Samsung SL-M4583FX, SL-M4580FX, M458x Service Manual

Mono Laser MFP

ProXpress M458x series

SL-M4580FX, SL-M4583FX

(Ver 1.10)

SERVICEMANUAL

Mono Laser MFP

Contents

1. Precautions

2. Product Specifications and Description

3. Disassembly and Reassembly

4. Troubleshooting

5. System Diagram

6. Reference Information

Refer to the service manual in the GSPN (see the rear cover) for more information.

Contents

Contents

1. Precautions ........................................................................................................................................			1 − 1
1.1.	Safety warning ..........................................................................................................................		1 − 1
1.2.	Caution for safety ......................................................................................................................		1 − 2
	1.2.1.	Toxic material...............................................................................................................	1 − 2
	1.2.2.	Electric shock and fire safety precautions ...........................................................................	1 − 2
	1.2.3.	Handling precautions .....................................................................................................	1 − 4
	1.2.4.	Assembly and Disassembly precautions.............................................................................	1 − 4
	1.2.5.	Disregarding this warning may cause bodily injury ..............................................................	1 − 5
1.3.	ESD precautions........................................................................................................................		1 − 6
1.4. Caution for Data Loss.................................................................................................................			1 − 7
2. Product Specifications and Description....................................................................................................			2 − 1
2.1.	Product Overview......................................................................................................................		2 − 1
2.2.	Specifications............................................................................................................................		2 − 2
	2.2.1.	General Specification .....................................................................................................	2 − 2
	2.2.2.	Print Specifications........................................................................................................	2 − 4
	2.2.3.	Scan specification..........................................................................................................	2 − 5
	2.2.4.	Copy specification .........................................................................................................	2 − 6
	2.2.5.	Fax specification ...........................................................................................................	2 − 7
	2.2.6.	Paper Handling specification............................................................................................	2 − 8
	2.2.7.	Software and solution specification .................................................................................	2 − 10
	2.2.8.	Supplies.....................................................................................................................	2 − 11
	2.2.9.	Maintenance Parts .......................................................................................................	2 − 12
	2.2.10.	Option.......................................................................................................................	2 − 13
2.3.	System Configuration ...............................................................................................................		2 − 14
2.4.	Feeding System.......................................................................................................................		2 − 19
	2.4.1.	Feeding System Overview.............................................................................................	2 − 19
	2.4.2.	Cassette.....................................................................................................................	2 − 22
	2.4.3.	Pick-Up Unit ..............................................................................................................	2 − 23
	2.4.4.	Registration Unit.........................................................................................................	2 − 24
	2.4.5.	MPF(Multi-Purpose Feeder) Unit ...................................................................................	2 − 25
2.5.	Image Creation........................................................................................................................		2 − 26
	2.5.1.	Printing process overview .............................................................................................	2 − 26
	2.5.2.	Toner Cartridge...........................................................................................................	2 − 27
	2.5.3.	Imaging Unit ..............................................................................................................	2 − 28
		2.5.3.1. Development................................................................................................	2 − 29
2.6.	Fuser unit...............................................................................................................................		2 − 30
	2.6.1.	Fuser unit overview .....................................................................................................	2 − 30
	2.6.2.	Fuser unit drive...........................................................................................................	2 − 31

i	Copyright© 1995-2016 SAMSUNG. All rights reserved.

			Contents
	2.6.3.	Fuser unit temperature control........................................................................................	2 − 32
2.7.	Laser Scanning Unit (LSU)........................................................................................................		2 − 33
	2.7.1.	Laser Scanning Unit Overview.......................................................................................	2 − 33
	2.7.2.	Laser Scanning Optical path ..........................................................................................	2 − 34
2.8.	Drive System ..........................................................................................................................		2 − 35
	2.8.1.	Drive Motors..............................................................................................................	2 − 35
	2.8.2.	Main Drive Unit..........................................................................................................	2 − 37
	2.8.3.	Exit Drive Unit ...........................................................................................................	2 − 38
	2.8.4.	Tray Lifting Drive Unit.................................................................................................	2 − 39
2.9.	Scanner System.......................................................................................................................		2 − 40
	2.9.1.	Scanner system overview..............................................................................................	2 − 40
	2.9.2.	Scanner System Components.........................................................................................	2 − 41
2.10.	Hardware Configuration............................................................................................................		2 − 42
	2.10.1.	Main board.................................................................................................................	2 − 44
	2.10.2.	MSOK ......................................................................................................................	2 − 45
	2.10.3.	SO-DIMM PBA..........................................................................................................	2 − 46
	2.10.4.	Fax Card....................................................................................................................	2 − 46
	2.10.5.	OPE..........................................................................................................................	2 − 47
	2.10.6.	USB Host PBA ...........................................................................................................	2 − 48
	2.10.7.	SMPS board ...............................................................................................................	2 − 49
	2.10.8.	Fuser Drive Board (FDB)..............................................................................................	2 − 51
	2.10.9.	HVPS board ...............................................................................................................	2 − 53
	2.10.10. SCF board..................................................................................................................		2 − 54
	2.10.11. Eraser PBA ................................................................................................................		2 − 55
	2.10.12. Cover-Open PBA ........................................................................................................		2 − 55
	2.10.13. Deve_Toner Crum Joint PBA.........................................................................................		2 − 56
	2.10.14. Toner Remain Sensor PBA............................................................................................		2 − 56
	2.10.15. Joint PBA ..................................................................................................................		2 − 57
	2.10.16. EEPROM PBA ...........................................................................................................		2 − 58
	2.10.17. CRUM PBA...............................................................................................................		2 − 58
3. Disassembly and Reassembly ................................................................................................................			3 − 1
3.1.	Precautions when replacing parts ..................................................................................................		3 − 1
	3.1.1.	Precautions when assembling and disassembling .................................................................	3 − 1
	3.1.2.	Precautions when handling PBA.......................................................................................	3 − 1
	3.1.3.	Releasing Plastic Latches................................................................................................	3 − 2
3.2.	Replacing the maintenance part ....................................................................................................		3 − 3
	3.2.1.	Fuser Unit....................................................................................................................	3 − 3
	3.2.2.	Transfer Roller..............................................................................................................	3 − 4
	3.2.3.	Pick-Up_Forward roller..................................................................................................	3 − 5
	3.2.4.	DSDF pick up roller Assy ...............................................................................................	3 − 6

Copyright© 1995-2016 SAMSUNG. All rights reserved.

ii

Contents

	3.2.5.	DSDF Reverse roller Assy ..............................................................................................		3 − 7
	3.2.6.	SCF Separation Roller....................................................................................................		3 − 8
	3.2.7.	SCF Pick-up Roller and Forward Roller.............................................................................		3 − 9
3.3. Replacing the main SVC part .....................................................................................................				3 − 10
	3.3.1.	Rear Cover.................................................................................................................		3 − 10
	3.3.2.	Front Cover................................................................................................................		3 − 11
	3.3.3.	Right_Left Cover ........................................................................................................		3 − 12
	3.3.4.	DSDF Unit.................................................................................................................		3 − 14
	3.3.5.	OPE Unit...................................................................................................................		3 − 15
	3.3.6.	Platen Unit.................................................................................................................		3 − 16
	3.3.7.	Middle Cover .............................................................................................................		3 − 17
	3.3.8.	HDD (Hard Disk Drive)................................................................................................		3 − 20
	3.3.9.	Main Board................................................................................................................		3 − 21
	3.3.10.	Joint PBA	..................................................................................................................	3 − 22
	3.3.11.	SMPS and FDB (Fuser Drive Board)...............................................................................		3 − 23
	3.3.12.	OPC motor and Main motor ..........................................................................................		3 − 24
	3.3.13.	Main Drive Unit..........................................................................................................		3 − 25
	3.3.14.	Duplex clutch and Pick up clutch....................................................................................		3 − 26
	3.3.15.	HVPS board ...............................................................................................................		3 − 27
	3.3.16.	Exit Unit....................................................................................................................		3 − 28
	3.3.17.	LSU..........................................................................................................................		3 − 29
	3.3.18.	Eraser Lamp PBA........................................................................................................		3 − 30
	3.3.19.	Cover Open PBA.........................................................................................................		3 − 31
	3.3.20.	Pick up Assy ..............................................................................................................		3 − 32
	3.3.21.	Second Cassette Feeder (Optional Tray)...........................................................................		3 − 35
		3.3.21.1.	PBA-SCF ....................................................................................................	3 − 35
		3.3.21.2.	Lift Unit ......................................................................................................	3 − 36
		3.3.21.3.	Clutch.........................................................................................................	3 − 37
		3.3.21.4.	Drive Unit ...................................................................................................	3 − 38
4. Troubleshooting..................................................................................................................................				4 − 1
4.1.	Control panel ............................................................................................................................			4 − 1
	4.1.1.	Display screen and useful buttons .....................................................................................		4 − 2
		4.1.1.1.	Menu navigation .............................................................................................	4 − 2
		4.1.1.2.	Home Screen Overview....................................................................................	4 − 3
		4.1.1.3. Customizing your home screen ..........................................................................		4 − 4
		4.1.1.4.	Notification Bar ..............................................................................................	4 − 6
4.2.	Understanding the LEDs .............................................................................................................			4 − 7
4.3.	Updating Firmware		....................................................................................................................	4 − 8
	4.3.1.	Updating from the Printer Control Panel ............................................................................		4 − 8
	4.3.2.	Updating from the Network ............................................................................................		4 − 9

iii	Copyright© 1995-2016 SAMSUNG. All rights reserved.

				Contents
4.4.	JAM removal..........................................................................................................................			4 − 12
	4.4.1. Clearing original document jams ....................................................................................			4 − 12
	4.4.2.	Clearing paper jams .....................................................................................................		4 − 15
4.5.	Service Mode..........................................................................................................................			4 − 24
	4.5.1. Entering the Service Mode ............................................................................................			4 − 24
	4.5.2. Service Mode Menu Tree .............................................................................................			4 − 25
	4.5.3.	Information ................................................................................................................		4 − 29
		4.5.3.1.	General .......................................................................................................	4 − 29
		4.5.3.2.	Supply Status ...............................................................................................	4 − 29
		4.5.3.3.	Software Version...........................................................................................	4 − 29
		4.5.3.4.	Service Hours...............................................................................................	4 − 30
		4.5.3.5.	Fault Log.....................................................................................................	4 − 30
		4.5.3.6.	Print Reports ................................................................................................	4 − 30
		4.5.3.7.	Export Reports..............................................................................................	4 − 30
	4.5.4.	Maintenance Counts.....................................................................................................		4 − 31
		4.5.4.1.	Fault Count .................................................................................................	4 − 31
		4.5.4.2.	Jam Count ...................................................................................................	4 − 31
		4.5.4.3.	Part Replacement Count .................................................................................	4 − 32
	4.5.5.	Diagnostics ................................................................................................................		4 − 33
		4.5.5.1.	Engine Diagnostics........................................................................................	4 − 33
		4.5.5.2.	Fax Diagnostics ............................................................................................	4 − 37
		4.5.5.3.	Scanner Diagnostics.......................................................................................	4 − 40
		4.5.5.4.	Adjustment ..................................................................................................	4 − 42
	4.5.6.	Service Functions ........................................................................................................		4 − 47
		4.5.6.1.	Main Memory Clear ......................................................................................	4 − 47
		4.5.6.2.	Hard Disk Maintenance..................................................................................	4 − 47
		4.5.6.3.	Network Port................................................................................................	4 − 47
		4.5.6.4.	Debug Log...................................................................................................	4 − 48
		4.5.6.5.	Capture Log .................................................................................................	4 − 48
		4.5.6.6.	Network Packet Capture .................................................................................	4 − 49
		4.5.6.7.	System Recovery ..........................................................................................	4 − 50
		4.5.6.8.	Clear System Cache.......................................................................................	4 − 51
		4.5.6.9.	Hibernation..................................................................................................	4 − 51
		4.5.6.10.	Paper Low Warning Message...........................................................................	4 − 52
		4.5.6.11.	Part Replacement Alert...................................................................................	4 − 52
		4.5.6.12.	FDI ............................................................................................................	4 − 52
		4.5.6.13.	EIUL (End of Image Unit Life)........................................................................	4 − 52
		4.5.6.14.	SFE (Special Feature Enablement)....................................................................	4 − 52
4.6. Error Code and Troubleshooting .................................................................................................				4 − 54
	4.6.1. Ax-xxxx type error code ...............................................................................................			4 − 58

Copyright© 1995-2016 SAMSUNG. All rights reserved.

iv

Contents

		4.6.2. Cx-xxxx type error code ...............................................................................................	4 − 67
		4.6.3. H1-xxxx type (Optional Cassette) error code.....................................................................	4 − 75
		4.6.4. Mx-xxxx type error code...............................................................................................	4 − 93
		4.6.5. Sx-xxxx type error code..............................................................................................	4 − 106
		4.6.6. U1-xxxx type (Fuser) error code....................................................................................	4 − 111
		4.6.7. U2-xxxx type (LSU) error code....................................................................................	4 − 118
		4.6.8. U3-xxxx type(DSDF) error code ..................................................................................	4 − 119
	4.7.	Image quality problem............................................................................................................	4 − 121
	4.8.	Other problems......................................................................................................................	4 − 135
5.	System Diagram..................................................................................................................................		5 − 1
	5.1.	Block Diagram..........................................................................................................................	5 − 1
	5.2.	Connection Diagram...................................................................................................................	5 − 2
6.	Reference Information..........................................................................................................................		6 − 1
	6.1.	Tool for Troubleshooting.............................................................................................................	6 − 1
	6.2.	Glossary...................................................................................................................................	6 − 2
	6.3. The Sample Pattern for the Test ....................................................................................................		6 − 8
	6.4. Model Name and Code ...............................................................................................................		6 − 9
	6.5.	Document Revision List............................................................................................................	6 − 10

v	Copyright© 1995-2016 SAMSUNG. All rights reserved.

1. Precautions

1. Precautions

In order to prevent accidents and damages to the equipment please read the precautions listed below carefully before servicing the product and follow them closely.

1.1. Safety warning

1)Only to be serviced by a factory trained service technician.

High voltages and lasers inside this product are dangerous. This product should only be serviced by a factory trained service technician.

2)Use only Samsung replacement parts.

There are no user serviceable parts inside the product. Do not make any unauthorized changes or additions to the product as these could cause the product to malfunctions and create an electric shocks or fire hazards.

3)Laser Safety Statement

The printer is certified in the U.S. to conform to the requirements of DHHS 21 CFR, chapter 1 Subchapter J for Class I(1) laser products, and elsewhere is certified as a Class I laser product conforming to the requirements of IEC/EN 60825-1:2014. Class I laser products are not considered to be hazardous. The laser system and printer are designed so there is never any human access to laser radiation above a Class I level during normal operation, user maintenance or prescribed service condition.

•Wavelength: 800 nm

•Beam divergence

-Parallel: 11 degrees

-Perpendicular: 35 degrees

•Maximum power of energy output: 12 mW

WARNING

Never operate or service the product with the protective cover removed from Laser/Scanner assembly. The reflected beam, although invisible, can damage your eyes.

When using this product, these basic safety precautions should always be followed to reduce risk of fire, electric shock, and personal injury.

4) Lithium battery not replaceable by user

Copyright© 1995-2016 SAMSUNG. All rights reserved.

1-1

1. Precautions

1.2. Caution for safety

1.2.1. Toxic material

This product contains toxic materials that could cause illness if ingested.

1)Please keep imaging unit and toner cartridge away from children. The toner powder contained in the imaging unit and toner cartridge may be harmful, and if swallowed, you should contact a doctor.

1.2.2. Electric shock and fire safety precautions

Failure to follow the following instructions could cause electric shock or potentially cause a fire.

1)Use only the correct voltage, failure to do so could damage the product and potentially cause a fire or electric shock.

2)Use only the power cable supplied with the product. Use of an incorrectly specified cable could cause the cable to overheat and potentially cause a fire.

3)Do not overload the power socket, this could lead to overheating of the cables inside the wall and could lead to a fire.

4)Do not allow water or other liquids to spill into the product, this can cause electric shock. Do not allow paper clips, pins or other foreign objects to fall into the product, these could cause a short circuit leading to an electric shock or fire hazard.

5)Never touch the plugs on either end of the power cable with wet hands, this can cause electric shock. When servicing the product, remove the power plug from the wall socket.

6)Use caution when inserting or removing the power cord. When removing the power cord, grip it firmly and pull. The power cord must be inserted completely, otherwise a poor contact could cause overheating leading to a fire.

7)Take care of the power cable. Do not allow it to become twisted, bent sharply around corners or power cable may be damaged. Do not place objects on top of the power cable. If the power cable is damaged it could overheat and cause a fire. Exposed cables could cause an electric shock. Replace the damaged power cable immediately, do not reuse or repair the damaged cable. Some chemicals can attack the coating on the power cable, weakening the cover or exposing cables causing fire and shock risks.

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1. Precautions

8)Ensure that the power sockets and plugs are not cracked or broken in any way. Any such defects should be repaired immediately. Take care not to cut or damage the power cable or plugs when moving the machine.

9)Use caution during thunder or lightning storms. Samsung recommends that this machine be disconnected from the power source when such weather conditions are expected. Do not touch the machine or the power cord if it is still connected to the wall socket in these weather conditions.

10)Avoid damp or dusty areas, install the product in a clean well ventilated location. Do not position the machine near a humidifier or in front of an air conditioner. Moisture and dust built up inside the machine can lead to overheating and cause a fire or cause parts to rust.

11)Do not position the product in direct sunlight. This will cause the temperature inside the product to rise possibly leading to the product failing to work properly and in extreme conditions could lead to a fire.

12)Do not insert any metal objects into the machine through the ventilator fan or other part of the casing, it could make contact with a high voltage conductor inside the machine and cause an electric shock.

13)	When replacing the SMPS board, please wait 5 minutes after unplugging the power cord, then replace it. You

can get a shock by the electric discharge.

Copyright© 1995-2016 SAMSUNG. All rights reserved.

1-3

1. Precautions

1.2.3. Handling precautions

The following instructions are for your own personal safety to avoid injury and so as not to damage the product.

1)Ensure the product is installed on a level surface, capable of supporting its weight. Failure to do so could cause the product to tip or fall.

2)The product contains many rollers, gears and fans. Take great care to ensure that you do not catch your fingers, hair or clothing in any of these rotating devices.

3)Do not place any small metal objects, containers of water, chemicals or other liquids close to the product which if spilled could get into the machine and cause damage or a shock or fire hazard.

4)Do not install the machine in areas with high dust or moisture levels, beside on open window or close to a humidifier or heater. Damage could be caused to the product in such areas.

5)Do not place candles, burning cigarettes, etc on the product, These could cause a fire.

6)Ensure that the machine is installed and used in proper area to meet the temperature and humidity specifications.

•If the machine is stored at below zero Celsius for a long time, do not use the machine instantly after movement. It can malfunction. Take care of the machine storage. If the machine is stored at below zero Celsius for a long time, keep the machine at room temperature and install it.

1.2.4. Assembly and Disassembly precautions

1)Replace parts carefully and always use Samsung parts. Take care to note the exact location of parts and also cable routing before dismantling any part of the machine. Ensure all parts and cables are replaced correctly. Please carry out the following procedures before dismantling the product or replacing any parts.

2)Ensure that power is disconnected before servicing or replacing any electrical parts.

3)Disconnect interface cables and power cables.

4)Only use approved spare parts. Ensure that part number, product name, any voltage, current or temperature rating are correct.

5)When removing or re-fitting any parts do not use excessive force, especially when fitting screws into plastic.

6)Take care not to drop any small parts into the machine.

7)Handling of the OPC Drum

•The OPC Drum can be irreparably damaged if it exposed to light. Take care not to expose the OPC Drum either to direct sunlight or to fluorescent or incandescent room lighting. Exposure for as little as 5 minutes can damage the surface of the photoconductive properties and will result in print quality degradation. Take extra care when servicing the product. Remove the OPC Drum and store it in a black bag or other lightproof container. Take care when working with the Covers (especially the top cover) open as light is admitted to the OPC area and can damage the OPC Drum.

•Take care not to scratch the green surface of OPC Drum Unit. If the green surface of the Drum Cartridge is scratched or touched the print quality will be compromised.

1-4	Copyright© 1995-2016 SAMSUNG. All rights reserved.

1. Precautions

1.2.5. Disregarding this warning may cause bodily injury

1)Be careful with the high temperature part.

The fuser unit works at a high temperature. Use caution when working on the printer. Wait for the fuser unit to cool down before disassembly.

2)Do not put fingers or hair into the rotating parts.

When operating a printer, do not put hand or hair into the rotating parts (Paper feeding entrance, motor, fan, etc.). If do, you can get harm.

3)When you move the printer, use safe lifting and handling techniques.

This printer is heavy. Use the lifting handles located on each side of the machine. Back injury could be caused if you do not lift carefully.

4)Ensure the printer is installed safely.

Ensure the printer is installed on a level surface, capable of supporting its weight. Failure to do so could cause the printer to tip or fall possibly causing personal injury or damaging the printer.

5)Do not install the printer on a sloping or unstable surface. After installation, double check that the printer is stable.

Copyright© 1995-2016 SAMSUNG. All rights reserved.

1-5

1. Precautions

1.3. ESD precautions

Certain semiconductor devices can be easily damaged by static electricity. Such components are commonly called “Electrostatically Sensitive (ES) Devices” or ESDs. Examples of typical ESDs are: integrated circuits, some field effect transistors, and semiconductor “chip” components. The techniques outlined below should be followed to help reduce the incidence of component damage caused by static electricity.

CAUTION

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

1)Immediately before handling a semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, employ a commercially available wrist strap device, which should be removed for your personal safety reasons prior to applying power to the unit under test.

2)After removing an electrical assembly equipped with ESDs, place the assembly on a conductive surface, such as aluminum or copper foil, or conductive foam, to prevent electrostatic charge buildup in the vicinity of the assembly.

3)Use only a grounded tip soldering iron to solder or desolder ESDs.

4)Use only an “anti-static” solder removal device. Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ESDs.

5)Do not use Freon-propelled chemicals. When sprayed, these can generate electrical charges sufficient to damage ESDs.

6)Do not remove a replacement ESD from its protective packaging until immediately before installing it. Most replacement ESDs are packaged with all leads shorted together by conductive foam, aluminum foil, or a comparable conductive material.

7)Immediately before removing the protective shorting material from the leads of a replacement ESD, touch the protective material to the chassis or circuit assembly into which the device will be installed.

8)Maintain continuous electrical contact between the ESD and the assembly into which it will be installed, until completely plugged or soldered into the circuit.

9)Minimize bodily motions when handling unpackaged replacement ESDs. Normal motions, such as the brushing together of clothing fabric and lifting one’s foot from a carpeted floor, can generate static electricity sufficient to damage an ESD.

1-6	Copyright© 1995-2016 SAMSUNG. All rights reserved.

1. Precautions

1.4. Caution for Data Loss

To prevent loss of customers data the SVC engineer provides end-user with relevant information in advance.

Copyright© 1995-2016 SAMSUNG. All rights reserved.

1-7

2. Product Specifications and Description

2. Product Specifications and Description

2.1. Product Overview

• Printing Speed (Mono)

• Up to 45 ppm in A4 (47 ppm in Letter)

• Processor

• Dual core CPU 1GHz

• Memory

• 4GB (2GB for Android OS)

• 320 GB HDD

2-1	Copyright© 1995-2016 SAMSUNG. All rights reserved.

2. Product Specifications and Description

2.2. Specifications

Product Specifications are subject to change without notice.

2.2.1. General Specification

Item			Specification
Processor	CPU		1GHz (C4N + A1000 )
	Operational Panel		10.1" Touch-Screen LCD
User Interface	LED		2 EA (Power / Status)
	Key / Button		1 EA (Power)
	Total (with		4 GB
	Android OS)
	Standard (without		2 GB
	Android OS)		(User Available Space for Android OS: 1GB)
Memory			N/A
	Expansion
			NOTE
	(Optional)		The standard memory size of the product manufactured before the 1st.Nov.2014 is
			1GB. These models can install 2GB optional memory.
Storage	Standard		320 GB HDD
			(User Available Space: 279 GB)
	USB (Device)		Hi-Speed USB 2.0
	USB (Host)		Hi-Speed USB 2.0
	USB (EDI)		Yes
Interface	Wired LAN		Std (Ethernet 10/100/1000 Base TX)
	Additional Wired		N/A
	LAN Support
	Wireless LAN		Option (IEEE 802.11b/g/n)
	NFC		Option (Active)
	From Sleep		Less than 23 sec
Warmup Time
	Power Off		Less than 25 sec
	Ready		less than 30W
	Normal operation		900W
Power	Max/Peak		900W
Consumption	Sleep		1.8W
	Power Off		0.45W
	TEC		2.9KWh/week
Default Sleep Delay Time			1 min
Max. Sleep Delay Time			60 min

Copyright© 1995-2016 SAMSUNG. All rights reserved.

2-2

2. Product Specifications and Description

	Item		Specification
	Power		Europe : AC 220~240V / 50Hz / 5A
		Input Voltage	USA : AC 100~127V / 60Hz / 10A
	Requirement
			Korea : AC 220~240V / 50/60Hz / 5A
		Printing Simplex /	Less than 54 dBA (Sound Pressure)
	Acoustic Noise	Duplex
		Copying	Less than 56 dBA (Sound Pressure) (@Tray1 DSDF copy)
	Level (Sound
	Power / Pressure)	Standby	Less than 30 dBA (Sound Pressure, Background Noise Only)
		Sleep	Background Noise Level
	Dimension (W x D	Set (mm)
		(without any	530 x 459.5 x 649 mm (20.9' x 18.1' x 25.5' )
	x H)
		options)
		Set (Kg)
	Weight	(with supplies	32.04 Kg (70.63 lb)
		/ without any
		options)
		Recommended	2,000 ~ 10,000 Images
	Reliability &	Monthly Print
		Volume
	Service
		Max Monthly Duty	200,000 Images
		Cycle
	Temperature	Operating	10 to 32 °C (50 to 90 °F)
		Storage	-20 to 40 °C (-4 to 104 °F)
	Humidity	Operating	20 to 80% RH
		Storage	10 to 90% RH

2-3	Copyright© 1995-2016 SAMSUNG. All rights reserved.

2. Product Specifications and Description

2.2.2. Print Specifications

	Item		Specification
		Simplex	45 ppm in A4 (47 ppm in Letter)
	Print Speed
		Duplex (Simplex	27 ipm in A4 (28 ipm in Letter)
		to Duplex)
		From Ready	As fast as 6.5 sec
	FPOT	From Sleep	Less than 23 sec
		From Coldboot	Less than 36 sec
	Resolution	Optical	Up to 1,200 x 600 dpi
		Enhanced	Up to 1,200 x 1,200 dpi effective output (1,200 x 600 x 2 bit)
	Printer Languages		PCL5e / PCL6 / PostScript3 / PDF Direct V1.7
	Font	PCL	111 Scalable Fonts (Include OCR-A / OCR-B) / 1 Bitmap
		Postscript3	136 Scalable Fonts
		Windows	XP(32/64bit) / Vista(32/64bit) / 2003 Server(32/64bit) / 2008 Server(32/64bit) /
			Win7(32/64bit) / 2008 Server R2(64bit) / Win8(32/64bit) / Win8.1(32bit/64bit) /
			2012 Server(64bit) / 2012 Server R2(64bit)
		Linux	• RedHat® Enterprise Linux WS 5, 6
			• Fedora 11, 12, 13, 14, 15, 16, 17, 18, 19
			• OpenSuSE® 11.0, 11.1, 11.2, 11.3, 11.4, 12.1, 12.2, 12.3
	Client OS Support		• Ubuntu 10.04, 10.10, 11.04, 11.10, 12.04, 12.10, 13.04
			• SuSE Linux Enterprise Desktop 10, 11
			• Debian 5.0, 6.0, 7.0, 7.1
			• Mint 13, 14, 15
		UNIX	• Sun Solaris 9,10,11 (x86, SPARC)
			• HP-UX 11.0, 11i v1, 11i v2, 11i v3 (PA-RISC, Itanium)
			• IBM AIX 5.1, 5.2, 5.3, 5.4, 6.1, .7.1 (PowerPC)
		Mac OS	Mac OS: X 10.5 - 10.9,
		Basic	IP assign(Ethernet speed, DHCP), SWS, SNMP, SNTP, SetIP,SLP, DDNS, Mdns,
	Network Protocol		WINS, LPD/LPR, SMB, FTP, SMTP, UPnP
		Advanced	LDAP, Kerberos, IPSec, 802.1x, IPP, WSD
	Duplex Print		Built-in
	Direct Print		Yes
	Max. Print Area
	Print Features		Direct Print / Secure Print

Copyright© 1995-2016 SAMSUNG. All rights reserved.

2-4

2. Product Specifications and Description

2.2.3. Scan specification

	Item		Specification
		B/W (Lineart,	• Duplex : up to 60 ipm (@ 300 dpi)
		Halftone)	• Simplex : up to 35 ipm (@ 300 dpi)
	Scan Speed	Gray	• Duplex : up to 60 ipm (@ 300 dpi)
			• Simplex : up to 35 ipm (@ 300 dpi)
		Color	• Duplex : up to 60 ipm (@ 300 dpi)
			• Simplex : up to 35 ipm (@ 300 dpi)
	Color Mode		Mono / Gray / Color
			• Windows : TWAIN / WIA
	Compatibility		•	Mac : TWAIN / ICDM
			•	Linux : SANE
	Scan method		3ch Digital CIS Module
		Optical (ADF)	Up to 600 x 600 dpi
	Resolution	Optical (Platen)	Up to 600 x 600 dpi
		Enhanced (ADF)	Up to 4,800 x 4,800 dpi
		Enhanced (Platen)	Up to 4,800 x 4,800 dpi
			TIFF / JPEG / PDF / XPS
	File Formats		PDF ( Compact PDF / PDF/A / PDF Encryption / Searchable PDF / Digital signature
			PDF )
	Scan Destinations		HDD(Shared Folder) / USB / Email / Client(NetScan) / SMB / FTP
	Scan Multi Destinations		Yes
	Communication Protocol		SMTP / MIME (Base 64)
	Scan Size	ADF	Max. 216 mm x 356 mm (8.5" x 14")
		Platen	Max. 216 mm x 356 mm (8.5" x 14")
	Scan Original Types		Text / Text,Photo / Photo
	Scan Features		DSDF

2-5	Copyright© 1995-2016 SAMSUNG. All rights reserved.

2. Product Specifications and Description

2.2.4. Copy specification

	Item		Specification
		SDMC (Single	45 cpm in A4
		Document
			(47 cpm in Letter)
		Multiple Copy)
	Copy Speed
		MDMC (Multiple	35 cpm in A4
		Document
			(36 cpm in Letter)
		Multiple Copy)
		From Ready	• Less than 6.5 sec @ Platen
			• Less than 7.5 sec @ DSDF
	FCOT	From Sleep	• Less than 23.0 sec @ Platen
			• Less than 24.0 sec @ DSDF
		From Coldboot	• Less than 36.0 sec @ Platen
			• Less than 37.0 sec @ DSDF
		DSDF	•	Scan: 600 x 600 dpi (Optical)
			• Printing : up to 600 x 600 x 4 bit
	Resolution
		Platen	•	Scan: 600 x 600 dpi (Optical)
			• Printing : up to 600 x 600 x 4 bit
	Reduce / Enlarge	DSDF	25 - 400 %
		Platen	25 - 400 %
	Preset	Reduction	25% / 50% / 70% A4→A5 / 78% Legal→Letter / 81% B5→A5 / 86% A4→B5
		Enlargement	104% Executive→Letter / 141% A5→A4 / 150% / 200% / 400%
	Darkness Control		11 Levels
	Sharpness Control		11 Levels
	Contrast Control		11 Levels
	Multi Copy		1 - 9999
	Duplex Copy		Built-in
	Copy Original Type		Text / Text/Photo /Photo
	Copy Features		N-Up / Booklet / Book Copy / Poster Copy / Image Repeat / Watermark / Stamp
			/ Overlay / Erase Edge / Image Shift / Covers / Background Adjustment / Mirror
			Image / Negative Image / Build Job / Proof Copy / ID Copy / Save to Box

Copyright© 1995-2016 SAMSUNG. All rights reserved.

2-6

2. Product Specifications and Description

2.2.5. Fax specification

Item			Specification
Compatibility			ITU-T G3 / Super G3
Communication System			PSTN / PABX
Modem Speed			33.6 Kbps
TX Speed			3 Sec (Mono / Standard / ECM-MMR / MemoryTx / ITU-T G3 No.1 Chart)
		Standard	5 Sec / LTR
Scan speed		Fine	5 Sec / LTR
		S.Fine	6 Sec / LTR
		Std	203 x 98 dpi
Resolution (Mono)		Fine	203 x 196 dpi
		S.Fine	300 x 300 dpi
		Ultra Fine	600 x 600 dpi
Compression Method			MH / MR / MMR / JBIG
Fax Memory (Standard / Max.)			HDD Shared MB/Shared pages
Dual Lines			N/A
		Handset	No
		On hook Dial	Yes
		Search	Yes (Address Book)
		1-Touch Dial	No
		Speed Dial	500 locations
		TAD I/F	Yes
		Tone/Pulse	Yes
		Pause	Yes
		Auto Redial	Yes
Fax Features		Last Number	Yes
		Redial
		Distinctive Ring	Yes
		Caller ID	Yes
		External Phone	Yes
		Interface
		Fax Forward to	Yes
		E-Mail
		Fax to PC	No
		Broadcasting	500 Locations
		Delayed Fax	Yes
		Color Fax	No

2-7	Copyright© 1995-2016 SAMSUNG. All rights reserved.

			2. Product Specifications and Description
2.2.6. Paper Handling specification
Item		Specification
	Standard	550-sheet cassette Tray (20 lb or 75 g/m²)
		(520 Sheets @ 80 g/m²)
	Multipurpose	100-sheet MP tray (80 g/m²)
Input Capacity
	Other Options	550-sheet cassette Tray (20 lb or 75 g/m²)
		(520 Sheets @ 80 g/m²)
	Maximum	2,300 Sheet Cassette Tray (550 Std + 100 MP + 3 x 550 SCF) (@ 75 g/m²)
		(2,180 @ 80 g/m²)
	Capacity	550 sheets @ 20 lb (75 g/m²)
		(520 Sheets @ 80 g/m²)
		A4 / Letter / Legal / Oficio / Folio / JIS B5 / ISO B5 / Executive / A5 / Statement
	Media sizes	/ A6 / PostCard 4x6 / Envelope B5 / Envelope Monarch / Envelope COM-10->
		Envelope No 10 / Envelope DL / Envelope C5 / Envelope C6 / Custom
	Media types	Plain Paper / Thin Paper / Bond / Punched / Pre-Printed / Recycled / Envelope
		/	Label / CardStock / Letterhead / Thick / Colored->Color / Archive / Cotton
Standard Cassette		• Supported Weight : 60 - 163 g/m² (16 - 43 lb)
		• Thin Paper (60 - 69 g/m²)
Tray		• Plain Paper (70 - 90 g/m²)
	Media weight
		• Thick Paper (91 - 120 g/m²)
		• Bond Paper (105 - 120 g/m²)
		•	Cardstock (121 - 163 g/m²)
		• H/W Install Detect: Yes
	Sensing	• Paper Empty & Low Level Detect: Yes
		• Paper Type Detect: No
		• Paper Size Detect: Yes
	Capacity	•	Plain Paper: 100 sheets
	Media sizes	Min : 76.2 mm x 127 mm (3" x 5")
		Max : 216 mm x 356 mm (8.5" x 14.0")
	Media type	Plain / Thin / Bond / Pre-printed / Recycled / Envelope / Label / Cardstock / Thick /
		Cotton / Color / Archive / Thicker
	Media weight	• Supported Weight : 60 - 220 g/m² (16 ~ 59 lb)
MP(Multipurpose)		• Thin Paper (60 - 69 g/m²)
		• Plain Paper (70 - 90 g/m²)
Tray
		• Thick Paper (90 - 120 g/m²)
		• Bond Paper (105 - 120 g/m²)
		•	Cardstock (121 - 163 g/m²)
		• Thicker Paper (164 - 220 g/m²)
	Sensing	•	Paper Empty Detect: Yes
		• Paper Type Detect: No
		• Paper Size Detect: No

Copyright© 1995-2016 SAMSUNG. All rights reserved.

2-8

2. Product Specifications and Description

	Item		Specification
		Capacity	50 sheets ( 21lb, 80 g/m²)
		Duplex Document	Yes
	DSDF	Scanning
		Document Size	•	Width: 105 ~ 216 mm (4.1" ~ 8.5")
	(Dual Scan
			• Length : 148 ~ 356 mm (5.8" ~ 14")
	Document Feeder)
			• Paper empty detect : Yes
		Sensing	•	Paper width detect : No
			• Paper length detect : No
		Stacking Capacity	500 sheets @ 20 lb (75 g/m²)
		(Face Down)
	Output Capacity
		Output Full	Yes
		sensing
		Max. Size	216 x 356 mm (8.5" x 14")
	Printing size	Min. Size	76 x 127 mm (3" x 5")
		Margin(T/B/L/R)	T/B/L/R : 1 mm
		Support	Built-in
	Duplex Printing	Media sizes	A4, Letter, Legal, Oficio, Folio
		Media types	Plain, Thin, Thick, Recycled, Pre-Printed, punched, Letterhead
		Media weight	16~32 lb (60 ~ 120 g/m²)

2-9	Copyright© 1995-2016 SAMSUNG. All rights reserved.

2. Product Specifications and Description

2.2.7. Software and solution specification

	Item		Specification
		Anyweb Print	Windows
		Easy Printer Manager	Windows / Mac
		Easy Color Manager	N/A
		Easy Document	Windows
		Creator
		Net PC Fax	Windows
	Application
		Direct Printing Utility	Windows
		Easy Deployment	Windows
		Manager
		Easy Eco Driver	Windows
		Universal Printer	Windows
		Driver
		Universal Scan Driver	Windows
		GCP (Google Cloud	Yes
	Mobile Printing	Print)
		AirPrint	No
		Device Management	SyncThru
		Output Management	CounThru
	Solution	Document	SmarThruWorkFlow
		Management and
		Distribution
		Security	SecuThru
		Mobility	SCP
		Authentication (Local)	Yes
		Authentication	Yes (Kerberos / SMB / LDAP)
		(Network)
		IP Address Filtering	IPv4 Filtering / IPv6 Filtering / MAC Filtering
		HDD Overwrite	MIO Only (Manual Image Ovewrite)
		(Standard)
		HDD Overwrite (Max.	9
	Security	Overwrites)
		Secure Print	Yes
		Encrypted Secure Print	Yes
		Encrypted PDF Mode	Yes
		(Encrypted Scanning)
		IP Sec	Yes
		Smart Card	N/A
		Authentication
		Others	Watermark

Copyright© 1995-2016 SAMSUNG. All rights reserved.

2-10

2. Product Specifications and Description

2.2.8. Supplies

Items		Model Name	Life	M4580FX	M4583FX
	Initial	-	7,000 pages	-	-
	Standard	MLT-D304S	7,000 pages	X	O
Toner Cartridge *	High Yield	MLT-D304L	20,000 pages	X	O
	Extra High Yield	MLT-D304E	40,000 pages	X	O
		MLT-D303E	40,000 pages	O	X
Imaging Unit **		MLT-R303	100,000 pages	O	X
		MLT-R304	100,000 pages	X	O

NOTE

*Declared yield value in accordance with ISO/IEC 19752. The number of pages may be affected by operating environment, printing interval, graphics, media type and media size.

**Based on simplex 3 average letter/A4-size pages per print job and 5% coverage. Actual Yield may vary based on other factors such as device speed, media type, media size, toner coverage, tray source, average print job complexity, ratio of simplex

/ duplex printing and operating environment.

2-11	Copyright© 1995-2016 SAMSUNG. All rights reserved.

			2. Product Specifications and Description
2.2.9. Maintenance Parts
Items	Part Code			Life
Fuser Unit	•	JC91-01177A (220V)		150,000 pages
	•	JC91-01176A (110V)
Transfer Roller Assy	JC93-00393A			200,000 pages
Tray 1 Roller (Pick up/Forward)	JC97-02259A			200,000 pages
Tray 1 Reverse roller	JC97-02259A			100,000 pages
Pick up/ Forward roller (for Tray2~4)	JC97-02259A			200,000 pages
Reverse roller (for Tray2~4)	JC97-02259A			100,000 pages
MP Roller	JC73-00295A			100,000 pages
MP Reverse roller	JC73-00328A			100,000 pages
DSDF Roller	JC82-00378A			100,000 pages
(A/S ASSY-PICK UP HOUSING)
DSDF separate roller	JC82-00380A			100,000 pages
(A/S ASSY-SEPARATE ROLLER)

NOTE

Depending on the print patterns and job mode used, the lifespan may differ.

Copyright© 1995-2016 SAMSUNG. All rights reserved.

2-12

2. Product Specifications and Description

2.2.10. Option

Option List

Item	Model	Remark
Second Cassette Feeder	SL-SCF4500	550 Sheets (@75gsm)
Stand	SL-DSK001S	-
Memory Upgrade Kit	SL-MEM001	2 GB
Wireless LAN	SL-NWE001X	Wireless + NFC

Option Specification

Model	Item	Specification
	Model Name	SL-SCF4500
	Capacity	550 Sheets (@75gsm) (520sh @80gsm)
	Media Sizes	A4 / Letter / Legal / Oficio / Folio / JIS B5 / ISO B5 / Executive / A5
		/ Statement / A6 / Custom
	Media types	Plain / Thin / Recycled / Thick / Archive / Bond / Cardstock
	Media weight	•	Supported Weight: 60 - 163 g/ (16 - 43 lb)
		• Thin Paper (60 - 70 g/)
		• Plain Paper (70 - 90 g/)
Second Cassette		• Thick Paper (90 - 105 g/)
Tray(Feeder)		• Bond Paper (105 - 120 g/)
		•	Cardstock: (121 - 163 g/)
	Sensing	•	H/W Install Detect : Yes
		• Paper Empty : Yes
		• Paper Type Detect : No
		• Paper Size Detect : No
	Dimension (W x D x	433 x 459.3 x 145.8 mm
	H)
	Weight	9.8 kg (21.6 lb)
	Model Name	SL-DSK001S
Stand	Dimension (W x D x	480 x 553 x 120 mm
	H)
	Weight	13.3 kg (29.3 lb)
Memory Upgrade Kit	Model Name	SL-MEM001
	Size	2 GB
Wireless LAN	Model Name	SL-NWE001X (Wireless + NFC)

2-13	Copyright© 1995-2016 SAMSUNG. All rights reserved.

2. Product Specifications and Description

2.3. System Configuration

1) Front View

1	Dual scan document feeder cover
2	Dual scan document feeder width guides
3	Dual scan document feeder input tray
4	Dual scan document feeder output tray
5	Control panel
6	Control board cover
7	Front cover
8	Handle
9	Optional tray
10	Stand
11	Tray handle

12	Tray 1
13	Multi-purpose tray
14	Push-release of Multi-purpose tray
15	Front cover release button
16	Output tray
17	Output support tray
18	USB memory port
19	Scanner glass
20	Scanner lid

Copyright© 1995-2016 SAMSUNG. All rights reserved.

2-14

2. Product Specifications and Description

2) Inner view

1Toner cartridges

2Imaging unit

3Multi-purpose support tray

4Paper width guides on a multi-purpose tray

2-15	Copyright© 1995-2016 SAMSUNG. All rights reserved.

2. Product Specifications and Description

3) Rear View

1	Rear cover handle
2	Rear cover
3	Extension telephone socket (EXT.)
4	Telephone line socket (LINE)
5	Network port
6	EDI port for card reader
7	USB port

8 5V output port for IEEE 1284B parallel connector

NOTE

•Optional feature

•To use the optional IEEE 1284B parallel connector, plug it to the UBS port and the 5V output port.

9 Power-switch

10 Power receptacle

Copyright© 1995-2016 SAMSUNG. All rights reserved.

2-16

2. Product Specifications and Description

System Layout

1	DSDF		8	Pick up roller / Retard roller/ Forward roller
2	SCANNER		9	MP tray
3	Exit		10	Imaging Unit
4	LSU		11	Toner Cartridge
5	Fuser Unit		12	OPE
6	Cassette
7	Optional tray (SCF)

2-17	Copyright© 1995-2016 SAMSUNG. All rights reserved.