SEMICONDUCTOR TECHNICAL DATA
2–1
REV 1
Motorola, Inc. 1996
11/95
The MC10E411 is a low skew 1-to-9 differential driver, designed with
clock distribution in mind. The MC10E411’s function and performance are
similar to the popular MC10E111, with the added feature of 1.2V output
swings. It accepts one signal input, which can be either differential or
single-ended if the VBB output is used. The signal is fanned out to 9
identical differential outputs.
• 200ps Part-to-Part Skew
• 50ps Output-to-Output Skew
• Differential Design
• V
BB
Output
• Voltage Compensated Outputs
• V
EE
Range of –4.5 to –5.5V
• 75kΩ Input Pulldown Resistors
The output voltage swing of the E411 is larger than a standard ECL
swing. The 1.2V output swings provide a signal which can be AC coupled
into RAMBus compatible input loads. The larger output swings are
produced by lowering the VOL of the device. With the exception of the
lower VOL, the E411 is identical to the MC10E111. Note that the larger
output swings eliminate the possibility of temperature compensated
outputs, thus the E411 is only available in the 10E style of ECL. In
addition, because the VOL is lower than standard ECL, the outputs cannot
be terminated to –2.0V. This datasheet provides a few termination
alternatives.
The E411 is specifically designed, modeled and produced with low
skew as the key goal. Optimal design and layout serve to minimize gate to
gate skew within a device, and empirical modeling is used to determine
process control limits that ensure consistent tpd distributions from lot to
lot. The net result is a dependable, guaranteed low skew device.
To ensure that the tight skew specification is met it is necessary that both sides of the differential output are terminated, even if
only one side is being used. In most applications, all nine differential pairs will be used and therefore terminated. In the case
where fewer than nine pairs are used, it is necessary to terminate at least the output pairs on the same package side as the
pair(s) being used on that side, in order to maintain minimum skew. Failure to do this will result in small degradations of
propagation delay (on the order of 10–20ps) of the output(s) being used which, while not being catastrophic to most designs, will
mean a loss of skew margin.
The MC10E411, as with most other ECL devices, can be operated from a positive VCC supply in PECL mode. This allows the
E411 to be used for high performance clock distribution in +5.0V systems. Designers can take advantage of the E411’s
performance to distribute low skew clocks across the backplane or the board. In a PECL environment, series or Thevenin line
terminations are typically used as they require no additional power supplies. For more information on using PECL, designers
should refer to Motorola Application Note AN1406/D.
1:9 DIFFERENTIAL
ECL/PECL RAMBUS
CLOCK BUFFER
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
MC10E411
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–2
1
5 6 7 8 9 10 11
25 24 23 22 21 20 19
26
27
28
2
3
4
18
17
16
15
14
13
12
V
EE
NC
IN
V
CC
IN
V
BB
NC
Q
3
Q
3
Q
4
V
CCO
Q
4
Q
5
Q
5
Pinout: 28-Lead PLCC
(Top View)
Q0Q0Q1V
CCO
Q1Q2Q
2
Q
8
Q
7
Q
6
Q
8
V
CCOQ7
Q
6
PIN NAMES
Function
Differential Input Pair
Differential Outputs
VBB Output
Pins
IN, IN
Q0, Q0–Q8, Q
8
V
BB
IN
IN
LOGIC SYMBOL
Q
0
Q
0
Q
1
Q
1
Q
2
Q
2
Q
3
Q
3
Q
4
Q
4
Q
5
Q
5
Q
6
Q
6
Q
7
Q
7
Q
8
Q
8
V
BB
TERMINATION ALTERNATIVES
Z
O
V
CC
VCC – 2.4V
RL = Z
O
* VOH and VOL levels
will vary slightly from
specification table
Z
O
V
CC
V
EE
300
Ω
RAMBus Load
RS = Z
O
EN
MC10E411
2–3 MOTOROLAECLinPS and ECLinPS Lite
DL140 — Rev 4
ECL DC CHARACTERISTICS
0°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
V
OH
Output HIGH Voltage
1
–1.020 –0.840 –0.980 –0.890 –0.810 –0.910 –0.720 V
V
OL
Output LOW Voltage
1
–2.420 –2.140 –2.380 –2.250 –2.110 –2.310 –2.020 V
V
IH
Input HIGH Voltage –1.170 –0.840 –1.130 –0.810 –1.060 –0.720 V
V
IL
Input LOW Voltage –1.950 –1.480 –1.950 –1.480 –1.950 –1.445 V
V
BB
Output Reference Voltage –1.38 –1.27 –1.35 –1.25 –1.31 –1.19 V
V
EE
Power Supply Voltage –4.5 –5.5 –4.5 –5.5 –4.5 –5.5 V
I
IH
Input HIGH Current 150 150 150 µA
I
EE
Power Supply Current 55 65 55 65 55 65 mA
1. Measured with 300Ω to VEE output pulldown.
PECL DC CHARACTERISTICS
0°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
V
OH
Output HIGH Voltage
1,2
3.98 4.16 4.02 4.11 4.19 4.09 4.28 V
V
OL
Output LOW Voltage
1,2
2.58 2.86 2.62 2.75 2.89 2.69 2.98 V
V
IH
Input HIGH Voltage
1
3.83 4.16 3.87 4.19 3.94 4.28 V
V
IL
Input LOW Voltage
1
3.05 3.52 3.05 3.52 3.05 3.56 V
V
BB
Output Reference Voltage
1
3.62 3.73 3.65 3.75 3.69 3.81 V
V
CC
Power Supply Voltage 4.5 5.5 4.5 5.5 4.5 5.5 V
I
IH
Input HIGH Current 150 150 150 µA
I
EE
Power Supply Current 55 65 55 65 55 65 mA
1. These values are for VCC = 5.0V. Level Specifications will vary 1:1 with VCC.
2. Measured with 300Ω to VEE output pulldown.
MC10E411
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–4
AC CHARACTERISTICS (VEE = VEE (min) to VEE (max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit Condition
t
PLH
t
PHL
Propagation Delay to Output
IN (differential)
IN (single-ended)
EN
to Q
400
350
450
600
650
850
430
380
450
630
680
850
500
450
450
700
750
850
ps
Note 1.
Note 2.
t
s
Setup Time EN to IN 200 0 200 0 200 0 ps Note 3.
t
H
Hold Time IN to EN 0 –200 0 –200 0 –200 ps Note 4.
t
R
Release Time EN to IN 300 100 300 100 300 100 ps Note 5.
t
skew
Within-Device Skew
Part-to-Part Skew (Diff)
50
200
50
200
50
200
ps Note 6.
V
PP
Minimum Input Swing 250 250 250 mV Note 7.
V
CMR
Common Mode Range –1.6 –0.4 –1.6 –0.4 –1.6 –0.4 V Note 8.
tr/t
f
Output Rise/Fall Time 275 600 275 600 275 600 ps 20%–80%
1. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the
differential output signals.
2. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal.
3. The setup time is the minimum time that EN
must be asserted prior to the next transition of IN/IN to prevent an output response greater than
±75 mV to that IN/IN
transition (see Figure 1).
4. The hold time is the minimum time that EN
must remain asserted after a negative going IN or a positive going IN to prevent an output response
greater than ±75 mV to that IN/IN
transition (see Figure 2).
5. The release time is the minimum time that EN must be deasserted prior to the next IN/IN transition to ensure an output response that meets
the specified IN to Q propagation delay and output transition times (see Figure 3).
6. The within-device skew is defined as the worst case difference between any two similar delay paths within a single device.
7. VPP(min) is defined as the minimum input differential voltage which will cause no increase in the propagation delay . The VPP(min) is AC limited
for the E411 as a differential input as low as 50 mV will still produce full ECL levels at the output.
8. V
CMR
is defined as the range within which the VIH level may vary, with the device still meeting the propagation delay specification. The VIL level
must be such that the peak to peak voltage is less than 1.0 V and greater than or equal to VPP(min).
MC10E411
2–5 MOTOROLAECLinPS and ECLinPS Lite
DL140 — Rev 4
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.004 (0.100)
SEATING
PLANE
-T-
12.32
12.32
4.20
2.29
0.33
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
—
2
°
10.42
1.02
12.57
12.57
4.57
2.79
0.48
0.81
—
—
11.58
11.58
1.21
1.21
1.42
0.50
10
°
10.92
—
1.27 BSC
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
VIEW S
B
U
Z
G1
X
VIEW D-D
H
K
F
VIEW S
G
C
Z
A
R
E
J
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
—
2
°
0.410
0.040
0.495
0.495
0.180
0.110
0.019
0.032
—
—
0.456
0.456
0.048
0.048
0.056
0.020
10
°
0.430
—
0.050 BSC
-N-
Y BRK
D
D
W
-M-
-L-
28 1
V
G1
K1
MC10E411
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–6
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MC10E411/D
*MC10E411/D*
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