Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Envy 23 TouchSmart All-in-One PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1Items listed below are classified as requiring selective treatment.
1.2Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
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Quantity |
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Item Description |
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Notes |
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of items |
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included |
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in product |
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Printed Circuit Boards (PCB) or Printed Circuit |
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With a surface greater than 10 sq cm |
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8 |
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Assemblies (PCA) |
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MB, scalar, sidekey, webcam, b-cas, |
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converterboard, Graphic card |
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Batteries |
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All types including standard alkaline and lithium coin |
7 |
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or button style batteries |
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Mercury-containing components |
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For example, mercury in lamps, display backlights, |
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0 |
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scanner lamps, switches, batteries |
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Liquid Crystal Displays (LCD) with a surface greater |
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Includes background illuminated displays with gas |
1 |
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than 100 sq cm |
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discharge lamps LED Panel |
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Cathode Ray Tubes (CRT) |
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0 |
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Capacitors / condensers (Containing PCB/PCT) |
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0 |
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Electrolytic Capacitors / Condensers measuring |
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0 |
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greater than 2.5 cm in diameter or height |
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External electrical cables and cords |
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1 |
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Gas Discharge Lamps |
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0 |
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Plastics containing Brominated Flame Retardants |
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0 |
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weighing > 25 grams (not including PCBs or PCAs |
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already listed as a separate item above) |
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Components and parts containing toner and ink, |
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Include the cartridges, print heads, tubes, vent |
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0 |
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including liquids, semi-liquids (gel/paste) and toner |
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chambers, and service stations. |
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Components and waste containing asbestos |
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0 |
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Components, parts and materials containing |
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0 |
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EL-MF877-00 |
Page 1 |
Template Revision B |
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PSG instructions for this template are available at EL-MF877-01 |
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refractory ceramic fibers |
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Components, parts and materials containing |
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0 |
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radioactive substances |
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2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
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Tool Description |
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Tool Size (if |
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applicable) |
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Description #1 |
Electric screw driver |
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2# X10 |
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Description #2 |
Electric screw driver |
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1# X10 |
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3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
Please refer to the 3.1.2 disassemble hinge and real cover
Please refer to the 3.1.3 disassemble the stand
Please refer to the 3.1.4 Remove MB shielding
Please refer to the 3.1.5 disassemble HDD & ODD
Please refer to the 3.1.6 disassemble B-case
Please refer to the 3.1.7 disassemble visa mount.
Please refer to the 3.1.8 disassemble Speaker
Please refer the 3.1.9/10/11 disassemble CPU/thermal module/system fan
Please refer to 3.1.12/13 disassemble scalar & converter board.
Please refer to 3.1.14 disassemble webcam
Please refer to 3.1.15 disassemble microphone
Please refer to 3.1.16 disassemble wireless card
Please refer to 3.1.17 disassemble TV card.
Please refer to 3.1.18 disassemble MB and battery remove
Please refer to 3.1.19 disassemble CPU & DDR.
Please refer to 3.1.20 disassemble Base pan and touch module.
Please refer to 3.1.21 Remove Mouse/Keyboard Battery/MB
Please refer to 3.1.22 Remove power supply
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure 1 : Mechanical parts disassembly
1) Place the system
EL-MF877-00 |
Page 2 |
Template Revision B |
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PSG instructions for this template are available at EL-MF877-01 |
2) Disassemble hinge cover and real cover.. Remove the screws with circle in red.
3) Disassemble stand
Remove four screws on both left and right so you can remove stand with two hands.
4) Disassemble MB shielding Remove the screws with circles in red.
EL-MF877-00 |
Page 3 |
Template Revision B |
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PSG instructions for this template are available at EL-MF877-01 |
5) Disassemble HDD & ODD
Remove one screw from HDD and pull backward to disengage the HDD from base pan.
Remove one screw and push ODD forward to slide from ODD cage.
6) Disassemble B-case ( with Japan SKU that has B-case module) Remove the following screws that have circulated in yellow
EL-MF877-00 |
Page 4 |
Template Revision B |
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PSG instructions for this template are available at EL-MF877-01 |
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