Mindray BeneView T8 User manual

BeneView T8

Patient Monitor

Service Manual

Intellectual Property Statement

SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS CO., LTD. (hereinafter called Mindray) owns the intellectual property rights to this product and this manual. This manual may refer to information protected by copyrights or patents and does not convey any license under the patent rights of Mindray, nor the rights of others. Mindray does not assume any liability arising out of any infringements of patents or other rights of third parties.

Mindray intends to maintain the contents of this manual as confidential information. Disclosure of the information in this manual in any manner whatsoever without the written permission of Mindray is strictly forbidden. Release, amendment, reproduction, distribution, rent, adaption and translation of this manual in any manner whatsoever without the written permission of Mindray is strictly forbidden.

, , and are the registered trademarks or

trademarks owned by Mindray in China and other countries. All other trademarks that appear in this manual are used only for editorial purposes without the intention of improperly using them. They are the property of their respective owners.

Contents of this manual are subject to changes without prior notice.

Revision History

This manual has a revision number. This revision number changes whenever the manual is updated due to software or technical specification change. Contents of this manual are subject to change without prior notice.

Revision number: 9.0

Release time:

February 2012

© 2006-2012 Shenzhen Mindray Bio-Medical Electronics Co., Ltd. All rights reserved.

I

FOR YOUR NOTES

II

Preface

Manual Purpose

This manual provides detailed information about the assembling, dissembling, testing and troubleshooting of the equipment to support effective troubleshooting and repair. It is not intended to be a comprehensive, in-depth explanation of the product architecture or technical implementation. Observance of the manual is a prerequisite for proper equipment maintenance and prevents equipment damage and personnel injury.

This manual is based on the maximum configuration; Therefore, some contents may not apply to your monitor. If you have any question, please contact our Customer Service Department.

Intended Audience

This manual is for biomedical engineers, authorized technicians or service representatives responsible for troubleshooting, repairing and maintaining the patient monitors.

III

Abbreviations

Abbreviations used in this manual are:

MPM	multi-parameter module
SMR	satellite module rack
CMS	central monitoring system
PCB	printed circuit board

Passwords

A password may be required to access different modes within the monitor. The passwords are listed below:

User maintenance: 888888 (User adjustable)

Factory maintenance: 332888

	Demo mode:	2088
	Configuration mode:	315666 (User adjustable)

IV

Contents

1 Safety.................................................................................................................................		1-1
1.1	Safety Information ..........................................................................................................	1-1
	1.1.1 DANGER ...........................................................................................................	1-2
	1.1.2 Warnings.............................................................................................................	1-2
	1.1.3 Cautions .............................................................................................................	1-2
	1.1.4 Notes ..................................................................................................................	1-3
1.2	Equipment Symbols ........................................................................................................	1-3

2 Theory of Operation ........................................................................................................		2-1
2.1	Introduction.....................................................................................................................	2-1
2.2	System Connections........................................................................................................	2-2
	2.2.1 Mounting the Patient Monitor............................................................................	2-2
	2.2.2 Connectors for Peripheral Devices.....................................................................	2-3
2.3	Main Unit ........................................................................................................................	2-4
	2.3.1 Input System ......................................................................................................	2-5
	2.3.2 Output System....................................................................................................	2-6
	2.3.3 Processing and Communications System...........................................................	2-7
	2.3.4 Power Management System...............................................................................	2-9
	2.3.5 Equipment Interface System ............................................................................	2-12
2.4	Parameter Module .........................................................................................................	2-14
	2.4.1 Module Infrared Communication Board ..........................................................	2-14
	2.4.2 Module Power Board .......................................................................................	2-14
	2.4.3 Parameter Board...............................................................................................	2-14
2.5	Satellite Module Rack...................................................................................................	2-15
2.6	BeneLink Module..........................................................................................................	2-16

3 Testing and Maintenance.................................................................................................	3-1
3.1 Introduction.....................................................................................................................	3-1
3.1.1 Test Equipment...................................................................................................	3-1
3.1.2 Test Report .........................................................................................................	3-2
3.1.3 Preventative Maintenance ..................................................................................	3-2
3.1.4 Recommended Frequency..................................................................................	3-2
3.2 Preventative Maintenance Procedures ............................................................................	3-4
3.2.1 Visual Inspection................................................................................................	3-4
3.2.2 NIBP Tests..........................................................................................................	3-5
3.2.3 Sidestream and Microstream CO2 Module Tests................................................	3-8
3.2.4 AG Tests ...........................................................................................................	3-10
3.2.5 Preventative maintenance test report................................................................	3-13
1

3.3 Power On Test ...............................................................................................................	3-14
3.4 Module Performance Tests............................................................................................	3-15
3.4.1 ECG Tests.........................................................................................................	3-15
3.4.2 Resp Performance Test.....................................................................................	3-16
3.4.3 SpO2 Test..........................................................................................................	3-16
3.4.4 NIBP Tests........................................................................................................	3-17
3.4.5 Temp Test .........................................................................................................	3-17
3.4.6 IBP Tests...........................................................................................................	3-17
3.4.7 C.O. Test...........................................................................................................	3-19
3.4.8 Mainstream CO2 Tests......................................................................................	3-20
3.4.9 Sidestream and Microstream CO2 Module Tests..............................................	3-21
3.4.10 AG Tests .........................................................................................................	3-21
3.4.11 ICG Test .........................................................................................................	3-22
3.4.12 BIS Test..........................................................................................................	3-23
3.4.13 RM Test..........................................................................................................	3-24
3.4.14 CCO/SvO2 Tests .............................................................................................	3-25
3.4.15 PiCCO Tests ...................................................................................................	3-26
3.4.16 ScvO2 Tests ....................................................................................................	3-27
3.5 Nurse Call Relay Performance Test ..............................................................................	3-28
3.6 Analog Output Performance Test ..................................................................................	3-28
3.7 Electrical Safety Test.....................................................................................................	3-29
3.8 Touchscreen Calibration................................................................................................	3-29
3.9 Recorder Check.............................................................................................................	3-29
3.10 Network Print Test ......................................................................................................	3-30
3.10.1 Equipment Connection and Setup ..................................................................	3-30
3.10.2 Print Function Test .........................................................................................	3-30
3.11 BeneLink Module Check.............................................................................................	3-31
3.11.1 Device Connection and Setup ........................................................................	3-31
3.11.2 Device Integration Function Test ...................................................................	3-33
3.11.3 Installation and Test Report............................................................................	3-35
3.12 Battery Check..............................................................................................................	3-36
3.13 Imbedded PC System Maintenance.............................................................................	3-37
3.13.1 Making USB Startup Disk..............................................................................	3-37
3.13.2 Restoring the System......................................................................................	3-39
3.14 Factory Maintenance...................................................................................................	3-42
3.14.1 Accessing Factory Maintenance Menu...........................................................	3-42
3.14.2 Drawing Waves ..............................................................................................	3-42
3.14.3 Recorder .........................................................................................................	3-42
3.14.4 Software Version ............................................................................................	3-43
3.14.5 Monitor Information.......................................................................................	3-44
3.14.6 Calibrate NIBP...............................................................................................	3-44
4 Troubleshooting................................................................................................................	4-1
4.1 Introduction.....................................................................................................................	4-1
2

4.2	Part Replacement ............................................................................................................	4-1
4.3	Patient Monitor Status Check..........................................................................................	4-1
4.4	Software Version Check..................................................................................................	4-2
4.5	Technical Alarm Check ...................................................................................................	4-2
4.6	Troubleshooting Guide....................................................................................................	4-2
	4.6.1 Power On/Off Failures .......................................................................................	4-2
	4.6.2 Display Failures .................................................................................................	4-3
	4.6.3 Module Rack Failures ........................................................................................	4-4
	4.6.4 Alarm Problems..................................................................................................	4-6
	4.6.5 Button and Knob Failures ..................................................................................	4-7
	4.6.6 Recorder Failures ...............................................................................................	4-7
	4.6.7 Interface Failures................................................................................................	4-8
	4.6.8 CF Card Problems ..............................................................................................	4-9
	4.6.9 Power Supply Failures .......................................................................................	4-9
	4.6.10 Network Related Problems..............................................................................	4-11
	4.6.11 Software Upgrade Problems...........................................................................	4-12
	4.6.12 Technical Alarm Messages.............................................................................	4-12
	4.6.13 M51A Self Test Information...........................................................................	4-12
	4.6.14 Device Integration Failures ............................................................................	4-13
5 Repair and Disassembly ..................................................................................................		5-1
5.1	Tools................................................................................................................................	5-1
5.2	Preparations for Disassembly..........................................................................................	5-1
5.3	Basic Disassembly ..........................................................................................................	5-2
	5.3.1 Disconnecting the Base ......................................................................................	5-2
	5.3.2 Separating the Front and Rear Half of the Monitor............................................	5-4
5.4	Further Disassembly........................................................................................................	5-6
	5.4.1 Removing the Power Switch & LED Board ......................................................	5-6
	5.4.2 Disconnecting the Encoder Assembly................................................................	5-7
	5.4.3 Removing the Button Board...............................................................................	5-7
	5.4.4 Removing the Touchscreen Control Board ........................................................	5-8
	5.4.5 Removing the Inverter........................................................................................	5-9
	5.4.6 Removing the LCD Screen ..............................................................................	5-10
	5.4.7 Removing the Alarm Lamp Board ...................................................................	5-12
	5.4.8 Removing the Wireless AP...............................................................................	5-13
	5.4.9 Removing the CF Assembly.............................................................................	5-15
	5.4.10 Removing the Main Board .............................................................................	5-16
	5.4.11 Removing the Fan ..........................................................................................	5-18
	5.4.12 Removing the Speaker ...................................................................................	5-18
	5.4.13 Removing the Interface Board Assembly.......................................................	5-19
	5.4.14 Removing the CIS Assembly .........................................................................	5-20
	5.4.15 Removing the Power Supply Assembly .........................................................	5-23
	5.4.16 Removing the Integral Module Rack .............................................................	5-26
	5.4.17 Removing the Recorder..................................................................................	5-30
	3

5.5	Removing the SMR Assembly ......................................................................................	5-35
5.6	Disassembling Modules ................................................................................................	5-39
	5.6.1 Disassembling the ICG Module .......................................................................	5-39
	5.6.2 Disassembling CO2 Module.............................................................................	5-42
	5.6.3 Disassembling the BeneLink Module ..............................................................	5-48
	5.6.4 Disassembling the New MPM Module ............................................................	5-51
6 Parts ..................................................................................................................................		6-1
6.1	Introduction.....................................................................................................................	6-1
6.2	Main Unit ........................................................................................................................	6-2
6.3	Base Assembly ................................................................................................................	6-3
6.4	Front housing Assembly..................................................................................................	6-4
	6.4.1 17” LCD with Anti-glare Screen........................................................................	6-4
	6.4.2 17” LCD Touchscreen........................................................................................	6-6
6.5	Rear Housing Assembly..................................................................................................	6-8
	6.5.1 Rear Housing Assembly.....................................................................................	6-8
	6.5.2 Power module...................................................................................................	6-10
	6.5.3 Integral Module Rack.......................................................................................	6-12
	6.5.4 Interface Board Assembly ................................................................................	6-13
	6.5.5 Main Support Assembly...................................................................................	6-15
	6.5.6 Main Control Board Assembly.........................................................................	6-17
	6.5.7 6800 Internal Wireless AP Assembly ...............................................................	6-18
	6.5.8 Others...............................................................................................................	6-18
6.6 SMR Assembly .............................................................................................................		6-20
	6.6.1 SMR Assembly.................................................................................................	6-20
	6.6.2 SMR Inside Assembly......................................................................................	6-21
6.7	Parameter Modules........................................................................................................	6-22
	6.7.1 MPM Module...................................................................................................	6-22
	6.7.2 New MPM Module ..........................................................................................	6-23
	6.7.3 C.O. Module.....................................................................................................	6-25
	6.7.4 RM Module ......................................................................................................	6-27
	6.7.5 ICG Module .....................................................................................................	6-28
	6.7.6 AG Module.......................................................................................................	6-30
	6.7.7 BIS Module ......................................................................................................	6-32
	6.7.8 IBP Module ......................................................................................................	6-34
	6.7.9 Mindray CO2 Module.......................................................................................	6-35
	6.7.10 Oridion CO2 Module ......................................................................................	6-37
	6.7.11 CCO Module ..................................................................................................	6-38
	6.7.12 PiCCO Module...............................................................................................	6-40
	6.7.13 ScvO2 Module ................................................................................................	6-41
	6.7.14 BeneLink Module...........................................................................................	6-43
6.8	Remote Display Box .....................................................................................................	6-45
6.9 Wireless AP ...................................................................................................................		6-46
6.10 Replaceable Parts ........................................................................................................		6-47
	4

	6.10.1 Main Unit .......................................................................................................	6-47
	6.10.2 SMR ...............................................................................................................	6-49
	6.10.3 Parameter Modules.........................................................................................	6-49
	6.10.4 Cables.............................................................................................................	6-50
7 Upgrade.............................................................................................................................		7-1
7.1 Introduction.....................................................................................................................		7-1
7.2 Upgrading Parameter Modules........................................................................................		7-2
7.3 Upgrading Functional Assemblies ..................................................................................		7-4
	7.3.1 Upgrading SMR .................................................................................................	7-4
	7.3.2 Upgrading Wireless Network Function..............................................................	7-4
	7.3.3 Upgrading Recorder ...........................................................................................	7-5
	7.3.4 Upgrading Analog Output ..................................................................................	7-5
	7.3.5 Upgrading CIS ...................................................................................................	7-5
7.4 Upgrading Software ........................................................................................................		7-6
	7.4.1 How to Upgrade Software..................................................................................	7-8
A Electrical Safety Inspection ...........................................................................................		A-1
A.1	Power Cord Plug ...........................................................................................................	A-2
A.2	Device Enclosure and Accessories................................................................................	A-2
A.3	Device Labeling ............................................................................................................	A-3
A.4	Protective Earth Resistance...........................................................................................	A-3
A.5	Earth Leakage Test ........................................................................................................	A-5
A.6	Patient Leakage Current................................................................................................	A-6
A.7	Mains on Applied Part Leakage ....................................................................................	A-8
A.8	Patient Auxiliary Current .............................................................................................	A-11
A.9	Functional test .............................................................................................................	A-12

5

FOR YOUR NOTES

6

1 Safety

1.1 Safety Information

DANGER

zIndicates an imminent hazard that, if not avoided, will result in death or serious injury.

WARNING

zIndicates a potential hazard or unsafe practice that, if not avoided, could result in death or serious injury.

CAUTION

zIndicates a potential hazard or unsafe practice that, if not avoided, could result in minor personal injury or product/property damage.

NOTE

zProvides application tips or other useful information to ensure that you get the most from your product.

1-1

1.1.1 DANGER

There are no dangers that refer to the product in general. Specific “Danger” statements may be given in the respective sections of this manual.

1.1.2 Warnings

WARNING

zAll installation operations, expansions, changes, modifications and repairs of this product are conducted by Mindray authorized personnel.

zThere is high voltage inside the equipment. Never disassemble the equipment before it is disconnected from the AC power source.

zWhen you disassemble/reassemble a parameter module, a patient leakage current test must be performed before it is used again for monitoring.

zThe equipment must be connected to a properly installed power outlet with protective earth contacts only. If the installation does not provide for a protective earth conductor, disconnect it from the power line and operate it on battery power, if possible.

zDispose of the package material, observing the applicable waste control regulations and keeping it out of children’s reach.

1.1.3 Cautions

CAUTION

zMake sure that no electromagnetic radiation interferes with the performance of the equipment when preparing to carry out performance tests. Mobile phone, X-ray equipment or MRI devices are a possible source of interference as they may emit higher levels of electromagnetic radiation.

zBefore connecting the equipment to the power line, check that the voltage and frequency ratings of the power line are the same as those indicated on the equipment’s label or in this manual.

zProtect the equipment from damage caused by drop, impact, strong vibration or other mechanical force during servicing.

1-2

1.1.4 Notes

NOTE

zRefer to Operation Manual for detailed operation and other information.

1.2Equipment Symbols

Attention: Consult
accompanying documents		CIS connector
(this manual).
Danger: High-voltage		Network connector
Alternating current(AC)		Defibrillator connector
Power ON/OFF		Connector for satellite
		module rack
Battery indication		Video output
Zero key		Auxiliary output connector
Calibrate key		USB connector
Measure/Standby		Equipotential terminal
Check sensor		CE marking

ESD warning symbol for Electrostatic sensitive devices.

Type CF applied part. Defibrillator-proof protection against electric shock.

Type BF applied part. Defibrillator-proof protection against electric shock.

1-3

FOR YOUR NOTES

1-4

2 Theory of Operation

2.1 Introduction

This patient monitor is designed to monitor a fixed set of physiological parameters including ECG, heart rate (HR), respiration (Resp), temperature (Temp), SpO2, pulse rate (PR), non-invasive blood pressure (NIBP), invasive blood pressure (IBP), cardiac output (C.O.), carbon dioxide (CO2), oxygen (O2), anesthetic gas (AG), impedance cardiograph (ICG), bispectral index (BIS), respiration mechanics (RM), continuous cardiac output (PiCCO), and central venous oxygen saturation (ScvO2).

The patient monitor also:

Provides audible and visual alarm indications in case of patient or equipment problems.

Enables displaying, reviewing, storing and transferring of real-time data.

Incorporates multiple input devices such as buttons, knob, touchscreen, keyboard and mouse.

Interfaces a clinical information system or central monitoring system.

Enables program upgrade over the network.

Integrates the information of other devices, which include but are not restricted to anesthesia machine and ventilator.

2-1

2.2 System Connections

2.2.1 Mounting the Patient Monitor

The patient monitor can be mounted on a wall bracket or on a trolley support. The wall bracket or trolley support can be ordered optionally. Each type of mounting bracket is delivered with a complete set of mounting hardware and instructions. Refer to the documentation delivered with the mounting hardware for instructions on assembling mounts.

CAUTION

zUse mounting brackets we supply or approve. If other compatible mounting bracket is used, be sure it can be safely used on the patient monitor.

zThe mounting bracket should be installed by our qualified service personnel, or engineers who have adequate knowledge on it.

zIf other mounting solution is used, the installation personnel and the customer should verify if it can be safely used on the patient monitor, and the customer assume the responsibility for any risk resulting from that.

2-2

2.2.2 Connectors for Peripheral Devices

On the back of the patient monitor you will find all connectors for peripheral devices.

1.AC Power Connector: used to connect an AC power source (100 to 240 VAC, 50/60Hz).

2.Equipotential Terminal: used to connect the equipotential terminal of other equipment, eliminating potential difference between different pieces of equipment.

3.SMR Connector: It outputs a 12V DC, used to connect the SMR.

4.Video Output: It is a DVI-D connector used to connect a secondary display.

5.CIS Connector: It is a RJ45 connector used to connect a CIS.

6.Network Connector: It is a RJ45 connector used to connect an ethernet network or a PC.

7.Analog Output and Defibrillator Connector: It is a Micro-D connector used to output analog signals and defibrillator synchronization signals.

8.Auxi Output Connector: It is a BNC connector used to output nurse call signals.

9.Secondary USB Connector: used to connect the mouse and keyboard of the secondary display.

10.General USB Connector: used to connect any USB-compatible peripheral device.

2-3

2.3 Main Unit

The patient monitor consists of:

Input system: button board, knob, touchscreen, power switch and LED board

Output system: LCD panel, alarm LED board, recorder, speaker

Processing and communications system: main board, CIS assembly, integral module rack

Power management system: battery, battery interface board, power module

Equipment interface system: USB interface board, DVI interface board, CF card assembly and internal wireless network card.

Additionally, the patient monitor can also connect satellite module rack (SMR), parameter modules, BeneLink module, mouse, keyboard, etc.

The following diagram illustrates the structure of the patient monitor.

2-4

2.3.1 Input System

Button board

The button board, located at the lower part of the monitor’s front panel, contains 6 keys and provides connections for the following components to the main board:

Knob

Power switch & LED board

Touchscreen control board

Backlight board

Alarm LED board

The following diagram shows the button board connections.

Knob

The knob can be pressed, or rotated both clockwise and counter-clockwise. It is connected with the button board.

Touchscreen

The touchscreen enables touch operations and can be calibrated. It is connected with the touchscreen control board and main board.

Power switch & LED Board

The power switch & LED board controls the power supply for the main unit. It has three LEDs, which respectively indicate the AC power status, battery status and monitor power on/off status. It is connected with the button board.

2-5

2.3.2 Output System

LCD

The patient monitor adopts a high-resolution LCD. The LCD is connected with the main board. Signals and power supply of the backlight board are transferred by the button board.

Alarm Lamp

The patient monitor has two alarm lamps: alarm lamp and technical alarm lamp. Alarm lamp lights either red or yellow whereas technical alarm lamp lights blue only. The signals from the alarm lamps are transferred by the button board and are controlled directly by the main board.

Recorder

The recorder receives data coming form the main board and then sends them to the thermal printhead for printing. The recorder has a hardkey (starting/stopping recordings) and a green LED on its front. It is connected with the main board.

The following diagram shows its operating principle.

2-6

Module		Description
Power interface	Introduces a DC from the main board.
Power module	Converts the input power into voltages that fit each module and then
		forwards them to each module.
CPU	Control the communications between modules.
Signal interface	Control the communications between the main board and the
		recorder CPU.
Motor drive circuit	Receives the control signals from the CPU and then forwards them to
		the step engines.
Button & LED	Includes one button and one LED which are directly controlled by
board	the CPU.

Speaker

The speaker provides sound for alarms, key strokes, heart beats and pulse, and allows PITCH TONE and multi-level tone modulation. It is connected with the main board and is directly driven by the main board.

2.3.3 Processing and Communications System

Main Board

The main board is the heart of the patient monitor. It implements a series of tasks including input & output control, data storage and processing, display processing, system control, communication management, printing management and alarming, etc.

The main board comprises the CPU board and mother board. The following diagram shows interfaces to other components.

2-7

The CPU board is an essential CPU system containing the CPU, FLASH, memory, realtime clock, EEPROM, etc. It interfaces to the mother board only, which then provides interfaces to all other external devices.

The mother board is in charge of connections and communications with other components and provides the following interfaces:

LCD port: connects a built-in display.

Video output+network+IO+IIC: connects the digital video interface board.

USB×2+UART: connects the USB interface board.

Button board port: connects the button board.

Integral module rack port: connects integral module rack communication board.

Fan port: connects the fan.

2-8

Speaker port: connects the speaker.

Power module port: connects the power module.

CIS port: located at the back of the mother board for connecting the CIS components.

CF port: connects the CF card assembly.

Recorder port: connects the recorder.

Internal wireless network card port: connects the internal wireless network card

Integral Module Rack

The patient monitor has two kinds of integral module rack: 2-slot and 5-slot. The control board includes a NIOS II FPGA. It implements protocol conversion and infrared communication between the main unit and the parameter modules.

The module rack communication board can be a 2-slot type or a 3-slot type. The 3-slot communication board communicates the main board directly. The 2-slot communication board is connected with and is controlled by the 3-slot communication board. The 3-slot communication board has the function of communication control. The 2-slot communication board consists of the infrared circuit and module power circuit. The RS422 drive circuit is located on the 3-slot communication board.

2.3.4 Power Management System

Battery

The patient monitor uses two chargeable lithium-ion batteries (11.1 V, 4500 mAh). The battery compartment door is located at the bottom of the patient monitor. The battery power is introduced to the power module via the battery interface board, and then processed and distributed to each component by the power module.

NOTE

zTwo batteries must be used simultaneously when the patient monitor operates on battery power. Otherwise, it may cause power supply protection.

Battery Interface Board

The battery interface board connects batteries to the power module, enabling charging and discharging between the batteries and the power board.

2-9

Power Module

The power module is located at the back of the patient monitor. The main part of the power module is the power board, which contains 4 PCBs: charging & power management board, voltage drop DC inverter, voltage rise and drop DC inverter, and voltage drop 5 V CIS power board.

The power module transforms the input power into DC and then forwards them to each component of the patient monitor. The input power comes from either the batteries or an AC source. The patient monitor will run power from the AC source whenever an AC source is available. If the AC source becomes unavailable, the patient monitor will automatically switch to the battery power. This does not affect the monitor’s operating status.

Power module has an AC input socket at its backside, and a socket at its front provides 4 connections to the batteries, main board, CIS components and USB interface board respectively. The power module protects itself and the patient monitor by switching off AC input or DC output in case of overcurrent, short circuit and overvoltage.The power module provides 4 DC outputs:

Outputs		Description
+3.3 V	Goes to the LCD, mother board, CPU board, DVI interface board and
		integral module rack.
+5.0 V	Goes to the DVI interface board, recorder, CF storage card board and
		USB interface board.
+5.0 V CIS	Goes to the CIS assembly.
+12 V	Goes to the recorder, LCD inverter, integral module rack, parameter
		modules and USB interface board.

The systematic principle diagram of the power module is as follows:

2-10

The following diagram shows the pins of the power module socket (excluding the pins of the battery power socket. On power board, pin 1 has a triangle symbol):

	Pin ID		Marking		Description	Cable
						color
	2, 4, 6, 7,		GND	The output grounding terminal of the power board.		Black
	13, 15, 17
	8		RXD	Receives serial communications (the main board sends).		Purple
	9		TXD	Sends serial communications (the main board receives).		Brown
				Power on/off control signal. It is a TTL pulse signal
					inputted from the back board. Every time when the power
	10		PCON		on/off switch is pressed (pulse of falling edge), a switch	Blue
					between power “on” and “off” happens. The pulse
					duration is no less than 0.1 s for power-on and no less
					than 2 s for power off.
				Backlight on/off control signal. The main board sends a
					backlight on/off control signal to the power board through
	11		LCD-EN		the serial interface. The power board processes the	Green
					received signal and then outputs a high or low level
					depending on the received signal.
	12, 1		12 V	The positive end of the 12 V DC coming from the power		Yellow
					board.
	14, 3		5 V CIS	The positive end of the 5 V CIS coming from the power		Purple
					board.
	16, 5		5 V	The positive end of the 5 V DC coming from the power		Red
					board.
	18, 19		3.3 V	The positive end of the 3.3 V DC coming from the power		Orange
					board.
	20		LEDAC	AC power status indication signal		White
	21		LEDBAT	Battery status indication signal.		Grey
	22		LCD-BR	Backlight brightness control voltage.		Brown
				2-11

2.3.5 Equipment Interface System

USB Interface Board

The USB interface board is compatible with such USB interfaces as USB2.0, USB1.1 and USB1.0. It is connected with the main board and the power module. It receives two USB differential signals coming from the main board and then distributes them to ten USB interfaces via two ISP1521 chips. The UART signal output by the main board is converted into RS422 signal by the USB interface board. The USB interface board receives 5 VDC and 12 VDC inputs from the power module, of which the 5 VDC goes to the USB interface board and the 12 VDC outputted to the SMR connector through a fuse.

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DVI Interface Board

The DVI interface board is connected with the mother board and the CIS mother board. The following diagram shows its interfaces to other components.

Interface	Description
CIS Connector	Connects the CIS mother board.
BNC connector	Outputs nurse call signals.
Micro-D connector	Outputs analog signals and defibrillator synchronization signals.
RJ 45 connector	It is a standard RJ45 connector, providing 10/100 BASE-TX Ethernet
(network)	communications channels. It connects an Ethernet network or a PC.
RJ 45 connector (CIS)	It is a standard RJ45 connector for connecting a CIS network.
DVI-D connector	Connects a secondary display.

CF Card assembly

The CF assembly serves the non-volatile CF storage card which is used for data storage and transfer. It is connected with the mother board.

Internal wireless network card

The internal wireless network card connects with the mother board. User can set network type as LAN or WLAN through user interface and can set the internal wireless network card through PC.

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2.4 Parameter Module

Each parameter module consists of the module infrared communication board, module power board, module button board, parameter board, etc.

2.4.1 Module Infrared Communication Board

The module infrared communication board allows a short delay when powering up the module and adopts FPGA to enable infrared communications between the module and the module rack. An ID is integrated into the module infrared communication board. When a module is inserted in the module rack, the ID is automatically sent to the module rack.

2.4.2 Module Power Board

Some modules have no power board. There are two kinds of module power board:

1.Isolated power board: converts the 12 V DC into a 12 V isolated DC and a 5 V isolated DC.

2.Non-isolated power board: converts the 12 V DC into a 5 V DC.

2.4.3 Parameter Board

The parameter board is a parameter measurement component, which is the most important component of the parameter module.

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