SEMICONDUCTOR TECHNICAL DATA
2–1
REV 2
Motorola, Inc. 1996
12/93
The MC10E/100E337 is a 3-bit registered bus transceiver with scan.
The bus outputs (BUS0–BUS2) are specified for driving a 25Ω bus; the
receive outputs (Q0 – Q2) are specified for 50Ω. The bus outputs feature
a normal HIGH level (VOH) and a cutoff LOW level — when LOW, the
outputs go to – 2.0V and the output emitter-follower is “off”, presenting a
high impedance to the bus. The bus outputs also feature edge slow-down
capacitors.
• Scannable Version of E336
• 25Ω Cutoff Bus Outputs
• 50Ω Receiver Outputs
• Scannable Registers
• Sync. and Async. Bus Enables
• Non-inverting Data Path
• 1500ps Max. Clock to Bus (Data Transmit)
• 1000ps Max. Clock to Q (Data Receive)
• Bus Outputs Feature Internal Edge Slow-Down Capacitors
• Additional Package Ground Pins
• Extended 100E V
EE
Range of – 4.2V to – 5.46V
• 75kΩ Input Pulldown Resistors
Both drive and receive sides feature the same logic, including a loopback path to hold data. The HOLD/LOAD
function is
controlled by Transmit Enable (TEN) and Receive Enable (REN) on the transmit and receive sides respectively, with a HIGH
selecting LOAD. Note that the implementation of the E337 Receive Enable differs from that of the E336.
A synchronous bus enable (SBUSEN) is provided for normal, non-scan operation. The asynchronous bus disable (ABUSDIS
)
disables the bus immediately for scan mode.
The SYNCEN
input is provided for flexibility when re-enabling the bus after disabling with ABUSDIS, allowing either
synchronous or asynchronous re-enabling. An alternative use is asynchronous-only operation with ABUSDIS
, in which case
SYNCEN
is tied LOW, or left open. SYNCEN is implemented as an overriding SET control (active-LOW) to the enable flip-flop.
Scan mode is selected by a HIGH at the SCAN input. Scan input data is shifted in through S_IN and output data appears at the
Q2 output.
All registers are clocked on the positive transition of CLK. Additional lead-frame grounding is provided through the Ground pins
(GND) which should be connected to 0V. The GND pins are not electrically connected to the chip.
PIN NAMES
Pin Function
A0– A
2
Data Inputs A
B0– B
2
Data Inputs B
S-IN Serial (Scan) Data Input
TEN, REN HOLD/LOAD Controls
SCAN Scan Control
ABUSDIS Asynchronous Bus Disable
SBUSEN Synchronous Bus Enable
SYNCEN Synchronous Enable Control
CLK Clock
BUS0 – BUS2 25Ω Cutoff Bus Outputs
Q0– Q
2
Receive Data Outputs (Q2 serves as SCAN_OUT in scan mode)
3-BIT SCANNABLE
REGISTERED
BUS TRANSCEIVER
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
MC10E337 MC100E337
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–2
LOGIC DIAGRAM
SCAN
S-IN
TEN
V
EE
REN
CLK
A
1
26
27
28
2
3
4
25 24 23 22 21 20 19
18
17
16
15
14
13
12
115 6 7 8 9 10
SBUSEN SYNCEN
B0A0ABUSDIS V
CCOQ0
GND
BUS0
V
CC
Q
1
V
CCO
BUS1
GND
B1A2B2V
CCO
BUS2 GND Q
2
A
2
B
2
A
1
B
1
A
0
B
0
S_IN
TEN
REN
SCAN
ABUSDIS
SYNCEN
SBUSEN
CLK
BUS2
Q2/
SCAN_OUT
BUS1
Q
1
BUS0
Q
0
D Q
D Q
D Q
D Q
D Q
D Q
D Q
SET
1
Pinout: 28-Lead PLCC (Top View)
* All VCC and V
CCO
pins are tied together on the die.
MC10E337 MC100E337
2–3 MOTOROLAECLinPS and ECLinPS Lite
DL140 — Rev 4
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
V
CUT
Cut-off Output Voltage
1
– 2.10 – 2.03 – 2.10 – 2.03 – 2.10 – 2.03 V
I
IH
Input HIGH Current µA
All Other Inputs 150 150 150
I
EE
Power Supply Current mA
10E 145 174 145 174 145 174
100E 145 174 145 174 167 200
1. measured with VTT = –2.10V
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
t
PLH
Propagation Delay to Output ps
t
PHL
Clk to Q 450 1000 450 1000 450 1000
Clk to BUS 800 1800 800 1800 800 1800
ABUSDIS 500 1500 500 1500 500 1500
SYNCEN 800 1800 800 1800 800 1800
t
s
Setup Time ps
BUS 350 350 350
SBUSEN 100 100 100
Data, S-IN 400 400 400
TEN, REN, SCAN 550 550 550
t
h
Hold TIme ps
BUS 350 350 350
SBUSEN 500 500 500
Data, S-IN 350 350 350
TEN, REN, SCAN 200 200 200
t
PW
Minimum Pulse Width ps
CLk 400 400 400
t
r
Rise/Fall Times ps
t
f
20 - 80% (Qn) 300 800 300 800 300 800
20 - 80% (BUSn Rise) 500 1000 500 1000 500 1000
20 - 80% (BUSn Fall) 300 800 300 800 300 800
MC10E337 MC100E337
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–4
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.004 (0.100)
SEATING
PLANE
-T-
12.32
12.32
4.20
2.29
0.33
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
—
2
°
10.42
1.02
12.57
12.57
4.57
2.79
0.48
0.81
—
—
11.58
11.58
1.21
1.21
1.42
0.50
10
°
10.92
—
1.27 BSC
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
VIEW S
B
U
Z
G1
X
VIEW D-D
H
K
F
VIEW S
G
C
Z
A
R
E
J
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
—
2
°
0.410
0.040
0.495
0.495
0.180
0.110
0.019
0.032
—
—
0.456
0.456
0.048
0.048
0.056
0.020
10
°
0.430
—
0.050 BSC
-N-
Y BRK
D
D
W
-M-
-L-
28 1
V
G1
K1
MC10E337 MC100E337
2–5 MOTOROLAECLinPS and ECLinPS Lite
DL140 — Rev 4
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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MC10E337/D
*MC10E337/D*
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