Page 1
®
HIGH VOLTAGE ULTRAFAST RECTIFIER
MAIN PRODUCT CHARACTERISTICS
STTH310/S
I
F(AV)
V
RRM
3A
1000 V
Tj (max) 175 °C
(max) 1.42 V
V
F
FEATURES AND BENEFITS
Low forward voltage drop
■
High reliability
■
■ High surge current capability
■ Soft switching for reducedEMI disturbances
■ Planar technology
DO-201AD
STTH310
DESCRIPTION
The STTH310, which is using ST ultrafast high
voltage planar technology, is specially suited for
free-wheeling, clamping, snubbering, demagnetizationinpowersuppliesandother power switching
SMC
STTH310S
applications.
ABSOLUTE RATINGS (limiting values)
Symbol Parameter Value Unit
V
V
(RMS)
I
F(AV)
RRM
Repetitive peak reverse voltage 1000 V
RMS voltage 700 V
Average forward current Tl = 75°C δ =0.5 DO-201AD 3 A
Tl = 75°C δ =0.5 SMC 3
I
FSM
Forward surge current t = 8.3 ms DO-201AD 55 A
SMC 45
T
stg
Storage temperature range - 50 + 175 °C
Tj Maximum operating junction temperature + 175 °C
January 2003 - Ed: 1
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Page 2
STTH310/S
THERMAL PARAMETERS
Symbol Parameter Value Unit
R
th (j-l)
Junction to lead L = 10 mm DO-201AD 20 ° C/W
SMC 20
R
th (j-a)
Junction to ambient L = 10 mm DO-201AD 75
STATIC ELECTRICAL CHARACTERISTICS
Symbol Parameter Tests conditions Min. Typ. Max. Unit
I
R
Reverse leakage current VR= 1000V Tj = 25°C 10 µA
Tj = 125°C 50
V
Forward voltage drop IF= 3 A Tj = 25°C 1.7 V
F
Tj = 150°C 0.98 1.42
To evaluate the maximum conduction losses use the following equation :
P=1.20xI
F(AV)
+ 0.075 x I
F2(RMS)
DYNAMIC ELECTRICAL CHARACTERISTICS
Symbol Parameter Tests conditions Min. Typ. Max. Unit
t
rr
Reverse recovery time IF= 0.5 A
Tj = 25°C 75 ns
Irr = 0.25 A IR=1A
t
fr
V
FP
Forward recovery time IF=3A
Forward recovery voltage 12 V
dIF/dt = 50 A/µs
VFR=1.1xVFmax
Tj = 25°C 300 ns
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Page 3
STTH310/S
Fig.1: Conduction losses versusaverage current.
P(W)
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
δ = 0.05
δ = 0.1
I (A)
F(AV)
δ = 0.2
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Fig. 3-1: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
FR4, L
Z/ R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
0.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
= 10mm) (DO-201AD).
leads
Single pulse
t (s)
p
δ
=tp/T
T
tp
Fig. 2: Forward voltage drop versus forward
current.
I (A)
FM
100.0
T=150°C
j
(typical values)
10.0
1.0
0.1
0.0 0.5 1.0 1.5 2.0 2.5 3.0
T=150°C
j
(maximum values)
V (V)
FM
T=25°C
j
(maximum values)
Fig. 3-2: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
FR4, S=1cm
Z/ R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
δ = 0.5
0.6
0.5
0.4
δ = 0.2
0.3
δ = 0.1
0.2
0.1
Single pulse
0.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
2
) (SMC).
t (s)
p
δ
=tp/T
T
tp
Fig. 4: Thermal resistance junction to ambient
versus copper surface under each lead (epoxy
printed circuit board FR4, copper thickness:
35µm).
R (°C/W)
th(j-a)
110
100
90
80
70
60
50
40
30
20
10
0
012345
DO-201AD
L =10mm
leads
S(cm²)
SMB
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Page 4
STTH310/S
PACKAGE MECHANICAL DATA
SMC
E1
D
E
C
L
E2
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 2.90 3.2 0.114 0.126
c 0.15 0.41 0.006 0.016
E 7.75 8.15 0.305 0.321
A1
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
A2
b
D 5.55 6.25 0.218 0.246
L 0.75 1.60 0.030 0.063
FOOTPRINT (in millimeters)
2.0 4.2 2.0
3.3
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Page 5
PACKAGE MECHANICAL DATA
DO-201AD
STTH310/S
BA
note 1
DIMENSIONS
REF.
Min. Max. Min. Max.
A 9.50 0.374
B 25.40 1.000
C 5.30 0.209
D 1.30 0.051
E 1.25 0.049
E
ØD ØD
note 2
E
1 - The lead diameter ∅ D is not controlled over zone E
2 - The minimum length which must stay straight between
the right angles after bending is 0.59"(15 mm)
note 1
B
ØC
NOTES Millimeters Inches
Ordering code Marking Package Weight Base qty Delivery mode
STTH310 STTH310 DO-201AD 1.12 g 600 Ammopack
STTH310S S10 SMC 0.245 g 2500 Tape & reel
STTH310RL STTH310 DO-201AD 1.12 g 1900 Tape & reel
■
Epoxy meets UL 94,V0
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useofsuchinformation nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
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change without notice. This publication supersedes and replaces all information previously supplied.
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