HP HCPL-2200-500, HCPL-2200-300, HCPL-2200-060, HCPL-2219-060 Datasheet

H

Low Input Current Logic Gate

Optocouplers

Technical Data

HCPL-2200

HCPL-2219

Features

•2.5 kV/μs Minimum Common Mode Rejection (CMR) at VCM = 400 V (HCPL-2219)

•Compatible with LSTTL, TTL, and CMOS Logic

•Wide VCC Range (4.5 to 20 V)

•2.5 Mbd Guaranteed over Temperature

•Low Input Current (1.6 mA)

•Three State Output (No Pullup Resistor Required)

•Guaranteed Performance from 0°C to 85°C

•Hysteresis

•Safety Approval

UL Recognized -2500 V rms for 1 minute

CSA Approved

VDE 0884 Approved with

VIORM = 630 V peak

(HCPL-2219 Option 060 Only)

•MIL-STD-1772 Version Available (HCPL-5200/1)

Applications

•Isolation of High Speed Logic Systems

•Computer-Peripheral Interfaces

•Microprocessor System Interfaces

•Ground Loop Elimination

•Pulse Transformer Replacement

•Isolated Buss Driver

•High Speed Line Receiver

Description

The HCPL-2200/2219 are optically coupled logic gates that combine a GaAsP LED and an integrated high gain photo detector. The detector has a three state output stage and has a

Functional Diagram

NC	1	8	VCC
ANODE	2	7	VO
CATHODE	3	6	VE
NC	4	5 GND
		SHIELD

A 0.1 μF bypass capacitor must be connected between pins 5 and 8.

detector threshold with hysteresis. The three state output eliminates the need for a pullup resistor and allows for direct drive of data busses. The hysteresis provides differential mode noise immunity and eliminates the potential for output signal chatter.

A superior internal shield on the HCPL-2219 guarantees common mode transient immunity of

2.5 kV/μs at a common mode voltage of 400 volts.

TRUTH TABLE (POSITIVE LOGIC)

LED	ENABLE	OUTPUT
ON	H	Z
OFF	H	Z
ON	L	H
OFF	L	L

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

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5965-3596E

The Electrical and Switching Characteristics of the HCPL2200/2219 are guaranteed over

the temperature range of 0°C to 85°C and a VCC range of 4.5 volts

to 20 volts. Low IF and wide VCC range allow compatibility with

TTL, LSTTL, and CMOS logic and result in lower power consumption compared to other high speed optocouplers. Logic signals are transmitted with a typical propagation delay of 160 nsec.

The HCPL-2200/2219 are useful for isolating high speed logic interfaces, buffering of input and output lines, and implementing isolated line receivers in high noise environments.

Selection Guide

						Small-Outline	Widebody
Minimum CMR				8-Pin DIP (300 Mil)		SO-8	(400 Mil)	Hermetic
			Input On-	Single	Dual	Single	Single	Single and Dual
dV/dt	VCM		Current	Channel	Channel	Channel	Channel	Channel
(V/μs)	(V)		(mA)	Package	Package	Package	Package	Packages
1,000	50		1.6	HCPL-2200[1]		HCPL-0201	HCNW2201
				HCPL-2201
				HCPL-2202
			1.8		HCPL-2231
2,500	400		1.6	HCPL-2219[1]
5,000[2]	300[2]		1.6	HCPL-2211		HCPL-0211	HCNW2211
				HCPL-2212
			1.8		HCPL-2232
1,000	50		2.0					HCPL-52XX
								HCPL-62XX

Notes:

1.HCPL-2200/2219 devices include output enable/disable functionality.

2.Minimum CMR of 10 kV/μs with VCM = 1000 V can be achieved with input current, IF, of 5 mA.

Ordering Information

Specify Part Number followed by Option Number (if desired).

Example:

HCPL-2219#XXX

060 = VDE 0884 VIORM = 630 Vpeak Option*

300 = Gull Wing Surface Mount Option

500 = Tape and Reel Packaging Option

Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for information.

*For HCPL-2219 only.

Schematic

ICC

		VCC
		8
	IF	IO
	+
		VO
	2
	VF	7
		IE
	–	VE
	3	6
	SHIELD	GND
		5

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Package Outline Drawings

8-Pin DIP Package

9.65 ± 0.25

(0.380 ± 0.010)

TYPE NUMBER

8

7

6

5

OPTION CODE*

HP XXXXZ

DATE CODE

YYWW

UR

UL

1

2

3

4

RECOGNITION

1.19 (0.047) MAX.

1.78 (0.070) MAX.

4.70 (0.185) MAX.

0.51 (0.020) MIN.

2.92 (0.115) MIN.

1.080 ± 0.320

0.65 (0.025) MAX.

(0.043 ± 0.013)

2.54 ± 0.25

(0.100 ± 0.010)

7.62 ± 0.25

(0.300 ± 0.010)

6.35 ± 0.25

(0.250 ± 0.010)

5° TYP.				0.254	+ 0.076
					- 0.051
			(0.010		+ 0.003)
					- 0.002)

DIMENSIONS IN MILLIMETERS AND (INCHES). *MARKING CODE LETTER FOR OPTION NUMBERS. "V" = OPTION 060

OPTION NUMBERS 300 AND 500 NOT MARKED.

8-Pin DIP Package with Gull Wing Surface Mount Option 300

																													PAD LOCATION (FOR REFERENCE ONLY)
							9.65 ± 0.25																																	1.016 (0.040)
						(0.380 ± 0.010)
																																															1.194 (0.047)
			8					7							6				5
																																																										4.826					TYP.
																																																										(0.190)
																									6.350 ± 0.25
																									(0.250 ± 0.010)																																						9.398 (0.370)
																																																															9.906 (0.390)
		1				2							3					4
																																																																0.381 (0.015)
																													1.194 (0.047)																																			0.635 (0.025)
																													1.778 (0.070)
																		1.780											9.65 ± 0.25
1.19																						(0.070)																						(0.380 ± 0.010)
																								MAX.																					7.62 ± 0.25
(0.047)
																																									(0.300 ± 0.010)
MAX.																																																																			+ 0.076
																																																																	0.254
																																																																			- 0.051
																									4.19			MAX.																																			(0.010				+ 0.003)
																		(0.165)
																																																																			- 0.002)

1.080	± 0.320
(0.043	± 0.013)																								0.635 ± 0.25
																							(0.025 ± 0.010)								12° NOM.
								2.54						0.635		± 0.130
	(0.100)													(0.025		± 0.005)

BSC

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

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Maximum Solder Reflow Thermal Profile

TEMPERATURE – °C

260

240

T = 145°C, 1°C/SEC

220

T = 115°C, 0.3°C/SEC

200

180

160

140

120

100

80

T = 100°C, 1.5°C/SEC

60

40

20

0

0

1

2

3

4

5

6

7

8

9

10

11

12

TIME – MINUTES

Note: Use of nonchlorine activated fluxes is highly recommended.

Regulatory Information

The HCPL-2200/2219 have been approved by the following organizations:

UL

Recognized under UL 1577, Component Recognition Program, File E55361.

CSA

Approved under CSA Component Acceptance Notice #5, File CA 88324.

VDE

Approved according to VDE 0884/06.92. (HCPL-2219 Option 060 Only)

Insulation and Safety Related Specifications

Parameter	Symbol	Value	Units	Conditions
Min. External Air Gap	L(IO1)	7.1	mm	Measured from input terminals to output terminals,
(External Clearance)				shortest distance through air.
Min. External	L(IO2)	7.4	mm	Measured from input terminals to output terminals,
Tracking Path				shortest distance path along body.
(External Creepage)
Minimum Internal		0.08	mm	Through insulation distance, conductor to conductor,
Plastic Gap				usually the direct distance between the photoemitter
(Internal Clearance)				and photodetector inside the optocoupler cavity.
Tracking Resistance	CTI	200	V	DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)
Isolation Group		IIIa		Material Group (DIN VDE 0110, 1/89, Table 1)

Option 300 - surface mount classification is Class A in accordance with CECC 00802.

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