MOTOROLA MC10E336, MC100E336 Technical data



SEMICONDUCTOR TECHNICAL DATA

2–1

REV 2

 Motorola, Inc. 1996

12/93

   

The MC10E/MC100E336 contains three bus transceivers with both

transmit and receive registers. The bus outputs (BUS0

–BUS2) are
specified for driving a 25Ω bus; the receive outputs (Q0 – Q2) are
specified for 50Ω. The bus outputs feature a normal HIGH level (VOH) and
a cutoff LOW level — when LOW, the outputs go to –2.0V and the output
emitter-follower is “off”, presenting a high impedance to the bus. The bus
outputs also feature edge slow-down capacitors.

• 25Ω Cutoff Bus Outputs

• 50Ω Receiver Outputs

• Transmit and Receive Registers

• 1500ps Max. Clock to Bus

• 1000ps Max. Clock to Q

• Bus Outputs Feature Internal Edge Slow-Down Capacitors

• Additional Package Ground Pins

• Extended 100E V

EE

Range of – 4.2V to – 5.46V

• 75kΩ Input Pulldown Resistors

The Transmit Enable pins (TEN) control whether current data is held in
the transmit register, or new data is loaded from the A/B inputs. A LOW on
both of the Bus Enable inputs (BUSEN), when clocked through the
register, disables the bus outputs to –2.0V.

The receiver section clocks bus data into the receive registers, after
gating with the Receive Enable (RXEN

) input.

All registers are clocked by a positive transition of CLK1 or CLK2 (or
both).

Additional leadframe grounding is provided through the Ground pins (GND) which should be connected to 0V. The GND pins
are not electrically connected to the chip.

LOGIC DIAGRAM

BUSEN1

BUSEN2

RXEN

V

EE

CLK1

CLK2

A

0

26

27

28

2

3

4

25 24 23 22 21 20 19

18

17

16

15

14

13

12

115 6 7 8 9 10

TEN2 TEN1 B2A2NC V

CCOQ2

GND

BUS2

V

CC

Q

1

V

CCO

BUS1

GND

B0A1B1V

CCO

BUS0

GND Q

0

A

0

B

0

A

1

B

1

A

2

B

2

TEN1
TEN2

RXEN

BUSEN1
BUSEN2

CLK1
CLK2

D

D

D

D

D

D

D

Q

Q

Q

Q

Q

Q

Q

0

0

0

1

1

1

BUS0

BUS1

BUS2

50

Ω

50

Ω

50

Ω

25 Ω CUTOFF

25

Ω

CUTOFF

25

Ω

CUTOFF

Q

0

Q

1

Q

2

1

Pinout: 28-Lead PLCC (Top View)

* All VCC and V

CCO

pins are tied together on the die.





3-BIT REGISTERED

BUS TRANSCEIVER

FN SUFFIX

PLASTIC PACKAGE

CASE 776-02

查询MC100E336供应商

MC10E336 MC100E336

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–2

DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

V

CUT

Cut-off Output Voltage

1

– 2.10 – 2.03 – 2.10 – 2.03 – 2.10 – 2.03 V

I

IH

Input HIGH Current µA

RXEN 225 225 225
All Other Inputs 150 150 150

I

EE

Power Supply Current mA

10E 125 150 125 150 125 150
100E 125 150 125 150 144 173

1. Measured with VTT = – 2.10V

AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

t

PLH

Propagation Delay to Output ps

t

PHL

Clk to Q 500 700 100 500 700 1000 500 700 1000
Clk to BUS 825 1250 1800 825 1250 1800 825 1250 1800

t

s

Setup Time ps

BUS, RXEN 150 –150 150 –150 150 –150
BUSEN 100 – 200 100 – 200 100 – 200
A, B Data 300 – 50 300 – 50 300 – 50
TEN 450 150 450 150 450 150

t

h

Hold Time ps

BUS, RXEN 450 150 450 150 450 150
BUSEN 500 200 500 200 500 200
A, B Data 350 50 350 50 350 50
TEN 200 –150 200 –150 200 –150

t

PW

Minimum Pulse Width ps

Clk 400 400 400

t

r

Rise/Fall Times ps

t

f

20 - 80% (Qn) 300 450 700 300 450 700 300 450 700
20 - 80% (BUSn Rise) 500 800 1000 500 800 1000 500 800 1000
20 - 80% (BUSn Fall) 300 500 800 300 500 800 300 500 800

MC10E336 MC100E336

2–3 MOTOROLAECLinPS and ECLinPS Lite

DL140 — Rev 4

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 776–02

ISSUE D

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.004 (0.100)

SEATING
PLANE

-T-

12.32

12.32

4.20

2.29

0.33

0.66

0.51

0.64

11.43

11.43

1.07

1.07

1.07
—
2

°

10.42

1.02

12.57

12.57

4.57

2.79

0.48

0.81
—
—

11.58

11.58

1.21

1.21

1.42

0.50

10

°

10.92
—

1.27 BSC

A
B
C
E
F
G
H

J
K
R
U
V
W
X
Y
Z

G1
K1

MIN MINMAX MAX

INCHES MILLIMETERS

DIM

NOTES:

1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.

2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.

3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).

VIEW S

B

U

Z

G1

X

VIEW D-D

H

K

F

VIEW S

G

C

Z

A

R

E

J

0.485

0.485

0.165

0.090

0.013

0.026

0.020

0.025

0.450

0.450

0.042

0.042

0.042
—
2

°

0.410

0.040

0.495

0.495

0.180

0.110

0.019

0.032
—
—

0.456

0.456

0.048

0.048

0.056

0.020

10

°

0.430
—

0.050 BSC

-N-

Y BRK

D

D

W

-M-

-L-

28 1

V

G1

K1

MC10E336 MC100E336

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–4

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specifically disclaims any and all liability , including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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MC10E336/D

*MC10E336/D*

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