Multi TOPLED® |
LSG T670, LSP T670, LSY T670 |
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LOP T670, LOG T670 |
Besondere Merkmale
●Gehäusebauform: P-LCC-4
●Gehäusefarbe: weiß
●als optischer Indikator einsetzbar
●zur Hinterleuchtung, Lichtleiterund Linseneinkopplung
●beide Leuchtdiodenchips getrennt ansteuerbar
●hohe Signalwirkung durch Farbwechsel der LED möglich
●bei geeigneter Ansteuerung, Farbwechsel von grün über gelb und orange bis super-rot möglich
●für alle SMT-Bestück- und Löttechniken geeignet
●gegurtet (8-mm-Filmgurt)
●Störimpulsfest nach DIN 40839
Features
●P-LCC-4 package
●color of package: white
●for use as optical indicator
●for backlighting, optical coupling into light pipes and lenses
●both chips can be controlled separately
●high signal efficiency possible by color change of the LED
●with appropriate controlling it is possible to change color from green to yellow and orange to super-red
●suitable for all SMT assembly and soldering methods
●available taped on reel (8 mm tape)
●load dump resistant acc. to DIN 40839
VPL06837
Semiconductor Group |
1 |
11.96 |
LSG T670, LSP T670, LSY T670
LOP T670, LOG T670
Typ |
Emissions- |
Farbe der |
Lichtstärke |
Lichtstrom |
Bestellnummer |
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farbe |
Lichtaustritts- |
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fläche |
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Type |
Color of |
Color of the |
Luminous |
Luminous |
Ordering Code |
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Emission |
Light Emitting |
Intensity |
Flux |
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Area |
IF = 10 mA |
IF = 10 mA |
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IV(mcd) |
ΦV (mlm) |
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LSY T670-HK |
super-red / |
colorless clear |
2.5 ... 12.5 |
- |
Q62703-Q3912 |
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LSY T670-J |
yellow |
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4.0 |
... |
8.0 |
18 (typ.) |
Q62703-Q2984 |
LSY T670-K |
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6.3 |
... 12.5 |
30 (typ.) |
Q62703-Q2985 |
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LSY T670-JL |
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4.0 |
... 20.0 |
- |
Q62703-Q3913 |
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LSG T670-HK |
super-red / |
colorless clear |
2.5 ... 12.5 |
- |
Q62703-Q2531 |
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LSG T670-J |
green |
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4.0 |
... |
8.0 |
18 (typ.) |
Q62703-Q2656 |
LSG T670-K |
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6.3 |
... 12.5 |
30 (typ.) |
Q62703-Q2657 |
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LSG T670-JL |
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4.0 |
... 20.0 |
- |
Q62703-Q2658 |
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LSP T670-FJ |
super-red / |
colorless clear |
1.0 ... |
8.0 |
- |
Q62703-Q2659 |
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LSP T670-G |
pure green |
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1.6 |
... |
3.2 |
8 (typ.) |
Q62703-Q2660 |
LSP T670-H |
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2.5 |
... |
5.0 |
12 (typ.) |
Q62703-Q2661 |
LSP T670-J |
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4.0 |
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... 8.0 |
18 (typ.) |
Q62703-Q2777 |
LSP T670-GK |
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1.6 |
... 12.5 |
- |
Q62703-Q2532 |
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LOG T670-HK |
orange/ |
colorless clear |
2.5 ... 12.5 |
- |
Q62703-Q2708 |
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LOG T670-J |
green |
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4.0 |
... |
8.0 |
18 (typ.) |
Q62703-Q2767 |
LOG T670-K |
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6.3 |
... 12.5 |
30 (typ.) |
Q62703-Q2768 |
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LOG T670-JL |
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4.0 |
... 20.0 |
- |
Q62703-Q2867 |
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LOP T670-FJ |
orange/ |
colorless clear |
1.0 ... |
8.0 |
- |
Q62703-Q2677 |
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LOP T670-G |
pure green |
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1.6 |
... |
3.2 |
8 (typ.) |
Q62703-Q2678 |
LOP T670-H |
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2.5 |
... |
5.0 |
12 (typ.) |
Q62703-Q2679 |
LOP T670-GK |
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1.6 |
... 12.5 |
- |
Q62703-Q2566 |
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Streuung der Lichtstärke in einer Verpackungseinheit IV max / IV min ≤ 2.0.1)
Streuung der Lichtstärke in einer LED IV max / IV min ≤ 3.0 (LSG T670, LOG T670, LSY T670),
≤4.0 (LSP T670, LOP T670).
1)Bei MULTILED® bestimmt die Helligkeit des jeweils dunkleren Chips in einem Gehäuse die Helligkeitsgruppe der LED.
Luminous intensity ratio in one packaging unit IV max / IV min ≤ 2.0.1)
Luminous intensity ratio in one LED IV max / IV min ≤ 3.0 (LSG T670, LOG T670, LSY T670),
≤4.0 (LSP T670, LOP T670).
1)In case of MULTILED®, the brightness of the darker chip in one package determines the brightness group of the LED.
Semiconductor Group |
2 |
LSG T670, LSP T670, LSY T670
LOP T670, LOG T670
Grenzwerte
Maximum Ratings
Bezeichnung |
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Symbol |
Wert |
Einheit |
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Parameter |
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Symbol |
Value |
Unit |
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Betriebstemperatur |
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Top |
– 55 ... + 100 |
˚C |
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Operating temperature range |
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Lagertemperatur |
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Tstg |
– 55 ... + 100 |
˚C |
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Storage temperature range |
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Sperrschichttemperatur |
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Tj |
+ 100 |
˚C |
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Junction temperature |
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Durchlaßstrom |
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IF |
30 |
mA |
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Forward current |
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Stoßstrom |
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IFM |
0.5 |
A |
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Surge current |
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t £ 10 ms, D = 0.005 |
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Sperrspannung |
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VR |
5 |
V |
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Reverse voltage |
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Verlustleistung |
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Ptot |
100 |
mW |
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Power dissipation |
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Wärmewiderstand |
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Thermal resistance |
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Sperrschicht / Umgebung |
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Junction / air |
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) |
(Padgröße ³ 16 mm |
2 |
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1) |
480 |
K/W |
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Montage auf PC-Board* |
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Rth JA |
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2 |
) |
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2) |
650 |
K/W |
mounted on PC board* (pad size ³ 16 mm |
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Rth JA |
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*) |
PC-board: FR4 |
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1) |
nur ein Chip betrieben |
1) |
one system only |
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2) |
beide Chips betrieben |
2) |
both systems on simultaneously |
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Notes
Die angegebenen Grenzdaten gelten für einen Chip.
The stated maximum ratings refer to one chip.
Semiconductor Group |
3 |