.094 0.107
b 0.61 0.88 0.024 0.035
D
b1 1.14 1.70 0.044 0.067
c 0.49 0.70 0.019 0.028
L1
L
b1
A1
c2 1.23 1.32 0.048 0.052
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.195 0.203
b
e
e1
c
E 10 10.40 0.394 0.409
L 13 14 0.512 0.551
L1 3.50 3.93 0.138 0.155
L2 1.27 1.40 0.050 0.055
Doc ID 5377 Rev 9 7/11
Package information STTH2003
Table 8. TO-220AB dimensions
Dimensions
Ref.
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
H2
Dia
L5
L6
L2
F2
F1
F
G1
G
L9
L4
A
C
L7
D
M
E
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
8/11 Doc ID 5377 Rev 9
Diam. 3.75 3.85 0.147 0.151
STTH2003 Package information
Table 9. TO-220FPAB 3 leads in-line dimensions
Dimensions
Ref.
Millimeters Inches
Min. Max. Min. Max.
A 4.4 4.9 0.173 0.192
A
H
B
B 2.5 2.9 0.098 0.114
D 2.45 2.75 0.096 0.108
E 0.4 0.7 0.016 0.028
Dia
L6
L2
L3
L5
F1
L4
F2
D
L7
F 0.6 1 0.024 0.039
F1 1.15 1.7 0.045 0.067
F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.205
G1 2.4 2.7 0.094 0.106
H 10 10.7 0.394 0.421
L2 16 Typ. 0.630 Typ.
F
G1
G
E
L3 28.6 30.6 1.126 1.205
L4 9.8 10.7 0.386 0.421
L6 15.8 16.4 0.622 0.646
L7 9 9.9 0.354 0.390
Dia. 2.9 3.5 0.114 0.138
Doc ID 5377 Rev 9 9/11
Ordering information STTH2003
3 Ordering information
Table 10. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STTH2003CT STTH2003CT TO-220AB 2.2 g 50 Tube
STTH2003CG STTH2003CG D2PAK 1.48 g 50 Tube
STTH2003CG-TR STTH2003CG
2
PA K
D
1.48 g 1000 Tape and reel
STTH2003CFP STTH2003CFP TO-220FPAB 2.08 g 50 Tube
STTH2003CR STTH2003CR I
2
PAK 1.49 g 50 Tube
4 Revision history
Table 11. Document revision history
Date Revision Changes
Aug-2003 7D Previous release.
26-Mar-2007 8 Removed ISOWATT package.
Updated base quantity for tape and reel delivery in
11-Feb-2011 9
Ta b l e 1 0 . Corrected temperature in Ta b l e 1 . Added
warning paragraph above Tab l e 7 .
10/11 Doc ID 5377 Rev 9
STTH2003
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Doc ID 5377 Rev 9 11/11
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