Datasheet STTH5R06 Datasheet (STMicroelectronics)

Page 1
®
TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER
Table 1: Main Product Characteristics
I
F(AV)
V
RRM
T
j
VF (typ)
(max)
t
rr
FEATURES AND BENEFITS
Ultrafast switching
Low reverse recovery current
Low thermal resistance
Reduces switching losses
DESCRIPTION
The STTH5R06, which is using ST Turbo 2 600V technology, is specially suited as boost diode in continuous mode power factor corrections and hard switching conditions. This device is also intended for use as a free wheeling diode in power supplies and other power switching applications.
5 A
175°C
1.4 V
40 ns
TO-220AC
STTH5R06D
K
A
NC
D2PA K
STTH5R06G
STTH5R06
A
K
TO-220FPAC
STTH5R06FP
K
NC
DPAK
STTH5R06B
A
K
A
Table 2: Order Codes
Part Number Marking
STTH5R06D STTH5R06D
STTH5R06FP STTH5R06FP
STTH5R06B STTH5R06B
Part Number Marking
STTH5R06B-TR STTH5R06B
STTH5R06G STTH5R06G
STTH5R06G-TR STTH5R06G
Table 3: Absolute Ratings (limiting values)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
Repetitive peak reverse voltage 600 V
RMS forward voltage
TO-220AC / TO-220FPAC / D2PAK
20 A
DPAK 10
I
F(AV)
Average forward current TO-220AC / DPAK
Tc = 135°C δ = 0.5 5 A
/ D2PAK
TO-220FPAC Tc = 105°C δ = 0.5 5
I
FSM
T
T
September 2004 REV. 4
Surge non repetitive forward current tp = 10ms sinusoidal 50 A
Storage temperature range -65 to + 175 °C
stg
Maximum operating junction temperature 175 °C
j
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STTH5R06
Table 4: Thermal Resistance
Symbol Parameter Value (max). Unit
R
th(j-c)
Table 5: Static Electrical Characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
IR * Reverse leakage current Tj = 25°C VR = V
VF ** Forward voltage drop Tj = 25°C IF = 5A 2.9 V
Pulse test: * tp = 5 ms, δ < 2%
To evaluate the conduction losses use the following equation: P = 1.164 x I
Table 6: Dynamic Characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
t
Junction to case
** tp = 380 µs, δ < 2%
Reverse recovery
rr
time
TO-220AC / DPA / D2PAK
3.0 °C/W
TO-220FPAC 5.5
RRM
20 µA
Tj = 125°C 25 250
Tj = 125°C 1.4 1.8
+ 0.128 I
F(AV)
F2(RMS)
Tj = 25°C IF = 0.5A Irr = 0.25A IR =1A 25 ns
IF = 1A dIF/dt = -50 A/µs VR =30V 40
I
RM
Reverse recovery current
Tj = 125°C IF = 5A VR = 400V
dIF/dt = -200 A/µs
S factor Softness factor 0.35
Qrr Reverse recovery
charges
t
V
Figure 1: Conduction losses versus average current
P(W)
13
12
11
10
9
8
7
6
5
4
3
2
1
0
01234567
Forward recovery
fr
time
Forward recovery
FP
voltage
δ = 0.05
δ = 0.1
δ = 0.2
I (A)
F(AV)
Tj = 25°C IF = 5A dIF/dt = 40 A/µs
VFR = 1.1 x V
Fmax
Tj = 25°C IF = 5A dIF/dt = 40 A/µs
VFR = 1.1 x V
Fmax
Figure 2: Forward voltage drop versus forward current
I (A)
FM
δ = 0.5
δ
=tp/T
δ = 1
T
tp
50
45
40
35
30
25
20
15
10
5
0
0123456
T =125°C
j
(typical values)
T =125°C
j
(maximum values)
V (V)
FM
5.0 6.0 A
110 nC
150 ns
4.5 V
T =25°C
j
(maximum values)
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STTH5R06
Figure 3: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, DPAK, D2PAK)
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
δ = 0.5
0.6
0.5
0.4
δ = 0.2
δ = 0.1
0.3
0.2
Single pulse
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00
t (s)
p
δ
=tp/T
T
tp
Figure 5: Peak reverse recovery current versus dIF/dt (90% confidence)
I (A)
RM
22
V =400V
R
T =125°C
j
20
18
16
14
12
10
8
6
4
2
0
0 200 400 600 800 1000
I =0.5 x I
FF(AV)
I =0.25 x I
FF(AV)
I=I
dI /dt(A/µs)
F
FF(AV)
I =2 x I
FF(AV)
Figure 4: Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC)
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
0.6
δ = 0.5
0.5
0.4
δ = 0.2
0.3
δ = 0.1
0.2
0.1
Single pulse
0.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
t (s)
p
δ
=tp/T
T
tp
Figure 6: Reverse recovery time versus dIF/dt (90% confidence)
t (ns)
rr
80
70
I =2 x I
60
50
40
30
20
10
0
0 200 400 600 800 1000
FF(AV)
I=I
FF(AV)
I =0.5 x I
FF(AV)
dI /dt(A/µs)
F
V =400V
R
T =125°C
j
Figure 7: Reverse recovery charges versus dIF/dt (90% confidence)
Q (nC)
rr
350
V =400V
R
T =125°C
j
300
I =2 x I
250
200
150
100
50
0
0 200 400 600 800 1000
FF(AV)
I=I
FF(AV)
I =0.5 x I
FF(AV)
dI /dt(A/µs)
F
Figure 8: Softness factor versus dIF/dt (typical values)
S factor
0.70
I=I
FF(AV)
V =400V
R
0.65
T =125°C
j
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0 200 400 600 800 1000
dI /dt(A/µs)
F
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STTH5R06
Figure 9: Relative variations of dynamic parameters versus junction temperature
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
25 50 75 100 125
I
RM
S factor
I=I
Q
RR
T (°C)
j
FF(AV)
V =400V
R
Reference:T =125°C
j
Figure 11: Forward recovery time versus dIF/dt (90% confidence)
t (ns)
fr
120
100
80
I=I
FF(AV)
V =1.1 x V max.
FR F
T =125°C
j
Figure 10: Transient peak forward voltage versus dIF/dt (90% confidence)
V (V)
FP
20
I=I
FF(AV)
T =125°C
18
j
16
14
12
10
8
6
4
2
0
0 100 200 300 400 500
dI /dt(A/µs)
F
Figure 12: Junction capacitance versus reverse voltage applied (typical values)
C(pF)
100
F=1MHz
V =30mV
OSC RMS
T =25°C
j
60
40
20
dI /dt(A/µs)
0
0 100 200 300 400 500
F
Figure 13: Thermal resistance junction to ambient versus copper surface under tab (epoxy FR4, eCU=35µm) (DPAK and D2PAK)
R (°C/W)
th(j-a)
100
90
80
70
60
50
40
30
20
10
0
02468101214161820
S(Cu)(cm²)
V (V)
R
10
1 10 100 1000
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Figure 14: DPAK Package Mechanical Data
STTH5R06
DIMENSIONS
REF.
A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2
Millimeters Inches
Min. Max Min. Max.
Figure 15: DPAK Foot Print Dimensions
(in millimeters)
6.7
6.7
3
3
1.61.6
2.32.3
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STTH5R06
Figure 16: D2PAK Package Mechanical Data
A
L2
E
L
L3
B2
B
G
C2
A1
C
A2
M
* FLAT ZONE NO LESSTHAN 2mm
R
*
V2
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009
D
B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
V2
Figure 17: D2PAK Foot Print Dimensions
(in millimeters)
16.90
10.30
8.90
3.70
5.08
1.30
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Figure 18: TO-220FPAC Package Mechanical Data
A
H
L6
L2
L3
L5
L4
G1
F1
F
G
B
Dia
L7
D
E
STTH5R06
DIMENSIONS
REF.
A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.204
G1 2.40 2.70 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 0.385 0.417 L6 15.9 16.4 0.626 0.645 L7 9.00 9.30 0.354 0.366
Dia. 3 3.20 0.118 0.126
Millimeters Inches
Min. Max. Min. Max.
Figure 19: TO-220AC Package Mechanical Data
H2
L5
Ø I
L6
L2
L9
F1
L4
F
G
A
C
L7
D
M
E
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
H2 10.00 10.40 0.393 0.409
L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. I 3.75 3.85 0.147 0.151
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STTH5R06
Table 7: Ordering Information
Ordering type Marking Package Weight Base qty Delivery mode
STTH5R06D STTH5R06D TO-220AC 1.90 g 50 Tube
STTHR5R06G STTH5R06G
STTHR5R06G-TR STTHR5R06G
D
D
2
PAK
2
PAK
STTHR5R06FP STTHR5R06FP TO-220FPAC 1.70 g 50 Tube
STTHR5R06B STTHR5R06B DPAK 0.3 g 75 Tube
STTHR5R06B-TR STTHR5R06B-TR DPAK 0.3 g 2500 Tape & reel
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.8 m.N. (TO-220FPAC) / 0.55 m.N. (TO-220AC)
Maximum torque value: 1.0 m.N. (TO-220FPAC) / 0.70 m.N. (TO-220AC)
Table 8: Revision History
Date Revision Description of Changes
Oct-2002 3 Last update
07-Sep-2004 4 Tcases values splitted for TO-220FPAC package
1.48 g 50 Tube
1.48 g 1000 Tape & reel
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STTH5R06
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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